CN115249758B - A pixel solid crystal machine - Google Patents

Abstract

The invention belongs to the technical field of semiconductor production equipment, and particularly relates to a pixel die bonder, which comprises a lower bottom plate, wherein a head bonding plate is fixed at the upper end of the lower bottom plate, a turret is assembled at the upper end of the head bonding plate, the output end of the turret extends to the lower end of the head bonding plate, a multi-station turntable is fixed at the lower end of the turret, the multi-station turntable is driven by the turret to perform unidirectional circular motion, and a plurality of vertical sliding table assemblies are annularly distributed at the outer side of the multi-station turntable. According to the invention, the pick-up of one (or a plurality of) pixel R, G, B wafers can be completed at a time, the die bonding path and single die bonding time are reduced, meanwhile, the conditions of wafer rotation angle at the lower end of the suction nozzle, cleanliness at the lower end of the suction nozzle, wafer damage, wafer omission and the like can be detected through the image acquisition element, when the wafer angle has deviation, the deflection angle of the wafer can be corrected through the rotation element, and the yield of die bonding is improved.

Description

A pixel solid crystal machine

technical field

The invention belongs to the technical field of semiconductor production equipment, and in particular relates to a pixel solid crystal machine.

Background technique

Die bonding machine is a kind of mechanical equipment for fixing crystals and semiconductor packaging. It can transfer and attach the wafer on the blue film to the substrate to complete chip mounting. It is widely used in LED direct display screens, semiconductor discrete devices, DIP And the production of SOP and other products.

When using a solid crystal machine to manufacture LED direct display screens, since each pixel on the LED direct display screen is composed of wafers of three different colors, red (R), green (G), and blue (B), in In the traditional wafer bonding process, the die bonding equipment picks up the wafer through the suction nozzle, and then drives the suction nozzle to move through the swing arm, and transports the wafer on the wafer supply ring to the substrate. The following problems exist in the process of round fitting:

1. The swing arm on the die-bonding equipment can only carry one wafer at a time. To complete one pixel R, G, and B wafers on the substrate, the swing arm needs to swing back and forth three times. Wafer handling efficiency and production efficiency lower;

2. The wafer is transported by swinging, which requires high rigidity and strength of the swing arm. The single die bonding path is long, the single die bonding time is long, the wafer handling frequency is high, the fixed platform runs many times, and the swing arm reciprocates The high frequency of movement will lead to a relatively weakened operation stability of the die-bonding equipment, and a relative decrease in the performance of the die-bonding, thereby affecting the final yield of the substrate;

3. After the suction nozzle picks up the wafer, if the rotation angle of the wafer on the suction nozzle deviates, it is difficult to adjust the angle due to the suction state, and the existing equipment does not have an angle correction mechanism, which cannot correct the rotation angle of the wafer. Wafers with deviations in angles are attached to the substrate, which will lead to a decrease in the yield of the substrate, which in turn will increase production costs and reduce product quality;

Based on the above problems, this solution proposes a pixel die bonder to solve the above industry pain points.

Contents of the invention

The purpose of the present invention is to provide a pixel die bonding machine, which can absorb wafers sequentially and complete the die bonding of one (or more) pixel R, G, and B wafers at a time, reducing the die bonding path and single die bonding time (The efficiency is increased by 3 times or 3*N times). At the same time, the rotation angle of the wafer at the lower end of the suction nozzle, the cleanliness of the lower end of the suction nozzle, wafer damage, and wafer omission can be detected through the image acquisition element. When there is a deviation in the circular rotation angle, the deflection angle of the wafer can be corrected by the rotating motor, which improves the yield rate of the substrate.

The technical scheme that the present invention takes is specifically as follows:

A pixel solid crystal machine, comprising a lower base plate, the upper end of the lower base plate is fixed with a bond head plate, the upper end of the bond head plate is equipped with a turret, and the output end of the turret extends to the lower end of the bond head plate , the lower end of the turret is fixed with a multi-station turntable, and the multi-station turntable makes a one-way circular motion under the drive of the turret, and the outer side of the multi-station turntable is annularly distributed with a plurality of vertical slide assemblies ,Also includes:

A wafer pick-up and correction assembly, the wafer pick-up and correction assembly is assembled on the vertical slide assembly, a vacuum air passage is opened inside the wafer pick-up and correction assembly, and the vertical slide assembly can drive the wafer pick-up and correction Components move vertically;

A suction nozzle, the suction nozzle is assembled inside the wafer pick-up and correction assembly, and a plurality of adsorption air passages are provided inside the suction nozzle;

Picking air path, the picking air path is composed of adsorption air path and vacuum air path, and the suction nozzle can pick up wafers sequentially through the picking air path to complete the pickup of pixel R, G, and B wafers;

An image acquisition assembly, the image acquisition assembly is assembled on the upper end of the lower base plate, and the image acquisition assembly can detect the rotation angles of R, G, and B wafers;

Wherein, the R, G, and B wafers can rotate synchronously with the suction nozzle to adjust the rotation angles of the R, G, and B wafers.

In a preferred solution, the wafer pickup and correction assembly includes a rotating motor, a vacuum seat, an axial fixing sleeve and a limit nut, the rotating motor is assembled on the vertical slide assembly, and the internal setting of the rotating motor There is an output shaft, and both ends of the output shaft extend to the outside of the rotating motor, the vacuum seat is fixed on the upper end of the rotating motor, and the vacuum air passage runs through the output shaft and the inside of the vacuum seat, the shaft The fixed sleeve is fixed to the lower end outside the output shaft, the suction nozzle is slipped inside the axial fixed sleeve, and the upper end of the suction nozzle fits with the lower end of the output shaft, and the limit nut is threaded It is located at the lower end of the axial fixed sleeve, and the limit nut can limit the suction nozzle.

In a preferred solution, it also includes a substrate holding assembly, a plurality of wafer supply assemblies and a plurality of image positioning assemblies, the substrate holding assembly and the plurality of wafer supply assemblies are all assembled on the lower base plate, and the There is a one-to-one correspondence between the wafer supply component and the image acquisition component, and a plurality of the image positioning components are assembled on the headboard, and the plurality of the image positioning components and the multiple wafer supply components as well as the image positioning component and the substrate clamping component There is a one-to-one correspondence between the substrate clamping assembly and the lower base plate, and between the wafer supply assembly and the lower base plate are equipped with a cross table, through which the cross table can adjust the substrate clamping assembly and The location of the wafer supply assembly.

In a preferred solution, the suction nozzle can pick up wafers sequentially through the pick-up air path to complete the pick-up of a group of pixel R, G, and B wafers.

In a preferred solution, the suction nozzle can pick up wafers sequentially through the pick-up air path to complete the pick-up of multiple groups of pixel R, G, and B wafers.

In a preferred solution, the suction nozzle can pick up wafers sequentially through the pick-up air path to complete the pick-up of any number of pixel R, G, and B wafers.

A control terminal, suitable for a pixel solid crystal machine described in any one of the above, including a processing unit, a storage unit and a communication module connected through a system bus, and an operating system and a CCD visual detection system are stored in the storage unit , when the processing unit runs the CCD visual inspection system, it can process and calculate the image.

The technical effect that the present invention obtains is:

The present invention can assemble the suction nozzle on the lower end of the output shaft through the cooperation of the axial fixing sleeve and the limit nut, and check the rotation angle of the wafer located at the lower end of the suction nozzle through the image acquisition element. If the rotation angle of the wafer deviates , start the rotating motor, drive the suction nozzle to rotate through the output shaft, and then adjust the rotation angle of the wafer at the lower end through the suction nozzle, so as to avoid the deviation of the rotation angle of the wafer when the wafer is attached, which will lead to the die-bonding yield Decrease, improve product quality and reduce production cost;

The invention drives the multi-station turntable to rotate in one direction through the turret, and alternately picks up, transports and attaches the wafers through a plurality of wafer pickup and correction components outside the multi-station turntable, which reduces the die-bonding path and single die-bonding It improves the efficiency of die bonding, reduces the number of times of operation of the die bonding platform, and relatively improves the stability of device operation and the performance of die bonding;

When the present invention picks up the wafer through the suction nozzle, through the multiple adsorption suction channels opened inside it, after the negative pressure is formed inside the pickup air circuit, the wafer can be picked up sequentially through the suction nozzle, and one or more pixels R, G, The picking of B wafers further reduces the number of runs of the die-bonding platform, improving the efficiency and productivity of die-bonding;

The present invention collects images of the lower end of the suction nozzle through the image acquisition element, and processes and calculates the collected image through the CCD visual detection system, and can check the rotation angle of the R, G, B wafers at the lower end of the suction nozzle and the cleaning of the lower end of the suction nozzle. Detection of degree, wafer damage, and wafer omission.

Description of drawings

Fig. 1 is a schematic structural diagram of the whole in Embodiment 1 of the present invention;

Fig. 2 is the rear view of the overall structure in Embodiment 1 of the present invention;

Fig. 3 is a schematic structural view of the top of the lower floor in Embodiment 1 of the present invention;

FIG. 4 is a schematic structural view of a turret and a wafer pick-up and correction assembly according to Embodiment 1 of the present invention;

Fig. 5 is a partial enlarged view of place A in Fig. 4 of the present invention;

6 is a cross-sectional view of the structure of the wafer pickup and correction assembly in Embodiment 1 of the present invention;

7 is a schematic structural diagram of an image acquisition component in Embodiment 1 of the present invention;

Fig. 8 is an exploded view of the structure of the image acquisition component in Embodiment 1 of the present invention;

9 is a schematic structural view of the cleaning assembly in Embodiment 1 of the present invention;

FIG. 10 is a schematic structural view of the substrate clamping assembly in Embodiment 1 of the present invention;

11 is a schematic structural diagram of a wafer supply assembly in Embodiment 1 of the present invention;

Fig. 12 is a schematic structural diagram of an image positioning component in Embodiment 1 of the present invention;

Fig. 13 is a frame diagram of a control terminal in Embodiment 1 of the present invention.

In the accompanying drawings, the list of parts represented by each label is as follows:

10. Lower bottom plate; 11. State head plate; 12. Suction nozzle; 20. Turret; 21. Multi-station turntable; 22. Vertical slide assembly;

30. Wafer pick-up and correction components;

31. Rotating motor; 32. Vacuum seat; 33. Axial fixed sleeve; 34. Limit nut; 35. Output shaft;

40. Image acquisition component;

41. Base; 42. Horizontal adjustment plate; 43. Longitudinal adjustment plate; 44. Displacement slide assembly; 45. Image acquisition component;

50. Cleaning components;

51. Lower base; 52. Vertical sliding table; 53. Horizontal sliding table; 54. Driving motor; 55. Dust collecting box;

60. A substrate clamping component; 70. A wafer supply component; 80. An image positioning component.

Detailed ways

In order to make the above objects, features and advantages of the present invention more obvious and comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

Second, "one embodiment" or "an embodiment" referred to herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. "In a preferred embodiment" appearing in different places in this specification does not all refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments.

Secondly, the present invention is described in detail in conjunction with schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the structure of the device will not be partially enlarged according to the general scale, and the schematic diagram is only an example, which should not limit the present invention. scope of invention protection. In addition, the three-dimensional space dimensions of length, width and depth should be included in actual production.

Embodiment one

Please refer to the accompanying drawings 1-5, which is the first embodiment of the present invention. This embodiment provides a pixel solid crystal machine, including a lower base plate 10, and a bond head plate 11 is fixed on the upper end of the lower base plate 10. The bond head The upper end of the plate 11 is equipped with a turret 20, and the output end of the turret 20 extends to the lower end of the head plate 11, the upper end of the turret 20 is provided with an electric slip ring, and the lower end of the turret 20 is fixed with a multi-station turntable 21, The multi-station turntable 21 performs one-way circular motion under the drive of the turret 20, and the outer side of the multi-station turntable 21 is circularly distributed with a plurality of vertical sliding table assemblies 22, which also include:

Wafer pick-up and correction assembly 30, the wafer pick-up and correction assembly 30 is assembled on the vertical slide assembly 22, the inside of the wafer pick-up and correction assembly 30 is provided with a vacuum air passage, and the vertical slide assembly 22 can drive the wafer pick-up and correction assembly 30 moves in the vertical direction;

The suction nozzle 12, the suction nozzle 12 is assembled inside the wafer pick-up and correction assembly 30, and the inside of the suction nozzle 12 is provided with a plurality of suction air channels;

The pick-up air path is composed of the adsorption air path and the vacuum air path. The suction nozzle 12 can pick up the wafers sequentially through the pick-up air path to complete the wafer pickup;

Among them, wafer pickup can be divided into three types, specifically:

Method 1: The suction nozzle 12 can pick up the wafers sequentially through the pick-up air path, and complete the pick-up of a group of pixel R, G, and B wafers.

Method 2: The suction nozzle 12 can pick up the wafers sequentially through the pick-up air path, and complete the pick-up of multiple sets of pixel R, G, and B wafers.

Method 3: The suction nozzle 12 can pick up the wafers sequentially through the pick-up air path, and complete the pick-up of any number of pixel R, G, and B wafers.

Of course, the above method is not a limitation to the actual picking, and the specific picking process can be selected according to production requirements.

An image acquisition assembly 40, the image acquisition assembly 40 is assembled on the upper end of the lower base plate 10, the image acquisition assembly 40 can detect the rotation angles of the R, G, and B wafers;

Wherein, the R, G, and B wafers can rotate synchronously with the suction nozzle 12 to adjust the rotation angles of the R, G, and B wafers.

Here, a vacuum pump is used in conjunction with the wafer pick-up and correction assembly 30. After the vacuum pump is running, a negative pressure is formed inside the pick-up air path, and the suction nozzle 12 picks up R, G, and B wafers through the negative pressure inside the pick-up air path.

In this embodiment, the turret 20 is started, and through the fixed connection between the turret 20 and the multi-station turntable 21, the turret 20 drives the multi-station turntable 21 to perform a one-way circular motion. Since the vertical slide assembly 22 is distributed on The outer side of the multi-station turntable 21 makes the multi-station turntable 21 drive the vertical slide assembly 22 to rotate, and then drives the wafer pick-up correction assembly 30 and the suction nozzle 12 to rotate. When the suction nozzle 12 rotates above the wafer, the vertical To the sliding table assembly 22, the vertical sliding table assembly 22 drives the wafer pickup and correction assembly 30 to move in the vertical direction, thereby making the suction nozzle 12 move towards the direction close to the wafer. When the suction nozzle 12 and the wafer are attached, start Vacuum pump makes negative pressure inside the pick-up air path, and the wafer is picked up through the adsorption air passage inside the suction nozzle 12. At the same time, since there are three adsorption air passages inside the suction nozzle 12, the suction nozzle 12 is driven to rotate sequentially through the turret 20 To the top of the R wafer, G wafer and B wafer, so that the suction nozzle 12 can sequentially suck the R wafer, G wafer and B wafer to complete the pickup of one pixel R, G and B wafers. 12 After picking up the R, G, and B wafers, the turret 20 drives the suction nozzle 12 to rotate. When the suction nozzle 12 rotates to the top of the image acquisition component 40, the rotation of the R, G, and B wafers by the image acquisition component 40 The angle is detected, and when the rotation angles of the R, G, and B wafers deviate, the wafer pick-up and correction assembly 30 is started, and the suction nozzle 12 is driven to rotate by the wafer pick-up and correction assembly 30, and then the suction nozzle 12 is used to correct the R, G, and B wafers. The rotation angle of the B wafer is corrected, so that the device has the function of detecting and correcting the rotation angle of the wafer, so as to avoid the deviation of the rotation angle when the R, G, and B wafers are attached to the substrate, resulting in a decrease in the yield of the substrate , Improve product quality and reduce production costs.

Next, please refer to Fig. 5-6 again, the wafer pick-up and correction assembly 30 includes a rotating motor 31, a vacuum seat 32, an axial fixing sleeve 33 and a limit nut 34, and the rotating motor 31 is assembled on the vertical slide assembly 22, rotating The inside of the motor 31 is provided with an output shaft 35, and both ends of the output shaft 35 extend to the outside of the rotary motor 31, the vacuum seat 32 is fixed on the upper end of the rotary motor 31, and the vacuum air passage runs through the output shaft 35 and the vacuum seat 32, the axial fixed sleeve 33 is fixed on the lower end of the output shaft 35, the suction nozzle 12 is slipped on the inside of the axial fixed sleeve 33, and the upper end of the suction nozzle 12 fits with the lower end of the output shaft 35, limiting The position nut 34 is threadedly connected to the lower end of the axial fixed sleeve 33 , and the limit nut 34 can limit the suction nozzle 12 .

Here, the vacuum seat 32 and the vacuum pump are connected through pipelines.

Further, the inside of the axial fixed sleeve 33 is equipped with a sealing element, and the material of the sealing element is a flexible material. The limit nut 34 is screwed so that the suction nozzle 12 is limited by the limit nut 34. When the suction nozzle 12 After the upper end is attached to the output shaft 35, it will squeeze the sealing element of flexible material, thereby avoiding the gap between the suction nozzle 12 and the output shaft 35, and improving the sealing performance of the air passage

In this embodiment, the vertical slide assembly 22 is started, the rotating motor 31 is driven to move in the vertical direction by the vertical slide assembly 22, and the suction nozzle 12, the axial fixing sleeve 33 and the limit nut 34 are driven by the rotating motor 31 Move in the vertical direction. When the suction nozzle 12 is attached to the wafer, start the vacuum pump to pick up the R, G, and B wafers through the suction nozzle 12. When the suction nozzle 12 carries the R, G, and B wafers and rotates to the upper end of the image acquisition module 40 Finally, the rotation angles of the R, G, and B wafers are detected by the image acquisition assembly 40, and when the rotation angles of the R, G, and B wafers deviate, the rotating motor 31 is started to rotate the output shaft rod 35, and the output shaft rod 35 is rotated through the output shaft The fixed connection between the rod 35 and the axial fixed sleeve 33 and the threaded connection between the axial fixed sleeve 33 and the limit nut 34 make the output shaft rod 35 drive the axial fixed sleeve 33 and the limit nut 34 to rotate, and further pass through the axial fixed sleeve. 33 and the limit nut 34 drive the suction nozzle 12 to rotate, and then correct the rotation angles of the R, G, and B wafers through the suction nozzle 12 .

In order to further understand and explain the process of adjusting the rotation angle of the wafer driven by the suction nozzle 12, taking Fig. The collection element 45, the base 41 is fixed on the upper end of the lower bottom plate 10, the horizontal adjustment plate 42 is slidably connected to the upper end of the base 41, the longitudinal adjustment plate 43 is slidably connected to the upper end of the horizontal adjustment plate 42, and the displacement slide assembly 44 is assembled on the longitudinal adjustment plate 43 On one side, the image acquisition element 45 is fixed on one side of the displacement slide assembly 44, and the upper end of the displacement slide assembly 44 and the upper end outside the image acquisition element 45 are also provided with a light source element, preferably an LED light source element, through which the light source element can Provide lighting and brightness supplements in the visible range.

Further, the displacement slider assembly 44 at least includes a slider base, a displacement slider and a positioning assembly, the slider base and the displacement slider are slidably connected, and the positioning assembly is assembled between the slider base and the displacement slider. The positioning assembly can limit the displacement of the slider, wherein the sliding base is fixedly connected to the longitudinal adjustment plate 43 , and the displacement slide is fixedly connected to the image acquisition element 45 .

In this embodiment, push the lateral adjustment plate 42 and the longitudinal adjustment plate 43 to adjust the position of the image acquisition element 45 on the horizontal plane, release the limitation of the positioning assembly on the displacement slide table, and adjust the position of the displacement slide block, through the displacement slide block and The fixed connection of the image acquisition element 45 adjusts the position of the image acquisition element 45 in the vertical direction, so that the image acquisition element 45 is located on the moving track of the suction nozzle 12, thereby facilitating the image acquisition element 45 to R, G, and B wafers At the same time, the cleanliness of the lower end of the suction nozzle 12, wafer damage, and wafer omission can be detected through the image acquisition element 45, which further improves the yield of the substrate.

Secondly, please refer to Fig. 9 again, and also include: cleaning assembly 50, and cleaning assembly 50 comprises lower base 51, longitudinal sliding table 52, lateral sliding table 53, driving motor 54 and dust collecting box 55, and lower base 51 is fixed on the lower base. On the bottom plate 10, the longitudinal slide 52 is fixed on one side of the lower base 51, the transverse slide 53 is fixed on the output end of the longitudinal slide 52, the drive motor 54 is fixed on the output of the transverse slide 53, and the output of the drive motor 54 The end is equipped with a cleaning element, and the dust box 55 is assembled on the output end of the transverse slide table 53 and is positioned at the lower end of the cleaning element.

Further, the head board 11 is also provided with a negative pressure detection module. After the R, G, B wafers and the substrate are bonded, the negative pressure detection module is used to perform negative pressure detection. If there is a difference in negative pressure, the turret 20 will drive the suction nozzle 12 to rotate to the upper end of the cleaning assembly 50, and the suction nozzle 12 will be cleaned by driving the motor 54.

In this embodiment, when the image acquisition element 45 detects that there is dirt at the lower end of the suction nozzle 12, under the drive of the turret 20, the suction nozzle 12 with the dirt at the lower end is rotated to the upper end of the cleaning element, and the longitudinal sliding table is started 52 and the horizontal sliding table 53, under the cooperation of the vertical sliding table 52 and the horizontal sliding table 53, the cleaning element at the output end of the driving motor 54 is fitted to the above-mentioned suction nozzle 12, the driving motor 54 is started, and the cleaning element is driven by the driving motor 54 Rotate, the above-mentioned suction nozzle 12 is cleaned by the cleaning element, and at the same time, the dust that is swept down is collected by the dust box 55 .

Next, please refer to FIGS. 1-3 and 10-12 together, which also includes a substrate holding assembly 60, a plurality of wafer supply assemblies 70 and a plurality of image positioning assemblies 80, and a substrate holding assembly 60 and a plurality of wafers. The supply assembly 70 is assembled on the lower base plate 10, and the wafer supply assembly 70 corresponds to the image acquisition assembly 40 one by one, and a plurality of image positioning assemblies 80 are assembled on the headboard 11, and a plurality of image positioning assemblies 80 and a plurality of There is a one-to-one correspondence between the wafer supply assembly 70 and the image positioning assembly 80 and the substrate holding assembly 60, and a cross work is installed between the substrate holding assembly 60 and the lower base plate 10 as well as between the wafer supply assembly 70 and the lower base plate 10 stage, the positions of the substrate holding assembly 60 and the wafer supply assembly 70 can be adjusted in the horizontal direction through the cross table.

Further, the substrate clamping assembly 60 is provided with a clamping jig for clamping the substrate, and the wafer supply assembly 70 is provided with a wafer supply ring for supplying R, G and B wafers, the wafer supply ring is provided with a blue film, the upper end of the lower bottom plate 10 and the lower end of the wafer supply ring is equipped with a jacking device, when the suction nozzle 12 sucks the wafer, start the jacking device, The wafer can be lifted by the lifting device, so that the wafer is separated from the blue film. The image positioning component 80 is provided with an industrial camera, which is used for precise positioning of the wafer, and the substrate clamping component 60 and the wafer supply component Under the action of the cross table at its lower end, 70 can adjust its position in the horizontal direction, and then drive the substrate, wafer supply ring and R, G, B wafers on the wafer supply ring to adjust their positions.

Preferably, in this embodiment, the number of suction nozzles 12 and wafer pick-up and correction assemblies 30 is eight, and the horizontal angle between two adjacent wafer pick-up and correction assemblies 30 is 45 degrees, and the adjacent During the two die-bonding cycles, the R, G, and B wafers rotate at an angle of 45 degrees when transported by the suction nozzle 12, thereby shortening the die-bonding path and the time for a single die-bonding, and the number of wafer supply assemblies 70 is Three, eight wafer pick-up correction assemblies 30 can alternately pick up the wafers on the three wafer supply assemblies 70. At the same time, when the wafer is picked up by the suction nozzle 12, the three suction suction channels opened inside it will be picked up in the air. After the negative pressure is formed inside the circuit, the wafers can be picked up sequentially by the suction nozzle 12, completing the picking up of a pixel R, G, and B wafers, shortening the number of operations of the wafer supply assembly 70, and improving the efficiency and productivity of die bonding.

In this embodiment, before the suction nozzle 12 picks up the R, G, and B wafers, the image positioning component 80 is used to accurately obtain the wafer position on the wafer supply ring. When on the track, start the cross table at the lower end of the wafer supply ring, adjust the position of the wafer on the wafer supply ring in advance through the cross table, so that the suction nozzle 12 can accurately pick up the R, G, B wafers, When the suction nozzle 12 picks up the R, G, and B wafers, the jacking device is started synchronously, and the wafer is lifted up by the jacking device to separate it from the blue film. Driven by the turret 20, the suction nozzle 12 Rotate, and pass the upper end of the image acquisition assembly 40 and stay on the upper end of the substrate on the substrate clamping assembly 60. When the suction nozzle 12 drives the R, G, and B wafers to rotate to the upper end of the image acquisition assembly 40, the suction The rotation angles of the R, G, and B wafers at the lower end of the nozzle 12 are detected. If the rotation angles of the R, G, and B wafers at the lower end of the suction nozzle 12 deviate, the rotation angles are corrected by the wafer pickup and correction assembly 30, After the suction nozzle 12 rotates to the upper end of the substrate, the R, G, and B wafers picked up by the suction nozzle 12 are placed on the substrate, and before the suction nozzle 12 places the R, G, and B wafers on the substrate, the The image positioning assembly 80 adapted to the holding assembly 60 can position the substrate to avoid deviations in the placement positions of the R, G, and B wafers. When there is a deviation in the position of the substrate, start the cross table at the lower end of the substrate holding assembly 60 , to adjust the position of the substrate.

The present invention also provides a control terminal, which may be a computer device, a server or other terminals with data processing capability. The control terminal includes a processing unit, a storage unit, and a communication module connected through a system bus, wherein the processing unit includes at least a CPU, a memory, a BIOS chip, and an I/O control chip, and the CPU is used to process instructions, execute operations, and request Actions, control time, and data processing. Memory components are used to temporarily store computing data in the CPU and data exchanged with external memories such as hard disks. BIOS chips are used for initialization and detection of various hardware devices during computer startup. I/O The control chip is used to manage all the input and output devices of the system. The storage unit of the control terminal includes a non-volatile storage medium and an internal storage unit. The non-volatile storage medium stores an operating system and a CCD visual detection system. The memory provides an environment for the operation of the operating system and the CCD visual inspection system in the non-volatile storage medium.

It should be noted that the CCD visual inspection system is an existing mature technology. It is a system that replaces human eyes with industrial cameras to complete functions such as identification, measurement, and positioning. It is widely used in electronic connectors, manufacturing industries, and connectors. The detection of flatness and alignment has the advantages of high detection efficiency, low cost, and high precision, so I won’t repeat them here.

In this embodiment, image acquisition is performed on the R, G, and B wafers at the lower end of the suction nozzle 12 through the image acquisition element 45, and the acquired image is transmitted to the control terminal, and the image is processed and calculated by the CCD visual inspection system. , the rotation angles of the R, G, and B wafers are determined, and if there is a deviation in the rotation angles of the R, G, and B wafers, the rotation angles of the R, G, and B wafers are corrected by the rotating motor 31, and at the same time, the rotation angles of the R, G, and B wafers are corrected by The CCD visual inspection system can also detect the cleanliness of the lower end of the suction nozzle 12, wafer damage, and wafer omission.

Working principle of the present invention is:

The suction nozzle 12 is driven by the turret 20 to rotate to the upper end of the wafer supply assembly 70, and the R, G, and B wafers are picked up by the suction nozzle 12. Before the suction nozzle 12 picks up the R, G, and B wafers, the image positioning assembly 80 accurately Acquire the wafer position on the wafer supply assembly 70, when the wafer position deviates, adjust the position of the wafer on the wafer supply ring on the wafer supply assembly 70 through the cross table at the lower end of the wafer supply assembly 70, and start The wafer pick-up and correction assembly 30 enables multiple suction nozzles 12 to pick up wafers alternately. When the suction nozzles 12 pick up R, G, and B wafers, the jacking device is started synchronously, and the wafer is jacked up by the jacking device to make it Separated from the blue film, driven by the turret 20, the suction nozzle 12 is rotated, and passes through the upper end of the image acquisition assembly 40 and stays on the upper end of the substrate on the substrate clamping assembly 60, the suction nozzle 12 drives R, G, B When the wafer rotates to the upper end of the image acquisition assembly 40, the rotation angle of the R, G, and B wafers at the lower end of the suction nozzle 12 is detected by the image acquisition assembly 40, and the wafer pick-up correction assembly 30 is started to rotate the wafer at the lower end of the suction nozzle 12. R, G, and B wafers are corrected. After the suction nozzle 12 is rotated to the upper end of the substrate, the R, G, and B wafers picked up by the suction nozzle 12 are placed on the substrate, and the R, G, and B wafers are placed on the suction nozzle 12. Before the circle is placed on the substrate, the position of the substrate is positioned by the image positioning component 80 adapted to the substrate clamping component 60 to avoid deviations in the placement positions of the R, G, and B wafers. When the position of the substrate deviates, start The cross table at the lower end of the substrate clamping assembly 60 adjusts the position of the substrate.

The above are only preferred embodiments of the present invention, and it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications should also be regarded as protection scope of the present invention. The structures, devices and operation methods not specifically described and explained in the present invention, unless otherwise specified and limited, shall be implemented according to conventional means in the art.

Claims (8)

1. A pixel solid crystal machine, comprising a lower base plate (10), characterized in that: the upper end of the lower base plate (10) is fixed with a head plate (11), and the upper end of the head plate (11) is equipped with A turret (20), and the output end of the turret (20) extends to the lower end of the head plate (11), the lower end of the turret (20) is fixed with a multi-station turntable (21), and the multi-station The station turntable (21) performs one-way circular motion under the drive of the turret (20). The outer side of the multi-station turntable (21) is distributed with a plurality of vertical sliding table assemblies (22), which also includes: A wafer pick-up and correction component (30), the wafer pick-up and correction component (30) is assembled on the vertical slide assembly (22), and a vacuum air passage is opened inside the wafer pick-up and correction component (30), so The vertical slide assembly (22) can drive the wafer pick-up and correction assembly (30) to move in the vertical direction; The suction nozzle (12), the suction nozzle (12) is assembled inside the wafer pick-up and correction assembly (30), the inside of the suction nozzle (12) has a plurality of adsorption air channels, the suction nozzle (12) There are three internal adsorption air channels; Picking air path, the picking air path is composed of adsorption air path and vacuum air path, and the suction nozzle (12) can pick up wafers sequentially through the picking air path to complete the pickup of pixel R, G, and B wafers, wherein , through the turret (20) to drive the suction nozzle (12) to rotate above the R wafer, G wafer and B wafer in turn, so that the suction nozzle (12) can sequentially suck the R wafer, G wafer and B wafer ; An image acquisition component (40), the image acquisition component (40) is assembled on the lower base plate (10), and the image acquisition component (40) can detect the rotation angles of R, G, and B wafers; Wherein, the R, G, and B wafers can rotate synchronously with the suction nozzle (12) to adjust the rotation angles of the R, G, and B wafers; Also includes: cleaning assembly (50), the cleaning assembly (50) includes the lower base (51), the longitudinal sliding table (52), the horizontal sliding table (53), the driving motor (54) and the dust box (55), the lower The base (51) is fixed on the lower base plate (10), the longitudinal slide (52) is fixed on one side of the lower base (51), and the transverse slide (53) is fixed on the output end of the longitudinal slide (52). The drive motor (54) is fixed on the output end of the transverse slide table (53), and the output end of the drive motor (54) is equipped with a cleaning element, and the dust collection box (55) is assembled on the output end of the transverse slide table (53) and is located on the cleaning unit. At the lower end of the component, a negative pressure detection module is also installed on the headboard (11). When the R, G, B wafers are bonded to the substrate, the negative pressure detection module is used to detect the suction nozzle (12). . 2. A pixel die bonding machine according to claim 1, characterized in that: the wafer pick-up and correction assembly (30) includes a rotating motor (31), a vacuum seat (32), an axial fixing sleeve (33) and limit nuts (34), the rotating motor (31) is assembled on the vertical slide assembly (22), the inside of the rotating motor (31) is provided with an output shaft (35), and the output shaft Both ends of the rod (35) extend to the outside of the rotating motor (31), the vacuum seat (32) is fixed on the upper end of the rotating motor (31), and the vacuum air passage runs through the output shaft (35) and the vacuum seat (32), the axial fixed sleeve (33) is fixed on the lower end of the output shaft (35), the suction nozzle (12) is slipped inside the axial fixed sleeve (33), and the suction The upper end of the nozzle (12) fits with the lower end of the output shaft (35), and the limit nut (34) is threadedly connected to the lower end of the axial fixed sleeve (33), and the limit nut (34) can Form a limit on the suction nozzle (12). 3. A pixel die bonding machine according to claim 1, characterized in that: the image acquisition component (40) includes a base (41), a horizontal adjustment plate (42), a longitudinal adjustment plate (43), a displacement slide The table assembly (44) and the image acquisition element (45), the base (41) is fixed on the upper end of the lower bottom plate (10), the horizontal adjustment plate (42) is slidably connected to the upper end of the base (41), the longitudinal The adjustment plate (43) is slidably connected to the upper end of the horizontal adjustment plate (42), the displacement slide assembly (44) is assembled on one side of the longitudinal adjustment plate (43), and the image acquisition component (45) is fixed on the displacement slide side of assembly (44). 4. A pixel die bonding machine according to claim 1, characterized in that it further comprises a substrate holding assembly (60), a plurality of wafer supply assemblies (70) and a plurality of image positioning assemblies (80), the The substrate clamping assembly (60) and multiple wafer supply assemblies (70) are all assembled on the lower base plate (10), and the wafer supply assembly (70) corresponds to the image acquisition assembly (40) one-to-one. Each of the image positioning components (80) is assembled on the headboard (11), a plurality of the image positioning components (80) and a plurality of wafer supply components (70), as well as the image positioning components (80) and the substrate holder There is a one-to-one correspondence between the holding assembly (60), and a cross table is installed between the substrate holding assembly (60) and the lower base plate (10) and the wafer supply assembly (70) and the lower base plate (10) , the positions of the substrate holding assembly (60) and the wafer supply assembly (70) can be adjusted in the horizontal direction through the cross table. 5. A pixel die-bonding machine according to claim 1, characterized in that: the suction nozzle (12) can pick up wafers sequentially through the pick-up air path, and complete the pick-up of a group of pixel R, G, and B wafers . 6. A pixel die-bonding machine according to claim 1, characterized in that: the suction nozzle (12) can pick up wafers sequentially through the pick-up air path, and complete the pick-up of multiple groups of pixel R, G, and B wafers . 7. A pixel die-bonding machine according to claim 1, characterized in that: the suction nozzle (12) can pick up wafers sequentially through the pick-up air path, and complete any number of pixel R, G, B wafers pick up. 8. A control terminal, suitable for the pixel die-bonding machine described in any one of claims 1-7, characterized in that it includes a processing unit, a storage unit and a communication module connected through a system bus, the storage unit An operating system and a CCD visual detection system are stored in the unit, and when the processing unit runs the CCD visual detection system, it can process and calculate images.

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