JPS581175U - Terminal mechanism for test points - Google Patents

Terminal mechanism for test points

Info

Publication number
JPS581175U
JPS581175U JP9377181U JP9377181U JPS581175U JP S581175 U JPS581175 U JP S581175U JP 9377181 U JP9377181 U JP 9377181U JP 9377181 U JP9377181 U JP 9377181U JP S581175 U JPS581175 U JP S581175U
Authority
JP
Japan
Prior art keywords
terminal mechanism
test points
wiring board
printed wiring
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9377181U
Other languages
Japanese (ja)
Inventor
辻　晃次
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP9377181U priority Critical patent/JPS581175U/en
Publication of JPS581175U publication Critical patent/JPS581175U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図、第２図は従来のテストポイント用端子機構の印
刷配線板の断面図、第３図は本考案による一実施例の印
刷配線板の断面図、第４図はその平面図である。 １・・・・・・印刷配線板、２・・・・・・従来技術の
裸軟銅線、３・・・・・・半田付け、４・・・・・・測
定器のプローブ、５・・・・・・端子ピン、６・・・・
・・本考案による裸軟銅線、７・・・０００ノ＼０Figures 1 and 2 are cross-sectional views of a printed wiring board of a conventional test point terminal mechanism, Figure 3 is a cross-sectional view of a printed wiring board of an embodiment of the present invention, and Figure 4 is a plan view thereof. . 1...Printed wiring board, 2...Bare annealed copper wire of conventional technology, 3...Soldering, 4...Probe of measuring instrument, 5... ...Terminal pin, 6...
...Bare annealed copper wire according to the present invention, 7...000＼＼

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線板に適当な穴を設け、該穴の上部を通過する位
置に裸軟銅線を印刷配線板に半田付された構造を特徴と
するテストポイント用端子機構。A test point terminal mechanism characterized by a structure in which a suitable hole is provided in a printed wiring board, and a bare annealed copper wire is soldered to the printed wiring board at a position passing through the upper part of the hole.
JP9377181U 1981-06-26 1981-06-26 Terminal mechanism for test points Pending JPS581175U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9377181U JPS581175U (en) 1981-06-26 1981-06-26 Terminal mechanism for test points

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9377181U JPS581175U (en) 1981-06-26 1981-06-26 Terminal mechanism for test points

Publications (1)

Publication Number Publication Date
JPS581175U true JPS581175U (en) 1983-01-06

Family

ID=29888739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9377181U Pending JPS581175U (en) 1981-06-26 1981-06-26 Terminal mechanism for test points

Country Status (1)

Country Link
JP (1) JPS581175U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605339U (en) * 1983-06-21 1985-01-16 浜口　秀彦 Pins for fixing agricultural vines

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605339U (en) * 1983-06-21 1985-01-16 浜口　秀彦 Pins for fixing agricultural vines
JPH018111Y2 (en) * 1983-06-21 1989-03-03

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