JPH0534128Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a circuit board device including a thick film circuit.

[Prior Art] Many circuit board devices provide circuits on both the front and back sides of the board. The following two methods are known as typical construction methods for this type of double-sided circuit board device.

The first method is to connect circuits on the front side of the board and circuits on the back side of the board using through holes.

The second method is to connect circuits on the front side of the board and circuits on the back side using a connecting member called a clip lead.

The present invention relates to the latter second method.

[Problems to be Solved by the Invention] By the way, when creating a circuit board device, there are times when it is desired to measure the electrical characteristics of the unfinished circuit board device.
When configuring a circuit board device according to the first method described above, the circuit on the back side of the board is connected to the circuit on the front side using through holes, so the measurement probe is attached only to the front side of the board. can be applied to measure electrical characteristics. However, in the case of the second method described above, the connection between the circuit on the front side and the circuit on the back side cannot be achieved unless clip leads are attached, so the electrical characteristics are measured by applying the measurement probe only to the circuit on the front side. It is not possible to measure it, and it is necessary to apply a measurement probe to the circuit on the back side as well. If the measurement probe is applied to the circuit on the back side of the board in this way, the workability of the measurement will be poor and the measurement efficiency will be reduced.

As one method for solving this kind of problem, as described in Japanese Utility Model Application Publication No. 59-192848, an intermediate stage (unfinished ) After making the circuit board device and measuring the electrical characteristics, one possible method is to divide the circuit board at the through-holes and remove unnecessary parts. Although this method does make it possible to measure the electrical characteristics on the front surface side, the problem arises that it is difficult to divide the substrate because the substrate is divided at the through-hole portion having the conductive film.

Therefore, the purpose of this invention is to make it possible to measure the electrical characteristics of the combination of circuits on the front side and circuits on the back side of the board on the front side, and to easily remove unnecessary parts of the board after measuring the electrical characteristics. An object of the present invention is to provide a circuit board device that can be removed and downsized.

[Means for Solving the Problems] The present invention for achieving the above object will be described with reference to the reference numerals in the drawings showing the embodiments. Although it is possible to measure electrical characteristics, it is not possible to ultimately complete the invention. It is a circuit board device at an intermediate stage in which the circuit board device is divided into a first board part 1 which is finally used as a circuit board, and a part which is ultimately removed and is divided into the first board part 1. a second substrate portion 2 that is possibly connected to each other, a first circuit portion formed on one main surface 4 of the first substrate portion 1, and the other main surface of the first substrate portion 1; 8 and one main surface 1 of the second substrate portion 2.
1 to the other main surface 12, and a region surrounding the through hole 13 or groove only on one main surface 11 of the second substrate portion 2 to the through hole. 13 or the other main surface 12 of the second substrate portion 2 via the groove,
Furthermore, a conductor layer 1 is formed on the other main surface 8 of the first substrate portion 1 to reach the second circuit portion.
4, using a portion of the conductor layer 14 formed on one main surface 12 of the second substrate portion 2 and a part of the first circuit portion to form the first circuit portion. The present invention relates to a circuit board device configured to remove the second board portion 2 after measuring the electrical characteristics of a circuit combined with the second circuit portion.

[Operations and Effects] In the present invention, the through hole 13 or groove for connection is formed in the second substrate portion 2, and the conductor layer 14 is formed only in the second substrate portion 2 on one main surface side. and does not extend to the first substrate part 1. Therefore, the conductor layer 14 on the first main surface (front surface) side
After measuring the electrical characteristics using
The division of the substrate portion 2 can be easily and efficiently achieved. That is, the first and second substrate portions 1,
On the dividing line of 2, there is a conductor layer 14 only on the second main surface (back) side and not on the first main surface (front surface) side, so it is easier and better than when there are conductor layers on both sides. It can be divided into.

In addition, the second main surface (back surface) of the first substrate portion 1
Since the second circuit portion of the second substrate portion 2 is led out to the first main surface (front surface) side of the second substrate portion 2, the electrical characteristics of the combination circuit of the first and second circuit portions can be measured on the first side.
It is now possible to perform this only on the main (front) side of the
Measurements can be carried out efficiently.

[Example] Next, a thick film hybrid integrated circuit device and a method for manufacturing the same according to an example of the present invention will be described. FIG. 1 is a plan view showing a circuit board device before completion of a hybrid integrated circuit, and FIG. 2 is a bottom view thereof. The ceramic circuit board consists of a first substrate part 1 and a second substrate part 2, the second substrate part 2 being separated from the first substrate part 1 at a parting line 3 consisting of a shallow linear groove.

A plurality of lead lands 5a, 5b, 5c, 5d are provided on one main surface (surface) 4 of the first substrate portion 1.
A first circuit portion including a wiring conductor layer 6 and a resistor layer 7 is provided. As shown in FIG. 2, a second circuit portion including lead lands 9a, 9b, 9c, and 9d and a wiring conductor layer 10 is provided on the other main surface (back surface) 8 of the first substrate portion 1. ing. Note that only some of the first and second circuit portions are schematically shown, and actually include many more circuit elements.

The second substrate portion 2 has one main surface (front surface) 11.
A through hole 13 is provided extending from the main surface (back surface) 12 to the other main surface (back surface) 12 . This through hole 1
Surface 1 facing in the opposite direction to the dividing line from around 3
The measurement terminal conductor layer 14 provided in FIG. 1 includes a conductor layer 15 provided on the wall surface of the through hole 13 as shown in FIG. The lead land 9a of the second circuit portion is connected to the lead land 9a of the second circuit portion. First substrate part 1
Although there are a plurality of lead lands 9a to 9d on the back surface 8 of the , a through hole 13 is not provided for all of them, but a through hole is provided for only the lead land 9a necessary for function trimming. 13
is provided.

This hybrid integrated circuit device has lead lands 5a to 5d on the front side and lead lands 9a to 9d on the back side.
By connecting the two, a desired circuit is completed. However, function trimming can be performed without fully connecting all of the circuit devices.

When performing function trimming, the characteristics of the circuit are measured by applying the first measurement probe to both the lead terminal 5a and the measurement terminal conductor layer 14, and applying the second measurement probe to the lead land 5b. Measure and trim the resistor layer 7. Since the lead land 5a and the conductor layer 14 are arranged close to each other, it is easy to apply a common probe to them. After the function trimming is completed, the second substrate portion 2 is divided and removed along the dividing line 3 to obtain the independent first circuit portion 1 shown in FIG. Incidentally, the division can be achieved satisfactorily since no wiring conductor layer is provided on the division line 3 on the front surface side.

Thereafter, the clip leads 17 shown in FIG. 6 are attached so as to be connected to the lead lands 5a to 5d on the front side and the lead lands 9a to 9d on the back side, and are connected with solder (not shown).

[Modifications] The present invention is not limited to the above-described embodiments, but can be modified as follows, for example.

(1) In Fig. 6, the interconnection between the front and back lead lands 5a and 9a is achieved by the springy clamping portion of the lead 17, but there is a dedicated connector for connecting the front and back lead lands 5a and 9a. This may also be done by means of a character-shaped connecting member. In this case, external lead members are further connected to the lead lands 5a to 5d.

(2) Instead of the through hole 13, a through groove may be formed in the end surface of the second substrate portion 2, and this may be used to achieve electrical connection between the front and back sides.

(3) The present invention can also be applied to the case where it is not necessary to electrically connect the measurement terminal conductor layer 14 and the lead land 5a for function trimming.

(4) It is also applicable when the lead lands 9a to 9d are not provided on the back side.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a part of a circuit board device according to an embodiment of the present invention, FIG. 2 is a bottom view of the circuit board device, FIG. 3 is a cross-sectional view taken along the - line in FIG. 1, and FIG. 1, FIG. 5 is a plan view showing the first board portion after removing the second board portion from the circuit board device shown in FIG. 1, and FIG. FIG. 1 is a cross-sectional view showing a state in which a clip lead is coupled to the substrate portion of FIG. DESCRIPTION OF SYMBOLS 1... First board part, 2... Second board part, 3... Parting line, 5a, 5d... Lead land, 7... Resistor layer, 9a to 9d... Lead land, 13... Through hole, 14... conductor layer for measurement terminal, 17... clip lead.

Claims (1)

[Claims for Utility Model Registration] A first board portion 1 that is an intermediate stage circuit board device whose electrical characteristics can be measured but is not finally completed, and which is ultimately used as a circuit board. , a second substrate portion 2 which is a portion to be finally removed and is separably connected to the first substrate portion 1; and one main surface of the first substrate portion 1. 4, a second circuit portion formed on the other main surface 8 of the first substrate portion 1, and a first circuit portion formed on the other main surface 8 of the second substrate portion 2; A through hole 13 or groove formed to reach the other main surface 12; and a through hole 13 or groove formed from a region surrounding the through hole 13 or groove only on one main surface 11 of the second substrate portion 2. the second substrate portion 2 through the groove;
a conductor layer 14 formed to reach the other main surface 12 of the first substrate portion 1 and further reach the second circuit portion of the other main surface 8 of the first substrate portion 1; Second board part 2
The electrical characteristics of a combination circuit of the first circuit portion and the second circuit portion were measured using a portion formed on one main surface 12 of the circuit and a portion of the first circuit portion. A circuit board device configured to subsequently remove said second board portion 2.