JPS636154B2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a DIP type IC case, and in particular to a DIP type IC case in which the shape of the lead wire provided in the IC case is improved.
This is about IC cases.

(b) Technical background DIP type IC cases mounted on printed wiring boards are
Lead wires of the IC case are inserted into through holes provided in the printed wiring board, and interconnections are formed via the conductive circuit pattern of the printed wiring board using solder dips or the like. However, as the degree of integration of semiconductor elements increases, the mounting density of printed wiring boards tends to become higher and higher. Therefore, it is impossible to perform all interconnections using conductive circuit patterns formed on printed wiring boards.
Furthermore, when additional components are mounted due to circuit changes, etc., it is necessary to connect the connection wire leading to the outside to the through hole into which the lead wire of the DIP type IC case is inserted. For example, it is necessary to connect the jumper wire of the additionally mounted component. A jumper connection with overlap insertion is performed. When making this jumper connection, the lead wires of the IC case that have been soldered must be removed, and the jumper wires to be connected are inserted and soldered overlapping the lead wires, which reduces work efficiency and reduces reliability. There is a strong demand for a DIP type IC case with good performance.

(c) Prior Art and Problems Figure 1 is a perspective view for explaining a conventional DIP type IC case.
A type IC case 2 is a printed wiring board formed with a plurality of through holes 21 and a conductive circuit pattern 22.

DIP type IC case 1 having the desired degree of integration is
A conductive circuit pattern 22 formed on the lead wire 12 of the IC case 1 and the printed wiring board 2 by inserting the lead wire 12 provided in the IC case 1 into the corresponding through hole 21 of the printed wiring board 2 and using a solder dip or the like. Interconnection is performed by As mentioned above, connections are made as shown in FIGS. 2 and 3 when components are added due to increased packaging density or circuit changes.
That is, FIG. 2 shows a perspective view and b a side sectional view for explaining the state in which jumper wires and lead wires for jumper connection are directly inserted into through holes.
Parts equivalent to those in FIG. 1 are given the same reference numerals. 3 is a jumper wire.

When components are added due to high-density mounting or circuit changes, through-holes 2 of printed wiring board 2
The adhesive, for example, solder, of the lead wire 12 of the IC case 1 bonded to the IC case 1 is melted once, and the jumper wire 3 is added into the through hole 21. The jumper wire 3 is inserted into the through hole 21 so as to overlap with the lead wire 12. Since it is then attached again by soldering or the like, workability is poor and high reliability is reduced. In addition, in Fig. 3, a is a perspective view and b is a side sectional view for explaining the state of jumper connection with a connecting pin interposed, and parts equivalent to those in the previous figure are given the same reference numerals. is a connection pin.

Similarly to FIG. 2, when a jumper connection is required, the adhesive (solder) on the lead wire 12 in the through hole 21 is melted, the lead wire 12 and the connecting pin 4 are overlapped, and the through hole 21 is closed. Insert it inside and glue it together. Since the jumper wire 3 is connected to the connection pin 4, there are disadvantages in that the working efficiency is poor and the reliability is lowered as described above.

(d) Purpose of the Invention In view of the above-mentioned conventional drawbacks, an object of the present invention is to provide a DIP type IC case having a shape that allows jumper wires to be directly connected to a plurality of lead wires provided in the DIP type IC case. That is.

(e) Structure of the invention In order to achieve the above-mentioned object, the present invention provides a DIP type
A lead wire led out from the IC case main body is integrally provided with a pair of connecting portions into which at least two external connecting wires can be separately inserted into the intermediate portion, and the connecting portion includes:
The lead wire is characterized in that each of the pair of protrusions protruding leftward and rightward from the intermediate portion of the lead wire is bent into a U-shaped cross section with its tip substantially touching the intermediate portion.

(f) Embodiments of the invention The following is a DIP type IC according to the present invention with reference to the drawings.
An example of the case will be described in detail.

FIG. 4 is a diagram for explaining one embodiment of the present invention.
is a perspective view, b is a perspective view of lead wires, and 5 is a DIP type IC consisting of a case body 51 and a plurality of lead wires 52.
In the case, the lead wire 52 includes a through hole insertion part 521, an IC case connection part 522, and a jumper wire connection part 523.

A lead wire 52, which corresponds to the conventional lead wire 12 and is made by machining a metal plate, is inserted into the through hole 21 and connected by soldering or the like to the through hole insertion portion 5.
21 and an IC case connection part 522 led out from the case body 51, a pair of connection parts 523 are formed for connecting external connection wires. This DIP type has a pair of protruding pieces that protrude to the left and right sides, each with a square-shaped cross section.
A mounting example of connecting the jumper wire 3 to the IC case 5 is shown in FIG. That is, FIG. 5a is a perspective view, FIG. 5b is a side sectional view, and c is a perspective view of a jumper line. Parts equivalent to those in FIGS. 1 to 4 are given the same reference numerals, and 6 is a This is an insertion pin.

As shown in the figure, the jumper wire connection portion 523 in the center of the lead wire 52 provided in the DIP type IC case 5
is in the shape of a bent socket, so if you want to make a jumper connection, use through hole 1.
Without melting the soldered portion of the lead wire 52 inserted and bonded to the jumper wire 2, the jumper wire 3 may be directly soldered to the jumper wire 3, or an insertion pin 6 attached to the tip of the jumper wire 3 may be inserted. The pair of connecting portions 523 formed on each lead wire 52 can connect two different jumper wires 3, and can connect the jumper wires 3 to each connecting portion 523 at the same time, or connect one of the connecting portions 523 to the pair of connecting portions 523. After connecting the jumper wire 3 to the connecting portion 523, the jumper wire 3 can be connected to the other connecting portion 523 without damaging the connection.

(g) Effect of the invention As is clear from the above explanation, the effects of the invention
According to the DIP type IC case, not only can jumper wire connections be easily and simply made without the need to disconnect already connected lead wires, but also at least two jumper wires can be connected to one lead wire. can be connected simultaneously or at the desired time difference, maintaining the reliability of already connected leads, increasing the efficiency of connecting additional jumper wires, and DIP
This has the effect of making it possible to improve the performance of circuits equipped with type ICs.

[Brief explanation of the drawing]

Figure 1 is a perspective view to explain a conventional DIP type IC case, Figures 2 and 3 are conventional DIP type IC cases.
A to explain the case jumper wire mounting example
is a perspective view, b is a side sectional view, and FIG. 4 is a perspective view of the present invention.
For explaining one embodiment of a DIP type IC case, a is a perspective view, b is a perspective view of a lead wire, FIG. 5 is a perspective view for explaining a mounting example, b is a side sectional view, c
is a perspective view of a push-in pin. In the figure, 1 and 5 are DIP type IC cases, 2 is a printed wiring board, 3 is a jumper wire, 4 is a connection pin, and 6
is the insertion pin, 11, 51 is the case body, 12,
52 is a lead wire, 21 is a through hole, 22 is a conductive circuit pattern, 521 is a through hole insertion portion, 522 is an IC case connection portion, and 523 is a jumper wire connection portion.

Claims (1)

[Claims] 1 A lead wire led out from the DIP type IC case main body is integrally provided with a pair of connecting portions into which at least two external connecting wires can be inserted separately into the middle portion, and the connecting portion is connected to the middle portion of the lead wire. A DIP type IC case, characterized in that a pair of protrusions protruding to the left and right sides are each bent to have a U-shaped cross section with their tips substantially touching the middle portion.