JPS63115394A - Electronic circuit package - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic circuit package, and particularly to an electronic circuit package mounted on another large substrate called a motherboard.

(Prior art) Electronic components called IC chips or semiconductor elements are
Since they cannot fully function as they are, they are usually mounted on a printed wiring board, or in some cases a large printed wiring board called a motherboard, along with other electronic components. In order to meet the recent demand for smaller electronic devices,
Needless to say, the above-mentioned electronic components as well as the above-mentioned printed wiring boards on which these are mounted are required to be miniaturized.
These demands have been met to some extent. As a result, it has become necessary to mount a wide variety of electronic components on printed wiring boards, so to speak, without gaps.

By the way, the mounting formats of electronic components mounted on printed wiring board-F, which is a large board called a motherboard, are generally of different types. There are two types of components: one that is inserted into a component mounting hole (lead wire insertion and mounting hole) formed on the side (hereinafter referred to as a lead component), and one that is mounted with a connection terminal formed on a printed wiring board, such as a pad. This is a type that is directly electrically connected to the outermost layer conductor circuit (hereinafter referred to as a surface mount component). Normally, lead components such as DIP components are mounted on a conductor circuit formed based on a reference grid of a printed wiring board, whereas connection terminals of surface mount components are not bound by such a reference grid. The connecting terminals of surface mount components that do not correspond to such a reference grid are mounted on conductor circuits that are not formed with the reference grid as a reference. Therefore, in order to efficiently mount these different types of electronic components on a printed wiring board, it is necessary to install conductor circuits that match the above reference grid on the printed wiring board and connect surface mount components that do not form the reference grid. Two types of conductor circuits that match the terminals must be simultaneously designed and formed.

However, although it is relatively easy to design and form a conductor circuit on a printed wiring board based on a reference grid, as mentioned above, conductor circuits based on a reference grid are not related to the reference grid. It is extremely difficult to design and form a conductor circuit of various states on a single printed wiring board. Although it has become relatively easy to design and form only conductor circuits based on reference grids due to the development of automatic design equipment, it is relatively easy to design and form conductor circuits that are not based on reference grids, especially as described above. This is because the reality is that it is impossible to design and form a conductor circuit that is not based on a reference grid, even including a conductor circuit that is based on a reference grid, without relying on human hands.

Therefore, the inventors have conducted intensive research on how to efficiently mount lead components such as DIP components and surface mount components on a printed wiring board, which is a large board called a motherboard. , each electronic component to be mounted on a printed wiring board is divided into groups of lead components such as DIP components and surface mount components, and lead components such as DIP components are directly mounted on a printed wiring board, which is a large board called a motherboard. The surface mount components are mounted on a printed wiring board that is separate from the large board called the motherboard, and the surface mount components are assembled separately and then mounted on a printed wiring board that is separate from the motherboard. The present invention was completed based on the new finding that mounting on a motherboard can improve mounting efficiency.

(Problems to be Solved by the Invention) The present invention was made based on the above-mentioned circumstances, and the problem to be solved is to mount electronic components of various types on a printed wiring board called a motherboard. The problem is the difficulty in designing and forming conductor circuits on the printed wiring board.

It is an object of the present invention to create a simple electronic circuit package that facilitates the design and formation of conductive circuits on a printed wiring board called a motherboard by integrating only surface-mounted components. It consists in providing by configuration.

(Means for solving the problems) The means taken by the present invention to solve the above problems are as follows:
To explain with reference to FIGS. 1 and 2 corresponding to the embodiment, [an electronic circuit package mounted on a motherboard (40) via connection pins (15),
40) of the electronic components (20) and (30) to be mounted on the printed wiring board (11).
These surface mount components (20) and printed wiring board (1
This is an electronic circuit package (10)J characterized in that at least the surface of 1) is resin-sealed (17)L/.

That is, the electronic circuit package (10) according to the present invention first includes holes for mounting components (lead wire insertion holes) in which connection terminals are formed on the board side among the electronic components to be mounted on the motherboard (40). ), and select only surface mount components (20) other than those of the type to be mounted by inserting them into It is implemented as a single package.

The above means will be explained in detail below according to specific examples shown in the drawings.

FIG. 1 shows an exploded perspective view of an electronic circuit package (10) according to the present invention. This electronic circuit package (l
O), only the surface mount components (20) to be mounted on the motherboard (40) are mounted on the printed wiring board (11).
), and these surface mount components (2
0) is connected to the fifth via the electronic circuit package (10).
It is mounted on the motherboard (40) shown in the figure together with other REIT components (30) such as DIP components. Note that the sealing resin (17) is not shown in FIG.

Printed wiring board (11) for electronic circuit package (10)
Although a variety of types can be applied, it is necessary to have a conductor circuit (13) on at least the surface thereof. Each surface mount component (
This is because the connection terminals 20) need to be directly connected on the surface of the printed wiring board (11). The first of these
The printed wiring board (
11), an inner layer conductor circuit (12) is formed not only inside this outer layer conductor circuit (I3) but also inside the outer layer conductor circuit (I3). These inner layer conductor circuits (12) and outer layer conductor circuits (1
3) are appropriately electrically connected via through holes (14) formed in the printed wiring board (11).

Some of the through holes (14) in each through hole (14)
4), a connecting pin (15) is inserted therethrough and fixed as shown in FIG. This connection pin (15) is longer than the height of each lead component (30) such as each DIP component mounted on the motherboard (40) located below the electronic circuit package (10), As a result, when the electronic circuit package (10) is mounted on the motherboard (40) after lead components (30) such as DIP components are mounted on the motherboard (40), the electronic circuit package (10) is mounted on the motherboard (40). ) and motherboard (
40) to prevent interference with lead components (30) such as the DIP components above.

In addition, each through hole (4) to which these connection pins (15) are fixed is formed on a reference grid corresponding to the reference grid on the motherboard (40), and solder (16) is formed as necessary. It is fixed in the corresponding through hole (14) by. This allows the electronic circuit package (
10), if only the conductor circuits and connections that fit the reference grid are formed on the motherboard (40), the connection terminals of each surface-fabricated component (20) on the electronic circuit package (10) will be aligned with the motherboard. (40) It becomes possible to implement the grid even if it is not formed to correspond to the above reference grid.

And the printed wiring board (11) configured as above
Each surface mount component (20) is mounted on the top.

As shown in FIG.
) There are flat back components that are electrically connected by contacting the outer layer conductor circuit (13) formed on J- with solder (16), and outer layer on printed wiring board (moon) using solder (]6). It includes what is called a chip component that is electrically connected to the conductor circuit (13). Further, in the example shown in FIG. 2, each surface mount component (20) is mounted not only on the upper side of the printed wiring board (11) but also on the lower side of the printed wiring board (11).

Each surface mount component (20) mounted on the printed wiring board (11) as described above and the surface of the printed wiring board (11) are sealed with a sealing resin (17) as shown in FIG. has been done. Of course, in this case, each connection pin (15
) is not sealed with the sealing resin (17) in order to maintain electrical continuity between the electronic circuit package (]0) and the motherboard (40).

Moreover, as shown in FIGS. 1 and 5, on each surface mount component (20) and printed wiring board (11) sealed with the sealing resin (17), a sealing IF cap is further placed. (18) may be used for sealing. In particular, when sealing with metal sealing caps (18) is repeated, the metal sealing caps (18) can improve noise resistance and prevent noise radiation. It is something.

The electronic circuit package (10
) is mounted on the motherboard (40) as shown in FIG. i.e. motherboard (40)
A conductor circuit is formed based on a reference grid so that only lead components (30) such as DIP components can be mounted.
After mounting all of the electronic circuit packages (10
) connects to the motherboard (40) through each connection pin (15).
It is implemented on the side.

In this example, the electronic circuit package (10
) is mounted on the motherboard (40) via a socket (old).

(Actions of the Invention) By adopting the above-described measures, the present invention has the following effects.

Since the printed wiring board (1]) constituting the electronic circuit package (10) is for mounting only surface mount components (20), each surface mount component to be formed on this printed wiring board (11) The outer layer conductor circuit (13) and inner layer conductor circuit (12) for (20) are connected to the motherboard (4).
Unlike the conductor circuit on the 0) side, there is no need to form it based on a reference grid. Therefore, in that sense, the printed wiring board (
11) outer layer conductor circuit (13) and inner layer conductor circuit (12)
) can be designed freely.

Moreover, in this electronic circuit package (10), each surface mount component (20) is mounted on the surface thereof, and the connection terminal of each surface mount component (20) is connected to the outer layer conductor circuit (I3). Electrical connections are made in one way. That is, -1 parts like DIR parts (
30) electrical connection to the connection hole and surface mount component (
Although the method of electrical connection to the outer layer conductor circuit (13) of 20) is different, since the electronic circuit package (10) has no lead components (30) such as DIP components, Lead parts like (30)
There is no need for a connection method compatible with surface mount components (
It is only necessary to make connections compatible with 20).

Furthermore, since the surface mount components (20) to be mounted on the motherboard (40) are grouped together on the electronic circuit package (10), the design and formation of the conductor circuits on the motherboard (40) are difficult. Since this can be done by designing based on a reference grid corresponding to lead components (30) such as DIP components, the design and manufacture of the motherboard (40) itself is facilitated. In particular, if the position of each connection pin (15) of the electronic circuit package (10) corresponds to the reference grid on the motherboard (40), the formation of the conductor circuit on the motherboard (40) will be easier. Since it is only necessary to focus on the lead components (30) such as each DIP component, the electronic circuit package (10) makes it easier to manufacture the motherboard 1 (40).

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to embodiments shown in the drawings.

(Example) The electronic circuit package (10) of this example is as shown in FIG.
), each surface mount component (20) is mounted on both the front and back surfaces of a printed wiring board (11) formed in a multilayer (4 layers), and these surface mount components (20) and the printed wiring board (
After the surface of 11) is sealed with a sealing resin (17), the top surface is further sealed with a sealing cap (18).

That is, in the printed wiring board (11) constituting this electronic circuit package (10), in order to improve the mounting density of each surface mount component (20) to be mounted on the printed wiring board (11), a copper-clad heat-resistant glass epoxy substrate is used. A conductive circuit was formed by etching, and three copper-clad heat-resistant glass epoxy substrates thus formed were laminated to form a printed wiring board (11).

Further, necessary through holes (14) were formed in the printed wiring board (11) thus formed, and an inner layer conductor circuit (12) was formed inside the through hole (14).

On both sides of the printed wiring board (II) formed in this way,
The surface mount components (20), a flat back component and a chip component, were soldered and mounted.

Thereafter, connecting pins (15) are inserted into each through hole (14) of this printed wiring board (11) and fixed to the printed wiring board (11) with solder, and the lower end of each of these connecting pins (15) as shown in the figure is Seal 1F resin (
17) was formed on the surface of each surface mount component (211) and printed wiring board (11). In addition, in order to improve the heat dissipation of the electronic circuit package (10), a -
Metal seal 11 - Seal 11 with cap (18)
-.

-1- On the printed wiring board (]l), surface mount components (
20) and the connecting pin (15) can be provided in two ways, and each method will be explained below.

First, as shown in FIG. 3, the first method is to mount each surface mount component (211) on a printed wiring board (1[)L, and then connect each connection pin (15) to the corresponding through hole ( 1
4) is a method of press-fitting and inserting. This method is
Suitable for cases where each connection pin (15) can be fixed (erected) by simply fitting into a through hole (14), and is suitable for a printed wiring board ( 11) can be mounted using only low melting point solder.

The second method is as shown in FIG. In other words, it is suitable for cases where each connecting pin (15) needs to be fixed with high melting point solder after fitting, and each connecting pin (15) is fixed to the through hole (14) with high melting point solder. Later, each surface mount component (211) is mounted using a low melting point solder. In this second method, for example, the printed wiring board (]1 is placed in a molten solder bath suitable for fixing each connection pin (15).
) is immersed before mounting each surface mount component (20), it is possible to avoid an adverse effect on each surface mount component (20) due to the heat of the molten solder.

(Effects of the Invention) As detailed above, the present invention provides an electronic circuit package mounted on a motherboard (40) via connection pins (15) as exemplified in the above embodiments. , motherboard (
40) of the electronic components (20) and (30) to be mounted on the printed wiring board (11).
These surface mount components (20) and printed wiring board (1
1) At least the surface of the circuit board (17) is sealed with resin (17). This makes it easy to design and form conductor circuits on a printed wiring board called a motherboard (40). Electronic circuit package (
10) can be provided with a simple configuration.

That is, according to this electronic circuit package (10),
Printed wiring board (11) with only surface mount components (211)
Since the electronic circuit package (10) is mounted on the motherboard (40), the design and formation of the conductor circuit on the motherboard (40) is
Since the design can be performed based only on the reference grid corresponding to the lead components (30) such as IP components, the motherboard (40) itself can be easily designed and manufactured. In other words, conventional surface mount components (20) and lead components such as DIP components (30)
When designing a motherboard (40) with a mixture of The circuit and the conductor circuit based on the reference grid corresponding to the lead component (30) such as the DIR component must be manually formed, and it usually takes three workers about 20 days to design. However, when the electronic circuit package (lO) of the present invention is adopted, the design of the motherboard (40) itself requires two workers to design the printed wiring board (11) itself. The design was completed in about three days by one person. Of course, the motherboard (40) and printed wiring board (1
Another advantage of adopting the electronic circuit package (10) is that the design of 1) can be performed separately and simultaneously.

Also, as shown above, the motherboard (40) and printed wiring board (11) can be designed separately.
As in the case of conventional motherboard (40) designs, surface mount components (20) and REIT components (such as DIR components)
Since there is no need to design a complicated conductor circuit for mixing the electronic circuit package (1) and
0) and the circuit design on the motherboard (40) on which this is mounted can be done without having advanced technology.

Further, in the electronic circuit package (10) according to the present invention, the surfaces of the surface mount component (20) and the printed wiring board (11) mounted thereon are coated with a resin pair 1F (17)L.

Additionally, the moisture resistance of the surface mount component (20), which is inferior to a REIT component (30) such as a DTP component, can be improved. This means that the electronic circuit package (10) is further fitted with a metal sealing cap (18).
In the case of sealing with , it is possible to make the layer more pronounced.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of an electronic circuit package according to the present invention, FIG. 2 is an enlarged sectional view taken along the line ■-■ in FIG.
FIGS. 3 and 4 are cross-sectional views showing a method for forming the electronic circuit package, and FIG. 5 is a perspective view showing the electronic circuit package being mounted on a motherboard. Explanation of symbols 10...Electronic circuit package, [1...Printed wiring board 12...Inner layer conductor circuit, 13-...Outer layer conductor circuit, 14-...Through hole, 15... Connection pin, 1
6-...Solder, 17...Resin for seal 1, 18...Double cap, 20...Surface mount component, 30...DI
REIT parts like R parts, 40...Mother boat,
41...Socket. that's all

Claims (1)

[Claims] 1) An electronic circuit package mounted on a motherboard via connection pins, wherein only surface mount components among the electronic components to be mounted on the motherboard are mounted on a printed wiring board. , An electronic circuit package characterized in that at least the surfaces of these surface mount components and printed wiring boards are sealed with resin. 2) A patent claim characterized in that the length of the connection pins provided upright on the printed wiring board is longer than the height of electronic components mounted on a motherboard located below the electronic circuit package. The electronic circuit package according to item 1 of the scope. 3) The electronic circuit package according to claim 1 or 2, wherein the connection pins are provided upright on a reference grid of the printed wiring board corresponding to a reference grid of the motherboard. . 4) The electronic circuit package according to any one of claims 1 to 3, wherein the surface mount components are mounted on both sides of the printed wiring board. 5) The electronic circuit package according to any one of claims 1 to 4, wherein the printed wiring board has a multilayer structure having an inner layer conductor circuit.