CN215301074U

CN215301074U - Local solder paste printing tool

Info

Publication number: CN215301074U
Application number: CN202120620364.5U
Authority: CN
Inventors: 韩长州; 李敏; 尹新新; 郭海生; 漆仲科; 郭磊
Original assignee: Gree Electric Appliances Inc of Zhuhai; Gree Hefei Electric Appliances Co Ltd
Current assignee: Gree Electric Appliances Inc of Zhuhai; Gree Hefei Electric Appliances Co Ltd
Priority date: 2021-03-26
Filing date: 2021-03-26
Publication date: 2021-12-24
Anticipated expiration: 2031-03-26

Abstract

The utility model relates to a circuit board production facility technical field especially relates to a local tin cream printing frock, include the bottom plate, locate backing plate on the bottom plate face with locate can cover on the bottom plate to the apron subassembly of backing plate, set up the constant head tank that is used for fixing a position the PCB board on the backing plate, the apron subassembly is including covering the steel mesh piece of backing plate, set up the fretwork position that can align the PCB board and pasted the welding paster device on the side that the steel mesh piece covers the backing plate, just set up the needle file pad hole site that is used for coating tin cream on this side of steel mesh piece, this local tin cream printing frock can be accurate high-efficiently reprint tin cream to the circuit board needle file, has simple structure, easy to operate's advantage.

Description

Local solder paste printing tool

Technical Field

The utility model relates to a circuit board production facility technical field especially relates to a local tin cream printing frock.

Background

With the continuous development and progress of high technology in the electronic industry, electronic components used on a circuit board gradually develop towards integration, surface mounting and miniaturization, so that more and more surface mounting electronic components with small volume, dense pins and the like are used in the production process of the circuit board, and the requirements on the SMT surface mounting production process are higher and higher. For these paster electronic components, the actual production process can have the dress hourglass, skew, weld the unusual (short circuit, desoldering, hourglass welding) scheduling problem, because these paster electronic components are small, and the reason that the concentration is big, adopt traditional manual electric iron to reprocess the circuit board and have the problem of being difficult to operate: the problems that short circuit is not easy to drag and weld, plastic shell packaging is easy to damage by a soldering iron at high temperature and the like exist, so that the circuit board cannot be repaired and can only be scrapped in practice. Therefore, when the chip electronic component is welded abnormally, the chip electronic component is difficult to repair, and the production is influenced.

Disclosure of Invention

The utility model aims at overcoming prior art's problem, providing a local tin cream printing frock, this local tin cream printing frock can be accurate high-efficiently reprint tin cream to circuit board needle file pad, and it has simple structure, easy to operate's advantage.

In order to achieve the above purpose, the utility model adopts the following scheme:

the utility model provides a local tin cream printing frock, includes the bottom plate, locates backing plate on the bottom plate face with locate can cover on the bottom plate to the apron subassembly of backing plate, set up the constant head tank that is used for fixing a position the PCB board on the backing plate, the apron subassembly is including covering the steel mesh piece of backing plate, set up on the side that the steel mesh piece covered the backing plate and align the PCB board and pasted the fretwork position of pasting the welding paster device, just set up the needle file pad hole site that is used for coating tin cream on this side of steel mesh piece.

Further, the apron subassembly still includes the plate body, the apron subassembly passes through the plate body articulates on the face of bottom plate, sunken position has been seted up on the face of plate body, sunken position can supply the backing plate embedding just the degree of depth of sunken position is not more than the thickness of backing plate, steel mesh piece is fixed on the interior bottom surface of sunken position.

Furthermore, a fixing frame is embedded in the inner side wall of the concave position, and the fixing frame presses the steel mesh.

Further, the rigid coupling has two connecting blocks on the face of bottom plate, thereby the plate body is through with two the connecting block is articulated articulate on the face of bottom plate.

Furthermore, supporting blocks are further fixed on the plate surface of the bottom plate, and the supporting blocks and the base plate are correspondingly located on two sides of the distance between the two connecting blocks.

Furthermore, the outer end of the supporting block is an inclined surface, the descending end of the inclined surface faces the connecting block, and the ascending end of the inclined surface faces back to the connecting block.

Furthermore, flannelette is fixedly connected to the inclined surface.

Furthermore, a handle is fixedly connected to the plate body.

Further, the backing plate is a bakelite backing plate.

Furthermore, the structure of the groove cavity of the positioning groove is matched with the structure of the PCB.

Compared with the prior art, the utility model has the advantages of as follows:

the utility model discloses a local tin cream printing frock can accurately fix a position the PCB board and enable the tin cream accurately to coat on the steel mesh, during the use, only need cover the steel mesh then can print the needle file soldering station that has got rid of unusual needle file with the tin cream accurately high-efficiently on the backing plate, the follow-up repair of being convenient for like this pastes new needle file, has avoided the manual electric iron of prior art to repair the problem that leads to, greatly reduced the disability rate of circuit board in the production process.

Drawings

The present application will be described in further detail with reference to the following drawings and detailed description.

Fig. 1 is a schematic top view of the local solder paste printing tool of the present invention.

Fig. 2 is a schematic side view of the local solder paste printing tool of the present invention.

Fig. 3 is a rear view schematic diagram of the local solder paste printing tool of the present invention.

Fig. 4 is a schematic view of the working states of the bottom plate, the plate body, the fixing frame, the connecting block, the supporting block and the handle of the present invention.

The figure includes:

a base plate 1; a backing plate 2; a cover plate assembly 3; a positioning groove 4; a steel mesh sheet 5; a hollowed-out position 6; a needle seat pad hole site 7; a plate body 8; a recessed location 9; a fixed frame 10; a connecting block 11; a support block 12; an inclined surface 13; a lint 14; a handle 15.

Detailed Description

The present application is further described in conjunction with the following examples.

The local solder paste printing tool disclosed in the embodiment comprises a base plate 1, a backing plate 2 arranged on the surface of the base plate 1, and a cover plate assembly 3 arranged on the base plate 1 and capable of covering the backing plate 2, wherein the cover plate assembly 3 is arranged on the base plate 1, so that the cover plate assembly 3 covers the backing plate 2 towards a fixed position. The backing plate 2 is provided with a positioning groove 4 for positioning a PCB, the groove cavity structure of the positioning groove 4 is matched with the structure of the PCB, the PCB for removing the abnormal needle seat can be stably placed on the backing plate 2 through the positioning groove 4, the cover plate component 3 comprises a steel mesh 5 capable of covering the backing plate 2, the side surface of the backing plate 2 covered by the steel mesh 5 is provided with a hollow position 6 capable of aligning with the PCB and provided with a welding patch device, when the steel mesh 5 covers the backing plate 2, the PCB on the backing plate 2 is provided with the welding patch device just on the hollow position 6, the damage of the welding patch device caused by the steel mesh 5 is avoided, the side surface of the steel mesh 5 is provided with a needle seat pad hole position 7 for coating the tin paste, the tin paste is coated on the needle seat pad hole position 7, when the steel mesh 5 covers the backing plate 2 and presses the PCB, the tin paste needle seat is printed on the abnormally removed welding pad, and after the solder paste is printed, the needle base is attached again. Preferably, the backing plate 2 is a bakelite backing plate 2, and the bakelite backing plate 2 protrudes outwards from the bottom surface of the bottom plate 1.

As shown in fig. 4, the cover plate assembly 3 further comprises a plate body 8, the cover plate assembly 3 is hinged to the surface of the bottom plate 1 through the plate body 8, and the cover state of the cover plate assembly 3 can be driven only by turning over the plate body 8 during use. Sunken position 9 has been seted up on the face of plate body 8, sunken position 9 can supply backing plate 2 embedding just sunken position 9's degree of depth is not more than backing plate 2's thickness, steel mesh piece 5 is fixed on sunken position 9's the interior bottom surface, makes the apron can more stably, more accurately press to backing plate 2 like this.

As shown in fig. 4, a fixing frame 10 is embedded in the inner side wall of the recessed portion 9, and the fixing frame 10 presses the steel mesh sheet 5.

As shown in fig. 4, two connecting blocks 11 are fixedly connected to the surface of the bottom plate 1, and the plate body 8 is hinged to the surface of the bottom plate 1 through the two connecting blocks 11, so that the cover plate assembly 3 can smoothly cover the backing plate 2.

As shown in fig. 4, the supporting blocks 12 are further fixed on the surface of the bottom plate 1, the supporting blocks 12 and the backing plate 2 are respectively located on two sides of a distance between the two connecting blocks 11, when the cover plate assembly 3 is lifted, the supporting blocks 12 can support the plate body 8 in the cover plate assembly 3, and the problem that the whole cover plate assembly 3 is turned backwards or downwards to affect the placing stability of the whole tool is avoided. Alternatively, the support blocks 12 can also be arranged on the face of the plate body 8 of the cover plate assembly 3.

As shown in fig. 2, the outer end of the supporting block 12 is provided with an inclined surface 13, the descending end of the inclined surface 13 faces the connecting block 11, and the ascending end of the inclined surface 13 faces away from the connecting block 11, so that the adhesion degree between the plate body 8 and the supporting block 12 in the cover plate assembly 3 can be improved, and the placing stability can be improved. The inclined surface 13 is fixedly connected with flannelette 14, and the flannelette 14 can reduce noise or reduce friction between the plate body 8 and the supporting block 12.

As shown in fig. 4, a handle 15 is fixed to the plate body 8, and the handle 15 facilitates the movement of the cover plate assembly 3, and preferably, the handle 15 is disposed at the outermost end of the plate body 8, so that the cover plate assembly 3 can be moved with less effort.

The utility model discloses a local tin cream printing frock's application method:

the PCB board that will get rid of unusual needle file is fixed a position on constant head tank 4 on backing plate 2, covers the steel mesh piece in the apron subassembly 3, coats the tin cream on needle file pad hole site 7 on steel mesh piece 5, then moves away the apron subassembly, can accomplish the tin cream printing, pastes the needle file again with the PCB board after the printing, and reflow soldering welding is crossed to the secondary again, realizes that the needle file can reprocess and utilize.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the protection scope of the present application, and although the present application is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. The utility model provides a local tin cream printing frock which characterized in that: including the bottom plate, locate backing plate on the bottom plate face with locate can cover on the bottom plate to the apron subassembly of backing plate, offer the constant head tank that is used for fixing a position the PCB board on the backing plate, the apron subassembly is including covering the steel mesh piece of backing plate, set up the fretwork position that can align the PCB board and paste dress welding paster device on the side that the steel mesh piece covered the backing plate, just set up the needle file pad hole site that is used for coating tin cream on this side of steel mesh piece.

2. The local solder paste printing tool according to claim 1, characterized in that: the cover plate assembly further comprises a plate body, the cover plate assembly is hinged to the plate face of the bottom plate, a concave position is formed in the plate face of the plate body, the concave position can supply the base plate to be embedded into the base plate, the depth of the concave position is not larger than the thickness of the base plate, and the steel mesh is fixed to the inner bottom face of the concave position.

3. The local solder paste printing tool according to claim 2, characterized in that: and a fixing frame is embedded in the inner side wall of the sunken position and presses the steel mesh.

4. The local solder paste printing tool according to claim 2, characterized in that: the fixed connection has two connecting blocks on the face of bottom plate, thereby the plate body is through with two the connecting block is articulated articulate on the face of bottom plate.

5. The local solder paste printing tool according to claim 4, characterized in that: the plate surface of the bottom plate is also fixedly provided with supporting blocks, and the supporting blocks and the base plate are correspondingly positioned on two sides of the distance between the two connecting blocks.

6. The local solder paste printing tool according to claim 5, characterized in that: the outer end of the supporting block is an inclined surface, the descending end of the inclined surface faces the connecting block, and the ascending end of the inclined surface faces back to the connecting block.

7. The local solder paste printing tool according to claim 6, characterized in that: flannelette is fixedly connected to the inclined plane.

8. The local solder paste printing tool according to claim 2, characterized in that: a handle is fixedly connected to the plate body.

9. The local solder paste printing tool according to claim 1, characterized in that: the backing plate is a bakelite backing plate.

10. The local solder paste printing tool according to claim 1, characterized in that: the groove cavity structure of the positioning groove is matched with the structure of the PCB.