JPS6451271U - - Google Patents
Info
- Publication number
- JPS6451271U JPS6451271U JP14499587U JP14499587U JPS6451271U JP S6451271 U JPS6451271 U JP S6451271U JP 14499587 U JP14499587 U JP 14499587U JP 14499587 U JP14499587 U JP 14499587U JP S6451271 U JPS6451271 U JP S6451271U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- printed circuit
- utility
- circuit board
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の一実施例におけるリード線固
定基板の平面図、第２図は同リード線固定基板の
側面断面図、第３図は従来のリード線固定部分を
示す側面断面図、第４図は他の従来例を示す側面
断面図である。
１……プリント基板、１ａ……穴、２……リー
ド線、３……ハンダ、５……樹脂。
FIG. 1 is a plan view of a lead wire fixing board according to an embodiment of the present invention, FIG. 2 is a side sectional view of the same lead wire fixing board, and FIG. 3 is a side sectional view showing a conventional lead wire fixing part. FIG. 4 is a side sectional view showing another conventional example. 1...Printed circuit board, 1a...hole, 2...lead wire, 3...solder, 5...resin.
Claims (1)
るものにおいて、合わせハンダ部及び、その周辺
をリード線被覆の溶融温度と同等以下の成型温度
の樹脂によつて、一体的に成型固定したリード線
固定基板。 (2) プリント基板の両面に樹脂が貫通し一体成
形できる穴を配設した実用新案登録請求の範囲第
１項記載のリード線固定基板。[Scope of Claim for Utility Model Registration] (1) In products in which lead wires are joined and soldered to a printed circuit board, the joined solder part and its surroundings are integrally formed with a resin whose molding temperature is equal to or lower than the melting temperature of the lead wire coating. Lead wire fixing board molded and fixed. (2) The lead wire fixing board according to claim 1 of the utility model registration claim, wherein holes are provided on both sides of the printed circuit board through which resin can penetrate and be integrally molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14499587U JPS6451271U (en) | 1987-09-22 | 1987-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14499587U JPS6451271U (en) | 1987-09-22 | 1987-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6451271U true JPS6451271U (en) | 1989-03-29 |
Family
ID=31413195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14499587U Pending JPS6451271U (en) | 1987-09-22 | 1987-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6451271U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5015351B1 (en) * | 1969-10-23 | 1975-06-04 |
-
1987
- 1987-09-22 JP JP14499587U patent/JPS6451271U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5015351B1 (en) * | 1969-10-23 | 1975-06-04 |