CN111584698A - Die bonder - Google Patents
Die bonder Download PDFInfo
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- CN111584698A CN111584698A CN202010436215.3A CN202010436215A CN111584698A CN 111584698 A CN111584698 A CN 111584698A CN 202010436215 A CN202010436215 A CN 202010436215A CN 111584698 A CN111584698 A CN 111584698A
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- die bonding
- conveying
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- station
- driving
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Abstract
The invention relates to the technical field of automation equipment, in particular to a die bonding device, which comprises: the conveying device is used for driving the substrate to move from front to back and sequentially passes through the plate feeding station, the die bonding station and the plate discharging station; a supply device for supplying a wafer; at least two solid brilliant devices, each solid brilliant device sets up along the fore-and-aft direction relatively, and all set up in solid brilliant station, wherein, gu brilliant device includes two at least solid brilliant units, each solid brilliant unit obtains the wafer from the feedway, and fix respectively at the different regional solid brilliant of base plate, gu brilliant unit includes nation head mechanism, the displacement actuating mechanism who is connected with nation head mechanism, nation head mechanism can snatch a plurality of wafers and fix the wafer in solid brilliant station department in feedway department, displacement actuating mechanism is used for driving nation head mechanism reciprocating motion between feedway and solid brilliant station. The invention reduces the movable range of the fixed unit, thus reducing the displacement deviation of the die bonding unit and improving the die bonding precision.
Description
Technical Field
The invention relates to the technical field of automation equipment, in particular to die bonding equipment.
Background
The die bonding equipment is equipment capable of fixing an LED wafer on an LED bracket. The conventional fixing equipment is only suitable for a small-size LED support and is not suitable for a large-size LED support, and particularly, if the conventional die bonding equipment is directly used for die bonding on the large-size LED support, the stroke range of a die bonding unit (310) (namely, an LED wafer is directly obtained from a feeding device (200) and is fixed to a structural component of the LED support) needs to be enlarged, and the stroke range of the die bonding unit (310) is enlarged, so that the displacement deviation of the die bonding unit (310) is increased, and the die bonding precision is poor.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides die bonding equipment, which aims to solve the problem of poor die bonding precision.
The invention is realized by the following steps:
a die bonding apparatus comprising:
the conveying device is used for driving the substrate to move from front to back and sequentially passes through the plate feeding station, the die bonding station and the plate discharging station;
the feeding device comprises a crystal ring, a crystal ring storage component, a crystal ring moving component, a crystal frame moving component and an ejector pin component, wherein a film adhered with at least one wafer is arranged on the crystal ring;
at least two solid brilliant devices, each solid brilliant device sets up along the fore-and-aft direction relatively, and all set up in solid brilliant station, wherein, gu brilliant device includes two at least solid brilliant units, each solid brilliant unit obtains the wafer from the feedway, and fix respectively at the different regional solid brilliant of base plate, gu brilliant unit includes nation head mechanism, the displacement actuating mechanism who is connected with nation head mechanism, nation head mechanism can snatch a plurality of wafers and fix the wafer in solid brilliant station department in feedway department, displacement actuating mechanism is used for driving nation head mechanism reciprocating motion between feedway and solid brilliant station.
Based on the structural design of the invention, the die bonding equipment is provided with at least four die bonding units, each die bonding unit is used for die bonding in different areas of the substrate, and compared with the die bonding of all areas of the substrate by only using one die bonding unit, the movable range of the fixed unit is reduced, so that the displacement deviation of the die bonding unit can be reduced, and the die bonding precision is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of a die bonding apparatus according to an embodiment of the present invention;
FIG. 2 is an exploded view of FIG. 1;
FIG. 3 is a schematic structural diagram of a feeding device unit in the die bonding apparatus according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a die bonding apparatus in the die bonding apparatus according to the embodiment of the present invention;
fig. 5 is a schematic structural diagram of a die bonding unit in the die bonding apparatus according to the embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a bond head mechanism in the die bonding apparatus according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a die attach head in the die attach apparatus according to the embodiment of the present invention;
fig. 8 is a schematic structural diagram of a substrate conveying mechanism in the die bonding apparatus according to the embodiment of the present invention;
fig. 9 is a schematic structural diagram of a stop structure in the die bonding apparatus according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a conveying mechanism in the die bonding apparatus according to the embodiment of the present invention;
fig. 11 is a schematic structural diagram of a conveying assembly in the die bonding apparatus according to the embodiment of the present invention.
The reference numbers illustrate:
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment of the invention provides die bonding equipment.
Referring to fig. 1 to 5, the die bonding apparatus includes:
the conveying device (100) is used for driving the substrate to move from front to back and sequentially passes through the plate feeding station 101, the die bonding station 102 and the plate discharging station 103;
the supply device 200 is used for supplying wafers, and comprises a wafer ring 210, a wafer ring storage assembly 220, a wafer ring moving assembly 230, a wafer frame moving assembly 240 and a thimble assembly 250, wherein a film adhered with at least one wafer is arranged on the wafer ring 210, the wafer ring storage assembly 220 is used for storing at least one wafer ring 210, the wafer ring moving assembly 230 is used for transporting the wafer ring 210 between the wafer ring storage assembly 220 and the wafer frame moving assembly 240, specifically, the wafer ring moving assembly 230 takes off the wafer ring 210 from the wafer frame moving assembly 240 after the wafer on the wafer frame moving assembly 240 is used up, puts the wafer ring 210 to the wafer ring storage assembly 220, then picks up the wafer ring 210 with the wafer from the wafer storage assembly 220, and puts the wafer ring 210 with the wafer to the wafer frame moving assembly 240, the wafer frame moving assembly 240 drives the wafer ring 210 to move relative to the thimble assembly 250, the thimble assembly 250 can lift the wafer from the film when corresponding to a wafer, so that the die bonding unit 310 can obtain the wafer;
at least two die bonder 300, each die bonder 300 is arranged in front and back directions and is arranged on the die bonder station 102, wherein the die bonder 300 comprises at least two die bonder units 310, each die bonder unit 310 acquires wafers from the feeding device 200 and respectively fixes the wafers in different areas of the substrate, each die bonder unit 310 comprises a bonding head mechanism 311 and a displacement driving mechanism 312 connected with the bonding head mechanism 311, the bonding head mechanism 311 can grab a plurality of wafers at the feeding device 200 and fix the wafers at the die bonder station 102, and the displacement driving mechanism 312 is used for driving the bonding head mechanism 311 to move back and forth between the feeding device 200 and the die bonder station 102.
Based on the structural design of the invention, the die bonding equipment is provided with at least four die bonding units 310, each die bonding unit 310 is used for die bonding in different areas of the substrate, and compared with the die bonding of all areas of the substrate by only using one die bonding unit 310, the movable range of the fixed unit is reduced, so that the displacement deviation of the die bonding unit 310 can be reduced, and the die bonding precision is improved.
In the embodiment of the present invention, displacement driving mechanism 312 includes left and right drivers 3121 and front and rear drivers 3122, where left and right drivers 3121 are configured to drive bond head mechanism 311 to translate in the left-right direction, and front and rear drivers 3122 are configured to drive bond head mechanism 311 to move back and forth.
Referring to fig. 6 and 7, in the embodiment of the present invention, the bond head mechanism 311 includes a bond head mounting plate 3100 and at least two die bonding heads 3200 both mounted on the bond head mounting plate 3100, where the die bonding head 3200 includes a die bonding suction nozzle 3210, a linkage block 3220, a die bonding driver 3230, and a motor mounting base 3240, the motor mounting base 3240 is connected to the bond head mounting plate 3100, the die bonding suction nozzle 3210 is configured to receive negative pressure gas connection and suck a die by using the negative pressure gas, the linkage block 3220 is connected to the die bonding suction nozzle 3210, the die bonding driver 3230 is connected to the motor mounting base 3240 and is configured to drive the linkage block 3220 to move up and down, and the die sucked by the die bonding suction nozzle is fixed to the substrate suction nozzle in a process of driving the linkage block 3210 to move down. Based on this, each die bonding head 3200 all includes die bonding suction nozzle 3210, linkage block 3220 and die bonding driver 3230, and each die bonding head 3200 is the independent operation, mutual noninterference, and each die bonding head 3200 can carry out adaptability according to the die bonding operation demand of each corresponding position, carries out the solid brilliant operation of differentiation, specifically, each die bonding head 3200 can carry out different die bonding dynamics, stroke etc to improve the die bonding quality of bond head mechanism 311.
Referring to fig. 6 and 7, in the embodiment of the present invention, the linkage block 3220 is provided with a movable groove 32201 extending in the left-right direction; the die bonding driver 3230 comprises a movable barrel 3231 extending in the front-back direction, an adapter 3232 connected with the movable barrel 3231, and a driving motor 3233 connected to the motor mounting base 3240 and used for driving the adapter 3232 to rotate around a rotation axis, the movable barrel 3231 is arranged in the movable groove 32201, and the central axis of the movable barrel 3231 and the rotation axis of the adapter 3232 are arranged in a staggered manner; the groove width of the movable groove 32201 is equal to the outer cylinder diameter of the movable cylinder 3231. In the using process, because the central axis of the movable cylinder 3231 and the rotation axis of the adapter 3232 are arranged in a staggered manner, in the process that the adapter 3232 rotates around the rotation axis, the horizontal position of the central axis of the movable cylinder 3231 can move up and down, wherein the driving motor 3233 can drive the linkage block 3220 to move up and down only by driving the adapter 3232 to rotate around the rotation axis in a single direction, the driving motor 3233 does not need to be repeatedly started and stopped, and the driving motor 3233 is prevented from being damaged easily due to repeated starting and stopping of the motor.
Further, in the embodiment of the present invention, the movable cylinder 3231 is rotatably connected to the adaptor 3232, so that the friction between the movable cylinder 3231 and the adaptor 3232 can be reduced.
Specifically, in an embodiment of the present invention, the movable barrel 3231 is a bearing.
In the embodiment of the present invention, the movable groove 32201 is penetratingly disposed. Therefore, the production and manufacturing efficiency is improved in the production and manufacturing process.
Referring to fig. 6 and 7, in the embodiment of the present invention, the linkage block 3220 includes a block body 3221, an adjusting block 3222 and a connecting member 3223, the block body 3221 is provided with a thick groove, the adjusting block 3222 is located in the thick groove and forms a movable groove 32201 together with the block body 3221, and the connecting member 3223 detachably connects the adjusting block 3222 to the block body 3221. Based on the structural design, the groove width of the movable groove 32201 can be adjusted by replacing the connecting pieces 3223 with different sizes, so that when the up-and-down movement amplitude of the moving block 3220 needs to be adjusted, only the connecting pieces 3223 need to be replaced.
Referring to fig. 7, the motor mounting seat 3240 includes a first mounting portion 3241, a second mounting portion 3242 connected to an edge of the first mounting portion 3241 and extending downward, and a third mounting portion 3243 connected to a lower edge of the second mounting portion 3242 and extending away from the first mounting portion 3241, the die bonding driver 3230 is located at a lower side of the first mounting portion 3241, and the connecting element 3223 and the die bonding driver 3230 are located at two sides of the second mounting portion 3242. The connecting element 3223 and the die bonding driver 3230 are located on two sides of the second mounting portion 3242, so that the shaking amplitude of the connecting element 3223 can be reduced, and the stability of the head bonding mechanism 311 in the operation process can be further improved.
In the embodiment of the present invention, the die bonding unit 310 further includes a die-taking lens 330, and the die-taking lens 330 is used for assisting the die-bonding head 3200 in accurately taking a die. By taking the crystal lens 330, the accuracy of the crystal taking process of the bonding head mechanism 311 is improved.
In the embodiment of the present invention, the die bonding unit 310 further includes a die bonding lens 340 and a lens driving mechanism 350 for driving the die bonding lens to move left and right, and the die bonding lens 340 is used for assisting the die bonding head 3200 to perform die bonding 2 accurately. Through die attach lens 340, it is favorable to improving the die attach accuracy of bond head mechanism 311.
In the embodiments of the present invention. The structure is simple and convenient to realize.
As shown in fig. 1 and fig. 2, in the embodiment of the present invention, each die bonding apparatus 300 includes two die bonding units 310, and the two die bonding units 310 are disposed opposite to each other in the left-right direction. In this way, the stroke of the die bonding unit 310 in the left-right direction can be reduced, the displacement deviation of the die bonding unit 310 can be further increased, and the die bonding precision can be improved.
As shown in fig. 1 and 2, in the embodiment of the present invention, two supply devices 200 are provided, and are oppositely disposed in the left-right direction; each die bonder 300 is arranged between the two feeding devices 200; the frame moving assembly 240 and the pin assembly 250 are disposed in a group, and two of them are disposed and respectively matched with a die bonding unit 310. Therefore, the number of the feeding devices 200 is reduced on the basis of reducing the crystal taking stroke of each crystal fixing unit 310 as much as possible, so that the cost is saved.
As shown in fig. 1 and 8, in the embodiment of the present invention, the transfer apparatus 100 includes two transfer mechanisms 110 and two substrate transfer mechanisms 140, the two transfer mechanisms 110 are respectively disposed at the plate-in station 101 and the plate-out station 103 and are used for transferring the substrate from front to back, the substrate transfer mechanism 140 includes a transfer platform 141, a stopping structure 142 and a platform driving assembly 143, the transfer platform 141 is used for transferring the substrate from front to back and is disposed between the two transfer mechanisms 110 and is spaced apart from the two transfer mechanisms 110, the platform driving assembly 143 is used for driving the transfer platform 141 to abut against the transfer mechanism 110 of the plate-in station 101 and then reset the transfer platform 141 to the die-bonding station 102, and is also used for driving the transfer platform 141 to abut against the transfer mechanism 110 of the plate-out station 103 and then reset the transfer platform 141 to the die-bonding station 102, the stopping structure 142 stops the substrate when the substrate completely enters the transfer platform 141, and releases the substrate when the platform driving assembly 143 drives the transport platform 141 to dock to the transfer mechanism 110 of the plate-out station 103.
As shown in fig. 9, the withstanding structure 142 includes a withstanding mounting seat 1421, a withstanding cylinder 1422, a baffle mounting seat 1423, a baffle 1424, a connecting plate 1425, and a sensor 1426. The resisting mounting seat 1421 is fixed to the conveying platform 141, the bottom of the connecting plate 1425 is fixed to the resisting mounting seat 1421, the baffle mounting seat 1423 is connected with the connecting plate 1425 in a sliding manner, the resisting cylinder 1422 is fixed to the resisting mounting seat 1421 and located at the lower end of the baffle mounting seat 1423, the baffle 1424 is fixed to the top of the baffle mounting seat 1423, and the sensing piece 1426 is fixed to one side of the connecting plate 1425; the retaining cylinder 1422 drives the baffle mounting seat 1423 to move up and down, and further drives the baffle 1424 to move up and down to retain the substrate, and the sensing element 1426 is used for sensing the movement state of the cylinder 1422.
As shown in fig. 1 and 10, in the embodiment of the present invention, the conveying mechanism 110 includes a mounting table 1100 and two conveying assemblies 1200 spaced apart in the left-right direction and mounted on the mounting table 1100, wherein the conveying assemblies 1200 include a connecting plate 1210, a belt conveying structure 1220 mounted on the connecting plate 1210, an adjusting structure 1230 mounted on the mounting table 1100 and used for driving the belt conveying structure 1220 to move in the left-right direction, and a guide structure 1240 used for driving the belt conveying structure 1220 to move in the left-right direction at the adjusting structure 1230 and guiding the belt conveying structure 1220, the guide structure 1240 includes a guide seat 1241 and a guide block 1242, the guide seat 1241 is provided with a guide slot extending in the left-right direction, and the guide block 1242 is slidably connected in the guide slot; guide 1241 is attached to one of attachment plate 1210 and mounting plate 1100, and guide 1242 is attached to the other of attachment plate 1210 and mounting plate 1100, specifically, guide 1241 is attached to attachment plate 1210 and guide 1242 is attached to strap mounting plate 1100, or guide 1241 is attached to strap mounting plate 1100 and guide 1242 is attached to attachment plate 1210. Therefore, the distance between the two belt conveying structures 1220 can be adjusted by the adjusting structure 1230, so that the width of the conveying mechanism 110 is adjusted, and thus, when materials with different widths need to be conveyed, the conveying mechanism 110 can be suitable for the materials with different widths only by the adjusting structure 1230, the conveying mechanism 110 does not need to be replaced, and the cost of one set of conveying mechanism 110 is not additionally increased.
In addition, since the conveying mechanism 110 is further provided with the guide structure 1240, in the process of adjusting the width of the conveying mechanism 110 by the adjusting structure 1230, the belt conveying structure 1220 can be prevented from being laterally deviated, thereby ensuring that the conveying direction of the belt conveying structure 1220 is the front-rear direction.
It should be noted that, in the embodiment of the present invention, the guide base 1241 is connected to the connection plate 1210, and the guide block 1242 is connected to the belt installation stage 1100.
It should be noted that in the embodiment of the present invention, the substrate is transferred by one transfer mechanism 110 from the substrate feeding station 101 to the die bonding station 102, and the substrate is transferred by another transfer mechanism 110 from the die bonding station 102 to the substrate discharging station 103.
As shown in fig. 10 and 11, in the embodiment of the present invention, the belt transmission structure 1220 includes a transmission belt 1221, a driving wheel, two driven wheels 1222 and a transmission motor 1223 for driving the driving wheel to rotate and mounted on the connection plate 1210, the transmission belt 1221 is disposed in a ring shape, the driving wheel and the two driven wheels 1222 are disposed through the transmission belt 1221 and jointly tension the transmission belt 1221, and a belt segment between upper sides of the two driven wheels 1222 in the transmission belt 1221 is disposed horizontally. Based on the structural design, the belt conveying structure 1220 is simple in structural implementation, convenient to produce and manufacture and low in cost.
Further, driven wheel 1222 is rotatably connected to connecting plate 1210, such that during the movement of transmission belt 1221, the friction between transmission belt 1221 and driven wheel 1222 can be reduced, specifically, if driven wheel 1222 is fixedly connected to connecting plate 1210, the friction between transmission belt 1221 and driven wheel 1222 is a static friction, driven wheel 1222 is rotatably connected to connecting plate 1210, and the friction between transmission belt 1221 and driven wheel 1222 is a rolling friction.
Referring to fig. 7, in the embodiment of the present invention, the level of the driving wheel is the same as that of the driven wheel 1222, and the diameter of the driving wheel is the same as that of the driven wheel 1222, so that the driving wheel and the driven wheel 1222 use the same material structure without preparing a plurality of materials during the manufacturing process.
As shown in fig. 9, in the present embodiment, the belt transferring structure 1220 further includes at least one supporting wheel 1224, and the supporting wheel 1224 is at the same level as the driven wheel 1222. As such, when the material is less than the distance between the driving wheel and the driven wheel 1222 in the length direction, such as when the material is transferred between the driving wheel and the driven wheel 1222 without the supporting wheel 1224, the conveyor belt 1221 is generally unable to directly support the material to maintain a predetermined conveying plane, thereby affecting the normal transferring operation of the transferring mechanism 110.
Further, a support wheel 1224 is rotatably coupled to the attachment plate 1210. In this way, during the movement of the transmission belt 1221, the friction between the transmission belt 1221 and the driven wheel 1222 can be reduced, specifically, if the driven wheel 1222 is fixedly connected to the connection plate 1210, the friction between the transmission belt 1221 and the support wheel 1224 is a static friction, the support wheel 1224 is rotatably connected to the connection plate 1210, and the friction between the transmission belt 1221 and the support wheel 1224 is a rolling friction.
As shown in fig. 9, in the embodiment of the present invention, the connection plate 1210 is provided with a threaded hole in the left-right direction; the adjusting structure 1230 includes a screw 1231 threadedly engaged with the threaded hole and an adjusting motor 1232 for driving the screw 1231 to rotate. The screw 1231 and the threaded hole are matched to form screw transmission, and based on the screw transmission, the adjusting motor 1232 can drive the connecting plate 1210 to move only with small power.
Further, a screw hole is penetratingly provided, so that a stroke of the connection plate 1210 may be determined according to a length of the screw 1231.
Of course, it should be noted that in other embodiments, the adjusting structure 1230 may be a mechanical structure such as an air cylinder capable of linear motion.
In the present invention, the transferring structure further includes at least three adjusting legs 1300, and each adjusting leg 1300 is installed at a lower side of the installation stage 1100. Thus, the placing state of the installation table 1100 can be adjusted quickly and conveniently by adjusting the feet 1300.
The present invention is not limited to the above preferred embodiments, and any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A die bonding apparatus, comprising:
the conveying device (100) is used for driving the substrate to move from front to back and sequentially passes through the plate feeding station (101), the die bonding station (102) and the plate discharging station (103);
the feeding device (200) comprises a wafer ring (210), a wafer ring storage assembly (220), a wafer ring moving assembly (230), a wafer frame moving assembly (240) and a thimble assembly (250), wherein a film adhered with at least one wafer is arranged on the wafer ring (210), the wafer ring storage assembly (220) is used for storing at least one wafer ring (210), the wafer ring moving assembly (230) is used for transporting the wafer ring (210) between the wafer ring storage assembly (220) and the wafer frame moving assembly (240), the wafer frame moving assembly (240) drives the wafer ring (210) to translate relative to the thimble assembly (250), and the thimble assembly (250) can jack the wafer from the film when corresponding to one wafer;
the die bonding device comprises at least two die bonding devices (300), wherein each die bonding device (300) is arranged oppositely along the front and back direction and is arranged on the die bonding station (102), each die bonding device (300) comprises at least two die bonding units (310), each die bonding unit (310) acquires wafers from the feeding device (200) and is respectively fixed on die bonding in different areas of the substrate, each die bonding unit (310) comprises a bonding head mechanism (311) and a displacement driving mechanism (312) connected with the bonding head mechanism (311), the bonding head mechanism (311) can grab a plurality of wafers at the feeding device (200) and fix the wafers at the die bonding station (102), and the displacement driving mechanism (312) is used for driving the bonding head mechanism (311) to move back and forth between the feeding device (200) and the die bonding station (102).
2. The die bonding apparatus according to claim 1, wherein the bonding head mechanism (311) comprises a bonding head mounting plate (3100) and at least two die bonding heads (3200) mounted on the bonding head mounting plate (3100), wherein the die bonding head (3200) comprises a die bonding suction nozzle (3210), a linkage block (3220), a die bonding driver (3230) and a motor mounting seat (3240), the motor mounting seat (3240) is connected with the bonding head mounting plate (3100), the die bonding suction nozzle (3210) is used for receiving negative pressure gas for connection and sucking a wafer by using the negative pressure gas, the linkage block (3220) is connected with the die bonding suction nozzle (3210), the die bonding driver (3230) is connected with the motor mounting seat (3240), and the linkage block (3220) is driven to move up and down, and the wafer sucked on the wafer fixing suction nozzle (3210) is fixed on a substrate in the process of driving the linkage block (3220) to move down.
3. The die bonding apparatus according to claim 2, wherein the linkage block (3220) is provided with a movable groove (32201) extending in the left-right direction;
the die bonding driver (3230) comprises a movable cylinder (3231) extending in the front-back direction, an adapter (3232) connected with the movable cylinder (3231), and a driving motor (3233) connected to the bonding head mounting bonding and used for driving the adapter (3232) to rotate around a rotation axis, the movable cylinder (3231) is placed in the movable groove (32201), and the central axis of the movable cylinder (3231) and the rotation axis of the adapter (3232) are arranged in a staggered mode;
the groove width of the movable groove (32201) is equal to the outer cylinder diameter of the movable cylinder (3231).
4. The die bonding apparatus according to claim 3, wherein the linkage block (3220) comprises a block body (3221), an adjusting block (3222) and a connecting member (3223), the block body (3221) is provided with a thick groove, the adjusting block (3222) is located in the thick groove and forms the movable groove (32201) together with the block body (3221), and the connecting member (3223) detachably connects the adjusting block (3222) to the block body (3221).
5. The die bonding apparatus according to claim 2, wherein the die bonding unit (310) further comprises a die pick-up lens (330), and the die pick-up lens (330) is used for assisting the die bond head (3200) in accurate die pick-up.
6. The die bonding apparatus according to claim 2, wherein the die bonding unit (310) further comprises a die bonding lens (340) and a lens driving mechanism (350) for driving the die bonding lens (340) to move left and right, and the die bonding lens (340) is used for assisting the die bonding head (3200) in die bonding accurately.
7. The die bonding apparatus according to claim 1, wherein each die bonding device (300) comprises two die bonding units (310), and the two die bonding units (310) are arranged oppositely in the left-right direction.
8. The die bonding apparatus according to claim 7, wherein the feeding devices (200) are provided in two and oppositely arranged in the left-right direction;
each die bonding device (300) is arranged between the two feeding devices (200);
the crystal frame moving assembly (240) and the ejector pin assembly (250) are arranged in groups, and two crystal frame moving assemblies are arranged and are respectively matched with one crystal fixing unit (310).
9. The die bonding apparatus according to claim 1, wherein the conveying device (100) comprises two conveying mechanisms (110) and two substrate conveying mechanisms (140), the two conveying mechanisms (110) are respectively disposed at the substrate feeding station (101) and the substrate discharging station (103) and are used for conveying the substrates from front to back, the substrate conveying mechanism (140) comprises a conveying platform (141), a resisting structure (142) and a platform driving assembly (143), the conveying platform (141) is used for conveying the substrates from front to back, is located between the two conveying mechanisms (110) and is spaced from the two conveying mechanisms (110), the platform driving assembly (143) is used for driving the conveying platform (141) to abut against the conveying mechanism (110) of the substrate feeding station (101) and then reset the conveying platform (141) to the die bonding station (102), the conveying platform (141) is reset to the die bonding station (102) after the conveying platform (141) is butted to the conveying mechanism (110) of the plate discharging station (103), the resisting structure (142) resists the substrate when the substrate completely enters the conveying platform (141), and the resisting structure releases the resisting of the substrate when the platform driving assembly (143) drives the conveying platform (141) to be butted to the conveying mechanism (110) of the plate discharging station (103).
10. The die bonding apparatus according to claim 1, wherein the conveying mechanism (110) comprises a mounting table (1100) and two conveying assemblies (1200) which are arranged at intervals in the left-right direction and are mounted on the mounting table (1100), wherein the conveying assemblies (1200) comprise a connecting plate (1210), a belt conveying structure (1220) mounted on the connecting plate (1210), an adjusting structure (1230) mounted on the mounting table (1100) and used for driving the belt conveying structure (1220) to move in the left-right direction, and a guide structure (1240) used for driving the belt conveying structure (1220) to move in the left-right direction on the adjusting structure (1230) and guiding the belt conveying structure (1220), the guide structure (1240) comprises a guide seat (1241) and a guide block (1242), and the guide seat (1241) is provided with a guide slot extending in the left-right direction, the guide block (1242) is slidably connected in the guide groove;
the guide seat (1241) is connected to one of the connecting plate (1210) and the mounting table (1100), and the guide block (1242) is connected to the other of the connecting plate (1210) and the mounting table (1100).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010436215.3A CN111584698B (en) | 2020-05-21 | 2020-05-21 | Die bonder |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010436215.3A CN111584698B (en) | 2020-05-21 | 2020-05-21 | Die bonder |
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| CN111584698A true CN111584698A (en) | 2020-08-25 |
| CN111584698B CN111584698B (en) | 2021-01-26 |
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| CN202010436215.3A Active CN111584698B (en) | 2020-05-21 | 2020-05-21 | Die bonder |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112928052A (en) * | 2021-02-04 | 2021-06-08 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN113539916A (en) * | 2021-07-13 | 2021-10-22 | 深圳市卓兴半导体科技有限公司 | Die bonding mechanical arm and die bonding equipment |
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| CN113539916A (en) * | 2021-07-13 | 2021-10-22 | 深圳市卓兴半导体科技有限公司 | Die bonding mechanical arm and die bonding equipment |
| CN113539916B (en) * | 2021-07-13 | 2023-02-28 | 深圳市卓兴半导体科技有限公司 | Die bonding mechanical arm and die bonding equipment |
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|---|---|
| CN111584698B (en) | 2021-01-26 |
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