JPH0510379Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a printed circuit board for producing an equivalent simulation circuit of a semiconductor integrated circuit device, which is generally called a mock-up or a blend board.

[Conventional technology]

In general, semiconductor integrated circuit devices (hereinafter referred to as IC)
The design process includes the production stage of an equivalent simulated circuit commonly called a mockup or a blended board. At the manufacturing stage of this equivalent circuit, a single-sided copper-clad printed circuit board is used, which includes a circuit pattern to which a 2.54 mm (1/10 inch) pitch DIP IC can be attached, and a power supply ( VCC) and ground (GND) lines.
Those with patterns are usually prepared.

[Problem that the invention attempts to solve]

Therefore, when fabricating an equivalent simulated circuit of an analog IC using this prepared printed circuit board, each of the multiple block circuits that make up the IC must be connected to only one power supply (VCC) system.
Commonly connected to line or ground (GND) line. However, since these block circuits differ in the magnitude of the current that flows, for example, signal current may leak from the output stage to the input stage, causing oscillation.Also, the connection wiring lengths are also different, so the grounding resistance is particularly important. It is not always easy to equivalently perform a simulation that corresponds 1:1 to the IC circuit to be designed, since this causes unevenness in the circuit operation as an equivalent simulated circuit.

In view of the above-mentioned circumstances, an object of the present invention is to provide a printed circuit board for producing an equivalent simulated circuit that can equivalently perform a 1:1 simulation with an IC circuit to be designed.

[Means for solving problems]

According to the present invention, a printed circuit board for producing an equivalent simulation circuit of an IC includes a circuit board, and two first power and ground lines, respectively, which are formed facing each other and spaced apart from each other along the edge of the circuit board. and two copper foil patterns for a second power supply line and a ground line, respectively, which are divided and formed in a line-symmetrical structure inside each of the two copper foil patterns; An IC circuit is formed by attaching external components to two copper foil patterns for a power supply and a ground, and making a power supply system independent for each block circuit between the two copper foil patterns for a second power supply and a ground. including.

〔Example〕

The present invention will be described in detail below with reference to the drawings.

Figure 1 shows an example of the power supply (VCC) of the present invention.
and ground (GND) line patterns. According to this embodiment, the printed circuit board for producing an IC equivalent simulation circuit of the present invention has a circuit board 1.
and copper foil patterns 2 and 3 of a first power supply (VCC) line and a first ground (GND) line, which are formed facing each other and spaced apart from each other along the edge of the circuit board 1; A second power supply (VCC) line and a second ground (GND) are formed separately along the inside of the copper foil pattern.
It includes copper foil patterns 4 and 5 having a line-symmetrical structure with respect to each other. Here, the first lines 2 and 3 are used for mounting external parts of the IC, and
Each second line is used to form an equivalent simulated circuit of the IC. Therefore, this division pattern is appropriately determined depending on the number of block circuits of the IC to be designed. Next, using this printed circuit board,
We will explain the method of creating an equivalent simulated circuit of an IC.

Figures 2 and 3 are each based on the present invention.
FIG. 2 is an example diagram of a connection circuit of an IC equivalent simulation circuit and its implementation diagram. According to this embodiment, the IC to be designed consists of each block circuit of an input stage 21, a bias and other circuit 22, and an output stage 23, and external components include three decoupling capacitor elements 17, 1.
8 and 19 and one resistance element 20. Here, each block circuit 21, 22, 23 of the IC is independently connected to each divided copper foil pattern 4 and 5 of a second power supply (VCC) line and a second ground (GND) line, and , decoupling capacitor elements 17, 18, 19 and resistance element 20 are connected to the copper foil patterns 2 and 3 of the VCC power supply terminal 14 or the first power supply (VCC) line and first ground (GND) line connected thereto. are connected to each other. At this time, the second
Each divided pattern of the copper foil patterns 4 and 5 of the power supply (VCC) and ground (GND) lines is provided in a part of the copper foil patterns 2 and 3 of the first power supply (VCC) and ground (GND) line, respectively. The voltage is supplied from a power supply (VCC) supply terminal 10 and a ground (GND) potential supply terminal 11 via a power supply (VCC) terminal 10' and a ground (GND) terminal 11' of the IC, respectively. Here, 8
is the connecting conductor used for this circuit connection. However, connections between the signal input terminal 15 and signal output terminal 16 and the equivalent simulated circuit input terminal 12 and equivalent simulated circuit output terminal 13, or between these terminals and external components, are made using the copper terminals provided on the board 1. The operations performed through the foil patterns 12', 13', 15', and 16' are exactly the same as in the conventional method.

As is clear from the circuit configuration of this example, the IC
Since the power supply (VCC) and ground (GND) potentials for the equivalent simulated circuit are supplied independently to each block circuit, oscillation phenomenon as in the conventional case does not occur, and the ground impedance can be adjusted appropriately for each block. It can be matched.

[Effect of idea]

As explained in detail above, according to the present invention,
Since the equivalent simulated circuit of the IC can be electrically separated from the circuit made up of external components and manufactured in an electrically and structurally stable state, it is possible to evaluate the designed circuit accurately and quickly. be.

[Brief explanation of the drawing]

Figure 1 shows an example of the power supply (VCC) of the present invention.
and ground (GND) line pattern diagrams, Figures 2 and 3 are based on the present invention.
FIG. 2 is an example diagram of a connection circuit of an IC equivalent simulation circuit and its implementation diagram. 1... Circuit board, 2... First power supply (VCC)
Line copper foil pattern, 3...First ground (GND) line copper foil pattern, 4...Second power supply (VCC) line copper foil pattern, 5...Second ground (GND) line copper foil pattern, 8... Connection conductor, 10... Power supply (VCC) supply terminal to IC,
10'...IC power supply (VCC) terminal, 11...IC ground (GND) supply terminal, 11'...IC ground (GND) terminal, 12 and 12'...IC equivalent simulation circuit, input Terminals and their copper foil patterns, 13 and 13'... IC equivalent simulation circuit, output terminals and their copper foil patterns, 14... Power supply (VCC) terminal, 15... Signal input terminal, 16...
Signal output terminal, 17, 18, 19... Decoupling capacitor element, 20... Resistance element, 2
1, 22 and 23...Input stage of the IC to be designed,
Bias and other circuits and output stage block circuits.

Claims (1)

[Scope of utility model registration request] a circuit board; two copper foil patterns for a first power supply line and a ground line, respectively, formed opposite to each other and spaced apart from each other at an edge of the circuit board;
Each of the second copper foil patterns is divided and formed in a line-symmetrical structure inside each of the two copper foil patterns.
and two copper foil patterns for the first power supply and ground lines, and external components are attached to the two copper foil patterns for the first power supply and ground lines, and two copper foil patterns for the second power supply and ground lines are attached. The feature is that an IC circuit is formed by making the power supply system independent for each block circuit between the patterns.
Printed circuit board for producing IC equivalent circuits.