JPH01270385A - Common signal input board - Google Patents

Common signal input board

Info

Publication number
JPH01270385A
JPH01270385A JP10052688A JP10052688A JPH01270385A JP H01270385 A JPH01270385 A JP H01270385A JP 10052688 A JP10052688 A JP 10052688A JP 10052688 A JP10052688 A JP 10052688A JP H01270385 A JPH01270385 A JP H01270385A
Authority
JP
Japan
Prior art keywords
signal input
electrode
board
common
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10052688A
Other languages
Japanese (ja)
Inventor
Fumihiro Watanabe
文博 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10052688A priority Critical patent/JPH01270385A/en
Publication of JPH01270385A publication Critical patent/JPH01270385A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits

Abstract

PURPOSE:To make a substrate common, reduce a manufacturing period of it, make it commonly usable by modification, and reduce a manufacturing cost of it by using components in common by a method wherein the substrate is formed into such a structure that a packaging section and electrodes of a common signal input wiring section are separated from each other. CONSTITUTION:An electrode 11 of a common signal input wiring section, an electrode 10 of a socket section, a signal input wiring 20, a jumper wire which connects the electrode 11 with the signal input wiring 20, and a packaging socket section 40 are provided onto a board. When the board is practically used, a shot-circuit wiring S, a capacitor C, and a resistor R are optionally connected between the electrode 10 of the socket section and the electrode 11 of the common signal input wiring section, so that the board can be adapted to many products if these components are re-connected for each product.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はいくつもの製品に同時に信号を入力するとき
に用いる基板、たとえばICのバーンイン基板などに関
するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a board used when inputting signals to a number of products at the same time, such as a burn-in board for an IC.

〔従来の技術〕[Conventional technology]

第3図は従来の基板の使用例を示す図で、QOは実装用
ソケットのリード用の電極、曽は入力信号用の信号入力
ライン、■は電極αOと信号ラインに)を接続するジャ
ンパ配線、■は実装用ソケット部である。
Figure 3 is a diagram showing an example of the use of a conventional board, where QO is the electrode for the lead of the mounting socket, Z is the signal input line for the input signal, and ■ is the jumper wiring that connects the electrode αO and the signal line. , ■ is the mounting socket part.

実装用ソケットに)に挿入された各製品には信号入力ラ
イン■を介して、信号81〜514が印加されて同時に
動作させることができる。
Signals 81 to 514 are applied to each product inserted into the mounting socket (2) through the signal input line (2), so that the products can be operated simultaneously.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来の基板では実装用ソケットと信号入力ラインとが製
品毎に〒義的に配線されてしまっているため製品毎に基
板を作製しなければならず、基板の急激な需要の変動に
対処できず、また基板作製時の部品たとえば実装ソケッ
トなどを各製品毎に購入せねばならず基板作成費用が高
くなるなどの課題があった。
With conventional boards, the mounting sockets and signal input lines are wired categorically for each product, so a board must be manufactured for each product, making it impossible to cope with sudden changes in demand for boards. In addition, when manufacturing the board, components such as mounting sockets must be purchased for each product, which increases the cost of manufacturing the board.

この発明は上記のような馴題を解消するためになされた
もので、共通の実装ソケットを用いる製品について基板
需要の変動に対処し易く、また基板作成費用を安価にで
きる基板構造得ることを目的とする。
This invention was made to solve the above-mentioned problems, and aims to provide a board structure that can easily cope with fluctuations in board demand for products that use a common mounting socket, and that can reduce board production costs. shall be.

〔課題を解決するための手段〕[Means to solve the problem]

この発明による基板は実装ソケット部の電極と共通信号
入力用の配線とを接続する電極とを分離ものである。
The substrate according to the present invention separates the electrode of the mounting socket portion from the electrode connecting the wiring for common signal input.

〔作用〕[Effect]

この発明における分離された電極構造は使用される目的
により短絡されたり、また無接続とされたり、部品を挿
入されたりするように自由に使用可能になる。
The separated electrode structure of the present invention can be used freely to be short-circuited, disconnected, or inserted with parts depending on the purpose of use.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第1図はこの発明の一実施例を示す図で、図において、
0υは共通信号入力配線部の電極、QOはソケット部の
電極、(1)は信号入力配線、■は電極αυと信号入力
配線(ホ)を接続するジャンパ線、−は実装用ソケット
部である。
FIG. 1 is a diagram showing an embodiment of the present invention, and in the figure,
0υ is the electrode of the common signal input wiring part, QO is the electrode of the socket part, (1) is the signal input wiring, ■ is the jumper wire that connects the electrode αυ and the signal input wiring (E), - is the mounting socket part .

第2図は第1図の構造をした基板を実使用した実施例を
示す図で、図において、(S)は短絡用配線、(R)は
抵抗体、(C)は容量を示す。
FIG. 2 is a diagram showing an example in which a board having the structure shown in FIG. 1 is actually used. In the figure, (S) indicates a short-circuit wiring, (R) a resistor, and (C) a capacitance.

第2図に示すように、ソケット部の電極Ql)と入力信
号用の電極東との間は短絡用配線S、容量C2抵抗体R
で任意に接続できるようになっているため、製品毎に接
続をしなおせば、第1図の構造の基板は数多くの製品に
適用できることになる。
As shown in Fig. 2, between the socket electrode Ql) and the input signal electrode east, there is a short-circuit wiring S, a capacitor C2, a resistor R
Since connections can be made arbitrarily, the board with the structure shown in Figure 1 can be applied to a large number of products by reconnecting each product.

前記実施例では図面上ではソケット部と共通人その数は
同一でなくても良い。また、共通信号入力配線のレイア
ウトは、基板の同一表面でも、裏面でも、また基板の中
間層であってもかまわない。
In the above embodiment, the number of socket parts and the number of common parts may not be the same in the drawings. Further, the layout of the common signal input wiring may be on the same surface of the substrate, on the back surface, or in an intermediate layer of the substrate.

また、ソケット部と共通信号入力配線の一部が直接接続
されていてもかまわない。
Further, the socket portion and a part of the common signal input wiring may be directly connected.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、実装部と共通信号入力
配線部の電極を分けるような基板構造としたので、基板
が共通にできるため、基板作成の工期短縮、修正による
共通利用、部品の共有による基板作成費用の低減などの
効果がある。
As described above, according to the present invention, the board structure is such that the electrodes of the mounting part and the common signal input wiring part are separated, so that the board can be used in common, which shortens the construction period of the board, allows for common use through modification, and allows parts to be used interchangeably. Sharing has the effect of reducing board production costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明の一実施例である基板の配線状態を示
す説明図、第2図は第1図の基板の使用例を示す実体図
、第3図は従来の基板の配線状態を示す説明図である。 図において、叫aυは電極、翰は信号入力配線、■はジ
ャンパ線、に)は実装用ソケット部、(S)は短絡用配
線、(R)は抵抗体、(C)は容量を示す。 なお、図中、同一符号は同一、又は相当部分を示す。
Fig. 1 is an explanatory diagram showing the wiring state of a board according to an embodiment of the present invention, Fig. 2 is an actual diagram showing an example of use of the board of Fig. 1, and Fig. 3 shows the wiring state of a conventional board. It is an explanatory diagram. In the figure, aυ is an electrode, a wire is a signal input wiring, ■ is a jumper wire, 2) is a mounting socket, (S) is a short circuit wiring, (R) is a resistor, and (C) is a capacitor. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims]  実装用の電極部と分離した共通信号入力用の電極部を
有したことを特徴とする共通信号入力用基板。
A board for common signal input, characterized in that it has an electrode part for common signal input separated from an electrode part for mounting.
JP10052688A 1988-04-22 1988-04-22 Common signal input board Pending JPH01270385A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10052688A JPH01270385A (en) 1988-04-22 1988-04-22 Common signal input board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10052688A JPH01270385A (en) 1988-04-22 1988-04-22 Common signal input board

Publications (1)

Publication Number Publication Date
JPH01270385A true JPH01270385A (en) 1989-10-27

Family

ID=14276407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10052688A Pending JPH01270385A (en) 1988-04-22 1988-04-22 Common signal input board

Country Status (1)

Country Link
JP (1) JPH01270385A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014040205A (en) * 2012-08-23 2014-03-06 Sumitomo Wiring Syst Ltd Circuit board for vehicle control

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014040205A (en) * 2012-08-23 2014-03-06 Sumitomo Wiring Syst Ltd Circuit board for vehicle control

Similar Documents

Publication Publication Date Title
US6181146B1 (en) Burn-in board
JPH06333652A (en) Terminal pitch converting connector for electronic parts
JPH01270385A (en) Common signal input board
JP2884845B2 (en) Circuit formation method on printed circuit board
JPH0124860Y2 (en)
JPH02237091A (en) Printed wiring board
JPH0510379Y2 (en)
JPH02177386A (en) Electronic device
US20120243193A1 (en) Motherboard interconnection device and motherboard interconnection method
JPH0548239A (en) Forming method of circuit substrate
JPH01208894A (en) Multilayer printed wiring board
JPH0419617A (en) Mounting structure of lcd module
JP2521599Y2 (en) Electronic clock
JPS6366988A (en) Breakable board
JPH0451504Y2 (en)
JPH1074892A (en) Electronic part
JPH02189992A (en) Method for assembling boards
JPH0481112A (en) Method of packaging fixed delay line
JPS6336166A (en) Simple wiring type dut board
JPH03233952A (en) Semiconductor testing device
JPS6134482A (en) Burn-in board
JPH07183320A (en) Connecting structure of bonding wire and connecting method of bonding wire
JPH0625775U (en) Test board for IC tester
JPS63253691A (en) Manufacture of thick film hybrid integrated circuit
JPH114049A (en) Electronic circuit board