JPH04299593A - Connection structure of printed wiring board - Google Patents

Connection structure of printed wiring board

Info

Publication number
JPH04299593A
JPH04299593A JP6361091A JP6361091A JPH04299593A JP H04299593 A JPH04299593 A JP H04299593A JP 6361091 A JP6361091 A JP 6361091A JP 6361091 A JP6361091 A JP 6361091A JP H04299593 A JPH04299593 A JP H04299593A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
connection structure
insertion hole
contact terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6361091A
Other languages
Japanese (ja)
Inventor
Tadayoshi Murakami
忠義 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP6361091A priority Critical patent/JPH04299593A/en
Publication of JPH04299593A publication Critical patent/JPH04299593A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To obtain a connection structure of a printed wiring board which can be easily connected with other printed wiring board without thermally damaging a printed wiring board adopting a metal insulative board. CONSTITUTION:An insertion hole 6c is formed in a first printed wiring board 6 wherein an electronic parts 4 is mounted on an insulative board 6a. A second printed wiring board 7 wherein an electronic parts 4 is mounted on a metal insulative board 7a is engaged with the insertion hole 6c in a plug-in manner, thereby coupling both printed wiring boards. A contact terminal 8 of spring metal is soldered to a first printed wiring board or the second printed wiring board, and circuits of both printed wiring boards are connected via the contact terminal 8 in the state that the second printed wiring board is engaged with the above insertion hole.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、複数のモジュールを組
合わせて構成した複合形ハイブリッドICを実施対象と
するプリント配線板の接続構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection structure for a printed wiring board for implementing a composite hybrid IC constructed by combining a plurality of modules.

【0002】0002

【従来の技術】複数のモジュールを組合わせた複合形ハ
イブリッドICの構成として、図7,図8に示すような
プリント配線板の接続構造が従来より知られている。こ
こで、図7は樹脂,ガラスなどの絶縁基板に導体パター
ンを形成して電子部品を実装したプリント配線板1に同
じ構成のプリント配線板2をプラグイン式に結合して両
者の回路間を接続するようにしたものであり、一方のプ
リント配線板1に開口した差込穴に他方のプリント配線
板2の端部を矢印方向に挿入して両者を結合し、この結
合状態で各プリント配線板1,2の導体パターンに形成
した外部端子ランド1aと2aとの間を半田付け(半田
付け部を符号3で示す)している。なお、4はプリント
配線板に実装された電子部品である。一方、図8はパッ
ケージングされたプリント配線板5をプリント配線板1
に組合わせた接続構造であり、プリント配線板5のケー
ス5aから引出したリードピン5bをプリント配線板1
側に形成したスルーホール1bに差し込み、半田付けに
より両者の回路を相互接続している。
2. Description of the Related Art A printed wiring board connection structure as shown in FIGS. 7 and 8 has been known as a structure of a composite hybrid IC in which a plurality of modules are combined. Here, FIG. 7 shows a printed wiring board 1 in which a conductor pattern is formed on an insulating substrate such as resin or glass and electronic components are mounted thereon, and a printed wiring board 2 having the same configuration is connected in a plug-in manner to connect the circuits between the two. The end of the other printed wiring board 2 is inserted in the direction of the arrow into the insertion hole opened in one printed wiring board 1 to connect the two, and each printed wiring board is connected in this connected state. External terminal lands 1a and 2a formed on the conductor patterns of plates 1 and 2 are soldered (the soldered portion is indicated by reference numeral 3). Note that 4 is an electronic component mounted on the printed wiring board. On the other hand, FIG. 8 shows the packaged printed wiring board 5 as printed wiring board 1.
The lead pin 5b pulled out from the case 5a of the printed wiring board 5 is connected to the printed wiring board 1.
It is inserted into a through hole 1b formed on the side, and the two circuits are interconnected by soldering.

【0003】0003

【発明が解決しようとする課題】最近の傾向として、パ
ワーモジュールなどのように発熱量が大きい素子を組み
込んだプリント配線板には、その基板として放熱性の優
れた金属絶縁基板が多く採用されている。ところで、金
属絶縁基板を採用したプリント配線板を図7で述べた方
法で他のプリント配線板に接続すると、プリント配線板
同士をプラグイン結合した後に行う半田付けの際に、熱
伝導性の高い金属絶縁基板側では半田鏝などから与えた
熱が半田付け部から金属基板側に逃げてしまって半田付
け不良を生じるおそれがあるほか、特に半田付けランド
の近傍に既に実装されている電子部品の半田付け部が加
熱により再溶融したりして半田付け接合強度の劣化,部
品のずれなどを引き起すことがある。
[Problems to be Solved by the Invention] As a recent trend, metal insulating substrates with excellent heat dissipation are often used as substrates for printed wiring boards that incorporate elements that generate a large amount of heat, such as power modules. There is. By the way, when a printed wiring board employing a metal insulating substrate is connected to another printed wiring board using the method described in Fig. 7, it is possible to connect the printed wiring board to another printed wiring board using the method described in Figure 7. On the metal insulated board side, heat applied from a soldering iron etc. may escape from the soldering part to the metal board side, causing soldering defects. Soldered parts may re-melt due to heating, causing deterioration of solder joint strength and misalignment of parts.

【0004】このために、従来では金属絶縁基板を採用
したプリント配線板を他のプリント配線板に組合わせて
接続する場合には、図8で述べた接続方式を一般に採用
するようにしているのが現状である。しかしながら、こ
の接続方式では、プリント配線板5がケース5a,リー
ドピン5bなどを装備しているのでコスト高になるほか
、プリント配線板1と組合わせた製品の外形,特に高さ
寸法が大形になる。かかる点、金属絶縁基板のプリント
配線板についても、図7のようにプリント配線板同士を
プラグイン方式に結合する接続構造が採用できれば、製
品全体を小形,コンパクトに構成できる。
For this reason, conventionally, when connecting a printed wiring board employing a metal insulating substrate to another printed wiring board, the connection method described in FIG. 8 has generally been adopted. is the current situation. However, with this connection method, the printed wiring board 5 is equipped with a case 5a, lead pins 5b, etc., which increases the cost, and the product combined with the printed wiring board 1 has a large external shape, especially the height dimension. Become. In this regard, if a connection structure for connecting printed wiring boards of metal insulating substrates in a plug-in manner as shown in FIG. 7 can be adopted, the entire product can be made smaller and more compact.

【0005】本発明は上記の点にかんがみなされたもの
であり、その目的は金属絶縁基板を採用したプリント配
線板と絶縁基板を採用したプリント配線板とを組合わせ
て両者間の回路を相互接続する際に、金属絶縁基板側の
実装部品に対しその半田付け部に熱的な障害を与えるお
それのある半田付け手段を用いることなく、しかもプリ
ント配線板同士をプラグイン式に簡単に接続できるよう
にしたプリント配線板の接続構造を提供することにある
The present invention was conceived in view of the above points, and its object is to combine a printed wiring board employing a metal insulating substrate and a printed wiring board employing an insulating substrate, and to interconnect circuits between the two. When connecting printed wiring boards, it is possible to easily connect printed wiring boards in a plug-in manner without using soldering methods that may cause thermal damage to the soldered parts of mounted components on the metal insulated board side. An object of the present invention is to provide a connection structure for a printed wiring board.

【0006】[0006]

【課題を解決するための手段】上記課題を解決するため
に、本発明は、絶縁基板に電子部品を組み込んだ第1の
プリント配線板に対し、金属絶縁基板に電子部品を組み
込んだ第2のプリント配線板をプラグイン式に接続する
プリント配線板の接続構造として、第1のプリント配線
板側に第2のプリント配線板の端部を挿入する差込穴を
設け、該差込穴に第2のプリント配線板の端部を挿入し
た状態で、接触端子を介してプリント配線板の回路間を
相互接続するよう構成するものとする。
[Means for Solving the Problems] In order to solve the above problems, the present invention provides a first printed wiring board in which electronic components are incorporated in an insulating substrate, and a second printed wiring board in which electronic components are incorporated in a metal insulating substrate. As a printed wiring board connection structure for connecting printed wiring boards in a plug-in manner, an insertion hole is provided on the first printed wiring board side into which the end of the second printed wiring board is inserted, and a second printed wiring board is inserted into the insertion hole. The configuration is such that the circuits of the printed wiring boards are interconnected via the contact terminals with the ends of the printed wiring boards of No. 2 inserted.

【0007】ここで、前記構成における接触端子はばね
性金属端子として作られたものであり、さらに該接触端
子の取付け構造に対する実施態様として、(1)第1の
プリント配線板の差込穴をスルーホールとして形成し、
かつ接触端子を前記スルーホールの導体に対向して第2
のプリント配線板側の導体パターンに半田付する、(2
)接触端子を差込穴内に臨ませて第1のプリント配線板
側の導体パターンに半田付する、(3)接触端子を差込
穴内で接触し合う2個の接触端子に分けた上で、その一
方を第1のプリント配線板側に、他方を第2のプリント
配線板側に半田付する、などの構成がある。
Here, the contact terminal in the above structure is made as a spring metal terminal, and as an embodiment of the mounting structure of the contact terminal, (1) the insertion hole of the first printed wiring board is Formed as a through hole,
and a second contact terminal facing the conductor of the through hole.
Solder to the conductor pattern on the printed wiring board side of (2)
) Solder the contact terminal to the conductor pattern on the first printed wiring board with the contact terminal facing into the insertion hole; (3) Divide the contact terminal into two contact terminals that contact each other within the insertion hole; There is a configuration in which one side is soldered to the first printed wiring board side and the other side is soldered to the second printed wiring board side.

【0008】また、前記の構成で、第1のプリント配線
板側に設置した接触端子の半田付け部を補強するために
、該接触端子の基部を延長して差込穴の近傍に設けた別
なスルーホールに半田付けすることができる。
[0008] Furthermore, in the above structure, in order to reinforce the soldered portion of the contact terminal installed on the first printed wiring board side, the base of the contact terminal is extended and provided in the vicinity of the insertion hole. It can be soldered to a through-hole.

【0009】[0009]

【作用】上記の構成において、第1のプリント配線板に
開口した差込穴へ第2のプリント配線板をプラグイン式
に結合することで、同時に双方のプリント配線板の回路
が接触端子を介して相互接続される。しかもプリント配
線板同士を接続する際には半田付けを行わないので、金
属絶縁基板側の実装部品に対しては、その半田接合部に
はなんらの影響もない。なお、金属絶縁基板を採用した
第2のプリント配線板側に接触端子を設ける場合は、該
接触端子を電子部品を同じ実装工程で同時に半田付けす
ることで対処できる。
[Operation] In the above configuration, by connecting the second printed wiring board in a plug-in manner to the insertion hole opened in the first printed wiring board, the circuits of both printed wiring boards can be simultaneously connected via the contact terminals. interconnected. Moreover, since no soldering is performed when connecting printed wiring boards, there is no effect on the solder joints on the components mounted on the metal insulating board. Note that when contact terminals are provided on the second printed wiring board side that employs a metal insulating substrate, this can be handled by simultaneously soldering the contact terminals to the electronic components in the same mounting process.

【0010】0010

【実施例】以下本発明の実施例を図1〜図6に示して説
明する。なお、各図の実施例において、符号6は絶縁基
板を採用した第1のプリント配線板、7は金属絶縁基板
を採用した第2のプリント配線板、8,9は第1のプリ
ント配線板6と第2のプリント配線板7の回路間を相互
接続する接触端子であり、10は接触端子8,9の半田
付け部を表している。また、第1のプリント配線板6に
ついて、6aは絶縁基板、6bは導体パターン(銅箔)
、6cは第2のプリント配線板7をプラグイン式に結合
するための差込穴、6dは差込穴6cの近傍に形成した
スルーホール、6eは差込穴6cに形成されたスルーホ
ール導体(銅箔)である。一方、第2のプリント配線板
7について、7は金属絶縁基板、7bは導体パターン(
銅箔)である。
Embodiments Examples of the present invention will be described below with reference to FIGS. 1 to 6. In the embodiments shown in the figures, reference numeral 6 indicates a first printed wiring board using an insulating substrate, 7 indicates a second printed wiring board using a metal insulating substrate, and 8 and 9 indicate the first printed wiring board 6. and a contact terminal for interconnecting the circuits of the second printed wiring board 7, and 10 represents the soldered portion of the contact terminals 8 and 9. Regarding the first printed wiring board 6, 6a is an insulating substrate, and 6b is a conductive pattern (copper foil).
, 6c is an insertion hole for connecting the second printed wiring board 7 in a plug-in manner, 6d is a through hole formed near the insertion hole 6c, and 6e is a through hole conductor formed in the insertion hole 6c. (copper foil). On the other hand, regarding the second printed wiring board 7, 7 is a metal insulating board, 7b is a conductive pattern (
copper foil).

【0011】まず、図1の実施例では、接触端子8が第
2のプリント配線板7に装備され、第1のプリント配線
板6の差込穴6cに対向させて導体パターン7bの端部
に半田付けされている。この接触端子8の構造は、図2
で示すように弾性金属板をU字形に湾曲成形したばね性
金属端子として作られたものであり、電子部品4を実装
する際に同じ半田付け工程で同時に半田付けされる。
First, in the embodiment shown in FIG. 1, a contact terminal 8 is installed on the second printed wiring board 7, and is attached to the end of the conductor pattern 7b facing the insertion hole 6c of the first printed wiring board 6. It is soldered. The structure of this contact terminal 8 is shown in FIG.
As shown in the figure, the spring metal terminal is made by bending an elastic metal plate into a U-shape, and is soldered at the same time in the same soldering process when electronic components 4 are mounted.

【0012】かかる構成で、第1のプリント配線板6と
第2のプリント配線板7を接続するには、第1のプリン
ト配線板6の差込穴6cへ第2のプリント配線板7を矢
印のように上方からプラグイン式に嵌め込む。これによ
り、双方のプリント配線板6と7とが機械的に連結し合
うと同時に、接触端子8が差込穴6cのスルーホール導
体6eに加圧接触し、プリント配線板6と7の間で回路
が接続される。
In this configuration, in order to connect the first printed wiring board 6 and the second printed wiring board 7, insert the second printed wiring board 7 into the insertion hole 6c of the first printed wiring board 6 by inserting the second printed wiring board 7 into the insertion hole 6c of the first printed wiring board 6. Insert it in a plug-in style from above as shown. As a result, both printed wiring boards 6 and 7 are mechanically connected to each other, and at the same time, the contact terminal 8 comes into pressure contact with the through-hole conductor 6e of the insertion hole 6c, and the contact terminal 8 is pressed into contact with the through-hole conductor 6e of the insertion hole 6c. The circuit is connected.

【0013】一方、図3の実施例は、第2のプリント配
線板7に設置した接触端子8と接触し合う接触端子9を
第1のプリント配線板6側にも設けたものであり、接触
端子9は端子先端部を差込穴6cに臨ませて端子基部が
導体パターン6bに半田付けされている。このように接
触端子を2個に分けて各プリント配線板6,7に設置す
ることにより、接続部に高い通電容量が確保できるほか
、接続部の強度,耐久性も増すので、保守点検,部品交
換など必要によりプリント配線板7の抜き差しを繰り返
し行うことが可能である。
On the other hand, in the embodiment shown in FIG. 3, contact terminals 9 that come into contact with contact terminals 8 installed on the second printed wiring board 7 are also provided on the first printed wiring board 6 side. The terminal 9 has a terminal base portion soldered to the conductive pattern 6b with the terminal tip portion facing the insertion hole 6c. By dividing the contact terminal into two pieces and installing them on each printed wiring board 6, 7 in this way, a high current carrying capacity can be secured at the connection part, and the strength and durability of the connection part will also be increased, making it easier to maintain and inspect parts. It is possible to repeatedly insert and remove the printed wiring board 7 as necessary for replacement.

【0014】また、図4は前記した図3の実施例の応用
実施例を示すものであり、第2のプリント配線板6に設
置した接触端子9は、その端子基部を延長して差込穴6
cの近傍に形成した別なスルーホール6dに差し込んで
半田付けされている。この構成によれば、接触端子9の
半田付け部が補強される。
FIG. 4 shows an applied example of the embodiment shown in FIG. 6
It is inserted into another through hole 6d formed near c and soldered. According to this configuration, the soldered portion of the contact terminal 9 is reinforced.

【0015】図5の実施例は、第1のプリント配線板6
にのみ、ばね性金属端子として作られた接触端子9を装
着したものであり、第2のプリント配線板7を第1のプ
リント配線板6の差込穴6cへ嵌合すると、同時に接触
端子9が第2プリント配線板7の導体パターン7bに圧
接し、プリント配線板6と7の間で回路が相互接続され
る。
In the embodiment of FIG. 5, the first printed wiring board 6
A contact terminal 9 made as a spring metal terminal is attached only to the terminal, and when the second printed wiring board 7 is fitted into the insertion hole 6c of the first printed wiring board 6, the contact terminal 9 is attached at the same time. is pressed against the conductor pattern 7b of the second printed wiring board 7, and a circuit is interconnected between the printed wiring boards 6 and 7.

【0016】また、図6の実施例は、図5の実施例にお
ける接触端子9の基部を延長し、図4の実施例と同様に
第1プリント配線板6のスルーホール6dへ差し込んで
半田付けしたものである。
Furthermore, in the embodiment shown in FIG. 6, the base of the contact terminal 9 in the embodiment shown in FIG. 5 is extended, and similarly to the embodiment shown in FIG. This is what I did.

【0017】[0017]

【発明の効果】本発明のプリント配線板の接続構造は、
以上説明したように構成されているので次記の効果を奏
する。すなわち、プリント配線板同士を接続する際に半
田付けを行わないので、金属絶縁基板を採用したプリン
ト配線板に対しても、半田付け接続方式の場合に問題と
なる半田付け不良,半田付け箇所の再溶融による部品の
ずれなどの障害を与えるおそれが全くなく、これにより
高密度実装、および製品の品質,信頼性を大幅に向上で
きる。また、プラグイン結合方式,接触端子の採用によ
り製品を小形,コンパクトに構成できるほか、接続が簡
単で、かつ点検,部品交換など必要に応じてプリント配
線板を繰り返し着脱できるなどの利点も得られる。
[Effect of the invention] The connection structure of the printed wiring board of the present invention is as follows:
Since it is configured as described above, the following effects are achieved. In other words, since soldering is not performed when connecting printed wiring boards, even for printed wiring boards that use metal insulated substrates, there is no problem with soldering defects and soldering points that occur when using the soldering connection method. There is no risk of problems such as parts shifting due to remelting, and this enables high-density packaging and greatly improves product quality and reliability. In addition, the use of a plug-in connection method and contact terminals allows the product to be made smaller and more compact, and it also has the advantage of easy connection and the ability to repeatedly attach and detach the printed wiring board as necessary for inspection, parts replacement, etc. .

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明実施例の構成断面図[Fig. 1] A cross-sectional view of the configuration of an embodiment of the present invention

【図2】図1における接触端子の外形斜視図[Fig. 2] External perspective view of the contact terminal in Fig. 1

【図3】本
発明の異なる実施例の構成断面図
FIG. 3 is a cross-sectional view of the configuration of different embodiments of the present invention.

【図4】図3の応用実
施例の構成断面図
[Fig. 4] A cross-sectional view of the configuration of the applied example shown in Fig. 3.

【図5】本発明のさらに異なる実施例
の構成断面図
FIG. 5 is a cross-sectional view of a configuration of still another embodiment of the present invention.

【図6】図5の応用実施例の構成断面図[Fig. 6] A cross-sectional view of the configuration of the applied example shown in Fig. 5.


図7】従来におけるプリント配線板の接続構造例を示す
斜視図
[
Figure 7: A perspective view showing an example of a conventional printed wiring board connection structure

【図8】図7と異なる従来の接続構造例の構成断面図[Fig. 8] A cross-sectional diagram of a conventional connection structure example different from that shown in Fig. 7.

【符号の説明】[Explanation of symbols]

4    電子部品 6    第1のプリント配線板 6a  絶縁基板 6b  導体パターン 6c  差込穴 6d  スルーホール 6e  スルーホール導体 7    第2のプリント配線板 7a  金属絶縁基板 7b  導体パターン 8    接触端子 9    接触端子 10    接触端子の半田付け部 4 Electronic parts 6 First printed wiring board 6a Insulating board 6b Conductor pattern 6c insertion hole 6d Through hole 6e Through-hole conductor 7 Second printed wiring board 7a Metal insulated substrate 7b Conductor pattern 8 Contact terminal 9 Contact terminal 10 Soldering part of contact terminal

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】絶縁基板に電子部品を組み込んだ第1のプ
リント配線板に対して、金属絶縁基板に電子部品を組み
込んだ第2のプリント配線板をプラグイン式に接続する
プリント配線板の接続構造であって、第1のプリント配
線板側に第2のプリント配線板を嵌め込む差込穴を設け
、該差込穴に第2のプリント配線板を挿入した状態で、
接触端子を介してプリント配線板の回路間を相互接続す
るよう構成したことを特徴とするプリント配線板の接続
構造。
Claim 1: A printed wiring board connection in which a second printed wiring board, in which electronic components are incorporated in a metal insulating substrate, is connected in a plug-in manner to a first printed wiring board in which electronic components are incorporated in an insulating substrate. The structure is such that an insertion hole into which a second printed wiring board is inserted is provided on the first printed wiring board side, and the second printed wiring board is inserted into the insertion hole,
A connection structure for a printed wiring board, characterized in that circuits on the printed wiring board are interconnected through contact terminals.
【請求項2】請求項1に記載の接続構造において、接触
端子がばね性金属端子であることを特徴とするプリント
配線板の接続構造。
2. The connection structure for a printed wiring board according to claim 1, wherein the contact terminal is a spring metal terminal.
【請求項3】請求項1に記載の接続構造において、第1
のプリント配線板の差込穴がスルーホールとして形成さ
れ、かつ接触端子が、前記スルーホールの導体に対向し
て第2のプリント配線板側の導体パターンに半田付けさ
れていることを特徴とするプリント配線板の接続構造。
3. The connection structure according to claim 1, wherein the first
The insertion hole of the printed wiring board is formed as a through hole, and the contact terminal is soldered to a conductor pattern on the second printed wiring board side facing the conductor of the through hole. Connection structure of printed wiring board.
【請求項4】請求項1に記載の接続構造において、接触
端子が、端子先端部を差込穴内に臨ませて第1のプリン
ト配線板側の導体パターンに半田付けされていることを
特徴とするプリント配線板の接続構造。
4. The connection structure according to claim 1, wherein the contact terminal is soldered to the conductor pattern on the first printed wiring board side with the terminal tip facing into the insertion hole. Connection structure of printed wiring board.
【請求項5】請求項1に記載の接続構造において、接触
端子が差込穴内で接触し合う2個の接触端子からなり、
その一方が第1のプリント配線板側に、他方が第2のプ
リント配線板側に半田付けされていることを特徴とする
プリント配線板の接続構造。
5. The connection structure according to claim 1, wherein the contact terminal comprises two contact terminals that come into contact with each other within the insertion hole;
A connection structure for a printed wiring board, characterized in that one of them is soldered to a first printed wiring board and the other is soldered to a second printed wiring board.
【請求項6】請求項4,5に記載の接続構造において、
第1のプリント配線板側に設置した接触端子が、その基
部を延長して差込穴の近傍に設けた別なスルーホールに
半田付けされていることを特徴とするプリント配線板の
接続構造。
6. The connection structure according to claims 4 and 5,
A connection structure for a printed wiring board, characterized in that a contact terminal installed on the first printed wiring board side is soldered to another through hole provided in the vicinity of the insertion hole by extending the base of the contact terminal.
JP6361091A 1991-03-28 1991-03-28 Connection structure of printed wiring board Pending JPH04299593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6361091A JPH04299593A (en) 1991-03-28 1991-03-28 Connection structure of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6361091A JPH04299593A (en) 1991-03-28 1991-03-28 Connection structure of printed wiring board

Publications (1)

Publication Number Publication Date
JPH04299593A true JPH04299593A (en) 1992-10-22

Family

ID=13234240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6361091A Pending JPH04299593A (en) 1991-03-28 1991-03-28 Connection structure of printed wiring board

Country Status (1)

Country Link
JP (1) JPH04299593A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0818188A (en) * 1994-06-29 1996-01-19 Nec Niigata Ltd Connectorless printed board connection mechanism
JP2010027412A (en) * 2008-07-22 2010-02-04 Hitachi Ltd Connection structure between printed wiring boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0818188A (en) * 1994-06-29 1996-01-19 Nec Niigata Ltd Connectorless printed board connection mechanism
JP2010027412A (en) * 2008-07-22 2010-02-04 Hitachi Ltd Connection structure between printed wiring boards

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