JP2565733Y2 - Power supply structure of electronic circuit package - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply structure of an electronic circuit package for supplying power to a plurality of electronic circuit packages mounted on an electronic circuit unit.

[0002]

2. Description of the Related Art FIG. 4 is a perspective view of an electronic circuit unit showing a power supply structure of a conventional electronic circuit package. In the figure, 1 is a shelf, 2 is an electronic circuit package mounted on the shelf 1, and the electronic circuit unit 3 has a configuration in which a plurality of electronic circuit packages 2 are mounted in the shelf 1.

[0003] Reference numeral 4 denotes rails mounted above and below the shelf 1. The rails 4 serve as guides when the electronic circuit package 2 is inserted, and are arranged in parallel according to the mounting position of the electronic circuit package 2. I have. A printed wiring board 5 is fixed to the shelf 1 at a position facing an opening serving as an insertion opening of the electronic circuit package 2, and the electronic circuit package 2 to be mounted is mounted on the printed wiring board 5.
, A plurality of connectors 6 are provided.

The electronic circuit package 2 has a plate-like shape in which various electronic circuits are mounted on a board. At an end on the shelf 1 insertion side, a connector 6 on a printed wiring board 5 is fitted. A connector 7 for making an electrical connection between the circuit package 2 and the printed wiring board 5 is attached. In the electronic circuit unit 3 having the above configuration, each electronic circuit package 2
Power is supplied to the printed wiring board 5 from the back surface of the printed wiring board 5 by a cable 8 and the connector 6 on the printed wiring board 5
Via the connector 7 of the electronic circuit package fitted with the connector 6.

[0005]

However, in the conventional power supply structure of the electronic circuit package described above, power is supplied to each electronic circuit package by a connector via a printed wiring board. Wiring boards are expensive, and furthermore, there are structural problems such as having a lot of time for designing and manufacturing and requiring much time for assembling work.

[0006] Further, there is an electrical problem that a voltage drop occurs due to an increase in impedance at the time of mating the connector, causing malfunction, and a connector has a low permissible current value per terminal and cannot flow a large current. is there. Further, it is difficult to repair the terminal when the connector is bent at the time of mating the connector. In a large electronic circuit unit in which a large number of electronic circuit packages are mounted, disconnection due to warpage or bending of the printed wiring board, There are structural problems such as causing defects.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and supplies electric power to each electronic circuit package without using a printed wiring board or a connector, shortens assembly work time, and reduces a large current. An object of the present invention is to provide a power supply structure of an electronic circuit package that can be handled.

[0008]

In order to achieve this object, the present invention provides an electronic circuit unit comprising a plurality of electronic circuit packages arranged in a shelf, and an electronic circuit for supplying power to each of the electronic circuit packages. In a power supply structure of a package, a plurality of cutouts in which a conductor pattern electrically connected to each component on the electronic circuit package is formed on an inner wall surface at an end of each electronic circuit package, The unit is made of a laminated material in which conductive layers and insulating layers are alternately stacked, and from the conductive layers, conductive terminals having spring properties are formed so as to protrude corresponding to the arrangement of the cutouts of each electronic circuit package. With a bus bar,
Power is supplied to each electronic circuit package by press-fitting the conductor terminal into a cutout portion of each stage of each electronic circuit package and supplying power to each conductor layer of the power supply bus bar.

[0009]

According to the present invention having the above-described structure, the conductor terminal of the power supply bus bar has a spring property and is press-fitted to the notch of the electronic circuit package. A conductor pattern is formed on the inner wall surface of the cutout portion of the electronic circuit package that contacts the conductor terminal.The conductor pattern is connected to various components on the electronic circuit package. By supplying power, power is supplied to each electronic circuit package.

[0010]

An embodiment will be described below with reference to the drawings. FIG. 1 is a perspective view of an electronic circuit unit showing a power supply structure of an electronic circuit package according to an embodiment of the present invention. In the figure, reference numeral 11 denotes a shelf, 12 denotes an electronic circuit package mounted on the shelf 11, and an electronic circuit unit 13 has a configuration in which a plurality of electronic circuit packages 12 are arranged and mounted in the shelf 11.

Reference numeral 14 denotes a rail mounted so as to face the upper and lower sides of the shelf 11. The rail 14 serves as a guide when inserting and removing the electronic circuit package 12, and is aligned with the mounting position of the electronic circuit package 12. Are arranged in parallel. The electronic circuit package 12 has a plate-like shape in which various electronic circuits are mounted on a board, and a plurality of cutouts 1 are provided at an end on the insertion side of the shelf 11 indicated by an arrow a.
5 are formed. FIG. 2 is a perspective view of a main part of the electronic circuit package according to the present embodiment showing the configuration of the cutout portion.
A conductor pattern 16 is mounted on the top and is electrically connected to various components (not shown) that receive power.

Returning to FIG. 1, reference numeral 17 denotes a power supply bus bar. The power supply bus bar 17 has a laminated plate structure in which insulating layers 18 are provided on upper and lower surfaces, respectively, and conductor layers 19 and insulating layers 18 are alternately arranged on the inner surface. Has become. In the power supply bus bar 17, the interval between the conductor layers 19 is substantially equal to the interval between the cutouts 15 of the electronic circuit package 12, and the conductor terminals 20 having a resilient spring characteristic are bent from the conductor layer 19.
However, a plurality of protrusions are formed in accordance with the arrangement of the notches 15 when the electronic circuit packages 12 are mounted on the shelf 11.

Reference numeral 21 denotes a power supply terminal protruding from the conductor layer 19.
To supply power to the power supply bus bar 17 from the outside.
Is fixed to the back surface side of the electronic circuit unit 13 so that the conductor terminal 20 projects toward the opening of the shelf 11. The power supply bus bar 17 has a structure in which a conductor layer 19 and an insulating layer 18 are stacked in a direction intersecting the direction of insertion and removal of the electronic circuit package 12 from the shelf 11. 12
In the direction of insertion and extraction.

FIG. 3 is a side sectional view of the electronic circuit unit for explaining the operation when the power supply bus bar and the electronic circuit package are fitted. FIG. 3A shows a state before the electronic circuit package is mounted.
FIG. 3B shows a state at the time of mounting. When the electronic circuit package 12 is mounted, as shown in FIG.
When 2 is inserted in the direction of arrow a along the rail shown in FIG. 1, the notch 15 of the electronic circuit package 12 comes into contact with the tip of the conductor terminal 20 of the power supply bus bar 17. After the contact, when the electronic circuit package 12 is further inserted,
Since the V-shaped conductor terminal 20 has a spring property, as shown in FIG. 3B, the V-shaped ridge is formed while contacting the conductor pattern 16 on the inner wall surface of the cutout 15. The conductor terminals 20 of the power supply bus bar 17 and the conductor patterns 16 of the cutouts 15 of the electronic circuit package 12 are electrically connected to each other by being press-fitted so as to be crushed.

As described above, the cable 22 with the crimp terminal from the outside is connected to the power supply terminal 21 projecting from the conductor layer 19 of the power supply bus bar 17, and the power is supplied to the power supply bus bar 17 from the outside. , Conductor terminal 20
Power is supplied from the power supply bus bar 17 to each electronic circuit package 12 via the conductor pattern 16. In addition,
When the electronic circuit package 12 is removed from the shelf 11, the state shown in FIG. 3B is changed from the state shown in FIG. 3B to the state shown in FIG. Notch 1 of circuit package 12
5 is disengaged from the conductor pattern 16 by press-fitting, and the power supply is cut off.

[0016]

As described above, according to the present invention, a notch is formed at an end portion of an electronic circuit package in which a conductor pattern electrically connected to each component on the electronic circuit package is formed on an inner wall surface. The electronic circuit unit is made of a laminated material in which conductor layers and insulating layers are alternately stacked, and from the conductor layers, the conductive terminals having spring properties correspond to the arrangement of the cutouts of each electronic circuit package. And a power supply bus bar formed so as to protrude, and the conductor terminals are press-fitted into the cutouts of each stage of each electronic circuit package to supply power to each conductor layer of the power supply bus bar. Since there is no need for a printed wiring board to be attached and no need to manufacture and assemble the printed wiring board, it has the effect of reducing the time required for designing, manufacturing and assembling the printed wiring board. Thus, an effect that can be provided at low cost.

In addition, even in a large-sized electronic circuit unit in which a large number of electronic circuit packages are mounted, the power supply bus bar has a conductive layer and an insulating layer in a direction intersecting the direction of inserting and extracting the electronic circuit package from the shelf. Are laminated, so that bending and warping hardly occur, and there is an effect that disconnection or connection failure does not occur. Furthermore, compared with a connector, a large contact area and a large cross-sectional area of a path through which a current flows can be obtained, so that a low impedance and a high allowable current value can be obtained, a large current can flow, and no voltage drop occurs. Since a large current can flow and a voltage drop does not occur, a signal can be transmitted at high speed.

Further, even if the conductor terminal is bent at the time of fitting, since the conductor terminal protrudes from the power supply bus bar, there is an effect that it can be easily repaired.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic circuit unit showing a power supply structure of an electronic circuit package according to an embodiment of the present invention.

FIG. 2 is a perspective view of a main part of the electronic circuit package of the present embodiment.

FIG. 3 is a side sectional view of an electronic circuit unit for explaining an operation when the power supply bus bar and the electronic circuit package are fitted to each other.

FIG. 4 is a perspective view of an electronic circuit unit showing a power supply structure of a conventional electronic circuit package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Shelf 12 Electronic circuit package 13 Electronic circuit unit 15 Notch 16 Conductor pattern 17 Power supply bus bar 18 Insulation layer 19 Conductor layer 20 Conductor terminal

Claims (1)

(57) [Scope of request for utility model registration] An electronic circuit unit comprising a plurality of electronic circuit packages arranged and mounted in a shelf. In a power supply structure of an electronic circuit package for supplying power to each of the electronic circuit packages, an end of each of the electronic circuit packages is provided. A laminated material in which a plurality of cutout portions in which a conductor pattern electrically connected to each component on the electronic circuit package is formed on an inner wall surface are provided, and a conductor layer and an insulating layer are alternately stacked on the electronic circuit unit. And a power supply bus bar protruding from the conductor layer corresponding to the arrangement of the cutouts of the electronic circuit packages. An electronic circuit package characterized in that power is supplied to each electronic circuit package by press-fitting into a notch of a step and supplying power to each conductor layer of a power supply bus bar. Power supply structure.