JPH01157461U - - Google Patents
Info
- Publication number
- JPH01157461U JPH01157461U JP4650688U JP4650688U JPH01157461U JP H01157461 U JPH01157461 U JP H01157461U JP 4650688 U JP4650688 U JP 4650688U JP 4650688 U JP4650688 U JP 4650688U JP H01157461 U JPH01157461 U JP H01157461U
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- board
- substrate
- circuit
- substrate portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例に係わる回路基板装置
の一部を示す平面図、第２図は回路基板装置の底
面図、第３図は第１図の−線断面図、第４図
は第１図の−線断面図、第５図は第１図の回
路基板装置から第２の基板部分を除去した後の第
１の基板部分を示す平面図、第６図は第５図の第
１の基板部分にクリツプリードを結合した状態を
示す断面図である。
１……第１の基板部分、２……第２の基板部分
、３……分割線、５ａ，５ｄ……リードランド、
７……抵抗体層、９ａ〜９ｄ……リードランド、
１３……貫通孔、１４……測定端子用導体層、１
７……クリツプリード。
FIG. 1 is a plan view showing a part of a circuit board device according to an embodiment of the present invention, FIG. 2 is a bottom view of the circuit board device, FIG. 3 is a cross-sectional view taken along the - line in FIG. 1, and FIG. 1, FIG. 5 is a plan view showing the first board portion after removing the second board portion from the circuit board device shown in FIG. 1, and FIG. FIG. 1 is a cross-sectional view showing a state in which a clip lead is coupled to the substrate portion of FIG. DESCRIPTION OF SYMBOLS 1...First board part, 2...Second board part, 3...Parting line, 5a, 5d...Lead land,
7... Resistor layer, 9a to 9d... Lead land,
13... Through hole, 14... Conductor layer for measurement terminal, 1
7...Clip lead.
Claims (1)
分と、 前記第１の基板部分に対して分割可能に連結さ
れている第２の基板部分と、 前記第１の基板部分の一方の主面側に形成され
た第１の回路部分と、 前記第１の基板部分の他方の主面側に形成され
た第２の回路部分と、 前記第２の基板部分の一方の主面から他方の主
面に至るように形成されている貫通孔又は溝と、 前記第２の基板部分の一方の主面における前記
貫通孔又は溝を囲む領域から前記貫通孔又は溝を
通して前記第１の基板部分の他方の主面の前記第
２の回路部分に至るように形成された導体層とを
備えた回路基板装置。[Claims for Utility Model Registration] A first board portion that will ultimately be used as a circuit board; a second board portion that is separably connected to the first board portion; a first circuit portion formed on one main surface side of the substrate portion; a second circuit portion formed on the other main surface side of the first substrate portion; and one of the second substrate portions. a through hole or groove formed to extend from the main surface of the second substrate portion to the other main surface; and a conductor layer formed on the other main surface of the first substrate portion to reach the second circuit portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4650688U JPH0534128Y2 (en) | 1988-04-06 | 1988-04-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4650688U JPH0534128Y2 (en) | 1988-04-06 | 1988-04-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01157461U true JPH01157461U (en) | 1989-10-30 |
| JPH0534128Y2 JPH0534128Y2 (en) | 1993-08-30 |
Family
ID=31272776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4650688U Expired - Lifetime JPH0534128Y2 (en) | 1988-04-06 | 1988-04-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0534128Y2 (en) |
-
1988
- 1988-04-06 JP JP4650688U patent/JPH0534128Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0534128Y2 (en) | 1993-08-30 |