JPH0292971U - - Google Patents
Info
- Publication number
- JPH0292971U JPH0292971U JP248589U JP248589U JPH0292971U JP H0292971 U JPH0292971 U JP H0292971U JP 248589 U JP248589 U JP 248589U JP 248589 U JP248589 U JP 248589U JP H0292971 U JPH0292971 U JP H0292971U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lead wire
- hole
- resin
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Description
第１図は本考案の一実施例による回路基板の側
断面図、第２図は同実施例による回路基板のリー
ド線引出し部分の拡大図、第３図は同実施例によ
る回路基板の斜視図、第４図は同実施例による回
路基板のアース基体への取付部分の正断面図、第
５図は回路基板上に実装される電気回路における
バイアホールによるワイヤーのボンデイング部分
を示す側断面図、第６図は従来の回路基板を示す
斜視図である。
１……回路基板、２……アウターモールド成形
部、３……リード線、４……穴、５……導体、６
……ハンダ付部分、１１……金属板、１２……絶
縁材、１５……モールド成形部。
FIG. 1 is a side sectional view of a circuit board according to an embodiment of the present invention, FIG. 2 is an enlarged view of the lead wire extraction portion of the circuit board according to the same embodiment, and FIG. 3 is a perspective view of the circuit board according to the same embodiment. , FIG. 4 is a front cross-sectional view of the attachment part of the circuit board to the earth base according to the same embodiment, and FIG. 5 is a side cross-sectional view showing the bonding part of the wire by the via hole in the electric circuit mounted on the circuit board. FIG. 6 is a perspective view showing a conventional circuit board. DESCRIPTION OF SYMBOLS 1... Circuit board, 2... Outer mold molding part, 3... Lead wire, 4... Hole, 5... Conductor, 6
...Soldered part, 11...Metal plate, 12...Insulating material, 15...Molded part.
Claims (1)
つて被覆された電気回路から外部接続用のリード
線を引き出すようにした回路基板であつて、回路
基板にあけられた穴に回路基板の下側からリード
線を差し込んで、そのリード線の先端を回路基板
上に形成された電気回路の所定箇所にハンダ付け
するようにしたことを特徴とする回路基板。 ２ 回路基板の下面におけるリード線の引き出し
部分を樹脂によつて被覆したことを特徴とする前
記第１項の記載による回路基板。[Scope of Claim for Utility Model Registration] 1. A circuit board from which lead wires for external connection are drawn out from an electric circuit mounted on the circuit board and entirely covered with resin, which has a hole in the circuit board. A circuit board characterized in that a lead wire is inserted into the hole from the bottom of the circuit board, and the tip of the lead wire is soldered to a predetermined location of an electric circuit formed on the circuit board. 2. The circuit board according to item 1 above, wherein the lead wire extension portion on the lower surface of the circuit board is covered with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002485U JPH0741179Y2 (en) | 1989-01-12 | 1989-01-12 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989002485U JPH0741179Y2 (en) | 1989-01-12 | 1989-01-12 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0292971U true JPH0292971U (en) | 1990-07-24 |
| JPH0741179Y2 JPH0741179Y2 (en) | 1995-09-20 |
Family
ID=31203287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989002485U Expired - Lifetime JPH0741179Y2 (en) | 1989-01-12 | 1989-01-12 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741179Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012109382A (en) * | 2010-11-17 | 2012-06-07 | Hitachi Cable Ltd | Connection structure and method of circuit board and lead wire |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63115394A (en) * | 1986-11-01 | 1988-05-19 | イビデン株式会社 | Electronic circuit package |
-
1989
- 1989-01-12 JP JP1989002485U patent/JPH0741179Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63115394A (en) * | 1986-11-01 | 1988-05-19 | イビデン株式会社 | Electronic circuit package |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012109382A (en) * | 2010-11-17 | 2012-06-07 | Hitachi Cable Ltd | Connection structure and method of circuit board and lead wire |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0741179Y2 (en) | 1995-09-20 |