JP3045592B2 - Wiring board with interlayer connector having multiple core conductors - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board having an interlayer connector having a plurality of core conductors, and more particularly to a wiring board between conductor circuit forming layers on different wiring boards provided in a vertical position with respect to each other. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board which enables a desired electrical connection without significantly increasing the overall size.

[0002]

2. Description of the Related Art Conventionally, in order to make a desired electrical connection between conductive circuit forming layers on different wiring boards provided inside and below each other in a positional relationship with each other, a conductive pin serving as an external connection terminal must be provided. Is used.

[0003]

However, in a conventional wiring board having the above-described conductor pins, for example, a plurality of independent wiring boards (for example, In order to electrically connect the (2) conductive circuits to the corresponding conductive circuits provided on the conductive circuit forming layer of the wiring board different from this, the number corresponding to the number of the conductive circuits is required. It is necessary to prepare a conductor pin of this type. For this reason, in order to form a required interlayer connector on the conductor circuit formation layer as described above, it is necessary to increase the area of the area accordingly. Met.
In a wiring board having through-hole plating for connecting conductor pins as described above, one of the remedies for reducing the area required for forming a required interlayer connector is to use concentric circles having different diameters. A technique of forming a plated through hole on a conductor circuit forming layer is disclosed. However, although such a technique is effective for a conductor circuit on a plurality of conductor circuit formation layers, a plurality of independent conductor circuits on one layer of the conductor circuit formation layer are formed through the plated through holes. Cannot be connected on the same plane. Moreover, the development of conductor pins that can be easily and reliably connected to such multiple through holes has been delayed.

The present invention relates to connecting a plurality of independent conductor circuits on one layer of a conductor circuit formation layer to a plurality of independent conductor circuits on a conductor circuit formation layer of another wiring board. Accordingly, it is an object of the present invention to solve the above-mentioned problems in the prior art in which a large area is required for forming an interlayer connector.

[0005]

SUMMARY OF THE INVENTION A wiring board with an interlayer connector having a plurality of core conductors according to the present invention has been made to achieve the above object, and is provided at an appropriate position on the wiring board. The interlayer connector is for making a desired electrical connection between conductive circuit forming layers on different wiring boards provided in a vertical positional relationship with each other . And before
The interlayer connector is composed of a plurality of core conductors inside a columnar insulator.
Are arranged in parallel in the axial direction, and the end of the columnar insulator
, A part of the side surface of the core conductor is exposed,
Of the columnar insulator to the extent that the insulator is left.
A concave portion is formed, and a plurality of independent conductor circuits on one layer of a predetermined conductor circuit forming layer can be connected on the same plane to the plurality of core conductors arranged in the interlayer connector. It is characterized by having.

[0006]

In the wiring board with an interlayer connector having a plurality of core conductors according to the present invention, the interlayer connectors provided at appropriate positions on the wiring board are provided on different wiring boards provided in a vertical positional relationship to each other. It is intended for causing the desired electrical connection conductor circuit forming layers of the interlayer connectors
Means that a plurality of core conductors are arranged in a columnar insulator in the axial direction.
At the end of the columnar insulator
Exposing a part of the side of the conductor but leaving the insulator between the core conductors
Recesses are formed on the side surfaces of the columnar insulator to the extent that
Is, characterized by being a plurality of conductor circuits independent in one layer on a given conductor circuit layer, the connectable to the plurality of core conductors, wherein is disposed interlayer connection body on the same plane A plurality of conductor circuits formed in different wiring boards, having an integrated interlayer connector having a columnar outer shape and a plurality of core conductors electrically insulated from each other in the axial direction of the columnar outer shape. Since it is used as an interlayer connector of a formation layer, a plurality of conductor circuits can be guided between layers with an area equal to or slightly larger than the area occupied by a single interlayer connector on the conductor circuit formation layer. Further, since the interlayer connector has the above configuration, a plurality of independent conductor circuits on one layer of the conductor circuit forming layer are connected on the same plane to the plurality of core conductors arranged in the integrated interlayer connector. be able to. In addition, the interlayer connector has a core at one end.
Exposing a part of the side of the conductor but leaving the insulator between the core conductors
Recesses are formed on the side surfaces of the columnar insulator to the extent that
The interlayer connector is mounted on the wiring board and
Connected to a conductor circuit using a connection conductor such as pad paste.
When the extra connection conductor is inserted into the recess formed in the insulator,
It stays and remains between core conductors to prevent penetration.
It is. Therefore, the adjacent core conductor due to the outflow of the connection conductor
The electrical insulation between the bodies can be reliably prevented from lowering.
You.

[0007]

The present invention will be described in detail with reference to several examples.

(Embodiment 1) Embodiment 1 is a case in which the present invention is applied to an external connection terminal portion of an electronic component mounting package, and will be described below with reference to FIGS.
The first embodiment will be described. First, FIG. 1 shows an interlayer connector (1) used in the first embodiment, which has, for example, a cylindrical outer shape with a diameter of 2 millimeters and a height of 3 millimeters. (Here, four) of core conductors (12) made of a required material such as Kovar or phosphor bronze are electrically insulated from each other in the axial direction of the columnar outer shape. It is integrally formed by filling with an insulator (11) made of a suitable material such as epoxy resin or polyimide resin. Although not shown in FIG. 1, the insulator (11) is divided into a structure for individually covering each core conductor (12) and another structure for integrating the individually covered core conductors. It has a separate structure, and each structure is made of a resin made of a different material. In the interlayer connector (1), the upper end of the core conductor (121) is exposed at the upper end thereof, and the lower end of the core conductor (122) is exposed at the lower end thereof. Here, especially with respect to the core conductor lower end portion (122), the purpose is to facilitate connection via a connection conductor as will be described later and to ensure electrical insulation between mutually adjacent core conductors. For this reason, the insulator (11) is left between the lower end portions (122) of the core conductors exposed as described above.
As a method of partially removing the insulator (11) so that only the lower end portion (122) of the core conductor remains, an appropriate method selected according to the material of the insulator (11) is used. A laser may be used. 2 and 3
Shows required manufacturing steps in the first embodiment. That is, on a substrate (4) (in this example, a metal substrate having a high heat dissipation property is used) in which the above-mentioned interlayer connector (1) is adhered or pressure-bonded to a predetermined through-hole, A wiring board (2) having one end protruding from one of the conductor circuits (21) (only two of them are shown in FIGS. 2 and 3) is bonded via an adhesive layer (3). The manufacturing process is shown. Further, by using an appropriate connection conductor (5) such as a solder paste, the four conductor circuits (21) and the four core conductor upper end portions (12
Electrical connection with 1) is made. FIG. 4 shows a process in which a required electronic component (6) is mounted on the wiring board (2) and sealed with an appropriate sealing resin (7). At this time, simultaneously with the sealing of the electronic component (6), the connection between the upper end portion (121) of the core conductor and the conductor circuit (21) is also sealed with the sealing resin (7). Here, as the sealing resin (7) for sealing the electronic component (6), it is preferable to select a material having a high heat transfer effect on the metal substrate (4). FIG. 5 shows a package in which required electronic components are mounted.
Four electrically independent conductive circuits (81) on one plane of the motherboard (8) (two shown in FIG. 5)
Is connected and mounted using an appropriate connection conductor (5) such as a solder paste.

(Embodiment 2) FIGS. 6 and 7 show Embodiment 2 according to the present invention. The differences between the second embodiment and the first embodiment are as follows. That is, the wiring board (2) shown in FIG.
(Two lines are shown in FIG. 6 and four lines are shown in FIG. 7) on the same plane on the base material.
The shape of the connection portion with the upper end portion (121) of the core conductor was formed in a ring shape, and a gas vent hole (22) capable of releasing gas generated at the time of connection was formed on the base material near the connection portion. There is such a difference. The gas vent hole (22) can also be used as an injection hole for the sealing resin. By making such a change, the degree of freedom of positioning of the four conductor circuits is improved, and connection with the upper end portion (121) of the core conductor is facilitated. Of the connecting conductor (5) can be prevented from flowing out between the adjacent conductor circuits (21).

(Embodiment 3) FIG. 8 shows an embodiment 3 according to the present invention. The differences between the third embodiment and the second embodiment are as follows. That is, in the wiring board (2), plated through holes (9) are formed at the tips of four conductor circuits (21) (two of which are shown in FIG. 8). Connection conductor (5) such as solder paste also in plated through hole (9)
Is a difference between the third embodiment and the second embodiment. By making such a change, it becomes easier to confirm the electrical connection between the four conductor circuits and the upper end portion (121) of the core conductor, and the reliability has been improved.

(Embodiment 4) FIGS. 9 and 10 show an embodiment 4 according to the present invention. The differences between the fourth embodiment and the first embodiment are as follows. That is, in the fourth embodiment, the upper end portion (121) of the core conductor is also
For the purpose of facilitating connection via connection conductors as will be described later and ensuring electrical insulation between adjacent core conductors, between exposed core conductor top ends (121) Although the insulator (11) is left in this embodiment, this is a difference from the first embodiment. In order to leave only the upper and lower end portions (121) of the core conductor and partially remove the insulator (11), as in the case of the first embodiment, the insulator (11) is used. An appropriate laser selected according to the material of (1) can be used. By making such a change, four conductor circuits (2) having one end protruding on the same plane in the through hole of the wiring board (2)
1) (two wires are shown in FIG. 9) and the electrical connection work between the four core conductor upper ends (121) is facilitated,
The connection status can be easily checked, and the reliability has been greatly improved.

[0012]

As described above in detail, the wiring board with an interlayer connector having a plurality of core conductors according to the present invention has a structure in which the interlayer connectors provided at appropriate positions on the wiring board are vertically positioned with respect to each other. It is for making a desired electrical connection between conductor circuit formation layers on different wiring boards provided in a relationship, and the interlayer connection body has a columnar outer shape,
In addition, a plurality of core conductors are arranged so as to be electrically insulated from each other in the axial direction inside the plurality of core conductors, and a plurality of independent conductor circuits on one layer of a predetermined conductor circuit forming layer are provided in the interlayer connector. The configuration is characterized in that it can be connected to the plurality of core conductors arranged on the same plane, so that the area occupied by a single interlayer connection body on the conductor circuit formation layer is the same as that of the related art. Alternatively, the plurality of conductor circuits can be guided between layers with a slightly larger area, and the plurality of independent conductor circuits on one layer of the conductor circuit formation layer are arranged in the integrated interlayer connector. In order to be able to connect on the same plane, it is necessary to reliably and easily connect a plurality of independent conductor circuits on one layer of a conductor circuit formation layer to a plurality of independent conductor circuits on a conductor circuit formation layer of another wiring board. Has been enabled, Is extremely large effect that the integral of the modules comprising a number of circuit boards and compact ones are Sose. In addition, at the end of the columnar insulator,
Exposing a part of the side of the conductor but leaving the insulator between the core conductors
Recesses are formed on the side surfaces of the columnar insulator to the extent that
So that the interlayer connector is mounted on the wiring board
Use a connection conductor such as solder paste to connect to the conductor circuit.
When the extra connecting conductors are
Accumulate in the core conductor, and the remaining insulator between the core conductors prevents penetration.
In rare cases, electricity between adjacent core conductors due to outflow of connecting conductors
Therefore, it is possible to reliably prevent a decrease in electrical insulation.

[Brief description of the drawings]

FIG. 1 is a perspective view of an interlayer connector according to a first embodiment of the present invention.

FIG. 2 is an enlarged sectional view of a main part showing a manufacturing process according to the first embodiment.

FIG. 3 is an enlarged sectional view of a main part showing a manufacturing process according to the first embodiment.

FIG. 4 is an enlarged sectional view of a main part showing a manufacturing process according to the first embodiment.

FIG. 5 is an enlarged sectional view of a main part showing a manufacturing process according to the first embodiment.

FIG. 6 is an enlarged sectional view of a main part showing a main part of a second embodiment of the present invention.

7 is an enlarged plan view of a main part when the AA cross section of FIG. 6 is viewed from the direction of the arrow.

FIG. 8 is an enlarged sectional view of a main part showing a main part of a third embodiment of the present invention.

FIG. 9 is an enlarged sectional view showing a main part of a fourth embodiment of the present invention.

10 is an enlarged plan view of a main part when the BB section of FIG. 9 is viewed from the direction of the arrow.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Interlayer connection body 11 Insulator 12 Core conductor 121 Core conductor upper end part 122 Core conductor lower end part 2 Wiring board 21 Conductor circuit 22 Gas vent hole 3 Adhesive layer 4 Substrate 4A Through hole 5 Connection conductor 6 Electronic component 7 Sealing resin 8 Motherboard 81 conductor circuit 9 through hole

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-59-33769 (JP, A) JP-A 64-51269 (JP, U) JP-A 62-166666 (JP, U) JP-A Sho 53- 92556 (JP, U) Actually open 61-19277 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 1/14

Claims (1)

(57) [Claims] 1. A wiring board with an interlayer connecting body provided at an appropriate position on a wiring board to provide a desired electrical connection between conductive circuit forming layers on different wiring boards provided in a vertical positional relationship with each other. In the above, the interlayer connection body includes a plurality of core conductors inside a columnar insulator.
The body is arranged in parallel in the axial direction and the end of the columnar insulator
The part of the side of the core conductor is exposed at the part
Between the columnar insulators to the extent that the insulator between them remains.
A concave portion is formed on the surface, and a plurality of independent conductor circuits on one layer of a predetermined conductor circuit forming layer are connected to the plurality of core conductors arranged in the interlayer connector on the same plane. A wiring board having an interlayer connector having a plurality of core conductors.