JPS58164253A - Dip type ic case - Google Patents

Dip type ic case

Info

Publication number
JPS58164253A
JPS58164253A JP4668282A JP4668282A JPS58164253A JP S58164253 A JPS58164253 A JP S58164253A JP 4668282 A JP4668282 A JP 4668282A JP 4668282 A JP4668282 A JP 4668282A JP S58164253 A JPS58164253 A JP S58164253A
Authority
JP
Japan
Prior art keywords
case
jumper
lead
wirings
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4668282A
Other languages
Japanese (ja)
Other versions
JPS636154B2 (en
Inventor
Masaoki Ishiwatari
石渡　正翁
Norihiko Shimada
島田　紀彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4668282A priority Critical patent/JPS58164253A/en
Publication of JPS58164253A publication Critical patent/JPS58164253A/en
Publication of JPS636154B2 publication Critical patent/JPS636154B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the working efficiency by providing a connector for an external connection cord at the lead wirings of a DIP type IC case. CONSTITUTION:The lead wirings 52 of an IC case have jumper wire connectors 523 at the intermediate from the inserting part 521 of through holes, which connectors 523 have inlet hole shape. According to this structure, the jumper wirings 3 can be directly soldered or the pin 6 at the end of the jumper wirings can be inserted and connected without melting the solder of the lead wirings 52 after soldering. Or, the top of the lead wirings is bent in ?-shaped to form a connector 723, and jumper wirings connecting hole 724 may be formed. Since the jumper wirings can be connected directly to a plurality of leads of an IC case, the workability can be improved and the reliability can also be improved.

Description

【発明の詳細な説明】 （川　発明の技術分野 本発明は、Ｄ工Ｐ型工Ｃグースに係り、とくにＩＣケー
スに具備したリード線の形状を改蕾したＤＩＰ型■Ｃケ
ースに関するものでおる。[Detailed Description of the Invention] (Technical Field of the Invention) The present invention relates to a DIP type C case, in which the shape of the lead wire provided in the IC case is modified. .

（至）技術の背景 印刷配線板に搭載されるＤＩＰ型ＩＣケースは、該ＩＣ
ケースのリード線を前記印刷配線板に設けられたスルー
ホーＡ／に挿入して半田ディツプ等により印刷配線板の
導電回路パターンを介してインクコネクションが形成さ
れる。ところが半導体素子の集積度向とにより印＃１１
１配線板の実装密度は益々高密度化の傾向にある。した
がって印刷配線板に形成され良導電回路パターンにより
全てのインクコネクションを行うことは不可能な伏線で
あり、さらに回路変疋等により部品を追加搭載する場合
には、前記り工ＰａＩ工Ｃケースのリードを挿入したヌ
ル−ホーＡ／に外部へ導出するコードを接続する必要が
め９１例えば追加搭載する部品のりヤンバー纏を重畳挿
入するジャンパー接続が行われている。このジャンパー
接続を行う場合は一旦半田デイツプした工Ｃケースのリ
ード線を取外して接続するジャンパー線を前記リード線
と重畳挿入し半田付けするために作業能率が悪く、しか
も信頼性が低下するので、作業性の良好なりｌＰｍ１Ｃ
ケースの出現が強く姿望されている。(To) Technical background The DIP type IC case mounted on the printed wiring board is
The lead wire of the case is inserted into the through hole A/ provided on the printed wiring board, and an ink connection is formed via the conductive circuit pattern of the printed wiring board by soldering dip or the like. However, due to the degree of integration of semiconductor elements, mark #11
There is a tendency for the mounting density of one wiring board to become higher and higher. Therefore, it is impossible to make all the ink connections using the well-conducting circuit pattern formed on the printed wiring board.Furthermore, when additional components are mounted due to circuit modification, etc., it is necessary to It is necessary to connect a cord led to the outside to the Null-Ho A/ in which the lead is inserted. For example, a jumper connection is performed to overlap and insert a yellow jacket for additionally mounted parts. When making this jumper connection, the lead wires of the solder-dipped case are removed and the jumper wires are inserted and soldered overlapping the lead wires, which results in poor work efficiency and reduced reliability. Good workability lPm1C
The appearance of cases is strongly expected.

（０）従来技術と問題点 第１図は従来のＤ工Ｐ型工Ｃケースを説明するための斜
視図で、ｌはケース本体１１と該ケース本体１１に具備
した複数のリード線１２からなるＤＩＰ型工Ｃケース、
２は複数のスルーホーＪ％／２１と導電回路パターン２
２を形成してなる印刷配線板である。(0) Prior art and problems Figure 1 is a perspective view for explaining a conventional D-type, P-type, and C case, where l is composed of a case body 11 and a plurality of lead wires 12 provided in the case body 11. DIP mold C case,
2 is multiple through holes J%/21 and conductive circuit pattern 2
This is a printed wiring board formed by forming 2.

所望の集積度を有するＤエル５ＩＣグーフ１を、該工Ｃ
ケースｌに具備したリード線１２の対応する印刷配線板
２のスルーホール２１に挿入し、半田ディップ峰により
、前記ＩＣケースｌのリード線１２と、印刷配線板２に
形成した導電回路パターン２２によりインタコネクショ
ンを行なっている。前述したように、実装密度の高密度
化あるいは回路変更等により部品を追加する場合等の接
続は第２図および第８図のごとく行なわれている。The DEL5IC goof 1 having the desired degree of integration is added to the
The lead wires 12 provided in the case l are inserted into the corresponding through holes 21 of the printed wiring board 2, and the lead wires 12 of the IC case l and the conductive circuit pattern 22 formed on the printed wiring board 2 are connected by solder-dipped peaks. Performing interconnection. As mentioned above, connections are made as shown in FIGS. 2 and 8 when components are added due to increased packaging density or circuit changes.

線とり一ド纏を直接スルーホールに挿入する状態を説明
するための■は斜視図、（至）は側断面図で、第１ｂｌ
Ｊと同等の部分くついては同一符号を付している。８は
ジャンパー線であル。■ is a perspective view, (to) is a side sectional view, and 1st bl is a perspective view to explain the state of directly inserting the wire handle into the through hole.
Parts equivalent to J are given the same reference numerals. 8 is a jumper wire.

高密度実装あるいは回路変更により部品追加等を生じた
ときは、印刷配線板２のスルーホーＡ／２１に接着し九
ＩＣケース！のリード線１２の半田付部を一旦廖解して
前記スルーホーＩｖｚｌ内に追加するジャンパー線８を
前記リード線１２と重畳する形でスルーホール２１内に
挿入して再び半田等により接着しているのでｆＩｐ業性
が急く高信頼性を低下させる原因となっている。また第
８図は接続用ビンを介在せしめてジャンパー接続する状
態を説明するための■は斜視図、（至）は側断面図で、
前面と同等の部分については同一符号を付しており、４
は接続用ピンである。When components are added due to high-density mounting or circuit changes, they are glued to the through-hole A/21 of the printed wiring board 2 to create a 9-IC case! The soldered part of the lead wire 12 is once opened, and the jumper wire 8 to be added into the through hole Ivzl is inserted into the through hole 21 in a manner overlapping with the lead wire 12 and bonded again with solder or the like. As a result, fIp performance rapidly deteriorates high reliability. In addition, in Fig. 8, ■ is a perspective view and (to) is a side sectional view to explain the state of jumper connection with a connecting bottle interposed.
Parts that are equivalent to the front are given the same symbols, 4
is a connection pin.

第２図と同様にジャンパー接続の必要が生じたときはス
ルーホーＡ／２１内のリード纏１２０半田付部を一旦鱗
解し、該リード線１２と接続用ビン４を重畳してス〃−
ホー／Ｉ／２１内に挿入して一体的に接着する。そして
前ｆ３振続用ビン４にノヤンバー線８を接続するので前
述と同様作業能率が悪く、しかも高信頼性が低下すると
いう欠点がめった。Similarly to FIG. 2, when it is necessary to make a jumper connection, first disassemble the soldered part of the lead wire 120 in the through-hole A/21, overlap the lead wire 12 and the connection pin 4, and then
Insert it into Ho/I/21 and glue it together. Since the Noyanbar wire 8 is connected to the front f3 shaking bottle 4, the working efficiency is poor and the reliability is also reduced, as mentioned above.

四　発明の目的 本発明は、上記従来の欠点に鑑み、ＤＩＰｆＭＩＣケー
スに具備した複数のリード線にジャンパー線が１に後接
続で西るような形状としたＤＩＰ型ＩＣケースを提供す
ることを目的とするものである。4. Purpose of the Invention In view of the above-mentioned conventional drawbacks, an object of the present invention is to provide a DIP type IC case in which a jumper wire is later connected to a plurality of lead wires included in the DIPfMIC case. That is.

ｔｅ）　　発明の構成 前述の目的を達成するためｅこ本発明は、印刷配線板の
スルーホール部に挿入して導通をとるリード線を備えた
Ｄ工ＰｇＸＣケースにおいて、前記リード線に外部接続
コードを接続ｉＪ能とする接続部を形成したものでめり
、また辿記リード線の接続部が折り曲げ形成された受口
の形状でろり、ｌＩＩ紀外部接続コードを受口に挿入接
続することを特徴とし、＋１１把リード部の接続部をコ
の字形に折り曲げ突出させ、外部コード挿入孔をそなえ
、前記外部接続コードを、該挿入孔に挿入接続すること
を特徴とする。te) Structure of the Invention In order to achieve the above-mentioned object, the present invention provides a D-type PgXC case that is equipped with a lead wire that is inserted into a through-hole portion of a printed wiring board to establish conduction, and an external connection cord is attached to the lead wire. It has a connection part that can be connected to the IJ function, and the connection part of the trace lead wire has a shape of a socket formed by bending, so that it is possible to insert and connect the III external connection cord into the socket. It is characterized in that the connection part of the +11 grip lead part is bent into a U-shape and protrudes, and is provided with an external cord insertion hole, and the external connection cord is inserted and connected to the insertion hole.

■　発明の寮施圓 以丁図面を参照しながら本発明に係るＤＩＰ型ＩＣケー
スの実施例について鮮細に説明する。(1) Examples of the DIP type IC case according to the present invention will be explained in detail with reference to the drawings.

第４図は本発明の一実施例を説明するための■は＠視図
、（至）はリード線の斜視図で、６は本体ケース６１と
複数のリード線６２からなるＤ工Ｐ型ＩＣケースで、該
リード線６２はスルーホール挿入部６２１とＩＣケース
接続部６２２とジャンパー線接続＠　６２１１とからな
っている。FIG. 4 is a diagram showing an example of the present invention, where ■ is a @ perspective view, (to) is a perspective view of lead wires, and 6 is a D type P type IC consisting of a main body case 61 and a plurality of lead wires 62. In the case, the lead wire 62 consists of a through hole insertion part 621, an IC case connection part 622, and a jumper wire connection @6211.

ＤＩＰ型ＩＣケース６に具備してなるリード線５２は従
来の工Ｃケースｌのリード線１２とヌル−ホール挿入部
６２１と、ＩＣケース接続部６２２は同じであるが、咳
工Ｃタース接続部５２２とスルーホール挿入部５２１と
の中間部にジャンパー線接続部５２８を形成したもので
あり、このＤＩＰ型ＩＣケースにジャンパー線８を！ｊ
！Ｍする！ｌ！鋳例を第５図に示す、すなわち第１ｓ図
四は斜視図、第６図（（２）は両断面図、（０）はジャ
ンパー線の斜視図で、第１図〜第４図と同等の部分には
同一符号を付しており、６は挿入用ビンである。The lead wire 52 provided in the DIP type IC case 6 is the same as the lead wire 12, the null-hole insertion part 621, and the IC case connection part 622 of the conventional case 1, but the lead wire 52 is the same as the conventional case 1. A jumper wire connection portion 528 is formed at the intermediate portion between 522 and the through-hole insertion portion 521, and the jumper wire 8 is connected to this DIP type IC case! j
! Do M! l! The casting example is shown in Fig. 5, that is, Fig. 1s Fig. 4 is a perspective view, Fig. 6 ((2) is a cross-sectional view of both sides, and (0) is a perspective view of the jumper wire, which is equivalent to Figs. 1 to 4). The same reference numerals are given to the parts, and 6 is an insertion bottle.

図で承すごとく、ＤＩＰ型ＩＣケース５に具備したリー
ド線６２の中央のジャンパー線接続部５２８は哲り曲げ
形成され九受口の形状となっているので、ジャンパー接
続を行うｔｉ１Ｍ＆ｕス〃−ホーＡ／１２に挿入接着し
たリード線５２の半田付部を溶解することなく、ジャン
パー線８を直接半田接着あるいは、ジャンパー線８の先
端に付設した神入用ビする形状としている。As shown in the figure, the jumper wire connecting portion 528 at the center of the lead wire 62 provided in the DIP type IC case 5 is bent and shaped into a nine-socket shape. The jumper wire 8 is directly soldered or bonded to the tip of the jumper wire 8 without melting the soldered part of the lead wire 52 inserted and bonded to the wire A/12, or the jumper wire 8 is attached to the tip of the jumper wire 8 in a shape that can be easily attached.

第６図は本発明に係るＤＩＰ型ＩＣケースの池の実施例
を説明するためのれ）は斜視図、（ｂｌはリード線の斜
視図で、７は本体ケース７１と複数のリードＭ７２から
なるＤＩＰａｋｌＩ（、ケースｆ、９リード線７２はス
ルーホー〃挿入部７２１と、ｒｃケース接続部７２２と
、ジャンパー接続部７２８およびジャンパー線挿入孔７
２４とからなっている。FIG. 6 is a perspective view for explaining an embodiment of a DIP type IC case according to the present invention, (bl is a perspective view of a lead wire, and 7 is composed of a main body case 71 and a plurality of leads M72. DIPaklI (case f, 9 lead wire 72 is through-hole insertion part 721, rc case connection part 722, jumper connection part 728 and jumper wire insertion hole 7
It consists of 24.

図のクロく、０１２ｍＩＣケース７に具備したリード線
７２の１部をコの字形に折り曲げ突出せしめたジャンパ
ー線接＠１２Ｂを形成し、該ジャンパー線接続部７２８
の中央に１下に貫通するジャンパー線挿入孔７２４を穿
設しである。このリード線７２を具備したＤ工Ｐｍ工Ｃ
ケース７を第７図に示す。As shown in the figure, a part of the lead wire 72 provided in the 012m IC case 7 is bent into a U-shape to form a protruding jumper wire connection @12B, and the jumper wire connection portion 728
A jumper wire insertion hole 724 is drilled in the center of the hole 724 to penetrate downward. D work Pm work C equipped with this lead wire 72
Case 7 is shown in FIG.

すなわち、第７図は実装例を説明するための側断面図で
、前回と同等の部分についでは同一符号を付しており、
ジャンパー接続の必要を生じた場合は、ジャンパー線３
をジャンパー線挿入孔７２４に挿通し半田等で接着すれ
ばよい。That is, FIG. 7 is a side sectional view for explaining an example of implementation, and the same parts as the previous one are given the same reference numerals.
If you need to connect a jumper, use jumper wire 3.
may be inserted into the jumper wire insertion hole 724 and bonded with solder or the like.

尚、リード線は本実施岡のリード線６２および７２に限
らず、ジャンパー線８の接続が容易ならば如何なる形状
であっても構わない、また外部コードとしてジャンパー
線で説明したが同等の機能をもつものであれば、これに
限定されるものではない。Note that the lead wires are not limited to the lead wires 62 and 72 used in this implementation, but may be of any shape as long as the jumper wire 8 can be easily connected.Also, although the jumper wire was explained as an external cord, it is possible to use a jumper wire with the same function. If it has, it is not limited to this.

■　発明の効果 以１の説明から明らかなように本発明に係るＤエル５Ｉ
Ｃケースによれば、ジャンパー線の接続が容易かつ簡単
に行えるので作＊能率の向上に寄与するとともにリード
線部の半田付部溶解が不要であり、高信頼性の維持でき
る利点がある。■ Effects of the invention As is clear from the explanation in 1 below, the DEL 5I according to the present invention
According to the C case, jumper wires can be connected easily and simply, contributing to improved production efficiency, and there is no need to melt the soldered portion of the lead wire portion, which has the advantage of maintaining high reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のＤＩＰ型ＩＣケースを説明するためのＭ
視図、第２図および第８図は従来のＤＩＰ５ＩＣケース
のジャンパー線実装例を説明するための（川は斜視図、
（至）は側断面図、第４図は本発明に係るＤＩＰ型ＩＣ
ケースの一実施例を説明するためのれ）は斜視図、　（
ｂ）はリード線の斜視図、第５図は実装例を説明するた
めの（〜は斜視図、（至）は側断面図、（Ｃ）は押入ビ
ンの＠挽面、＠６図は本発明に係るＤ工ｐｔｊｊｌｘｃ
ケーヌの池の実ａｔｉ的を説明するためのれ）は斜視図
、山はリード線の斜視図、第７図は実装例を説明するた
めの側断面図である。 図において、ｌ、５および７はＤＩＰ型ＩＣケース、２
は印刷配線板、８はジャンパー線、４は接続用ビン、６
は挿入用ピン、１１．６１および７１は本体ケース、１
２．５２および７２はリード線、２１はスＩレーホー〜
、２２は導ｗｔ回路用パターン、５２１および７２１は
スルーホー〃挿入部。 ５２２および７２２はＩＣケース接続部、６２８および
７２８はジャンパー線接続部、７２４はジャンパー線挿
入孔をそれぞれ示す。 第１図 １ 第２図 第３１！！１ 第４図 第５図 第６図 （（１） １ （ｂ）Figure 1 shows M to explain a conventional DIP type IC case.
The perspective view, FIG. 2, and FIG.
(to) is a side sectional view, and FIG. 4 is a DIP type IC according to the present invention.
To explain one embodiment of the case, () is a perspective view, (
b) is a perspective view of the lead wire, Figure 5 is a perspective view for explaining a mounting example, (to) is a side sectional view, (C) is the @ grinding surface of the closet bin, and Figure @6 is the book. D engineering related to the invention ptjjlxc
7 is a perspective view for explaining the actual structure of the pond, the mountain is a perspective view of a lead wire, and FIG. 7 is a side sectional view for explaining an example of implementation. In the figure, l, 5 and 7 are DIP type IC cases, 2
is a printed wiring board, 8 is a jumper wire, 4 is a connection bottle, 6
is the insertion pin, 11.61 and 71 are the main body case, 1
2. 52 and 72 are lead wires, 21 is SLEHO~
, 22 is a conductive wt circuit pattern, and 521 and 721 are through-hole insertion parts. 522 and 722 are IC case connection parts, 628 and 728 are jumper wire connection parts, and 724 is a jumper wire insertion hole, respectively. Figure 1 Figure 2 Figure 31! ! 1 Figure 4 Figure 5 Figure 6 ((1) 1 (b)

Claims (1)

【特許請求の範囲】 （１１印刷に３１ｉａ板のスルーホール部に挿入して４
通をとるリード線を備えたＤＩＰ型工Ｃケースにおいて
、前記リード線に外部接続コードを接続ＩＩＩＪ能とす
る接続部を形成したことを特徴とするＤ工Ｐｍ、ＩＣケ
ース。 （２）前記リード線の接続部が折り曲げ形成された受口
の形状であや、前記外部接続コードを受口に挿入接続す
ることを特徴とする特許請求の範囲第ｆ１１項に記載の
ＤＩｌＰ型ＩＣケース。 （８）前記リード部の接続部をコの字形に折抄曲げ突出
させ、外部コード挿入孔をそなえ、ｉｒＩ］紀外部接続
コードを、該挿入孔に挿入接続することを特徴とする特
許請求の範囲第１１１項に記載のＤＩＰ型工Ｃケース。[Claims]
A DIP type C case equipped with a lead wire for communication, characterized in that the lead wire is formed with a connecting portion for connecting an external connection cord. (2) The DIlP type IC according to claim f11, characterized in that the connecting portion of the lead wire has a shape of a socket formed by bending, and the external connection cord is inserted and connected to the socket. Case. (8) The connecting portion of the lead portion is bent into a U-shape and protrudes, and an external cord insertion hole is provided, and the external connecting cord is inserted and connected to the insertion hole. DIP type work C case described in Scope No. 111.
JP4668282A 1982-03-23 1982-03-23 Dip type ic case Granted JPS58164253A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4668282A JPS58164253A (en) 1982-03-23 1982-03-23 Dip type ic case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4668282A JPS58164253A (en) 1982-03-23 1982-03-23 Dip type ic case

Publications (2)

Publication Number Publication Date
JPS58164253A true JPS58164253A (en) 1983-09-29
JPS636154B2 JPS636154B2 (en) 1988-02-08

Family

ID=12754145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4668282A Granted JPS58164253A (en) 1982-03-23 1982-03-23 Dip type ic case

Country Status (1)

Country Link
JP (1) JPS58164253A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0442029Y2 (en) * 1987-11-05 1992-10-02

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51151562U (en) * 1975-05-28 1976-12-03

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51151562U (en) * 1975-05-28 1976-12-03

Also Published As

Publication number Publication date
JPS636154B2 (en) 1988-02-08

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