CN107175382B

CN107175382B - Selective wave-soldering nozzle structure and nozzle disc composed of same

Info

Publication number: CN107175382B
Application number: CN201610132547.6A
Authority: CN
Inventors: 许杰; 司运涛; 卢长全
Original assignee: DIAS Automotive Electronic Systems Co Ltd
Current assignee: DIAS Automotive Electronic Systems Co Ltd
Priority date: 2016-03-09
Filing date: 2016-03-09
Publication date: 2020-04-10
Anticipated expiration: 2036-03-09
Also published as: CN107175382A

Abstract

The invention discloses a selective wave soldering nozzle structure, which is divided into a first part vertically arranged on a tin cylinder; and a second part which is arranged on the first part and has an inclination angle A with the first part in the vertical direction. The invention also discloses a nozzle disc consisting of the selective wave-soldering nozzle structure. The invention can increase the pulling force of the redundant tin liquid between the nozzle tin wave and the pin, reduce the interference of various factors on the detinning process and reduce the tin connection risk; the overflow range of the tin wave of the nozzle on the PCB is reduced, a larger space is provided for the patch element, and the poor part washing and the whole PCB size are reduced.

Description

Selective wave-soldering nozzle structure and nozzle disc composed of same

Technical Field

The invention relates to the field of automobiles, in particular to a selective wave-soldering nozzle structure. The invention also relates to a nozzle disc consisting of the selective wave soldering nozzle structure.

Background

The highest stable no vortex crest height of full-size wave nozzle of traditional wave-soldering is less than 8mm, has the component of 8mm height promptly as the face of weld design, and need consider the tool to cover the thickness size for 2mm usually to the bottom of component, promptly when actual component height is greater than 6mm, can't use traditional wave-soldering promptly, to littleer, the higher electronic circuit board design of density, needs more nimble welding mode, on this basis, selectivity wave-soldering should be transported and produced.

The fundamental idea of selective wave soldering is to reduce the size of a wave nozzle of the traditional wave soldering to adapt to the arrangement of finer welding holes, the smaller nozzle size can avoid large-size (especially the height is more than 6mm) elements of a welding surface, programming is carried out in a point position coordinate mode during welding, and point-by-point welding (single nozzle) is carried out, but the welding time of the mode is too long, batch production cannot be realized, and then on the basis, a multi-nozzle plate welding mode is developed.

The multi-nozzle tray welding mode is that the whole furnace passing tray is taken as a whole, one tray can bear different numbers of products, and a nozzle (the height of the nozzle is 4-6mm) is manufactured corresponding to all point positions needing welding, namely the tray of each product corresponds to one set of multi-nozzle tray. When the tin cylinder is lifted up integrally, the element to be welded is in contact with the tin wave for welding, and the position to be avoided has no tin liquid and does not need to be avoided. After the welding is finished, the tin cylinder integrally descends, and the tray is output from the track to the equipment, so that the whole welding process is finished.

The advantages of the multi-nozzle are as follows:

1. since the tact of the tin cylinders is substantially the same, the more products on each tray, the lower the tact of the individual products, and the production efficiency will no longer depend on the equipment capacity, but the design size of the PCB.

2. The multiinjector is installed on 500 KG's tin jar, and the thermal capacity of whole tin jar system is big, to the single nozzle that uses 10KG capacity tin jar, to the temperature of the stable solder joint of easier during high-power, the component welding that thermal diffusivity is strong, phenomenon such as easy emergence broach

Multiple nozzle disadvantages:

1. referring to fig. 1, in the conventional design of the multi-nozzle, after a solder joint is combined with tin liquid during operation, the redundant tin liquid is pulled off by the tin liquid in a tin cylinder from the vertical direction due to tension, and in the process of detinning, the tin liquid is interfered by various factors such as pin length, liquid level height, liquid level flatness, relative flatness of a tray and a nozzle, and poor tin connection is easy to occur.

2. Referring to fig. 2, in the conventional multi-nozzle design, the circulation of the molten tin flows back to the tin cylinder from above the nozzle, and due to the thickness dimension and the installation error of the nozzle, the dimension avoidance of the element with the nearest distance from the center of the pin is larger than 8.2mm, so that the elements of the chip can be easily washed into the tin cylinder by the tin wave flowing back from above the nozzle by using the conventional nozzle design.

Disclosure of Invention

The invention aims to solve the technical problem of providing a selective wave soldering nozzle structure which can reduce the occurrence probability of continuous tin and reduce the tin overflow range of the nozzle. The invention also provides a nozzle disc consisting of the nozzle structure.

The invention provides a selective wave-soldering nozzle structure, wherein: the nozzle structure is divided into a first part vertically arranged on the tin cylinder; and the second part is arranged on the first part and forms an inclined included angle A with the first part in the vertical direction.

The inclined included angle A is 12-22 degrees, and the inclined included angle A is preferably 14 degrees, 15 degrees or 16 degrees.

Wherein the relationship between the first portion length a and the second portion length b of the nozzle structure satisfies the following condition;

8mm≤COSA×b+a≤25mm。

preferably 12 mm. ltoreq. COSA × b + a. ltoreq.18 mm.

The present invention provides a nozzle tray comprising any one of the nozzle structures described above, wherein: the inclination direction of the second part of the nozzle structure is as follows: away from the direction of the nearest component to the corresponding pin of the nozzle.

In the nozzle structure, the inclined second part of the nozzle pushes the molten tin in the vertical direction and the horizontal direction (leftward), the nozzle provides horizontal pushing force far away from an element to help the molten tin to deviate a pin and a bonding pad in the detinning process, and then the molten tin is separated from the pin by overcoming the tension of the molten tin by gravity in the vertical direction. The invention can increase the pulling force of the redundant tin liquid between the nozzle tin wave and the pin, reduce the interference of various factors on the detinning process and reduce the tin connection risk; the overflow range of the tin wave of the nozzle on the PCB is reduced, a larger space is provided for the patch element, and the poor part washing and the whole PCB size are reduced.

Drawings

FIG. 1 is a schematic view of a conventional selective wave soldering nozzle structure in a first usage state.

FIG. 2 is a schematic diagram of a second conventional selective wave soldering nozzle structure.

FIG. 3 is a first schematic view of a selective wave soldering nozzle configuration according to the present invention.

Fig. 4 is a partially enlarged schematic view of fig. 3.

Detailed Description

As shown in fig. 3 and 4, the selective wave soldering nozzle structure provided by the invention comprises: the nozzle structure is divided into a first part vertically arranged on the tin cylinder; and the second part is arranged on the first part and has an inclined included angle A in the vertical direction with the first part, the inclined included angle A is 12-22 degrees, and the inclined included angle A is preferably 14 degrees, 15 degrees or 16 degrees.

the COSA x b + a is more than or equal to 8mm and less than or equal to 25 mm. Preferably 12 mm. ltoreq. COSA × b + a. ltoreq.18 mm.

The present invention has been described in detail with reference to the specific embodiments and examples, but these are not intended to limit the present invention. Many variations and modifications may be made by one of ordinary skill in the art without departing from the principles of the present invention, which should also be considered as within the scope of the present invention.

Claims

1. A selective wave-soldering nozzle structure is characterized in that: the nozzle structure is divided into a first part vertically arranged on the tin cylinder; and a second part which is arranged on the first part and has an inclined included angle A with the first part in the vertical direction, the nozzle opening is equal in height, the inclined included angle A is 12-22 degrees, and the relation between the length a of the first part and the length b of the second part of the nozzle structure is as follows: the COSA x b + a is more than or equal to 8mm and less than or equal to 25 mm.

2. The selective wave solder nozzle structure of claim 1, wherein: the inclined included angle A is 14 degrees, 15 degrees or 16 degrees.

3. The selective wave solder nozzle structure of claim 1, wherein: the nozzle arrangement first portion length a and second portion length b are related by: the COSA x b + a is more than or equal to 12mm and less than or equal to 18 mm.

4. A nozzle plate comprising the nozzle arrangement of any one of claims 1 to 3, wherein: the inclination direction of the second part of the nozzle structure is as follows: away from the direction of the nearest component to the corresponding pin of the nozzle.