TW478303B - Soldering method of printed circuit substrate and spraying-flow soldering vessel - Google Patents

Abstract

There are provided a soldering method of printed circuit substrate and spraying-flow soldering vessel. Melting solder material in an air turbulence status is strongly sprayed to the moving printed circuit substrate in an inclined direction from a one-time spraying-flow nozzle formed with an air turbulence formation mechanism. After the soldering surface of the printed circuit substrate contacts with the melting solder material sprayed in an air turbulence status, the soldering surface contacts with the spraying flow of stable melting solder material sprayed from a second-time spraying-flow nozzle, thereby completing the soldering. The one-time spraying-flow nozzle of the spraying-flow soldering vessel is composed of an entrance side nozzle plate, exit side nozzle plate and a pair of sidewall nozzle plate. The opening of the one-time spraying-flow nozzle has an upwardly inclined seam shape. Furthermore, in the one-time spraying-flow nozzle, there is arranged an air turbulence formation mechanism.

Description

478303 V. Description of the invention (i) < Invention range > The present invention relates to welding and printing by the method of an automatic circuit substrate and a jet nozzle of an automatic device < Background of the invention > Lexus Slots. Conventional automatic welding devices, welding tanks, coolers and other welding processes: There are „preheaters, jets-for parallel walking conveyors, do: carry these equipment, place the board, let it travel on The soldering place Uly holds the base solder between the conveyors, and the preheater is used to pre-apply the + side and the tin substrate is connected with the applicator, or the printed circuit board line and the through-hole brush circuit board are mounted. The solder joints are connected, so the molten solder is soldered :: The electrode is printed into a small through hole, or the sharpness of the electronic part = Koro is not fully penetrated to be incomplete., Then the soldering operation is generally made to print A circuit board is attached to T, and a molten tin solder is provided in a turbulent state. The spray tin material is sprayed twice and the molten tin solder is discharged in a flat state. The spray nozzle is sprayed by the nozzle. The solder has a turbulent waveform, so :: mouth. This-: owe to the inside of the through hole of the substrate and the corner of the electronic part, which can easily invade the printing. Such a turbulent wave of the jet nozzle, Gu Ke I = The connection is not complete, but the molten tin solder is attached to the shovel in a turbulent state: Page 4 478303 V. Explanation of the invention (2) The formation of flash and span in the welding part " flash, the tip is easy to discharge and damage the road substrate If an electronic circuit is formed, it will be short-circuited and lost as a second or as a cross bridge. The task of the nozzle is to modify the function of the primary jet. The secondary jet is flat due to the secondary jet. The flying edge and the bridge are bridged. The edge and the bridge are bridged to remove unnecessary tin material ^ ^ = mouth flow, re-melt flying The conventional jet flow welding tank is set-times = a + turbulent flow is set at the top of the mouth Mechanism, receiving foreigners = He Ming 'in the nozzle or spraying No. 62-46270, the first time the nozzle mouth = = = = moving. For example, the special public Zhao moving body, the swinging body is driven by a motor, so that i i The number of fins becomes shaken so that the jet flow of the primary jet nozzle becomes chaotic ^: rotation, or reciprocating motion, No. 6 2-358 57, at the top of the secondary jet nozzle; a cylindrical body is provided, and so on Cavity spray molten solder has most of the cavities penetrating back and forth to cause turbulent waves. Section 'Meanwhile makes the cylinder but turbulence machine Rotary or reciprocating motion, + device, but if the motor is set in a high-temperature jet, the driving speed of the motor and other motors will affect the speed of the motor. J said: "The problem is that the motor is prone to failure." : The flow state is disturbed. The jet of the material will inevitably cause the mutual wave of the molten tin solder wave === the solder-like solder solder flying away. This small granular tin solder is attached as follows: 2: The short conductors between the narrow conductors often cause short circuits, or the insulation is damaged and the function is impaired. That is to say, it is necessary to make a single jet nozzle allow the molten tin solder to completely penetrate into the inner y, but avoiding the granular tin bucket is also an important condition. Page 5 478303 V. Explanation of the invention (3) If the spray nozzle is provided with the scattering of the granular tin solder driven by an external drive, there is also a proposal to not provide a + one-time spray nozzle (refer to : Special open show 58 — 丨 78593 = a kind of one-jet nozzle that does not use the turbulent flow mechanism, namely tin solder., Narrow mouth ^ mouth, strong spray melting use this: m day: set the conventional jet spray Nozzle's jet welding slot and method for making gas connection. Fig. 4 is a front view of a conventional jet fresh welding slot, and Fig. 5 is an enlarged sectional view of a 啧 used in the conventional jet welding slot. Τ 租 机 嘴Bird material 2, in the Λ1: 2 picture, the body 1 of the jet soldering tank is used for the purpose of soldering. The solder is melted with a heater (not shown). 4ding W secondary nozzle 2 β There is a primary spray nozzle 4 for the jet direction of the jet nozzle in the body 1. These nozzles 3 and 4 are from the arrowheads of Kuriura 5. The molten iron tin material, And through the primary and secondary jet nozzles 6, 7

9, and the jet nozzle 3 are formed by a pair of side wall nozzles and plates with narrow slits on the entrance side nozzle plate 8, and the exit side nozzle plate. The nozzle openings 6 are P-shaped openings of the partition substrate, and the slit-shaped openings are obliquely directed toward the upper-side printed electrical jet. Neat spray of molten tin solder 2 sent from pump 5 from-> 7. The exit state is completely unobtrusive as shown in Fig. 5. The exit side is two-side yoke / wide mouth nozzle 4, and the jet 7 is formed by the entrance side nozzle plate 10, 1,11, and not shown. -Composed of a nozzle plate on the side wall. two

478303 Description of the Five 'Invention (4) The lateral width of the secondary jet nozzle opening 7 is larger than that of the primary jet nozzle opening 6 previously. This second congratulatory nozzle sprays out / eight sisters ★ green ~ ^ 10% molten tin without turbulence < general theory of invention > However, as > conventional »,,, Shega, / paw The nozzle is connected to the printed circuit. The tower once contained printed electronic components on the printed circuit board, 1 W electric circuit, and 1 printed circuit board substrate. The solder solder part was inserted into the metal gate. The phenomenon of lead-through Uchida + L + + million. According to the method of the present invention, the jet nozzle is also used. ^ Α 7, .. It is necessary to attach tin solder to the shadow plastic joint part of the tower, and the soldering part will be attached to the shadow plastic connection part, & The solder can fully penetrate. According to Wan Hehe welding slot, the inventor of the present invention for the use of plume 4 ^ + 4 r ^, but also use Baizhi jet jet nozzle to engage in poor connection, or through-hole tin penetration surname I ^, material bucket The reason for the invasion, Rui Jiu, Guo, Guoguo found what is neat in the knowledge, resulting in the jet state of the jet stream and mouth. Qianliang or tin solder has not fully penetrated, that is, the conventional Hazard + +, ^ < the jet flow soldering tank of the He-He-He nozzle is added with molten tin solder to print the electronic components carried on the tower of the Lei Lu substrate Since the molten tin solder belongs to the state of “敕” and “+ contact” is a rectified state, the only part of the molten tin solder that ca n’t be touched is the same. 丨 M-It can cover thousands of pieces to flow and reach the miss. Moon side attachment. Regardless of how strong the ^ 5,,, e a, ^ g molten tin solder spray potential is, the molten tin solder reaches the depth of the through hole.

The present inventors have found that A is for the purpose of eliminating the spray jet nozzles. And then back to the side shaped part solder. The soldering of the substrate was not attached, and there was once "Although all the soldering holes on the through holes were deliberately researched repeatedly during welding, it is found in the vias" Even if the side of the application is exposed to the solder in contact with the solder Can make welding

478303 V. Description of the invention (5) Good, or the tin solder is turbulent. The first private disc of the present invention, ################################################################################################### ##### It is characterized by the "n, sad-shaped molten tin solder 'surface contact, and the welding is completed from the contact between the secondary solder and the printed circuit board's soldering contact. I. The second invention of the basic invention, Izumi + Each nozzle is characterized by the nozzle opening formed when the inlet d-plate is a flow welding slot 1-times slit-shaped slit i. It is inclined upward. Detailed description of the preferred embodiment > In the present invention, the molten tin solder from-is tilted to produce a strong and "state" molten solder flow force: ::: = printed circuit board. It is a strong substrate, so it is easy to intrude into the printed circuit that runs through the through hole in a slanted state, and it is easy to invade the corner of the part, so the jet flow belongs to the back of the electronic part of the solder. Direct contact with the molten tin seam in this turbulent state, i: two u: in the groove, the nozzle openings form a narrow, thin and molten tin solder jet: enough to spray a strong molten tin solder jet toward the. Formed in the lower part of the slit;: Poor pair: Brush the circuit board and flow in an inclined direction. χ There is a difference. The neat jet at this step becomes five. Explanation of the invention (6) In the present installation, if the jet is changed to the same surface as f's jet, the jet can not be soldered. Furthermore, the turbulent flow of the molten solder according to the present invention is formed on the back surface of the fusion-welded portion, that is, the primary surface of the nozzle plate is approximately one side of the nozzle plate. It is ejected by the nozzle. [Examples] In the following, the enlarged cross section of the spray jet of the present invention and the previously described spray jet welding slot have a jet nozzle of molten solder that is sprayed from the upper nozzle of the jet nozzle jet nozzle. If it is narrow, it will fully penetrate into the through hole in a neat state. . The turbulent waves of the molten solder infiltrated into the printed circuit substrate and the turbulent flow forming mechanism is fixed inside. This turbulent flow formation mechanism is expected to become a turbulent flow state. Because the upper flow of the jet nozzle is not flowed into the back of the welded part only once in the present invention, the used manifold cannot be reached by the jet through the strong plate through-hole or the angle of the electronic parts. The square mechanism is straight or parallel to the entrance side, or it is formed first. It is equipped with a flow nozzle, which is formed by a turbulent flow forming machine, which is disturbed by the tin-melting mechanism. The nozzle plate is thinner. The bottom surface of the bottom of this turbulent nozzle is solder sprayed. In the present invention, the shape of the lower part of the slit and the shape of the side is formed by the flow forming mechanism when the flow is sent in a rectified state, and the tin flow is melted in this state. The molten solder coming from the nozzle on the exit side fixed to the entrance side then forms a single jet stream. Two = the secret picture illustrates the jet stream soldering tank of the present invention. The first figure is =, the front sectional view of two, the second figure is a primary jet nozzle 'two, and the third figure is a plan view of the jet welding slot. I wish the same part of the conventional jet welding tank

Page 9 478303 V. Description of the invention (7) A symbol. 1 is a jet soldering tank, 2 is a molten tin solder, 3 is a primary jet nozzle, 4 is a secondary jet nozzle, 6 is a primary jet nozzle port, and 7 is a secondary jet nozzle port, of which one or two The jet nozzle openings 6 and 7 spray a molten tin solder by a pump (not shown). The primary jet nozzle opening 6 is composed of an entrance-side nozzle plate 8, an exit-side nozzle plate 9, and a pair of side-wall nozzle plates 15,16. The exit-side nozzle plate 9 is pulled up slightly vertically, and the upper portion is bent and inclined in the direction of the entry-side nozzle plate 8. It enters the side nozzle plate 8 to be guided approximately vertically, and the upper side of the upper part is fixed with a screw 15 to the turbulent flow forming mechanism 14. The turbulent flow forming mechanism 14 is a cross-section mesa-shaped plate, and the side surface fixed to the entrance-side nozzle plate 8 is perpendicular to the bottom surface, and the other side surface is inclined at an acute angle with the bottom surface. Its inclination angle is approximately the same as or slightly larger than the inclination angle of the bending of the front nozzle plate 9 on the exit side. That is, the upper part of the exit side nozzle plate 9 and the inclined side of the turbulent flow formation mechanism 14 are parallel to the oblique upper direction, or the slit-shaped primary jet nozzle mouth with a thinner tip is 6 °, and the entrance side nozzle is approximately vertical. The width between the plate 8 and the exit side nozzle plate 9 which is drawn up approximately vertically is slightly enlarged to the halfway, but the upper side of the entry side nozzle plate 8 is provided with a table-shaped turbulent flow forming mechanism, so the primary jet nozzle 3 forms a narrow and thin Seam-like. That is, the primary jet nozzle opening 6 becomes a slit-like one with a step 16 attached to the lower portion. The secondary jet nozzle 4 is composed of an entrance-side nozzle plate 10, an exit-side nozzle plate 11, and a pair of side-wall nozzle plates 16 and 16. The secondary jet nozzle opening 7 formed by the entry-side nozzle plate 10 and the exit-side nozzle plate 11 is much wider than that of the primary jet nozzle opening 6 previously opened. The exit side nozzle plate 11 is provided obliquely downward

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Page 11 478303

478303 V. Description of Invention (ίο) Recording and Recording. This is an excellent effect that conventional devices cannot achieve. In summary, this is a preferred embodiment of the present invention, but it is not intended to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made in accordance with the scope of patent application for the present invention shall be covered by the scope of patent for the invention.

478303 Brief description of the drawings. Figure 1 is a front cross-sectional view of the spray welding tank of the present invention; Figure 2 is an enlarged sectional view of a primary spray nozzle provided in the spray welding tank of the present invention; and Figure 3 is a spray welding tank of the present invention. FIG. 4 is a front cross-sectional view of a conventional jet welding tank provided with a spray jet nozzle, and FIG. 5 is a front cross-sectional view of a conventional jet spray nozzle provided in a jet welding tank. Component name and symbol in the drawing Jet soldering tank body Molten tin solder Primary jet nozzle Secondary jet nozzle Entry side nozzle plate Exit side nozzle plate Printed circuit board

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Claims (1)

478303 VI. Scope of patent application 1. One of the two types of mechanisms: 2. The freshly spliced substrate that is not strong enough to make the jet of the welding material. 2. The seed plate and the nozzle exiting the jet nozzle. The flow forming mechanism is a printed circuit-based jet nozzle. The surface of the jet turbulence is in contact with the surface. The surface is in contact with the nozzle plate and the nozzle on the side of the welding spout to complete the welding jet flow. The soldering method is a method in which turbulent molten solder is formed on the printed circuit board from a slanted side, and molten solder is ejected from the printed circuit in a turbulent state. Smooth melting soldering. The secondary jet nozzle is composed of an inlet side spray and a pair of side wall nozzle plates, which are slit-shaped at one time obliquely upward and simultaneously jet into a mechanism at the same time. The jet welding slot of item 2, wherein the step formed at the lower part of the random slit is different. One