JPH04266081A - Printed-circuit board - Google Patents

Abstract

PURPOSE:To provide for a printed-circuit board which can supply a power supply with less noise and a ground signal by solving a problem of generation of noise by a conventional jumper wire when performing circuit change of a circuit and then reducing a signal line of ground as much as possible. CONSTITUTION:A parts mounting surface 4a has a land 5 for connecting parts terminal of electronic parts such as an IC and then a via hole 6 for conducting the parts mounting surface 4a and a solder surface 4b electrically by making connection to the land 5, power supply patterns 7 and 8 and ground patterns 9 and 10 provided on the solder surface 4b sandwiching the via hole 6 are provided.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board that can be used in computers and controller cards.

0002

2. Description of the Related Art Generally, printed circuit boards for computers and the like are wired without considering changes in circuit design.

[0003] When a circuit design change occurs in such a printed circuit board and an IC component is added, the circuit shown in FIG.
As shown in FIG. 1, a preliminary IC mounting pattern 1 is provided, and the IC 3 is wired using jumper wires 2.

0004

[Problems to be Solved by the Invention] However, in the above-mentioned conventional printed circuit board, when providing the spare IC mounting pattern 1, the number of pins of ICs having different numbers of terminals such as 14 pins, 16 pins, 20 pins, etc. The position of the power pin and ground pin cannot be determined depending on the orientation of the IC. Therefore, when the power supply pin and ground pin are specified, wiring of the additional jumper wire 2 becomes difficult depending on the orientation of the IC. Furthermore, when an element such as TTL is used, input signals of unused gates are connected to ground, so there is a problem that it is impossible to predict these positions and provide spare IC lands. Further, due to the wiring of the jumper wire 2, a problem arises in that the power supply and ground signals supplied to the IC become unstable due to noise.

The present invention solves these conventional problems, and when adding electronic components such as ICs, it is possible to give priority to wiring and determine the direction of the IC, thereby facilitating wiring for the added components. The purpose of the present invention is to provide a highly reliable printed circuit board that can supply power and ground signals with less noise by making the lines for supplying power and ground as short as possible.

[0006]

[Means for Solving the Problems] In order to achieve the above object, the printed circuit board of the present invention has a plurality of lands for connecting component terminals of electronic components such as ICs on the component mounting surface, and connects to the lands. It has a plurality of via holes that electrically conduct the component mounting surface and the soldering surface, and a power supply pattern and a ground pattern provided on the soldering surface with the via holes in between.

[0007]

[Operation] Therefore, according to the printed circuit board of the present invention, I
Since the power supply pattern and the ground pattern are formed with the via hole connected to the land of C in between, the land for IC terminal connection can be easily connected to the power supply pattern and the ground pattern. In addition, since power and ground are supplied from the substrate pattern over the shortest distance, signals with less noise can be supplied to the power and ground.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A printed circuit board according to an embodiment of the present invention will be described below with reference to the drawings. Figures 1(a) and (b)
As shown in the figure, a land 5 for a small outline package IC is formed on the component mounting surface 4a of the printed circuit board 4, and a via hole 6 is connected to the land 5 for the IC.
Power supply patterns 7 and 8 and ground patterns 9 and 10 are formed on the other side (hereinafter referred to as the solder side) 4b of the printed circuit board 4 at positions with the via hole 6 in between.

FIGS. 2A and 2B show the IC 11 mounted on the printed circuit board 4 constructed as described above, and is soldered to the lands 5. FIG. IC11
The power terminal 12 passes through the via hole 6 and connects to the solder surface 4b.
It is connected by solder 13 to the power supply pattern 8 formed above. Similarly, the ground terminal 14 of IC11,
15, 16 and 17 are connected to the ground pattern 10, and ground terminals 18, 19 and 20 are connected to the ground pattern 9 by solder 13.

As described above, according to the above embodiment, the direction of the IC can be set freely, and jumper wires are not required for connecting the power terminal 12 or interconnecting the ground terminals 14 to 20. You can get a power supply and ground with less noise.

In addition, in the case of a multilayer board, the power supply pattern 7
In order to reduce noise, it is desirable to provide a large number of power via holes 21 and ground via holes 22 connected to inner layer conductors (not shown) inside each of the ground patterns 9 and 8 and the ground patterns 9 and 10, respectively.

0012

Effects of the Invention As is clear from the above embodiments, when a printed circuit board of the present invention is provided with a land for connecting a component terminal of an electronic component such as an IC, the printed circuit board can be connected to a power supply pattern with a via hole connected to the land in between. A ground pattern is provided on the solder surface, and when changing the circuit design, etc.
Even when adding electronic components such as, the number of jumper wires for supplying power and ground can be reduced, which greatly helps improve work efficiency. Furthermore, by being able to supply a stable power supply and ground, malfunctions such as noise, electromagnetic interference, etc. can be suppressed, and reliability can be significantly improved.

[Brief explanation of the drawing]

FIG. 1: (a) A plan view of the main parts of a printed circuit board according to an embodiment of the present invention; (b) A back view of the main parts showing the positions of a power supply pattern and a ground pattern on the same printed circuit board.

[Fig. 2] (a) A plan view of the main parts showing a state in which an IC is mounted on a printed circuit board in one embodiment. (b) A back view of the main parts showing a state of connection by solder on the same printed board.

[Figure 3] Plan view of main parts showing a state in which an IC is mounted on a conventional printed circuit board

[Explanation of symbols]

4(a) Component mounting surface 4(b) Solder side 5 Land 6 Buyer Hall 7 Power pattern 9,10 Ground pattern 11 Electronic components such as IC

Claims (1)

[Claims] 1. A component mounting surface has a plurality of lands for connecting component terminals of an electronic component such as an IC, and a plurality of lands are connected to the lands and electrically conductive between the component mounting surface and the soldering surface. A printed circuit board having a via hole, and a power supply pattern and a ground pattern provided on the solder surface with the via hole in between.