JP2581397B2 - Mounting / connection board for multi-pin circuit elements - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used, for example, in an optical disk device, and mounts and mounts a multi-pin circuit element such as a light receiving element on a device. Related to connection board.

[0002]

2. Description of the Related Art In a conventional optical disk device, a mounting / connection board for a multi-pin circuit element for mounting a light receiving element, which is a multi-pin circuit element, to the apparatus and for connecting to a flexible printed wiring board is shown in FIG. The structure is as shown.

FIG . 2A is a plan view, and FIG. 2B is a side view. In the example shown here, the land portion 3 to which each pin 8 of the light receiving element 7 is soldered is placed on the insulating layer 2 on one side of the substrate 1.
a, a land 3b to be joined to the joint 6 of the flexible printed wiring board 5, and a wiring pattern for wiring the two lands 3a and 3b.

FIG . 3A is a plan view, FIG. 3B is a side view, and FIG. 3C is a bottom view. In the example shown here, a land portion 3a to which each pin 8 of the light receiving element 7 is soldered is formed on the insulating layer 1a on one surface of the substrate 1, and the flexible printed board 5 is formed on the insulating layer 1b on the other surface. The lands 3b to which the joints 6 are joined are printed, and the corresponding lands 3a and 3b on both sides are electrically connected by through holes 9, respectively.

However, in the conventional mounting / connecting board for a multi-pin circuit element as described above, in the case of a structure using one side as shown in FIG. 2 , since all lands are formed on the same plane, the pattern depends on the pattern. Wiring needs to be routed.
In addition, since the arrangement side of the multi-pin circuit element is a bonding surface to another device, the pattern arrangement of the land portion is restricted. As a result, the size of the substrate increases.

In the case of a structure using both surfaces as shown in FIG. 3 , the pitch between the land portions is limited due to the necessity of forming through holes, and the structure becomes complicated. There are problems such as price.

[0007]

As described above, the conventional multi-pin circuit element mounting / connecting board, when used on one side, is increased in size due to restrictions on the pattern arrangement of the lands. Further, in the case of double-sided use, there is a problem that the pitch between the land portions is limited, and the structure is complicated and the price is high.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is possible to reduce the size of the apparatus by reducing the substrate area, and at the same time, to mount a multi-pin circuit element which can be realized at a low price and a narrow pitch. An object is to provide a connection board.

[0009]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is formed by sequentially laminating a metal layer, an insulating layer, and a solder plating layer, and attaching a multi-pin circuit element to a device to be mounted. In a multi-pin circuit element mounting / connection board for connecting a pin circuit element to a flexible printed wiring board, a land portion for pin soldering of the multi-pin circuit element is formed by a solder plating layer, and a flexible printed wiring board is provided near the land portion. Are provided to connect to the land portion, and the multi-pin circuit element has pins facing each other.
A group between the opposing pin groups and the multi-pin group.
The through-hole is provided on the lower surface of the circuit element .

[0010]

In the mounting / connecting board for a multi-pin circuit element having the above structure, the flexible printed wiring board can be directly connected to the land for soldering and fixing the multi-pin circuit element, so that the wiring is not required. Thus, the substrate area can be made relatively small. Moreover, because of the single-sided substrate structure, it can be realized at low cost and at a narrow pitch.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIGS. 1A and 1B show a configuration in which the present invention is applied to a mounting / connection board for a light receiving element mounted on an optical head of an optical disk device, wherein FIG. 1A is a plan view and FIG. 1B is a side view. . The light receiving element 17 shown here has a plurality of pins 18 on both sides. A mounting / connection board for mounting the same is formed by sequentially laminating a metal layer 11, an insulating layer 12, and a solder plating layer, and the solder plating layer is used to land portions for soldering the pins 18 of the light receiving elements 17 respectively. 13 are formed so as to extend toward the center.

Between the land portions 13 facing each other ,
A through hole 14 for inserting a flexible printed wiring board 15 is provided on the lower surface of the light receiving element 17, and the flexible printed wiring board 15 is inserted into the through hole 14 to form a joint 16 at the end. The land 13 is directly soldered and fixed to the center end of the land 13 so as to be connectable.

That is, according to this structure, the through hole 14
After passing through the flexible printed wiring board 15 and soldering the end joints 16 to the center end of the land 13, the flexible printed wiring board 15 of each land 13 is
Each of the formed terminals 18 of the light receiving element 17 can be soldered and fixed to the end on the side where is not joined.

Therefore, if the mounting / connecting board having the above structure is used, the wiring area is not required, so that the board area can be made relatively small, whereby the size of the device to be mounted can be reduced. Because of the structure, it can be realized at a low price and a narrow pitch.

In the above embodiment, the light receiving element is described as an example. However, the present invention is not limited to this, and other multi-pin circuit elements can be realized with the same configuration. In addition, it goes without saying that various modifications can be made without departing from the scope of the present invention.

[0017]

As described above, according to the present invention,
Mounting of multi-pin circuit elements that can be achieved by reducing the board area and miniaturizing the device, and at a low price and at a narrow pitch.
A connection board can be provided.

[Brief description of the drawings]

FIG. 1A is a plan view and FIG. 1B is a side view showing a structure of a light receiving element mounting / connecting substrate mounted on an optical head of an optical disk device as one embodiment of the present invention.

2A is a plan view and FIG. 2B is a side view showing a structure of a conventional mounting / connection board for a multi-pin circuit element.

3 (a) is a plan view, FIG. 3 (b) is a side view, and FIG. 3 (c) is a bottom view showing the structure of another conventional mounting / connection board for a multi-pin circuit element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Insulating layer 3a, 3b Land part 5 Flexible printed wiring board 6 Joining part 7 Light receiving element 8 Pin 9 Through hole 11 Metal layer 12 Insulating layer 13 Land part 14 Through hole 15 Flexible printed wiring board 16 End joint 17 Light receiving Element 18 pin

Claims (2)

(57) [Claims] 1. A multi-pin circuit formed by sequentially laminating a metal layer, an insulating layer, and a solder plating layer, attaching a multi-pin circuit element to a mounted device, and connecting the multi-pin circuit element to a flexible printed wiring board. In the element mounting / connection board, a land portion for pin soldering of the multi-pin circuit element is formed by the solder plating layer, and the flexible printed wiring board is inserted near the land portion to be connected to the land portion. Through holes for the multi-pin circuit element
The child has a group of pins facing each other,
And the lower surface of the multi-pin circuit element,
A mounting / connection board for a multi-pin circuit element, wherein a hole is provided . 2. The multi-pin circuit element according to claim 1, wherein said multi-pin circuit element is a light receiving element.
Connection board.