JPH01208894A - Multilayer printed wiring board - Google Patents

Abstract

PURPOSE:To improve the yield, by making a plurality of printed circuit boards of two or more layers and then electrically connecting said boards to each other with pins having projections to manufacture a multilayer printed circuit board of four or more layers. CONSTITUTION:Two printed wiring boards 1 and 2 having many through holes 3-9 are piled up and action pins 12 having action portions 10 to electrically connect with said through holes are driven into said through hole but not driven into the through hole 5 of the printed wiring board 1 because it has no opposing holes in other printed circuit boards. The through hole 3 is through-hole-plated and the pin 12 is driven because a signal must be sent with a pin through said through hole 3. Holes of the same diameter are made in the identical positions of all the printed wiring boards made respectively and only the holes going throughout the finally completed printed circuit board are through-hole-plated, and pins are driven into such holes for electric connection.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a printed wiring board on which electronic components are mounted,
In particular, it relates to a multilayer printed wiring board that is mounted using vias with through holes and convex portions for making electrical connections.

[Conventional technology]

Conventionally, in the structure of this type of printed wiring board, when the signal layer 20 has eight layers as shown in FIG. layer 23
It is a single multilayer board that is laminated with two layers in between. Also,
A vial 25 with one convex portion for electrical connection to the through hole is used, and when remodeling, wrapping 24 is used to connect the wiring.

[Problem to be solved by the invention]

In the conventional printed wiring boards mentioned above, the greater the number of calendars, the more likely manufacturing defects will occur due to lamination misalignment, etc.
Generally, as the board becomes thicker, it becomes difficult to drill holes, etc.
This results in overall poor manufacturability and lower yield.

Further, when modifying, modified wiring such as a single wire or twisted pair wire is used and the modification is done manually, so if the number of wires is large, it takes time and the electrical characteristics of the pattern are not uniform.

[Means to solve the problem]

When manufacturing a multilayer printed wiring board of four or more layers, the multilayer printed wiring board of the present invention is manufactured separately into a plurality of printed wiring boards of two or more layers.
When connecting the ND to another printed wiring board or wiring through a bottle, drill holes with the same diameter and at the same position on all printed wiring boards that are manufactured separately, and then drill through holes in each printed wiring board. , through-hole plating is applied only when there is a connection in the printed wiring, and after fixing all the through-hole positions of the divided printed wiring boards in the same state, connect the through-holes and electrical connections to the through-holes. The convex part for making the connection is 2
A vial with at least three holes is driven in to make an electrical connection between the vial and the through hole.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view of a first embodiment of the invention.

As shown in FIG. 1, a multilayer printed wiring board consists of two printed wiring boards 1 and 2 having a large number of through holes 3 to 9 placed one on top of the other, and two convex portions for making electrical connections with the through holes, i.e. A conductive bottle in which an action part 10 is formed;
In other words, it has a configuration in which an action pin 12 is driven into it.

The through hole 5 is a through hole that is used only inside the printed wiring board 1, and there is no need to send a signal to the outside of the printed wiring board 1 through a bottle. It needs to be brought out through the hole and has through-hole plating. In this case, the through hole 7 is required at the position of the printed wiring board 2 corresponding to the position of the through hole 3, and the through hole 7 has no signal connection, so there is no through hole plating.

As for the through-holes 4.8, the above is the reverse, and the through-holes 8 are required to output the signals from the printed wiring board 2 through the vias, and are plated through-hole. A through hole 4 is required at the position of the printed wiring board 1 corresponding to the through hole 8, and as shown above, the through hole 4 does not require plating. When driving the bottle,
Since the through hole 4.7 is not plated, the action part 10 does not deform much when driving into the through hole, and driving can be performed with the same insertion force as in the case where the action part 10 is in one place.

The through hole 6.9 is used when the printed wiring boards 1 and 2 have the same type of power supply and GND, or when the printed wiring board 1
．． 2, the insertion force of the pin is greater than the above-mentioned bins, but since the number of these bins is generally smaller than the total number of bins, the insertion force is lower than that of the conventional one. Action pin 12, which does not change much,
As shown in FIG. 1, the bottle is driven in until it stops at a stopper 11 formed on the bottle.

FIG. 2 is a cross-sectional view of a second embodiment of the invention. If it is necessary to modify the printed wiring board due to a manufacturing error or design error, pattern the modified wiring as shown in wiring pattern 17 in Figure 2, and connect all the parts of the printed wiring board that correspond to the portions where the bottles stand. Holes are drilled at locations 14 to 16, and the printed wiring board 18 and the printed wiring board 1.2 are fixed with through-hole plating only in the areas that need to be connected to the action pins 13, and the action parts 10 are attached to the three locations. Driving the pin 13. At this time, the number of through holes required to connect with the pin is quite small compared to the total number of through holes, so driving the action pin 13 is easy. Printed wiring board 1, 2.1 under the stopper
The part of the bottle protruding downward from 8 is brought into contact with a connector attached to another printed wiring board to connect the power supply to GND or a signal. Further, the upper part of the stopper can be connected to wires by wrapping, if necessary.

FIG. 3 is a sectional view of a third embodiment of the invention. Third
As shown in the figure, it is also possible to attach the printed wiring board 18 to the position above the stopper by using an action pin 19 in which the action portion 10 is provided above the stopper 11.

〔Effect of the invention〕

As explained above, the present invention provides a method for manufacturing a multilayer printed wiring board having four or more layers, for example, a printed wiring board having 12 layers.
If three 4-layer printed wiring boards are manufactured and laminated, a printed wiring board thinner than 12 layers will be manufactured, making drilling and lamination easier. This improves yield, and even if one of the boards is defective, if the others are normal, you only need to replace the defective printed wiring board. It is effective to improve the yield of the entire wiring board, and to minimize the amount of modified wiring by adding a printed wiring board patterned with the modified wiring at the time of modification.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of the first embodiment of the present invention, FIG.
The figure is part 2 of the present invention. A cross-sectional view of the third embodiment, and FIG. 4 are cross-sectional views of a conventional example. 1.2...Printed wiring board, 3.5.6,8.9...
・Through-holes with plating, 4, 7... Through-holes without plating, 10... Action part for making electrical connection with through-holes, 12... Has two action parts. action pin.

Claims (1)

[Claims] a first having a plurality of selectively plated through-holes;
A printed wiring board, a second printed wiring board having a plurality of selectively plated through holes, and a plurality of action pins each having a plurality of action parts, each of the action pins having a plurality of action parts, each of which is connected to the first printed wiring board. one of the through holes of the wiring board and one of the through holes of the second printed wiring board, and one of the plated through holes of the first printed wiring board or the second printed wiring at the action part. A multilayer printed wiring board characterized by being configured to contact one of the plated through holes of the board.