JPH03110857U - - Google Patents

Info

Publication number
JPH03110857U
JPH03110857U JP1990019874U JP1987490U JPH03110857U JP H03110857 U JPH03110857 U JP H03110857U JP 1990019874 U JP1990019874 U JP 1990019874U JP 1987490 U JP1987490 U JP 1987490U JP H03110857 U JPH03110857 U JP H03110857U
Authority
JP
Japan
Prior art keywords
semiconductor device
wiring board
lead
hole
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990019874U
Other languages
Japanese (ja)
Other versions
JP2509095Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990019874U priority Critical patent/JP2509095Y2/en
Publication of JPH03110857U publication Critical patent/JPH03110857U/ja
Application granted granted Critical
Publication of JP2509095Y2 publication Critical patent/JP2509095Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体装置の実施例を示
す正面断面図、第２図は第１図の要部拡大図であ
る。 ２……配線基板、７……外部導出入用リード、
８……モールド材、９……接着層。 FIG. 1 is a front sectional view showing an embodiment of a semiconductor device according to the present invention, and FIG. 2 is an enlarged view of the main part of FIG. 2...Wiring board, 7...External lead-in/out lead,
8...Mold material, 9...Adhesive layer.

Claims (1)

【実用新案登録請求の範囲】 １ 配線基板と外部導出入用リードとの接続導通
部がモールド材でモールドされてなる半導体装置
において、配線基板と外部導出入用リードとをは
んだ材またはろう材で接着導通し、このはんだ材
またはろう材を配線基板の接続導通部に穿孔され
た貫通孔の内部にまで充填したことを特徴とする
半導体装置。 ２ 請求項１の半導体装置において、外部導出入
用リードの接続導通部にも貫通孔を穿孔し、この
貫通孔の内部にも前記はんだ材またはろう材を充
填したことを特徴とする半導体装置。[Scope of Claim for Utility Model Registration] 1. In a semiconductor device in which a connecting conductive part between a wiring board and an external lead-in/out lead is molded with a molding material, the wiring board and the external lead-in/out lead are connected with a solder material or a brazing material. What is claimed is: 1. A semiconductor device characterized in that adhesive conduction is achieved, and the solder material or brazing material is filled into the inside of a through hole drilled in a connection conduction portion of a wiring board. 2. The semiconductor device according to claim 1, wherein a through hole is also formed in the connection conductive portion of the external lead/in/out lead, and the inside of this through hole is also filled with the solder material or brazing material.
JP1990019874U 1990-02-28 1990-02-28 Semiconductor device Expired - Lifetime JP2509095Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990019874U JP2509095Y2 (en) 1990-02-28 1990-02-28 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990019874U JP2509095Y2 (en) 1990-02-28 1990-02-28 Semiconductor device

Publications (2)

Publication Number Publication Date
JPH03110857U true JPH03110857U (en) 1991-11-13
JP2509095Y2 JP2509095Y2 (en) 1996-08-28

Family

ID=31522978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990019874U Expired - Lifetime JP2509095Y2 (en) 1990-02-28 1990-02-28 Semiconductor device

Country Status (1)

Country Link
JP (1) JP2509095Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184525A (en) * 2005-12-07 2007-07-19 Mitsubishi Electric Corp Electronic apparatus
JP2011023748A (en) * 2005-12-07 2011-02-03 Mitsubishi Electric Corp Electronic apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63160261A (en) * 1986-12-23 1988-07-04 Kyocera Corp Electronic component with lead
JPH01136358A (en) * 1987-11-24 1989-05-29 Hitachi Chem Co Ltd Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63160261A (en) * 1986-12-23 1988-07-04 Kyocera Corp Electronic component with lead
JPH01136358A (en) * 1987-11-24 1989-05-29 Hitachi Chem Co Ltd Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184525A (en) * 2005-12-07 2007-07-19 Mitsubishi Electric Corp Electronic apparatus
JP2011023748A (en) * 2005-12-07 2011-02-03 Mitsubishi Electric Corp Electronic apparatus

Also Published As

Publication number Publication date
JP2509095Y2 (en) 1996-08-28

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Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term