JPS63261895A - Through-hole of multilayer printed interconnection board - Google Patents
Through-hole of multilayer printed interconnection boardInfo
- Publication number
- JPS63261895A JPS63261895A JP9771987A JP9771987A JPS63261895A JP S63261895 A JPS63261895 A JP S63261895A JP 9771987 A JP9771987 A JP 9771987A JP 9771987 A JP9771987 A JP 9771987A JP S63261895 A JPS63261895 A JP S63261895A
- Authority
- JP
- Japan
- Prior art keywords
- intermediate layer
- hole
- surface layer
- multilayer printed
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 68
- 239000002344 surface layer Substances 0.000 claims description 45
- 239000004020 conductor Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
多層印刷配線板の中間層に設けた中間層パターン相互を
接続する中間層スルーホールを、表面層パターン相互を
接続するスルーホールの周囲に、同心に設けることによ
り、多層印刷配線板の小形化の推進を計る。[Detailed Description of the Invention] [Summary] Intermediate layer through holes that connect intermediate layer patterns provided in the intermediate layer of a multilayer printed wiring board are provided concentrically around through holes that connect surface layer patterns. This will promote the miniaturization of multilayer printed wiring boards.
本発明は、多層印刷配線板のスルーホール構造の改良に
関す。The present invention relates to improvements in the through-hole structure of multilayer printed wiring boards.
近年は電子機器の小形化、低コスト化に伴い、多数の搭
載部品を高密度に印刷配線板に実装することが要求され
ている。これに伴い高密度実装された搭載部品間の接続
、或いは搭載部品を外部回路に接続するために、多数の
パターンが必要となっている。In recent years, as electronic devices have become smaller and lower in cost, it has become necessary to mount a large number of components on printed wiring boards at high density. Along with this, a large number of patterns are required to connect mounted components mounted at high density or to connect mounted components to external circuits.
このために、近年は印刷配線板を多層化して、多数のパ
ターンの形成を可能とするともに、多数のスルーホール
を設けて、各層に形成したパターン間を接続している。To this end, in recent years, printed wiring boards have been multilayered to enable the formation of a large number of patterns, and a large number of through holes have been provided to connect the patterns formed in each layer.
多層印刷配線板に設けた従来のスルーホールは、一般に
第２図に示す断面図のように構成されている。Conventional through-holes provided in multilayer printed wiring boards are generally configured as shown in the cross-sectional view of FIG.
第２図に示す多層印刷配線板は、５枚の積層絶縁板より
なる多層印刷配線板の例であって、下方より上方に、表
面層１２、中間層２３，２□、２Ｉ１表面層ＩＩの順に
積層され一体化されている。The multilayer printed wiring board shown in FIG. 2 is an example of a multilayer printed wiring board consisting of five laminated insulating plates, and includes, from the bottom to the top, a surface layer 12, an intermediate layer 23, 2□, 2I1 and a surface layer II. They are laminated in order and integrated.
表面層１．．１２の外側面には、所望の表面層パターン
３０を印刷形成してあり、また表面層ＩＩ１２の内側面
、及び中間層２１１２□、２□の間には、それぞれ所望
の中間層パターン２０を印刷形成しである。Surface layer 1. ．． A desired surface layer pattern 30 is printed on the outer surface of the surface layer II 12, and a desired intermediate layer pattern 20 is printed on the inner surface of the surface layer II 12 and between the intermediate layers 2112□ and 2□. It is formed.
表面層１い１２の外側面に形成した表面層パターン３０
相互間は、下記のようにして接続している。Surface layer pattern 30 formed on the outer surface of the surface layer 1-12
They are connected to each other as follows.
所望の表面層パターン３０に接続するランド３Ａを、表
面層１１．１２のそれぞれの外側面に対向して形成し、
ランド３Ａの中心部に表面層１１＋ 中間層２３，２□
。A land 3A connected to the desired surface layer pattern 30 is formed opposite to the outer surface of each of the surface layers 11 and 12,
Surface layer 11+ Intermediate layer 23, 2□ in the center of land 3A
.
２３、及び表面層１２を貫通するスルーホール３を設け
る。このことにより、表面層ＩＩ上の表面層パターン３
０−ランド３Ａ−スルーボール３の導体部−ランド３Ａ
−表面層１．上の表面層パターン３０の電気回路が構成
される。23 and a through hole 3 penetrating the surface layer 12. As a result, the surface layer pattern 3 on the surface layer II
0-Land 3A-Conductor portion of through ball 3-Land 3A
-Surface layer 1. The electrical circuit of the upper surface layer pattern 30 is configured.
また、中間層パターン２０と表面層パターン３０との接
続は、例えば表面Ｎ１．と中間層２Ｉの間に中間層パタ
ーン２０を印刷形成し、この中間層パターン２０を、中
間層ランド４Ａを介してスルーホール３の導体部に接続
し、表面層パターン３０に接続している。Further, the connection between the intermediate layer pattern 20 and the surface layer pattern 30 is, for example, the connection between the surface layer pattern 20 and the surface layer pattern 30 at the surface N1. An intermediate layer pattern 20 is printed between the intermediate layer 2I and the intermediate layer 2I, and is connected to the conductor portion of the through hole 3 via the intermediate layer land 4A, and then to the surface layer pattern 30.
上述のようにすることにより、所望の表面層パターン３
０相互間、及び所望の中間層パターン２０と所望の表面
層パター・７３０間は、スルーホール３を介して接続す
ることができる。By doing as described above, the desired surface layer pattern 3
0 and between the desired intermediate layer pattern 20 and the desired surface layer pattern 730 can be connected through the through holes 3.
中間層パターン２０間の接続は、例えば中間層２３を所
望の個所で貫通する中間層スルーホール５を設け、中間
層ランド５Ａを介して、中間層２３の両側面に設けた中
間層パターン２０間を接続するようにしている。The connection between the intermediate layer patterns 20 can be made, for example, by providing an intermediate layer through hole 5 that penetrates the intermediate layer 23 at a desired location, and connecting the intermediate layer patterns 20 provided on both sides of the intermediate layer 23 via an intermediate layer land 5A. I am trying to connect.
なお、この中間層スルーホール５の導体部の内部に、例
えばエポキシ樹脂等の絶縁物６を充填して、多層印刷配
線板を製造する積層絶縁板を積層工程時に、中間層スル
ーホール５が圧壊しないようにしである。Note that the conductor portion of the intermediate layer through hole 5 is filled with an insulating material 6 such as epoxy resin to prevent the intermediate layer through hole 5 from being crushed during the lamination process of a laminated insulating board for manufacturing a multilayer printed wiring board. I try not to do that.
なおスルーホール３は、スルーホールの中空部に搭載部
品の端子を挿入し半田付けし、搭載部品を多層印刷配線
板に実装するという目的もあるので、搭載部品数が多く
なればなるほど多数必要であり、また中間層スルーホー
ル５は、中間層パターン２０の増加、即ち搭載部品の増
加に伴い多数必要である。The purpose of the through-hole 3 is to insert and solder the terminals of the mounted components into the hollow part of the through-hole and mount the mounted components on the multilayer printed wiring board, so the larger the number of mounted components, the more required. In addition, a large number of intermediate layer through holes 5 are required as the number of intermediate layer patterns 20 increases, that is, the number of mounted components increases.
しかしながら上記従来の多層印刷配線板のスルーホール
は、スルーホール３と中間層スルーホール５とは、導体
の直径がほぼ等しい。したがってスルーホール３を設け
た個所とは別の個所に、中間層スルーホール５を設けな
ければならない。However, in the through holes of the conventional multilayer printed wiring board, the through holes 3 and the intermediate layer through holes 5 have approximately the same conductor diameter. Therefore, the intermediate layer through hole 5 must be provided at a location different from the location where the through hole 3 is provided.
よって、多層印刷配線板の表面積が大きくなり、低コス
ト化を阻害するという問題点があった。Therefore, there is a problem in that the surface area of the multilayer printed wiring board becomes large, which hinders cost reduction.
本発明はこのような点にかんがみて創作されたもので、
表面積が小さくて小形の多層印刷配線板を、提供するこ
とを目的としている。The present invention was created in view of these points.
The purpose of the present invention is to provide a compact multilayer printed wiring board with a small surface area.
上記従来の問題点を解決するため本発明は、第１図に例
示し・たように、一方の表面［１１、中間層２２，２□
、−・・−１及び他方の表面層１２を貫通するスルーホ
ール３を設け、それぞれの表面層１２１２の外側面に設
けた表面層パターン３０相互を接続する。In order to solve the above conventional problems, the present invention, as illustrated in FIG.
, ...-1 and the other surface layer 12 are provided, and the surface layer patterns 30 provided on the outer surfaces of the respective surface layers 1212 are connected to each other.
また、所望の中間層パターン２０をスルーホール３の導
体部の外周面に接続して、表面層パターン３０と所望の
中間層パターン２０とを接続する。Further, the desired intermediate layer pattern 20 is connected to the outer peripheral surface of the conductor portion of the through hole 3, thereby connecting the surface layer pattern 30 and the desired intermediate layer pattern 20.
一方、スルーホール３に同心で、スルーホール３の外径
よりも大きい内径を有し、スルーホール３の導体部とは
絶縁物６０により絶縁された、所望の中間層のみを貫通
する中間層スルーホール５０を設ける。On the other hand, an intermediate layer through hole that is concentric with the through hole 3, has an inner diameter larger than the outer diameter of the through hole 3, and is insulated from the conductor part of the through hole 3 by an insulator 60, and that penetrates only the desired intermediate layer. A hole 50 is provided.
このような中間層スルーホール５０により、所望の中間
層パターン２０相互を接続する。Such intermediate layer through holes 50 connect desired intermediate layer patterns 20 to each other.
上記本発明において、中間層スルーホール５０は、スル
ーホール３に同心で、スルーホール３の周囲に形成しで
ある。したがって、スルーホール３と中間層スルーホー
ル５０とは、占有部分が殆ど共通となり、多層印刷配線
板の面積を小さくしても、必要数のスルーホール３．及
び中間層スルーホール５０を設けることができる。In the present invention, the intermediate layer through hole 50 is concentric with the through hole 3 and formed around the through hole 3. Therefore, the through holes 3 and the intermediate layer through holes 50 occupy almost the same portion, and even if the area of the multilayer printed wiring board is reduced, the required number of through holes 3. and an intermediate layer through hole 50 can be provided.
以下図を参照しながら、本発明を具体的に説明する。な
お、全図を通じて同一符号は同一対象物を示す。The present invention will be specifically described below with reference to the drawings. Note that the same reference numerals indicate the same objects throughout the figures.
第一１図は本発明の一実施例の図で、（ａ）は一部破断
斜視図、（ｂｌは断面図である。FIG. 11 shows an embodiment of the present invention, in which (a) is a partially cutaway perspective view, and (bl is a sectional view).
表面層１２、中間層２３．２□、２１２表面層１１の順
に積層され一体化された多層印刷配線板は、表面層１８
，１２の外側面に形成した表面層パターン３０相互間を
、所望の表面層パターン３０に接続するランド３Ａを、
表面層１３．■□のそれぞれの外側面に対向して形成し
、ランド３Ａの中心部に表面層１６．中間層２＋、 ２
ｔ、 ２ｘ、及び表面Ｎ１２を貫通するスルーホール３
を設けて、接続している。A multilayer printed wiring board in which the surface layer 12, the intermediate layer 23.2□, and the 212 surface layer 11 are laminated and integrated in this order has a surface layer 18.
, 12 to connect the surface layer patterns 30 formed on the outer surfaces of the surfaces 12 to a desired surface layer pattern 30.
Surface layer 13. A surface layer 16. is formed at the center of the land 3A, facing the outer surface of each of the lands 3A. Middle layer 2+, 2
t, 2x, and through hole 3 through surface N12
is set up and connected.
また、中間層パターン２０と表面層パターン３０との接
続は、例えば表面層１１と中間層２Ｉの間に中間層パタ
ーン２０を印刷形成し、この中間層パターン２０を、中
間層ランド４Ａを介してスルーホール３の導体部に接続
し、表面層パターン３０に接続している。Further, the connection between the intermediate layer pattern 20 and the surface layer pattern 30 is achieved by, for example, printing the intermediate layer pattern 20 between the surface layer 11 and the intermediate layer 2I, and connecting the intermediate layer pattern 20 through the intermediate layer land 4A. It is connected to the conductor portion of the through hole 3 and connected to the surface layer pattern 30.
一方、中間層パターン２０相互を接続するには、中間層
スルーホール５０を使用する。この中間層スルーホール
５０は、スルーホール３に同心で、スルーホール３の外
径よりも大きい内径を有し、スルーホール３の導体部と
は絶縁物６０により絶縁されている。On the other hand, intermediate layer through holes 50 are used to connect the intermediate layer patterns 20 to each other. This intermediate layer through hole 50 is concentric with the through hole 3, has an inner diameter larger than the outer diameter of the through hole 3, and is insulated from the conductor portion of the through hole 3 by an insulator 60.
例えば、中間層２．の両面に形成した中間層パターン２
０相互を接続するために、中間層２３の両側面に対向し
て、スルーホール３を中心とする中間層ランド５Ａを予
め形成して、中間層パターン２０と中間層ランド５八を
接続しである。For example, middle layer 2. Intermediate layer pattern 2 formed on both sides of
In order to connect the intermediate layer patterns 20 and the intermediate layer lands 58 to each other, intermediate layer lands 5A having the through holes 3 at the center are formed in advance on both sides of the intermediate layer 23, and the intermediate layer lands 5A are connected to the intermediate layer patterns 20 and the intermediate layer lands 58. be.
そして、スルーホール３に同心で、スルーホール３の導
体部の外径よりも大きい内径を有する、中間層２３を貫
通する中間層スルーホール５０を設けである。Then, an intermediate layer through hole 50 is provided which is concentric with the through hole 3 and has an inner diameter larger than the outer diameter of the conductor portion of the through hole 3 and penetrates through the intermediate layer 23 .
なお、中間層スルーホール５の導体部の内部に、例えば
エポキシ樹脂よりなる絶縁物６０を充填して、スルーホ
ール３の導体部の形成を可能とするとともに、スルーホ
ール３の導体部と中間層スルーホール５０の導体部とを
絶縁している。Note that the inside of the conductor part of the intermediate layer through hole 5 is filled with an insulator 60 made of, for example, epoxy resin, so that the conductor part of the through hole 3 can be formed, and the conductor part of the through hole 3 and the intermediate layer can be formed. The conductor portion of the through hole 50 is insulated.
以上説明したように本発明は、中間層パターン相互を接
続する中間層スルーホールを、表面層パターン相互を接
続するスルーホールの周囲に、同心に設けたものであっ
て、多層印刷配線板の表面積を小形にすることができ、
低コストであるという実用上で優れた効果がある。As explained above, the present invention provides intermediate layer through holes connecting intermediate layer patterns to each other concentrically around through holes connecting surface layer patterns to each other, so that the surface area of a multilayer printed wiring board is can be made smaller,
It has an excellent practical effect of being low cost.
【図面の簡単な説明】 第１図は本発明の一実施例の図で、 （ａ）は一部破断斜視図、 （ｂｌは断面図、 第２図は従来例の断面図である。 図において、 １０，１２は表面層、 ２１．２□、２３は中間層、 ３はスルーホール、 ５．５０は中間層スルーホール、 ２０は中間層パターン、 ３０は表面層パターンをそれぞれ示す。 −醪皺咋杵契の （ＣＬ） 弗 １ ― 第 ２ に[Brief explanation of drawings] FIG. 1 is a diagram of one embodiment of the present invention, (a) is a partially cutaway perspective view; (bl is a cross-sectional view, FIG. 2 is a sectional view of a conventional example. In the figure, 10 and 12 are surface layers, 21.2□, 23 are middle class, 3 is a through hole, 5.50 is the middle layer through hole, 20 is a middle layer pattern, 30 indicates a surface layer pattern, respectively. - Moriwa Kui Kiki contract (CL) 弗 - Second,
Claims (1)
・・・・・）、及び他方の表面層（１＿２）を貫通し、
該表面層（１＿１、１＿２）の外側面に設けた、表面層
パターン（３０）相互、及び該表面層パターン（３０）
と中間層パターン（２０）を接続するスルーホール（３
）と、 該スルーホール（３）に同心で、且つ該スルーホール（
３）の外径よりも大きい内径を有し、選択した中間層を
貫通して構成された、中間層パターン（２０）相互を接
続する中間層スルーホール（５０）とを、備えたことを
特徴とする多層印刷配線板のスルーホール。[Claims] One surface layer (1_1), intermediate layer (2_1, 2_2,
...), and penetrates the other surface layer (1_2),
The surface layer patterns (30) provided on the outer surfaces of the surface layers (1_1, 1_2) and the surface layer patterns (30)
and a through hole (3) connecting the intermediate layer pattern (20).
), concentric with the through hole (3) and with the through hole (
3) An intermediate layer through-hole (50) that connects the intermediate layer pattern (20) and is configured to penetrate the selected intermediate layer and has an inner diameter larger than the outer diameter of the intermediate layer (3). Through holes in multilayer printed wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9771987A JPS63261895A (en) | 1987-04-20 | 1987-04-20 | Through-hole of multilayer printed interconnection board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9771987A JPS63261895A (en) | 1987-04-20 | 1987-04-20 | Through-hole of multilayer printed interconnection board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63261895A true JPS63261895A (en) | 1988-10-28 |
Family
ID=14199702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9771987A Pending JPS63261895A (en) | 1987-04-20 | 1987-04-20 | Through-hole of multilayer printed interconnection board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63261895A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03225899A (en) * | 1990-01-31 | 1991-10-04 | Nippon Avionics Co Ltd | Multi-layered printed wiring board |
| JPH03273697A (en) * | 1990-03-23 | 1991-12-04 | Nippon Avionics Co Ltd | Multilayer printed-wiring board with inner via hole |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504573A (en) * | 1971-12-27 | 1975-01-17 |
-
1987
- 1987-04-20 JP JP9771987A patent/JPS63261895A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504573A (en) * | 1971-12-27 | 1975-01-17 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03225899A (en) * | 1990-01-31 | 1991-10-04 | Nippon Avionics Co Ltd | Multi-layered printed wiring board |
| JPH03273697A (en) * | 1990-03-23 | 1991-12-04 | Nippon Avionics Co Ltd | Multilayer printed-wiring board with inner via hole |
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