JPH0355895A - Connecting device for printed wiring board - Google Patents
Connecting device for printed wiring boardInfo
- Publication number
- JPH0355895A JPH0355895A JP19291489A JP19291489A JPH0355895A JP H0355895 A JPH0355895 A JP H0355895A JP 19291489 A JP19291489 A JP 19291489A JP 19291489 A JP19291489 A JP 19291489A JP H0355895 A JPH0355895 A JP H0355895A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- hole
- printed wiring
- wiring board
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000011889 copper foil Substances 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 238000005476 soldering Methods 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims description 2
- 238000003780 insertion Methods 0.000 abstract description 7
- 230000037431 insertion Effects 0.000 abstract description 7
- 238000007747 plating Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、両面に銅箔を印刷されたプリント配線基板の
両面をジャンパー線で接続するプリント配線基板接続装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a printed wiring board connecting device for connecting both sides of a printed wiring board having copper foil printed on both sides with jumper wires.
従来の技術
會ず、片面印刷プリント配線基板に於ける配線間の接続
方法について第４図ａを参照しながら説明する。プリン
ト配線基板２の配！ＩＩ２＆を筐たぐ場合にジャンパー
線１が用いられる。この場合、片面印刷プリント配線基
板２にジャンパー線１を挿入し、半田ディップによって
銅箔３と接続される。First, a method of connecting wires in a single-sided printed wiring board will be described with reference to FIG. 4a. Layout of printed wiring board 2! Jumper wire 1 is used when housing II2&. In this case, the jumper wire 1 is inserted into the single-sided printed wiring board 2 and connected to the copper foil 3 by soldering dip.
次に両面印刷プリント配線基板の両面接続方法について
第４図ｂを参照しながら説明する。両面に印刷された銅
箔３の接続したい部分２ｂに孔をあけ、その孔２ｂにス
ルホールメッキ５を行ない両面の銅箔３を接続する。こ
の時、スルホールメッキ６には銀，銅が一般的に使われ
る。Next, a method for connecting both sides of a double-sided printed wiring board will be explained with reference to FIG. 4b. A hole is made in the portion 2b of the copper foil 3 printed on both sides to be connected, and through-hole plating 5 is applied to the hole 2b to connect the copper foil 3 on both sides. At this time, silver and copper are generally used for the through-hole plating 6.
発明が解決しようとする課題
しかしながら上記の様な構成では、銀スルホールなどの
様に高価な材料を使用することと、片面印刷プリント配
線基板に比較し約２倍の製造工程を要する。よってコス
トが高く、壕た修正などのリードタイムが長いという欠
点がある。ジャンパー線による接続は本来、片面印刷プ
リント配線基板の片面の銅箔接続に使用されている。Problems to be Solved by the Invention However, the above configuration requires the use of expensive materials such as silver through-holes, and the manufacturing process is about twice as long as that of a single-sided printed wiring board. Therefore, it has the drawbacks of high cost and long lead time for repairs, etc. Jumper wire connections are originally used for copper foil connections on one side of single-sided printed wiring boards.
本発明は上記問題点に鑑み、ジャンパー線のみでスルホ
ールメッキをすることなく両面の銅箔間の接続を可能に
するものである。In view of the above problems, the present invention enables connection between copper foils on both sides using only jumper wires without through-hole plating.
課題を解決するための手段
上記問題点を解決する為に本発明のプリント配線基板接
続装置は、半田ディップ面となる第一の面の銅箔に接続
される脚部と他の第二の面より第一の面に臨んで第二の
面の銅箔に接続される折曲部とを有するジャンパー線を
、上記脚部挿入用の第一孔と折曲部挿入用の第二孔とを
有するプリント配線基板に挿入し、上記第一孔近傍の第
一の面に形成した銅箔と第二孔近傍の第二の面に形成し
た銅箔とを上記ジャンパー線の半田ディップによる半田
付で接続するように構成したことを特徴とするものであ
る。Means for Solving the Problems In order to solve the above-mentioned problems, the printed wiring board connecting device of the present invention has a leg part connected to the copper foil on the first surface which becomes the solder dipping surface and the other second surface. A jumper wire having a bent part facing the first side and connected to the copper foil on the second side is inserted into the first hole for inserting the leg part and the second hole for inserting the bent part. The copper foil formed on the first surface near the first hole and the copper foil formed on the second surface near the second hole are soldered by soldering dip of the jumper wire. It is characterized in that it is configured to be connected.
作 用
本発明は、上記した構成によって、ジャンパー線の折曲
部が半田面に臨んでいる為、この折曲部を伝って半田が
吸い上げられ、第二の面側の銅箔と半田付が行なわれ、
第一の面と第二の面との銅箔がジャンパー線によシ接続
される。Function: With the above-described configuration, the bent portion of the jumper wire faces the solder surface, so the solder is sucked up along the bent portion, and the copper foil and solder on the second surface side are absorbed. done,
The copper foils on the first side and the second side are connected by jumper wires.
実施例
以下、本発明の実施例のプリント配線基板接続装置につ
いて図面を参照しながら説明する。Embodiments Hereinafter, printed wiring board connecting devices according to embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例を示す第一の挿入孔１了にジ
ャンパー線１１を挿入し、ジャンパー挿入面よジ角孔で
なる第二の孔１８に向かってジャンパー線１１をプレス
する。すると、ジャンパー線１１に折曲部１１Ａができ
、半田ディップ面に折曲部１１Ａが露出する。最後にデ
ィップすると、折曲部１１Ａを伝って半田が吸い上げら
れ、折曲部近傍の第二の面の銅箔１３Ｂと第一の面の銅
箔１３Ａとが接続される。FIG. 1 shows an embodiment of the present invention, in which a jumper wire 11 is inserted into a first insertion hole 1, and the jumper wire 11 is pressed from the jumper insertion surface toward a second hole 18, which is a square hole. . Then, a bent portion 11A is formed in the jumper wire 11, and the bent portion 11A is exposed on the solder-dipped surface. When the solder is finally dipped, the solder is sucked up along the bent portion 11A, and the copper foil 13B on the second surface near the bent portion and the copper foil 13A on the first surface are connected.
第２図は本発明の第２の実施例を示す。ジャンパー線１
１に折曲部１１Ａを加工し、プリント配線基板１２の第
一の孔１７に直脚，第二の孔１６に折曲部１１Ａを挿入
する。ディップして第一の面と第二の面の銅箔１３Ａ，
１３Ｂが半田付され接続される。FIG. 2 shows a second embodiment of the invention. jumper wire 1
A bent portion 11A is formed in the printed wiring board 12, and the straight leg is inserted into the first hole 17 of the printed wiring board 12, and the bent portion 11A is inserted into the second hole 16. Dip the copper foil 13A on the first side and the second side,
13B is soldered and connected.
第３図は第２図の銅箔が一方の挿入孔近傍になく、半田
接続される箇所が３ケ所となっている。In FIG. 3, the copper foil in FIG. 2 is not located near one of the insertion holes, and there are only three solder connections.
ただし第一の面は補強用として２ケ所に半田付している
。However, the first side is soldered in two places for reinforcement.
発明の効果
以上のように本発明は、半田ディッデ面となる第一の面
の銅箔に接続される脚部と他の第二の面より第一の面に
臨んで第二の面の銅箔に接続される折曲部を有するジャ
ンパー線によって両面の接続を可能にしたので、スルホ
ールメッキによる両面接続方法に比しプリント配線基板
のコスト及び製造工程の削減が出来る。Effects of the Invention As described above, the present invention provides a leg portion connected to a copper foil on a first surface which is a soldering surface, and a copper foil on a second surface facing the first surface from the other second surface. Since it is possible to connect both sides using a jumper wire having a bent portion connected to the foil, the cost of the printed wiring board and the manufacturing process can be reduced compared to a double-sided connection method using through-hole plating.
第１図は本発明のプリント配線基板接続装置の一実施例
を示す工程説明図、第２図は同じ他の実施例を示す工程
説明図、第３図は同じく他の実施例を示す断面図、第４
図は従来のプリント配線基板接続装置を示す断面図であ
る。
１１・・・・・・ジャンパー線、１３・・・・・・プリ
ント配線基板、１３Ａ，１３Ｂ・・・・・・銅箔、１４
・・・・・・半田、１
６・・・・・・第二挿入孔、
１
７・・・・・・第一挿入孔。Fig. 1 is a process explanatory diagram showing one embodiment of the printed wiring board connecting device of the present invention, Fig. 2 is a process explanatory diagram showing another embodiment of the same, and Fig. 3 is a sectional view similarly showing another embodiment. , 4th
The figure is a sectional view showing a conventional printed wiring board connecting device. 11...Jumper wire, 13...Printed wiring board, 13A, 13B...Copper foil, 14
... Solder, 1 6 ... Second insertion hole, 1 7 ... First insertion hole.
Claims (1)
と他の第２の面より第一の面に臨んで第２の面の銅箔に
接続される折曲部とを有するジャンパー線を、上記脚部
挿入用の第一孔と折曲部挿入用の第２孔とを有するプリ
ント配線基板に挿入し、上記第一孔近傍の第一の面に形
成した銅箔と第２孔近傍の第２の面に形成した銅箔とを
上記ジャンパー線の半田ディップによる半田付で接続す
るように構成したことを特徴とするプリント配線基板接
続装置。It has a leg portion that is connected to the copper foil on the first surface that is the solder dipping surface, and a bent portion that faces the first surface from the other second surface and is connected to the copper foil on the second surface. A jumper wire is inserted into a printed wiring board having a first hole for inserting the leg portion and a second hole for inserting the bent portion, and the jumper wire is inserted into a printed wiring board having a first hole for inserting the leg portion and a second hole for inserting the bent portion, and a copper foil formed on the first surface near the first hole and the second hole are inserted. A printed wiring board connecting device characterized in that the jumper wire is connected to a copper foil formed on a second surface in the vicinity of the two holes by soldering using solder dip of the jumper wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19291489A JPH0355895A (en) | 1989-07-25 | 1989-07-25 | Connecting device for printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19291489A JPH0355895A (en) | 1989-07-25 | 1989-07-25 | Connecting device for printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0355895A true JPH0355895A (en) | 1991-03-11 |
Family
ID=16299078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19291489A Pending JPH0355895A (en) | 1989-07-25 | 1989-07-25 | Connecting device for printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0355895A (en) |
-
1989
- 1989-07-25 JP JP19291489A patent/JPH0355895A/en active Pending
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