JPH01175296A - Multilayer printed circuit board device - Google Patents

Multilayer printed circuit board device

Info

Publication number
JPH01175296A
JPH01175296A JP62336344A JP33634487A JPH01175296A JP H01175296 A JPH01175296 A JP H01175296A JP 62336344 A JP62336344 A JP 62336344A JP 33634487 A JP33634487 A JP 33634487A JP H01175296 A JPH01175296 A JP H01175296A
Authority
JP
Japan
Prior art keywords
parts
conductors
printed circuit
well
electronic modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62336344A
Inventor
Yasuto Saito
Toshiaki Sato
Masao Segawa
Shinpei Yoshioka
Original Assignee
Toshiba Audio Video Eng Corp
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Audio Video Eng Corp, Toshiba Corp filed Critical Toshiba Audio Video Eng Corp
Priority to JP62336344A priority Critical patent/JPH01175296A/en
Publication of JPH01175296A publication Critical patent/JPH01175296A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To enable high density packaging and improve the reliability of conductive properties of interlayer wiring conductors as well, by connecting layer wiring conductors by each through hole connecting part and providing recessed parts at an outer layer wiring board as well, thereby embedding electronic modules in the recessed parts.
CONSTITUTION: Double-side printed circuit board 11 where copper foiled conductors 21 and 22 are formed on both sides are sticked with single side printed circuit boards 12 and 13 whose sticked sides have no conductors to make up a multilayer board 10. Through hole connecting parts 26 are made up and connected electrically by forming a plated conductor 24 on the internal face of the through hole. The recessed parts 16 and 16 are made at the prescribed positions and electronic modules 14 and 14' as well as chip parts 14b are embedded and then, gapped parts are filled with a resin 17. The resultant structure makes it possible to increase exceedingly the number of the chip parts mountable and enable high density packaging. As only highly reliable electronic modules without defective chip parts are incorporated in the multilayer board 10, a yielding rate can be improved.
COPYRIGHT: (C)1989,JPO&Japio
JP62336344A 1987-12-28 1987-12-28 Multilayer printed circuit board device Pending JPH01175296A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62336344A JPH01175296A (en) 1987-12-28 1987-12-28 Multilayer printed circuit board device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62336344A JPH01175296A (en) 1987-12-28 1987-12-28 Multilayer printed circuit board device

Publications (1)

Publication Number Publication Date
JPH01175296A true JPH01175296A (en) 1989-07-11

Family

ID=18298151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62336344A Pending JPH01175296A (en) 1987-12-28 1987-12-28 Multilayer printed circuit board device

Country Status (1)

Country Link
JP (1) JPH01175296A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0428997A2 (en) * 1989-11-17 1991-05-29 E.I. Du Pont De Nemours And Company Method for fabricating multilayer circuits
JPH03117881U (en) * 1990-03-15 1991-12-05
JPH09312478A (en) * 1996-05-22 1997-12-02 Nec Niigata Ltd Multi-layer circuit board
US5875100A (en) * 1996-05-31 1999-02-23 Nec Corporation High-density mounting method and structure for electronic circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0428997A2 (en) * 1989-11-17 1991-05-29 E.I. Du Pont De Nemours And Company Method for fabricating multilayer circuits
JPH03117881U (en) * 1990-03-15 1991-12-05
JPH09312478A (en) * 1996-05-22 1997-12-02 Nec Niigata Ltd Multi-layer circuit board
US5875100A (en) * 1996-05-31 1999-02-23 Nec Corporation High-density mounting method and structure for electronic circuit board

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