CN108581200A - The processing method of the laser soldering device and application of multi-wavelength the output device - Google Patents
The processing method of the laser soldering device and application of multi-wavelength the output device Download PDFInfo
- Publication number
- CN108581200A CN108581200A CN201810744624.2A CN201810744624A CN108581200A CN 108581200 A CN108581200 A CN 108581200A CN 201810744624 A CN201810744624 A CN 201810744624A CN 108581200 A CN108581200 A CN 108581200A
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- China
- Prior art keywords
- laser
- wavelength
- laser beam
- workpiece
- wave length
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of laser soldering devices of multi-wavelength output, appropriate wavelength combination can be selected according to the difference of workpieces processing material, when coping with the workpiece welding processing of different materials, optimum wavelength is selected according to demand, improves the efficiency and welding quality of laser welding.Different output wavelengths are fitted in same device, a kind of compact-sized, perfect in shape and function laser has been obtained, solve the problems, such as that the laser of traditional single wavelength output cannot pointedly handle different materials, processing efficiency and low-quality.Also disclose a kind of processing method, suitable wavelength combination is chosen according to the needs of microwelding, workpiece has low reflection and/or high-selenium corn effect to wherein at least one wavelength, first workpiece surface is pre-processed with the laser beam of this wavelength, workpiece surface temperature to be welded increases, surface roughening, so that workpiece material declines the reflectivity of other wavelength laser beams, absorptivity rises, to efficiently use each wavelength of laser output.
Description
Technical field
The invention belongs to technical field of laser processing, relate in particular to a kind of Laser Welding tipping with multi-wavelength output
Set and using the laser soldering device processing method.
Background technology
Laser welding is that high-intensity laser beam is radiated to metal surface, passes through the interaction of laser and metal, metal
Absorption laser, which is converted into thermal energy, makes metal molten postcooling crystallize to form welding, and laser welding is that the important of laser processing technology answers
With one of aspect, workpiece surface is heated in laser emission, and surface heat is spread by heat transfer to inside workpiece, by controlling laser
The parameters such as width, energy, peak power and the repetition rate of pulse make workpiece melt, and are then welded together two workpiece.Swash
Flush weld connection technology has the advantages that high quality, high-precision, low deformation, high efficiency and high speed, it is made to navigate in machine-building, aviation
It, the fields such as auto industry, biomedical microelectronic industry are widely applied.
The laser for being presently used for welding generally includes a laser light source, exports the laser beam of single wavelength, carries out
Welding, but it is different to the laser absorption ability of different wave length to be different workpieces processing so that and the laser of single wavelength welds
When the problem of there may be workpiece materials to laser high reflection, the low absorption of the wavelength so that the output energy of laser can not
It is utilized effectively, low, of poor quality so as to cause laser welding efficiency, this laser can not be adjusted according to different materials and be exported
Optical maser wavelength, application range is relatively narrow.
Invention content
For this purpose, only including a laser light source, Laser Welding technical problem to be solved by the present invention lies in conventional laser
It is only capable of output single wavelength when connecing, can not targetedly choose output wavelength for different materials, lead to laser welding efficiency
It is low, of poor quality, to propose a kind of exportable at least laser soldering device of two beam different wave length laser beams and utilize the laser
The method that welder is laser machined.
In order to solve the above technical problems, the technical scheme is that：
The present invention provides a kind of laser soldering device of multi-wavelength output, and the laser soldering device includes along laser optical path
The multiple-wavelength laser that is sequentially arranged expands mechanism, diffraction optical element, galvanometer, bunching mechansim and loading mechanism, more waves
Long laser is used to export the laser beam of at least two beam different wave lengths.
Preferably, the laser beam of different wave length coaxially exports.
Preferably, the laser beam of the different wave length includes in infrared laser beam, green laser beam, UV laser beam
At least two.
Preferably, the laser beam of different wave length is sequentially output with the time interval of 20ns-100 μ s.
Preferably, the laser beam laser facula of different wave length be completely superposed or hot spot between be spaced 10-60 spot diameter
Distance.
Preferably, further including control mechanism, the control mechanism is different for controlling the multiple-wavelength laser output
The laser beam of wavelength.
Preferably, the mechanism that expands is laser beam expanding lens, the bunching mechansim is planoconvex spotlight, biconvex lens or sweeps
Retouch lens.
It is special the present invention also provides a kind of method that the laser soldering device exported using the multi-wavelength is processed
Sign is, includes the following steps：
S1, workpiece to be welded is fixed on loading mechanism surface；
S2, according to the property settings optical maser wavelength of workpiece to be welded combination and parameter；
S3, the laser beam for emitting first wave length to workpiece surface, make workpiece surface temperature be increased to surface roughening；
S4, the laser beam for emitting second wave length to workpiece surface, weld welding workpiece.
Preferably, the workpiece to be welded is low to the laser beam reflectivity of the first wave length, absorptivity is high.
Preferably, the frequency of the laser beam of the first wave length and the laser beam of the second wave length is according to characteristic
It is selected as fundamental frequency, two frequencys multiplication or frequency tripling.
The above technical solution of the present invention has the following advantages over the prior art：
(1) laser soldering device of multi-wavelength output of the present invention can be selected according to the difference of workpieces processing material
Appropriate wavelength combination, the workpiece have the characteristics that high-selenium corn and/or low reflection to wherein at least one wavelength laser, are coping with not
With material workpiece welding processing when, select optimum wavelength according to demand, improve laser welding efficiency and welding matter
Amount.Different output wavelengths are fitted in same device, a kind of compact-sized, perfect in shape and function laser has been obtained, has solved
The laser of traditional single wavelength output cannot pointedly handle different materials, processing efficiency and low-quality problem.
(2) processing method of the present invention chooses suitable wavelength combination, workpiece to be welded according to the needs of microwelding
To wherein at least one wavelength have it is low reflection and/or high-selenium corn effect, first with the laser beam of this wavelength to workpiece surface into
Row pretreatment, makes workpiece surface temperature to be welded increase, and surface roughening so that workpiece material is to other wavelength laser beams
Reflectivity decline, absorptivity rise, to efficiently use laser output each wavelength.
Description of the drawings
In order to make the content of the present invention more clearly understood, it below according to specific embodiments of the present invention and combines
Attached drawing, the present invention is described in further detail, wherein
Fig. 1 is the structural schematic diagram of the laser soldering device of the multi-wavelength output described in the embodiment of the present invention.
Reference numeral is expressed as in figure：1- multiple-wavelength lasers；2- expands mechanism；3- diffraction optical elements；4- galvanometers；5-
Bunching mechansim；6- bunching mechansims；7- control mechanisms.
Specific implementation mode
Embodiment 1
The present embodiment provides a kind of laser soldering device of multi-wavelength output, it is used to carry out microwelding to workpiece, it is described
Laser soldering device is as shown in Figure 1 comprising the multiple-wavelength laser 1 that is sequentially arranged along laser optical path expands mechanism 2, diffraction
Optical element 3, galvanometer 4, bunching mechansim 5 and loading mechanism 6 further include control mechanism 7, the control mechanism 7 and more waves
Long laser 1, galvanometer 4 and loading mechanism 6 signal connect, and for regulating and controlling said mechanism, the multiple-wavelength laser 1 is for exporting
At least the laser beam of two beam different wave lengths, the laser beam of the different wave length coaxially export.
Specifically, the laser beam of 1 exportable at least two different wave length of the multiple-wavelength laser：As infrared laser beam+
Green laser beam, infrared laser beam+UV laser beam, green laser beam+UV laser beam or infrared laser beam+green laser beam
+ UV laser beam.
To realize to the efficient welding of workpiece, the laser beam of above-mentioned different wave length with the time interval of 20ns-100 μ s sequentially
Output, such as this embodiment of infrared laser beam+green laser beam, the control mechanism 7 controls the multiwavelength laser
The output wavelength first of device 1 is in the infrared laser beam of infrared band, and then output wavelength is in the green of green light band after 20ns
Ray laser beam；Or as disposable embodiment, for this combination of infrared laser beam+UV laser beam, control mechanism 7
Control 1 output wavelength of multiple-wavelength laser is in the infrared laser beam of infrared band first, then the output wave strong point after 100 μ s
In the UV laser beam of ultraviolet band；Or for this embodiment of infrared laser beam+green laser beam+UV laser beam,
The control mechanism 7 controls the infrared laser beam that 1 output wavelength of multiple-wavelength laser is in infrared band first, then in 20 μ s
Output wavelength is in the green laser beam of green light band afterwards, then output wavelength is in the ultraviolet laser of ultraviolet band after 100ns
Beam.
In addition, the laser beam of different wave length can also be certain space interval output：The control mechanism 7 controllable first
Laser beam is overlapped with post laser beam on spatial position, i.e., the hot spot that the laser beam of different wave length is formed in workpiece surface is complete
It overlaps；Or the laser beam of different wave length is variant on spatial position, i.e., the laser beam of different wave length is formed in workpiece surface
Hot spot between have an interval, the size of space is the sum of the diameter of 10-60 hot spot.
Further, the control mechanism 7 is the computer for being integrated with control software, and the mechanism 2 that expands expands for laser
Shu Jing, the bunching mechansim 5 are planoconvex spotlight, biconvex lens or scanning lens, and biconvex lens is used in the present embodiment, described to shake
Mirror 4 is X-Y galvanometers, and eyeglass can be rotated in X, Y direction, and reflex is played to realize to the inclined of laser beam to laser beam
Turn effect, galvanometer is connected with angle measuring sensor, and the deflection angle for measuring X, Y galvanometer simultaneously sends the information measured to
Control unit 7.The loading mechanism 6 is X-Y axis mobile platforms, can be to be welded along X, Y-direction drive under the regulation and control of control unit 7
Connect workpiece movement.
Embodiment 2
The present embodiment provides a kind of methods being processed using laser soldering device described in embodiment 1 comprising such as
Lower step：
S1, workpiece to be welded is placed in 6 surface of loading mechanism, and by controlling the movement of loading mechanism 6 by work to be welded
Part is adjusted to the position for being suitable for processing.
S2, according to the material property of workpiece to be welded, set the parameters such as combination and power, the frequency of optical maser wavelength.
S3, start the mechanisms such as multiple-wavelength laser 1, welded, in welding process, control mechanism 7 controls more waves first
The laser beam of long laser output first wave length, in the present embodiment, the laser beam of first wave length is infrared laser beam.
S2, control mechanism 7 control the laser beam that the multiple-wavelength laser 1 exports second wave length after 50 μ s, this implementation
In example, the laser beam of second wave length is UV laser beam, what the infrared laser beam was formed with UV laser beam in workpiece surface
Hot spot spacing is the sum of the distance of 20 spot diameters, and the workpiece is low with reflectivity to the laser beam of first wave length, absorbs
The high feature of rate so that first laser beam heats workpiece surface, temperature increases or even has the phase transition process such as melting,
And surface roughening, so that workpieces processing declines the reflectivity of second wave length laser beam, absorptivity rises, it is efficiently sharp
With the laser of different wave length, according to the material character of workpiece, first wave length, second wave length laser beam frequency may be set to base
Frequently, two frequencys multiplication or frequency tripling, it is arbitrary adjustable within laser full power for fundamental frequency；For two frequencys multiplication and frequency tripling, full
It is arbitrary adjustable in power maximum conversion efficiency.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes still within the protection scope of the invention.
Claims (10)
1. a kind of laser soldering device of multi-wavelength output, which is characterized in that the laser soldering device includes along laser optical path
The multiple-wavelength laser that is sequentially arranged expands mechanism, diffraction optical element, galvanometer, bunching mechansim and loading mechanism, more waves
Long laser is used to export the laser beam of at least two beam different wave lengths.
2. the laser soldering device of multi-wavelength output according to claim 1, which is characterized in that the laser beam of different wave length
Coaxial output.
3. the laser soldering device of multi-wavelength output according to claim 2, which is characterized in that the different wave length swashs
Light beam includes at least two in infrared laser beam, green laser beam, UV laser beam.
4. the laser soldering device of multi-wavelength output according to claim 3, which is characterized in that the laser beam of different wave length
It is sequentially output with the time interval of 20ns-100 μ s.
5. the laser soldering device of multi-wavelength output according to claim 3, which is characterized in that the laser beam of different wave length
Laser facula be completely superposed or hot spot between be spaced 10-60 spot diameter distance.
6. the laser soldering device of multi-wavelength output according to claim 4 or 5, which is characterized in that further include control machine
Structure, the control mechanism are used to control the laser beam of the multiple-wavelength laser output different wave length.
7. the laser soldering device of multi-wavelength output according to claim 6, which is characterized in that the mechanism that expands is sharp
Light beam expanding lens, the bunching mechansim are planoconvex spotlight, biconvex lens or scanning lens.
8. the side that a kind of laser soldering device using such as the output of claim 1-7 any one of them multi-wavelengths is processed
Method, which is characterized in that include the following steps：
S1, workpiece to be welded is fixed on loading mechanism surface；
S2, according to the property settings optical maser wavelength of workpiece to be welded combination and parameter, welded；
S3, the laser beam for emitting first wave length to workpiece surface, make workpiece surface temperature be increased to surface roughening；
S4, the laser beam for emitting second wave length to workpiece surface, weld welding workpiece.
9. processing method according to claim 8, which is characterized in that the workpiece to be welded swashs the first wave length
Light beam reflectivity is low, absorptivity is high.
10. processing method according to claim 9, which is characterized in that the laser beam of the first wave length and described second
The frequency of the laser beam of wavelength is selected as fundamental frequency, two frequencys multiplication or frequency tripling according to characteristic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810744624.2A CN108581200A (en) | 2018-07-09 | 2018-07-09 | The processing method of the laser soldering device and application of multi-wavelength the output device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810744624.2A CN108581200A (en) | 2018-07-09 | 2018-07-09 | The processing method of the laser soldering device and application of multi-wavelength the output device |
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| CN108581200A true CN108581200A (en) | 2018-09-28 |
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| CN201810744624.2A Pending CN108581200A (en) | 2018-07-09 | 2018-07-09 | The processing method of the laser soldering device and application of multi-wavelength the output device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112719628A (en) * | 2020-12-18 | 2021-04-30 | 浙江泰仑电力集团有限责任公司 | Complex-color laser foreign matter removing device and method based on foreign matter transparency |
| CN113909678A (en) * | 2021-11-18 | 2022-01-11 | 哈焊国创(青岛)焊接工程创新中心有限公司 | Welding system for aluminum alloy laser welding and surface treatment method |
| CN114453734A (en) * | 2021-12-24 | 2022-05-10 | 深圳市大族数控科技股份有限公司 | Plate laser surface roughening treatment device and method |
| TWI811938B (en) * | 2020-04-23 | 2023-08-11 | 南韓商普羅科技有限公司 | Flip chip bonding apparatus using vcsel device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI811938B (en) * | 2020-04-23 | 2023-08-11 | 南韓商普羅科技有限公司 | Flip chip bonding apparatus using vcsel device |
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| CN114453734A (en) * | 2021-12-24 | 2022-05-10 | 深圳市大族数控科技股份有限公司 | Plate laser surface roughening treatment device and method |
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