JPH01175296A - Multilayer printed circuit board device - Google Patents
Multilayer printed circuit board deviceInfo
- Publication number
- JPH01175296A JPH01175296A JP62336344A JP33634487A JPH01175296A JP H01175296 A JPH01175296 A JP H01175296A JP 62336344 A JP62336344 A JP 62336344A JP 33634487 A JP33634487 A JP 33634487A JP H01175296 A JPH01175296 A JP H01175296A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- conductors
- printed circuit
- well
- electronic modules
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0 abstract 5
- 239000011799 hole materials Substances 0 abstract 3
- 239000010410 layers Substances 0 abstract 2
- 239000010949 copper Substances 0 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound data:image/svg+xml;base64,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 data:image/svg+xml;base64,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 [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0 abstract 1
- 229910052802 copper Inorganic materials 0 abstract 1
- 230000002950 deficient Effects 0 abstract 1
- 230000001976 improved Effects 0 abstract 1
- 239000011229 interlayers Substances 0 abstract 1
- 238000009740 moulding (composite fabrication) Methods 0 abstract 1
- 229920000642 polymers Polymers 0 abstract 1
- 239000011347 resins Substances 0 abstract 1
Abstract
PURPOSE: To enable high density packaging and improve the reliability of conductive properties of interlayer wiring conductors as well, by connecting layer wiring conductors by each through hole connecting part and providing recessed parts at an outer layer wiring board as well, thereby embedding electronic modules in the recessed parts.
CONSTITUTION: Double-side printed circuit board 11 where copper foiled conductors 21 and 22 are formed on both sides are sticked with single side printed circuit boards 12 and 13 whose sticked sides have no conductors to make up a multilayer board 10. Through hole connecting parts 26 are made up and connected electrically by forming a plated conductor 24 on the internal face of the through hole. The recessed parts 16 and 16 are made at the prescribed positions and electronic modules 14 and 14' as well as chip parts 14b are embedded and then, gapped parts are filled with a resin 17. The resultant structure makes it possible to increase exceedingly the number of the chip parts mountable and enable high density packaging. As only highly reliable electronic modules without defective chip parts are incorporated in the multilayer board 10, a yielding rate can be improved.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62336344A JPH01175296A (en) | 1987-12-28 | 1987-12-28 | Multilayer printed circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62336344A JPH01175296A (en) | 1987-12-28 | 1987-12-28 | Multilayer printed circuit board device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01175296A true JPH01175296A (en) | 1989-07-11 |
Family
ID=18298151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62336344A Pending JPH01175296A (en) | 1987-12-28 | 1987-12-28 | Multilayer printed circuit board device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01175296A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0428997A2 (en) * | 1989-11-17 | 1991-05-29 | E.I. Du Pont De Nemours And Company | Method for fabricating multilayer circuits |
| JPH03117881U (en) * | 1990-03-15 | 1991-12-05 | ||
| JPH09312478A (en) * | 1996-05-22 | 1997-12-02 | Nec Niigata Ltd | Multi-layer circuit board |
| US5875100A (en) * | 1996-05-31 | 1999-02-23 | Nec Corporation | High-density mounting method and structure for electronic circuit board |
-
1987
- 1987-12-28 JP JP62336344A patent/JPH01175296A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0428997A2 (en) * | 1989-11-17 | 1991-05-29 | E.I. Du Pont De Nemours And Company | Method for fabricating multilayer circuits |
| JPH03117881U (en) * | 1990-03-15 | 1991-12-05 | ||
| JPH09312478A (en) * | 1996-05-22 | 1997-12-02 | Nec Niigata Ltd | Multi-layer circuit board |
| US5875100A (en) * | 1996-05-31 | 1999-02-23 | Nec Corporation | High-density mounting method and structure for electronic circuit board |
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