CN204795857U - Prevent even pad of tin - Google Patents
Prevent even pad of tin Download PDFInfo
- Publication number
- CN204795857U CN204795857U CN201520499290.9U CN201520499290U CN204795857U CN 204795857 U CN204795857 U CN 204795857U CN 201520499290 U CN201520499290 U CN 201520499290U CN 204795857 U CN204795857 U CN 204795857U
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- soldering
- pad
- dish
- soldering dish
- thief
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Abstract
The utility model relates to a prevent even pad of tin, including base plate and a plurality of pin pads of setting at the substrate surface, be equipped with the through -hole on the pin pad, to be located on the reflow soldering moving direction, that contain two at least pin pads each go each reflow soldering position of rest who goes the pin pad sets up the first thief soldering dish, and reflow soldering end position sets up the second and steals the soldering dish, the first thief soldering dish and second are stolen the soldering dish and are the surperficial bellied boss for the base plate. Above -mentioned pad can effectively increase the size of pad, enables multiway part on the base plate when crossing the welding of tin stove, and the disappearance is the condition of tin even, can effectually steal tin, plays when preventing to weld even tin, has guaranteed once to weld the quality, can avoid welding the quality hidden danger of bringing because of the secondary to improve production efficiency.
Description
Technical field
The utility model relates to soldering technology conventional in Electronic Assemblies industry, particularly relates to a kind of anti-pad connecting tin.
Background technology
Soldering is connection means conventional in Electronic Assemblies industry, is connected on circuit board by electronic devices and components by scolding tin.Wiring board production has generally all merged SMT (SurfaceMountTechnology, surface mount or surface mounting technology) and wiring board plug-in unit welds two kinds of production technologies.SMT is that one (will be called for short SMC/SMD without pin or short leg surface-assembled components and parts, Chinese claims sheet components and parts) be arranged on FPC (FlexiblePrintedCircuit, Flexible Printed Circuit) or PCB (Printedcircuitboard, printed circuit board) surface or other substrate surface on, by the circuit load technology of reflow method in addition welding assembly, after SMT part completes, again plug-in unit welding is carried out to wiring board.
Traditional Reflow Soldering is skimmed over from the scolding tin surface of reflow ovens, realizes the welding to part on substrate.When scolding tin between electronic devices and components pin is too much, different pins can be caused to be shorted link together, the circuit causing having welded cannot normally run by this, the meeting that the leg of such as part is in column or in a row easily occurs connecting tin phenomenon, Lian Xihui causes part short circuit, causes substrate short circuit in the problem such as bad, efficiency is low.
Utility model content
Based on this, be necessary, for company's tin of occurring during welding and the low problem of production efficiency thereof, to provide a kind of anti-pad connecting tin.
The anti-pad connecting tin, comprise substrate and the multiple pin pads being arranged on substrate surface, described pin pad is provided with through hole;
For being positioned at every a line on Reflow Soldering moving direction, that comprise at least two pin pads, arrange the first thief soldering dish in the Reflow Soldering original position of described every a line pin pad, Reflow Soldering end position arranges second and steals soldering dish;
The boss that soldering dish is the rat relative to substrate stolen by described the first thief soldering dish and second.
Wherein in an embodiment, the longitudinal profile of described the first thief soldering dish becomes large gradually along Reflow Soldering moving direction, and the described second longitudinal profile stealing soldering dish diminishes gradually along Reflow Soldering moving direction.
Wherein in an embodiment, the cross section of described boss is triangle.
Wherein in an embodiment, the overall width of described boss is 2.9 ~ 3.1 millimeters, and entire length is 3.9 ~ 4.1 millimeters, and whole height is 0.15 ~ 0.25 millimeter.
Wherein in an embodiment, described boss comprises afterbody and head, and described afterbody compares head closer to through hole side; The cross section of described afterbody is rectangle, and the cross section of described head is triangle.
Wherein in an embodiment, described boss comprises head and afterbody, and described afterbody compares head closer to through hole side; The cross section of described head is triangle, and the cross section of described afterbody is rectangle.
Wherein in an embodiment, the shape of soldering dish stolen by described the first thief soldering dish and second, size is all identical.
Wherein in an embodiment, described the first thief soldering dish and second steals the boss height difference of soldering dish in 0.1 millimeter.
Wherein in an embodiment, the distance of described the first thief soldering dish and adjacent through-holes equals the distance that second steals soldering dish and adjacent through-holes, and described distance is 1.9-2.1 millimeter.
Above-mentioned pad, pad is stalked owing to being provided with the first thief soldering dish and second, effectively can increase the size of pad, when the multiway part on substrate can be made to cross the welding of tin stove, there is not the situation connecting tin, effectively can steal tin, play when preventing welding and connect tin, ensure that and once weld quality, the quality hidden danger because secondary welding comes can be avoided, thus enhance productivity.
Accompanying drawing explanation
Fig. 1 is the planar structure schematic diagram of traditional pad;
Fig. 2 is the anti-planar structure schematic diagram connecting soldering dish of an embodiment;
Fig. 3 is the anti-planar structure schematic diagram connecting soldering dish of another embodiment.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but execution mode of the present utility model is not limited thereto.
As shown in Figure 1 be the planar structure schematic diagram of traditional welding plate, in figure, pad comprises substrate 10 and is arranged on multiple pin pads 20 on substrate 10 surface, and described pin pad 20 is provided with through hole 30.Pad is the basic comprising unit of surface mount assembling, is used for the welding disk pattern of forming circuit plate.One section of lead terminal of the element of attachment, through through hole 30, makes this section jointly form solder joint with the pin pad 20 in printed board by solder.
Be illustrated in figure 2 the anti-of an embodiment and connect soldering dish floor map, these anti-multiple pin pads 20 connecting soldering dish and comprise substrate 10 and be arranged on substrate 10 surface, described pin pad 20 is provided with through hole 30.In Fig. 2, four pin pads 20 are positioned on Reflow Soldering moving direction and become a line to arrange.Be described with four pin pad 20 citings in the present embodiment.
Be appreciated that the quantity of pin pad 20 can be 2,3 or more.Four pin pad 20 arrangement modes are also not limited to single file, also may be wherein two be in line, two other is in line.The quantity of the pin pad that substrate is formed and arrangement mode are that the typesetting of element and the circuit board that will mount according to pin pad 20 place circuit board and layout are determined.The pin pad 20 of every a line may correspond to discrete component, also may correspond to multiple element be arranged side by side.
In the present embodiment, as shown in Figure 2, for the pin pad 20 be in line, arrange the first thief soldering dish 40 in Reflow Soldering original position, Reflow Soldering end position arranges second and steals soldering dish 50.Wherein, the boss that soldering dish 50 is the rat relative to substrate stolen by the first thief soldering dish 40 and second.
Reflow Soldering is the cream dress solder allocated in advance by refuse on printed board pad, realizes the room machine of surface-assembled components and parts welding end or pin and printed board pad and the solder of electrical connection.Reflow Soldering is the effect by thermal current butt welding point, and gluey solder flux carries out the welding that physical reactions reaches short leg surface-assembled components and parts under certain high temperature gas flow.
Reflow Soldering start bit refers to that substrate is when crossing Reflow Soldering, and substrate enters the starting point in plate direction; Reflow Soldering end position refers to and refers to that substrate is when crossing Reflow Soldering, and substrate enters the end point in plate direction.
Principle that soldering dish 50 steals tin stolen by the first thief soldering dish 40 and second is intramolecular force according to molten tin, popular saying is exactly that suction draws unnecessary liquid tin, mainly solves Small Distance and connects tin (the key tin between many pins) and Joint Strength (radiate or be tear pad drag tin) problem.
In another embodiment, the longitudinal profile of the first pad and the second pad becomes greatly all gradually along Reflow Soldering moving direction, and described longitudinal profile diminishes gradually along Reflow Soldering moving direction.
The anti-of an embodiment as shown in Figure 2 connects soldering dish floor map, and the boss that soldering dish 50 is the rat relative to substrate stolen by the first thief soldering dish 40 and second.In figure, the cross section of boss is triangle, and the overall width w of boss is 2.9 ~ 3.1 millimeters, and entire length l is 3.9 ~ 4.1 millimeters, whole height h is 0.15 ~ 0.25 millimeter, the size overall width w of preferred boss is 3 millimeters, and entire length l is 4 millimeters, and whole height h is 0.2 millimeter.
The shape that soldering dish 50 stolen by the first thief soldering dish 40 and second is identical, and the cross section of boss is triangle.
The first thief soldering dish 40 and the distance of adjacent through-holes equal the distance a that second steals soldering dish 50 and adjacent through-holes 30, and described distance a is 1.9-2.1 millimeter, preferably 2 millimeters.
The height that soldering dish boss stolen by the first thief soldering dish and second is unequal, and difference in height is in 0.1 millimeter.
In another embodiment, the height that soldering dish boss stolen by the first thief soldering dish and second is equal, is highly 0.2 millimeter.
In another embodiment, the height of the first thief soldering dish is 0.15 millimeter, and the second height stealing soldering dish boss is 0.2 millimeter.
In another embodiment, the shape that soldering dish 50 stolen by the first thief soldering dish 40 and second is identical, and the corner angle of boss become fillet, and each side of boss is curved surface and smooth connection, the cross section being equivalent to boss is similar triangle, and described similar leg-of-mutton each drift angle is fillet.
In another embodiment, the shape that the shape and second of the first thief soldering dish steals soldering dish is different, and the cross section of the first thief soldering dish boss is triangle, and the cross section of the first thief soldering dish boss is similar triangle.
In another embodiment, boss shape is " pyramid " shape, and the boss side surfaces near through hole side is vertical with substrate.The cross section of boss diminishes gradually along perpendicular to substrate direction upwards.
In another embodiment, boss upper surface is platform, and the upper surface of boss is parallel with lower surface, and cross section is triangle.
During Reflow Soldering, liquid tin produces inertia at substrate when moving forward, the company's of generation tin defects between closely spaced pad can be made, because the first thief soldering dish and the second cross section stealing the boss of soldering dish are triangle, it is large that soldering dish tension force stolen by triangle, be conducive to tin steathily, thus ensure the not company's of generation tin defects.
As the anti-of another embodiment of Fig. 3 connects soldering dish floor map, in figure, the boss that soldering dish 50 is the rat relative to substrate stolen by the first thief soldering dish 40 and second.Described boss comprises head 51 and afterbody 52, and described afterbody 52 compares head closer to through hole 30 side; The cross section of described head 51 is triangle, and the cross section of described afterbody 52 is rectangle.
The cross section of described boss head 51 is triangle, and the entire length l1 of boss head is 3.9 ~ 4.1 millimeters, and overall width w1 is 2.9 ~ 3.1 millimeters, and whole height h1 is 0.15 ~ 0.25 millimeter; The entire length l2 of boss afterbody is 0.9 ~ 1.1 millimeter, and overall width w2 is 1.9 ~ 2.1 millimeters, and whole height h2 is 0.15 ~ 0.25 millimeter.
The size of preferred boss head: the entire length l1 of head is 4 millimeters, and overall width w1 is 3 millimeters, and whole height h1 is 0.2 millimeter; The entire length l2 of boss afterbody is 1 millimeter, and overall width w2 is 2 millimeters, and whole height h2 is 0.2 millimeter.
The shape that soldering dish 50 stolen by the first thief soldering dish 40 and second is identical, and boss includes head and afterbody, and the cross section of described head is triangle, and the cross section of described afterbody is rectangle.
In another embodiment, the shape that soldering dish stolen by the first thief soldering dish and second is different, and the boss of the first thief soldering dish comprises head and afterbody; Second boss stealing soldering dish only has head.
In another embodiment, the shape that soldering dish stolen by the first thief soldering dish and second is different, and the boss of the first thief soldering dish only has head; Second boss stealing soldering dish comprises head and afterbody.
During Reflow Soldering, liquid tin produces inertia at substrate when moving forward, the company's of generation tin defects between closely spaced pad can be made, because the first thief soldering dish and the second boss stealing soldering dish comprise head and afterbody, the cross section of head is triangle, and the cross section of afterbody is rectangle, and it is large that soldering dish tension force stolen by the triangle of boss head, be conducive to tin steathily, thus ensure the not company's of generation tin defects.The width of boss afterbody is larger than the diameter of through hole, is conducive to tin steathily, and can reduces the active force between liquid tin and afterbody gradually, be conducive to liquid tin and flow to boss head.
Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this specification is recorded.
The above embodiment only have expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to utility model patent scope.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (9)
1. the anti-pad connecting tin, comprise substrate and the multiple pin pads being arranged on substrate surface, described pin pad is provided with through hole;
For being positioned at every a line on Reflow Soldering moving direction, that comprise at least two pin pads, arrange the first thief soldering dish in the Reflow Soldering original position of described every a line pin pad, Reflow Soldering end position arranges second and steals soldering dish;
The boss that soldering dish is the rat relative to substrate stolen by described the first thief soldering dish and second.
2. the anti-pad connecting tin according to claim 1, it is characterized in that, the longitudinal profile of described the first thief soldering dish becomes large gradually along Reflow Soldering moving direction, and the described second longitudinal profile stealing soldering dish diminishes gradually along Reflow Soldering moving direction.
3. the anti-pad connecting tin according to claim 2, it is characterized in that, the cross section of described boss is triangle.
4. the anti-pad connecting tin according to claim 3, it is characterized in that, the overall width of described boss is 2.9 ~ 3.1 millimeters, and entire length is 3.9 ~ 4.1 millimeters, and whole height is 0.15 ~ 0.25 millimeter.
5. the anti-pad connecting tin according to claim 1, it is characterized in that, described boss comprises head and afterbody, and described afterbody compares head closer to through hole side; The cross section of described head is triangle, and the cross section of described afterbody is rectangle.
6. the anti-pad connecting tin according to claim 5, it is characterized in that, described head overall width is 2.9 ~ 3.1 millimeters, and entire length is 3.9 ~ 4.1 millimeters, and whole height is 0.15 ~ 0.25 millimeter; The entire length of described afterbody is 0.9 ~ 1.1 millimeter, and width is 1.9 ~ 2.1 millimeters, is highly 0.15 ~ 0.25 millimeter.
7. anti-according to claim 3 or 5 connects the pad of tin, it is characterized in that, the shape of soldering dish stolen by described the first thief soldering dish and second, size is all identical.
8. the anti-pad connecting tin according to claim 1, it is characterized in that, described the first thief soldering dish and second steals the boss height difference of soldering dish in 0.1 millimeter.
9. the anti-pad connecting tin according to claim 1, it is characterized in that, the distance of described the first thief soldering dish and adjacent through-holes equals the distance that second steals soldering dish and adjacent through-holes, and described distance is 1.9 ~ 2.1 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520499290.9U CN204795857U (en) | 2015-07-10 | 2015-07-10 | Prevent even pad of tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520499290.9U CN204795857U (en) | 2015-07-10 | 2015-07-10 | Prevent even pad of tin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204795857U true CN204795857U (en) | 2015-11-18 |
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ID=54535814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520499290.9U Expired - Fee Related CN204795857U (en) | 2015-07-10 | 2015-07-10 | Prevent even pad of tin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204795857U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108288610A (en) * | 2018-04-20 | 2018-07-17 | 深圳市锐钜科技有限公司 | It a kind of design of novel chip tin tailing solder pad and its is applied in red adhesive process |
| CN108347829A (en) * | 2018-03-29 | 2018-07-31 | 广东欧珀移动通信有限公司 | The circuit board and its manufacturing method of continuous tin prevention |
| CN109068502A (en) * | 2018-10-31 | 2018-12-21 | 中新科技集团股份有限公司 | A kind of PCB |
-
2015
- 2015-07-10 CN CN201520499290.9U patent/CN204795857U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108347829A (en) * | 2018-03-29 | 2018-07-31 | 广东欧珀移动通信有限公司 | The circuit board and its manufacturing method of continuous tin prevention |
| CN108288610A (en) * | 2018-04-20 | 2018-07-17 | 深圳市锐钜科技有限公司 | It a kind of design of novel chip tin tailing solder pad and its is applied in red adhesive process |
| CN109068502A (en) * | 2018-10-31 | 2018-12-21 | 中新科技集团股份有限公司 | A kind of PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151118 Termination date: 20180710 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |