JP2010192795A - Electronic component mounting line - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform processes of printing solder and mounting electronic components on two substrates with high precision and good efficiency. <P>SOLUTION: An electronic component mounting line for mounting electronic components on both surfaces of the substrate includes: a single setting tool 14 capable of positioning and setting two substrates individually with mutually opposite-side surfaces made on top sides; and a conveying device 20 which conveys the setting tool 14 to a printing process of printing solder on the top sides of the two substrates and a mounting process of mounting the electronic components on the top sides of the two substrates in order. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component mounting line for printing solder on both sides of a substrate and mounting electronic components.

  For this type of electronic component mounting line, for example, the technology disclosed in Patent Document 1 is already known. In this technique, a solder printing unit, a component mounting unit, and a reflow furnace are sequentially arranged along the traveling direction of the conveyance path set in two rows. And it sets so that the board | substrate set to each jig | tool may be sent with respect to the conveyance path of two rows, and these two board | substrates may be processed collectively.

Japanese Patent No. 3900166

  In the technique disclosed in Patent Document 1, since two substrates are set in individual jigs and fed into the respective conveyance paths, they are shifted to the positions of jigs (substrates) that move through the individual conveyance paths. When this occurs, there is a difference in solder printing accuracy or component mounting accuracy with respect to each substrate. In other words, it may happen that the processing accuracy with respect to the individual substrates moving in the two rows of transport paths is appropriate, but one is inappropriate.

  An object of the present invention is to solve such a problem, and an object of the present invention is to perform processing such as solder printing and electronic component mounting on two substrates with high accuracy and efficiency.

The present invention is for achieving the above object, and is configured as follows.
An electronic component mounting line for mounting electronic components on both sides of a board, which can be set by individually positioning two boards with their opposite surfaces facing each other. And a conveying device for conveying the set jig in the order of a printing process for printing solder on the front sides of the two substrates, and a mounting process for mounting electronic components on the front sides of the two substrates, respectively. .

  According to this configuration, it is possible to simultaneously perform processes such as solder printing and electronic component mounting on the opposite surfaces of the two substrates set on the basis of one setting jig. High-precision processing can be performed efficiently.

The top view showing the electronic component mounting apparatus. The front view of FIG. The top view which represented FIG. 1 typically.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
The electronic component mounting line of the printed wiring board shown in the drawing is for mounting electronic components on both sides of the substrate. On the upper surface of the base 10 constituting this line, a setting jig 14 for setting a substrate, a solder printing machine 24, an electronic component mounting machine 30, and a reflow furnace 36 are arranged. 1 and 3 is the work position 12, and the space and the width space in the left-right direction are set to about one worker. The set jig 14 and the printing machine 24 are arranged on the right side of the drawing, and the reflow furnace 36 is arranged on the left side of the drawing. Further, the mounting machine 30 is disposed on the opposite side of the work position 12.

The setting jig 14 is a metal plate and includes a pair of positioning portions 16 and 17 on the upper surface thereof. These positioning portions 16 and 17 are formed in a rectangular concave shape, and can be set in a state in which a printed wiring board (not shown) is fitted. That is, two substrates can be set on the setting jig 14 at the same time.
The set jig 14 is reciprocally conveyed between the work position 12 and the mounting machine 30 by driving of a conveying device 20 described below. Further, the set jig 14 can be moved up and down in FIG. 2 with respect to the conveying device 20 side by driving and controlling the lifting cylinder 23 shown in FIG.

  The conveying device 20 is arranged on the base 10 and is configured such that the moving member 22 reciprocates between the work position 12 and the mounting machine 30 by driving thereof. A set jig 14 is mounted on the moving member 22 so as to be able to reciprocate and move up and down. Thereby, the conveyance apparatus 20 can reciprocate the setting jig | tool 14 (including the cylinder 23 for raising / lowering) between the working position 12 and the mounting machine 30 as mentioned above.

  The printing machine 24 includes a pair of masking sheets 26 disposed above the setting jig 14 and a pair of squeegees 28 located on both masking sheets 26. The masking sheet 26 and the squeegee 28 form a pair corresponding to the two substrates set on the positioning portions 16 and 17 of the setting jig 14. Both squeegees 28 reciprocate in a direction parallel to the moving member 22 of the conveying device 20 along the upper surface of each masking sheet 26 by a drive mechanism (not shown) of the printing press 24. Thereby, the paste-like solder supplied on both masking sheets 26 is printed on the corresponding substrate.

The mounting machine 30 is mainly composed of a robot arm 32. The robot arm 32 is driven to rotate around the axis of the arm shaft 33 shown in FIG. The spindle 34 provided at the tip of the robot arm 32 can be driven in the vertical direction, and a chuck (not shown) that can hold various electronic components mounted on the substrate at the lower end. ).
The mounting machine 30 may have a transfer function for transferring the substrate from the setting jig 14 to the reflow furnace 36. In that case, the robot arm 32 is provided with a spindle for gripping the substrate separately from the spindle 34.

The reflow furnace 36 is equipment for performing soldering on the substrate, and is disposed on the base 10 on the opposite side (left side in the drawing) of the printing machine 24. The reflow furnace 36 includes a pair of conveyors 38 that continuously pass from the mounting machine 30 side to the working position 12 side through the furnace.
Inside the reflow furnace 36, hot air is blown out from a plurality of air heaters (not shown) arranged along the moving direction of the conveyor 38. This hot air radiates far-infrared rays toward the substrate carried by both conveyors 38.

Next, mounting of electronic components by the mounting line will be described.
First, the substrate is set on the positioning portions 16 and 17 of the setting jig 14 at the work position 12. At this time, a substrate having one surface (hereinafter referred to as “A surface”) is positioned and set in one positioning portion 16, and the other surface (hereinafter referred to as “B surface”) is set in the other positioning portion 17. Position and set the board on the front side. As will be described later, electronic components have already been mounted and soldering has been completed for the A surface of the substrate whose B surface is set on the front side of the positioning portion 17.

As described above, the two substrates are simultaneously set on the single setting jig 14 and the operation of the mounting line is started. As a result, the conveying device 20 moves the setting jig 14 from the position indicated by the solid line in FIG. 1 to the printing position by the printer 24 and stops. In this printing position, the set jig 14 is raised by the lifting cylinder 23, and the surfaces (A surface and B surface) of the two substrates are brought into contact with the lower surfaces of the corresponding masking sheets 26, respectively.
Here, by causing both squeegees 28 of the printing machine 24 to reciprocate along the upper surface of the masking sheet 26, the paste-like solder is printed on the A side and B side of both substrates as described above. Thereafter, the set jig 14 is lowered to the original position by the lifting / lowering cylinder 23, and the A and B surfaces of both substrates are separated from the lower surfaces of the individual masking sheets 26. Thus, the “printing step” for simultaneously printing the solder on the two substrates is completed.

  After the set jig 14 is lowered to the original position, the transport device 20 is again driven and controlled, and the set jig 14 is moved to the mounting position indicated by the phantom line in FIG. 1 and stopped. A predetermined pattern of solder is individually printed on the surfaces (A surface and B surface) of both substrates carried to this mounting position in the above-described “printing step”. Therefore, the mounting machine 30 is driven and controlled at the mounting position, the robot arm 32 pivots around the axis of the arm shaft 33, and the vertical movement of the spindle 34 and the operation of the chuck are repeated and stocked at a predetermined position. The electronic components are mounted on the A side and B side of both substrates. Thus, the “mounting process” for mounting the electronic components on the two substrates is completed.

Next, the two substrates set in the positioning portions 16 and 17 of the setting jig 14 are transferred onto the conveyors 38 corresponding to the reflow furnace 36 by appropriate means. As described above, when the mounting machine 30 has a board transfer function, both boards are moved onto the individual conveyors 38 by the operation of the robot arm 32. At this time, the setting jig 14 is returned to the start position indicated by the solid line from the mounting position indicated by the phantom line in FIG.
Both substrates transferred onto both conveyors 38 of the reflow furnace 36 pass through the reflow furnace 36 by the movement of the conveyors 38 and are carried to the working position 12 side. Both substrates are heated by passing through the reflow furnace 36, and the solders individually printed in the “printing process” are melted and soldered. This completes the “soldering process” in a state where electronic components are mounted on two substrates.

Both substrates sent out from the reflow furnace 36 are individually collected from the conveyor 38 at the work position 12. As is apparent from the process flow shown by the arrows in FIG. 3, one of the set jigs 14 that has already returned to the start position is recovered for the substrate that has been recovered with the A side facing out. This time, it is set in the positioning portion 17 with the B surface facing up. On the other hand, since the mounting and soldering on both sides of the substrate collected with the B side facing up are completed, it is sent to the next step.
Note that a new substrate sent from the previous process is set on the other positioning portion 16 of the setting jig 14 with the A side facing up, and two substrates are set again on the setting jig 14. The above operation is repeated.

As described above, the solder printing in the “printing process” and the electron in the “mounting process” are performed on the A surface and the B surface, which are opposite surfaces of the two substrates set in one setting jig 14. Processing such as component mounting can be performed simultaneously in parallel. As a result, the electronic component mounting line can be downsized and the working efficiency can be improved as compared with the case where the processing on both sides of the substrate is performed on separate lines. In addition, since the two boards are moved in one direction to perform solder printing and electronic component mounting, and thereafter, the moving direction of both boards is reversed and soldering is performed in the reflow furnace 36. Is greatly shortened, and the installation space can be reduced.
Furthermore, the target substrate is a single unit (one piece), and unlike the case where a multi-piece substrate is separated later, there is no generation of dust associated with the separation work, and no extra man-hours are required.

14 Setting jig 20 Conveying device 24 Printing machine 30 Mounting machine

Claims (1)

An electronic component mounting line for mounting electronic components on both sides of a substrate,
A single set jig that can be set by positioning the two boards individually with the opposite sides facing up, and this set jig is printed with solder on the front side of the two boards. An electronic component mounting line comprising: a printing process for transporting, and a transport device for transporting the electronic components in the order of the mounting process for mounting electronic components on the front sides of the two boards.

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