JPS6416085U - - Google Patents
Info
- Publication number
- JPS6416085U JPS6416085U JP11072887U JP11072887U JPS6416085U JP S6416085 U JPS6416085 U JP S6416085U JP 11072887 U JP11072887 U JP 11072887U JP 11072887 U JP11072887 U JP 11072887U JP S6416085 U JPS6416085 U JP S6416085U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- board
- socket
- board surface
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図ａ，ｂ、第２図ａ，ｂ、第３図ａ，ｂは
それぞれこの考案の実施例を示す説明図、第４図
は第３図ｂに示す実施例による実装部品の基板表
面側への取付け状態を示す説明図である。
１……基板、２……貫通孔、３……モールド部
、４ａ，４ｂ……ストツパー部、５……リード部
、６……接触子部、７ａ，７ｂ，７ｃ……ストツ
パー部、８ｂ，８ｃ……半田溜め、９ａ，９ｂ…
…実装部品。なお各図中同一符号は同一または相
当する部分を示す。
Figures 1a and b, Figures 2a and b, and Figures 3a and b are explanatory diagrams showing embodiments of this invention, respectively, and Figure 4 is the board surface of a mounted component according to the embodiment shown in Figure 3b. It is an explanatory view showing a state where it is attached to the side. DESCRIPTION OF SYMBOLS 1... Board, 2... Through hole, 3... Mold part, 4a, 4b... Stopper part, 5... Lead part, 6... Contact part, 7a, 7b, 7c... Stopper part, 8b, 8c...Solder reservoir, 9a, 9b...
…Mounting parts. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
ド部を基板の各リード取付け用貫通孔に挿入する
と、該ソケツトを各リード部の一部分が基板表面
上に露出した状態に支えるストツパー部を設け、
各リード部を基板表面に配設した配線導体にも半
田付けすることができる構造としたＩＣ用ソケツ
ト。 (2) 各リード部の基板表面上に露出する部分に
半田溜めを設け、実装部品を基板表面側にも取付
けることができる構造としたことを特徴とする実
用新案登録請求の範囲第(1)項記載のＩＣ用ソケ
ツト。[Claims for Utility Model Registration] (1) When the molded part or each lead part is inserted into each lead attachment through hole of the board, the socket is inserted so that a part of each lead part is exposed on the board surface. A stopper part is provided to support the condition,
An IC socket with a structure that allows each lead part to be soldered to the wiring conductor arranged on the surface of the board. (2) Utility model registration claim No. (1) characterized in that a solder reservoir is provided in the exposed portion of each lead portion on the board surface, so that mounted components can be attached to the board surface side as well. IC socket described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11072887U JPS6416085U (en) | 1987-07-21 | 1987-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11072887U JPS6416085U (en) | 1987-07-21 | 1987-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6416085U true JPS6416085U (en) | 1989-01-26 |
Family
ID=31348150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11072887U Pending JPS6416085U (en) | 1987-07-21 | 1987-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6416085U (en) |
-
1987
- 1987-07-21 JP JP11072887U patent/JPS6416085U/ja active Pending