CN107175382A - The spray nozzle plate of selective wave-soldering nozzle arrangements and its composition - Google Patents
The spray nozzle plate of selective wave-soldering nozzle arrangements and its composition Download PDFInfo
- Publication number
- CN107175382A CN107175382A CN201610132547.6A CN201610132547A CN107175382A CN 107175382 A CN107175382 A CN 107175382A CN 201610132547 A CN201610132547 A CN 201610132547A CN 107175382 A CN107175382 A CN 107175382A
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- Prior art keywords
- nozzle
- nozzle arrangements
- tin
- soldering
- degree
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
Abstract
The invention discloses a kind of selective wave-soldering nozzle arrangements, the nozzle arrangements are divided into first be vertically arranged on tin cylinder；And, it is arranged on first, there is second of angle of inclination A in vertical direction with first.The invention also discloses a kind of spray nozzle plate being made up of the selective wave-soldering nozzle arrangements.The present invention can increase the pulling force of unnecessary tin liquor between nozzle tin ripple and pin, reduce interference of the various factors to detin process, and reduction connects tin risk；Reduce overflow scope of the tin ripple on PCB of nozzle, concede bigger space to surface mount elements, it is bad with PCB whole plate sizes that part is washed in reduction.
Description
Technical field
The present invention relates to automotive field, more particularly to a kind of selective wave-soldering nozzle arrangements.The invention further relates to one kind
The spray nozzle plate being made up of the selective wave-soldering nozzle arrangements.
Background technology
The full-scale wave nozzle highest stabilizing unconfined flow crest height of traditional wave-soldering is less than 8mm, i.e., when solder side is designed
There is the element of 8mm height, and need to be usually 2mm to the bottom cover thickness of element in view of tool, that is, work as reality
When element heights are more than 6mm, i.e., traditional wave-soldering can not be used, be designed for the higher electronic circuit board of smaller, density
For, it is necessary to which more flexible welding manner, on this basis, selective wave-soldering arises at the historic moment.
Its basic thinking of selective wave-soldering is that the crest jet size of traditional wave-soldering is reduced to finer and closely woven to adapt to arrangement
Welding hole, smaller jet size can avoid large scale (especially height be more than 6mm) element of solder side, during welding
Programmed in position coordinate mode, pointwise welding (single injector), but the weld interval of this mode is long, it is impossible to realize and criticize
Amount production, then on this basis, has developed selection weldering multiinjector disk welding manner.
Multiinjector disk welding manner is that one pallet can carry the production of varying number as an entirety using whole furnace tray of crossing
Product, to welding in need point position all manufacture a nozzle (nozzle height is 4-6mm) correspondence, i.e., every kind of product
Pallet all corresponds to a set of multiinjector disk.When tin cylinder is lifted on the whole, it is necessary to which the element contact tin ripple of welding is welded, need
The place of position is kept away then without tin liquor, it is not necessary to keep away position processing.After the completion of welding, tin cylinder entire lowering, pallet is from track
Upper output equipment, completes whole welding process.
Multiinjector advantage：
1. disposably welding multiple products, because the beat of tin cylinder is essentially identical, then the product on each pallet is more, single
The beat of individual product is lower, and production efficiency will not be dependent on capacity of equipment, but PCB design size.
2. multiinjector is installed on 500KG tin cylinder, the thermal capacity of whole tin cylinder system is big, for being held using 10KG
For the single injector for measuring tin cylinder, it is more easy to stablize the temperature of solder joint for the strong element of high-power, thermal diffusivity when welding, is difficult
Occur drawing the phenomenons such as point
Multiinjector shortcoming：
1. with reference to shown in Fig. 1, the existing design of multiinjector, after solder joint is combined with tin liquor during work, unnecessary tin liquor is from vertical
Tin liquor of the Nogata in by tin cylinder is pulled because of tension force, during detin, tin liquor by pin length, liquid level,
The various factors such as liquid level flatness, pallet flatness relative with nozzle are disturbed, and easily occur even tin bad.
2. with reference to shown in Fig. 2, in the existing design of multiinjector, the circulation of tin liquor flows back to tin cylinder above nozzle, due to spray
Mouth thickness in itself and alignment error, the nearest component size of pin centre distance keep away position and are greater than 8.2mm, with existing
The design of some nozzles, from nozzle above the Xi Boyi of backflow the element of paster is together washed into tin cylinder.
The content of the invention
The technical problem to be solved in the present invention be technical problems to be solved in this application be to provide it is a kind of can the company's of reduction tin feelings
Condition occurrence probability, reduces the selective wave-soldering nozzle arrangements of the excessive tin scope of nozzle.Present invention also offers one kind by described
The spray nozzle plate of nozzle arrangements composition.
The selective wave-soldering nozzle arrangements that the present invention is provided, wherein：The nozzle arrangements, which are divided into, to be vertically arranged on tin cylinder
First；And, it is arranged at first and goes up and first second in vertical direction with angle of inclination A.
Wherein, the slanted angle A is 12 degree of -22 degree, and the slanted angle A is preferably 14 degree, 15 degree or 16
Degree.
Wherein, relation meets following condition between nozzle arrangements the first minister degree a and second minister's degree b；
8mm≤COSA×b+a≤25mm。
Preferably 12mm≤COSA × b+a≤18mm.
The spray nozzle plate being made up of above-mentioned any one nozzle arrangements that the present invention is provided, wherein：Second inclination of nozzle arrangements
Direction is：Away from the direction with the closest element of nozzle corresponding pin.
The nozzle arrangements of the present invention, second of nozzle inclination will promote tin liquor in vertical and horizontal (to the left) both direction,
Nozzle will provide the horizontal thrust away from element and help tin liquor skew pin and pad when during detin, afterwards in Vertical Square
Depart to the tension force of tin liquor is overcome by gravity with pin.The present invention can increase the drawing of unnecessary tin liquor between nozzle tin ripple and pin
Power, reduces interference of the various factors to detin process, and reduction connects tin risk；Reduce overflow of the tin ripple of nozzle on PCB
Scope, concedes bigger space to surface mount elements, and it is bad with PCB whole plate sizes that part is washed in reduction.
Brief description of the drawings
Fig. 1 is existing selective wave-soldering nozzle arrangements use state schematic diagram one.
Fig. 2 is existing selective wave-soldering nozzle arrangements use state schematic diagram two.
Fig. 3 is selective wave-soldering nozzle arrangements use state schematic diagram one of the invention.
Fig. 4 is Fig. 3 close-up schematic view.
Embodiment
As shown in Figure 3, Figure 4, the selective wave-soldering nozzle arrangements that the present invention is provided, wherein：The nozzle arrangements are divided
To be vertically arranged at first on tin cylinder；And, be arranged at first above has inclination angle with first in vertical direction
Spend second of A, the slanted angle A is 12 degree -22 and spent, the slanted angle A be preferably 14 degree, 15 degree or
16 degree.
Wherein, relation meets following condition between nozzle arrangements the first minister degree a and second minister's degree b；
8mm≤COSA×b+a≤25mm.Preferably 12mm≤COSA × b+a≤18mm.
The spray nozzle plate being made up of above-mentioned any one nozzle arrangements that the present invention is provided, wherein：Second inclination of nozzle arrangements
Direction is：Away from the direction with the closest element of nozzle corresponding pin.
The present invention is described in detail above by embodiment and embodiment, but these are not constituted pair
The limitation of the present invention.Without departing from the principles of the present invention, those skilled in the art can also make many deformations
And improvement, these also should be regarded as protection scope of the present invention.
Claims (6)
1. a kind of selective wave-soldering nozzle arrangements, it is characterized in that：The nozzle arrangements, which are divided into, to be vertically arranged on tin cylinder
First；And, it is arranged at first and goes up and first second in vertical direction with angle of inclination A.
2. selectivity wave-soldering nozzle arrangements as claimed in claim 1, it is characterized in that：The slanted angle A is 12 degree
- 22 degree.
3. selectivity wave-soldering nozzle arrangements as claimed in claim 2, it is characterized in that：The slanted angle A be 14 degree,
15 degree or 16 degree.
4. selectivity wave-soldering nozzle arrangements as claimed in claim 2, it is characterized in that：Nozzle arrangements the first minister degree a and
Second minister's degree b relations are：8mm≤COSA×b+a≤25mm.
5. selectivity wave-soldering nozzle arrangements as claimed in claim 4, it is characterized in that：Nozzle arrangements the first minister degree a and
Second minister's degree b relations are：12mm≤COSA×b+a≤18mm.
6. a kind of spray nozzle plate being made up of claim 1 to 5 any one nozzle arrangements, it is characterized in that：Nozzle arrangements
Two incline directions are：Away from the direction with the closest element of nozzle corresponding pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610132547.6A CN107175382B (en) | 2016-03-09 | 2016-03-09 | Selective wave-soldering nozzle structure and nozzle disc composed of same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610132547.6A CN107175382B (en) | 2016-03-09 | 2016-03-09 | Selective wave-soldering nozzle structure and nozzle disc composed of same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107175382A true CN107175382A (en) | 2017-09-19 |
| CN107175382B CN107175382B (en) | 2020-04-10 |
Family
ID=59830314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610132547.6A Active CN107175382B (en) | 2016-03-09 | 2016-03-09 | Selective wave-soldering nozzle structure and nozzle disc composed of same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107175382B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0738250A (en) * | 1993-07-16 | 1995-02-07 | Matsushita Electric Ind Co Ltd | Wave solder bath |
| CN101293297A (en) * | 2008-06-17 | 2008-10-29 | 杨国金 | Reaction jet welding device and uses thereof |
| CN101600305A (en) * | 2009-06-29 | 2009-12-09 | 深圳创维－Rgb电子有限公司 | A kind of crest tin soldering machine and crest nozzle thereof, tin stove |
| CN203401181U (en) * | 2013-07-23 | 2014-01-22 | 深圳市劲拓自动化设备股份有限公司 | Preheating device of printed circuit board |
| TWM478303U (en) * | 2013-11-11 | 2014-05-11 | I-Chan Kuang | A shoe with a clipping player and a clipping player |
| CN104084661A (en) * | 2014-07-11 | 2014-10-08 | 库尔特机电设备（上海）有限公司 | Nozzle of selective wave soldering equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW478303B (en) * | 2000-09-07 | 2002-03-01 | Senju Metal Industry Co | Soldering method of printed circuit substrate and spraying-flow soldering vessel |
-
2016
- 2016-03-09 CN CN201610132547.6A patent/CN107175382B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0738250A (en) * | 1993-07-16 | 1995-02-07 | Matsushita Electric Ind Co Ltd | Wave solder bath |
| CN101293297A (en) * | 2008-06-17 | 2008-10-29 | 杨国金 | Reaction jet welding device and uses thereof |
| CN101600305A (en) * | 2009-06-29 | 2009-12-09 | 深圳创维－Rgb电子有限公司 | A kind of crest tin soldering machine and crest nozzle thereof, tin stove |
| CN203401181U (en) * | 2013-07-23 | 2014-01-22 | 深圳市劲拓自动化设备股份有限公司 | Preheating device of printed circuit board |
| TWM478303U (en) * | 2013-11-11 | 2014-05-11 | I-Chan Kuang | A shoe with a clipping player and a clipping player |
| CN104084661A (en) * | 2014-07-11 | 2014-10-08 | 库尔特机电设备（上海）有限公司 | Nozzle of selective wave soldering equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107175382B (en) | 2020-04-10 |
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