CN110504206A - A kind of LED bonder suction means - Google Patents
A kind of LED bonder suction means Download PDFInfo
- Publication number
- CN110504206A CN110504206A CN201910914649.7A CN201910914649A CN110504206A CN 110504206 A CN110504206 A CN 110504206A CN 201910914649 A CN201910914649 A CN 201910914649A CN 110504206 A CN110504206 A CN 110504206A
- Authority
- CN
- China
- Prior art keywords
- guide rail
- main body
- suction means
- electromagnet
- means according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000002699 waste material Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a kind of LED bonder suction means, including main body and suction nozzle, including are mutually attracted electromagnet and magnetic support, and the electromagnet is fixed in the main body, and the magnetic support liftable is set in the main body, and the suction nozzle is set on the magnetic support.Electromagnet and magnetic support are attracted, and electromagnet and magnetic support separate when suction nozzle and the excessive pressure of LED chip, eliminate the pressure between suction nozzle and LED chip, avoid LED chip from being subject to crushing under excessive pressure, reduce the waste of material.
Description
Technical field
The present invention relates to LED technical field of processing equipment more particularly to a kind of LED bonder suction means.
Background technique
Bonder is the key equipment in LED packing producing line, and die bond process is: glue applying mechanism is first in the die bond of bracket
Chip is jacked up, is then taken out LED chip from brilliant ring by die bond arm, then by core by station dispensing, thimble alignment chip center
Piece is transferred on station for dispensing glue, completes die bond.
The nozzle portion of existing bonder is fixed on mostly on die bond arm, but when die bond arm absorption LED chip, it is right
The pressure of LED chip is difficult to control, and is easy to damage by pressure LED chip when pressure is excessive, is caused unnecessary waste.
Summary of the invention
The technical problems to be solved by the present invention are: providing a kind of LED bonder absorption dress for avoiding damaging LED chip by pressure
It sets.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention are as follows: a kind of LED bonder suction means, packet
Main body and suction nozzle are included, including is mutually attracted electromagnet and magnetic support, the electromagnet is fixed in the main body, and the magnetic support can rise
Drop is set in the main body, and the suction nozzle is set on the magnetic support.
Further, the magnetic support includes connected sliding seat and magnetic absorption member, and the suction nozzle is fixed in the sliding seat,
Further include the resetting apparatus resetted for sliding seat, the resetting apparatus is equipped between the sliding seat and main body.
Further, the resetting apparatus includes restoring board, pedestal and elastic component, and the sliding seat liftable is set to described
On restoring board, the bottom end of the restoring board is equipped with the pedestal, and one end of the elastic component is fixed on the pedestal, elastic component
The other end offset with the sliding seat.
Further, further include mounting bracket for installing the electromagnet, the mounting bracket is fixed on described multiple
On the plate of position.
Further, the magnetic support is pulled on the top of the electromagnet.
It further, further include guide rail mounting plate and guide rail, the guide rail mounting plate is set to by the guide rail liftable
In the main body, the restoring board is fixed on the guide rail mounting plate.
It further, further include pressure sensor, the block matched with the pressure sensor and in main body
Controller, the main body are equipped with the block, and the pressure sensor is additionally provided on the guide rail mounting plate, and the pressure passes
Sensor and electromagnet are electrically connected with the controller respectively.
It further, further include motor and eccentric shaft, the output end of the motor drives institute by the eccentric shaft
It states guide rail mounting plate and does reciprocating motion in vertical direction.
It further, further include a connection piece, the eccentric shaft is fixed by the connector and the guide rail mounting plate
Connection.
Further, the motor is connected with the controller in a signal way..
The beneficial effects of the present invention are: electromagnet and magnetic support are attracted, the electromagnetism when pressure of suction nozzle and LED chip is excessive
Iron and magnetic support separation, eliminate the pressure between suction nozzle and LED chip, LED chip are avoided to be subject to crushing under excessive pressure, reduce
The waste of material.
Detailed description of the invention
Fig. 1 is the LED bonder suction means structural schematic diagram of the embodiment of the present invention one；
Fig. 2 is the LED bonder suction means explosive view of the embodiment of the present invention one.
Label declaration:
1, main body；
2, suction nozzle；
3, electromagnet；
4, magnetic support；
41, sliding seat；
42, magnetic absorption member；
5, resetting apparatus；
51, restoring board；
52, pedestal；
53, elastic component；
6, guide rail mounting plate；
7, guide rail；
8, pressure sensor；
9, block；
10, motor；
11, eccentric shaft；
12, connector.
Specific embodiment
To explain the technical content, the achieved purpose and the effect of the present invention in detail, below in conjunction with embodiment and cooperate attached
Figure is explained.
The most critical design of the present invention is: electromagnet and magnetic support separate when suction nozzle and the excessive pressure of LED chip, eliminate
Pressure between suction nozzle and LED chip.
Referring to Fig.1 and 2, a kind of LED bonder suction means, including main body 1 and suction nozzle 2, including mutually it is attracted electricity
Magnet 3 and magnetic support 4, the electromagnet 3 are fixed in the main body 1, and 4 liftable of magnetic support is set in the main body 1, described
Suction nozzle 2 is set on the magnetic support 4.
The working principle of the invention is summarized as follows: the suction nozzle being connected with magnetic support moves downward absorption LED chip, suction nozzle with
Pressure between LED chip, which crosses conference, makes the magnetic between magnetic support and electromagnet connect disconnection, eliminates suction nozzle and applies to LED chip
Active force, prevent LED chip from damaging in excessive pressure.
As can be seen from the above description, the beneficial effects of the present invention are: electromagnet and magnetic support are attracted, suction nozzle and LED chip
Pressure it is excessive when electromagnet and magnetic support separation, eliminate the pressure between suction nozzle and LED chip, avoid LED chip excessive
It is subject to crushing under pressure, reduces the waste of material.
Further, the magnetic support 4 includes connected sliding seat 41 and magnetic absorption member 42, and the suction nozzle 2 is fixed on the work
Further include the resetting apparatus 5 resetted for sliding seat 41 on dynamic seat 41, is equipped between the sliding seat 41 and main body 1 described multiple
Position device 5.
Further, the resetting apparatus 5 includes restoring board 51, pedestal 52 and elastic component 53, and the sliding seat 41 can rise
Drop is set on the restoring board 51, and the bottom end of the restoring board 51 is equipped with the pedestal 52, and one end of the elastic component 53 is fixed
In on the pedestal 52, the other end of elastic component 53 offsets with the sliding seat 41.
Seen from the above description, elastic component is held between pedestal and sliding seat, is flicked upwards convenient for sliding seat, and electromagnetism is made
Iron is smoothly detached with magnetic support.
Further, further include mounting bracket for installing the electromagnet 3, the mounting bracket is fixed on described multiple
On the plate 51 of position.
Further, the magnetic support 4 is pulled on the top of the electromagnet 3.
Seen from the above description, the magnetic support for being pulled on the top of electromagnet can be moved upwards from the top of electromagnet, with
Electromagnet separation.
It further, further include guide rail mounting plate 6 and guide rail 7, the guide rail mounting plate 6 passes through 7 liftable of guide rail
In the main body 1, the restoring board 51 is fixed on the guide rail mounting plate 6.
Seen from the above description, guide rail mounting plate moves on guide rail, is conducive to the stabilization for keeping lifting process.
Further, further include pressure sensor 8, the block 9 matched with the pressure sensor 8 and be set to main body 1
On controller, the main body 1 is equipped with the block 9, is additionally provided with the pressure sensor 8, institute on the guide rail mounting plate 6
It states pressure sensor 8 and electromagnet 3 is electrically connected with the controller respectively.
Seen from the above description, controller can adjust the actuation ability of electromagnet in time according to the size of pressure.
It further, further include motor 10 and eccentric shaft 11, the output end of the motor 10 passes through the eccentric shaft
The 11 driving guide rail mounting plates 6 do the reciprocating motion in vertical direction.
It further, further include a connection piece 12, the eccentric shaft 11 is installed by the connector 12 with the guide rail
Plate 6 is fixedly connected.
Further, the motor 10 is connected with the controller in a signal way..
Embodiment one
Referring to Fig.1 and 2, the embodiment of the present invention one are as follows: a kind of LED bonder suction means, including main body 1 and suction
Mouth 2, including it is mutually attracted electromagnet 3 and magnetic support 4, the electromagnet 3 is fixed in the main body 1, and 4 liftable of magnetic support is set
In in the main body 1, the suction nozzle 2 is set on the magnetic support 4.
In the present embodiment, LED bonder is when shifting LED chip, by increasing the electric current increase electricity by electromagnet 3
The suction-combining force between magnet 3 and magnetic support 4 can prevent LED chip from shaking in the process, enhance stability, improve solid
Brilliant accuracy.
Detailed, the magnetic support 4 includes connected sliding seat 41 and magnetic absorption member 42, and the suction nozzle 2 is fixed on the activity
On seat 41, further includes the resetting apparatus 5 resetted for sliding seat 41, the reset is equipped between the sliding seat 41 and main body 1
Device 5.
The resetting apparatus 5 includes restoring board 51, pedestal 52 and elastic component 53, and 41 liftable of sliding seat is set to described
On restoring board 51, the bottom end of the restoring board 51 is equipped with the pedestal 52, and the pedestal is fixed in one end of the elastic component 53
On 52, the other end of elastic component 53 offsets with the sliding seat 41, it is preferred that the elastic component 53 is spring.
It in the present embodiment, further include mounting bracket for installing the electromagnet 3, the mounting bracket is fixed on institute
It states on restoring board 51.
Preferably, the magnetic support 4 is pulled on the top of the electromagnet 3, so it is easy to understand that the magnetic support 4 is pulled on
The top of electromagnet 3, elastic component 53 is located under sliding seat 41 and offsets with sliding seat 41, between suction nozzle 2 and LED chip
When pressure is excessive, under pressure and the elastic force collective effect of elastic component 53, disconnect electromagnet 3 with suction nozzle 2.
It further include guide rail mounting plate 6 and guide rail 7, the guide rail mounting plate 6 is set to the master by 7 liftable of guide rail
On body 1, the restoring board 51 is fixed on the guide rail mounting plate 6.
Optionally, further include pressure sensor 8, the block 9 matched with the pressure sensor 8 and be set to main body 1 on
Controller (not shown), the main body 1 is equipped with the block 9, is additionally provided with the pressure sensing on the guide rail mounting plate 6
Device 8, the pressure sensor 8 and electromagnet 3 are electrically connected with the controller respectively；It is described in another feasible embodiment
Main body 1 is equipped with the pressure sensor 8, and the guide rail mounting plate 6 is equipped with the block 9.
It is detailed, it further include motor 10 and eccentric shaft 11, the output end of the motor 10 passes through the eccentric shaft 11
The guide rail mounting plate 6 is driven to do the reciprocating motion in vertical direction；It is easily understood that fixed on the guide rail mounting plate 6
Equipped with the restoring board 51, liftable is equipped with the sliding seat 41 on the restoring board 51, is fixed in the sliding seat 41
The suction nozzle 2, motor 10 can directly drive suction nozzle 2 and move down, the magnetic when pressure is excessive between electromagnet 3 and magnetic support 4
It inhales connection to disconnect, sliding seat 41 moves upwards under the action of spring and pressure, realizes that electromagnet 3 and magnetic support 4 separate.
Specifically, further including a connection piece 12, the eccentric shaft 11 passes through the connector 12 and the guide rail mounting plate 6
It is fixedly connected.
Optionally, the motor 10 is connected with the controller in a signal way., and controller can also receive pressure sensor 8
Signal, according to the output power of the big minor adjustment motor 10 of pressure.
The working principle of the invention is summarized as follows: electromagnet 3 and magnetic support 4 are attracted, and spring is in compressive state, motor
10 driving restoring boards 51, sliding seat 41, magnetic support 4 and 2 entirety of suction nozzle move downward, and suction nozzle 2 is enable to adsorb LED chip；Work as suction
When pressure is excessive between mouth 2 and LED chip, under pressure and spring force effect, magnetic support 4 is separated with electromagnet 3, is eliminated at once
The pressure that suction nozzle 2 applies LED chip, prevents LED chip from damaging under stress.
In conclusion LED bonder suction means provided by the invention, pressure sensor and block can measure suction nozzle and
Pressure between LED chip is adjusted the output power of motor and the suction-combining force of electromagnet by controller, is convenient for and elasticity
Part, suction nozzle and LED chip form cooperation, adjust the pressure between electromagnet and magnetic support in time, realize accurate movement LED core
It prevents from pressure from crossing senior general's LED chip while piece to damage by pressure.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalents made by bright specification and accompanying drawing content are applied directly or indirectly in relevant technical field, similarly include
In scope of patent protection of the invention.
Claims (10)
1. a kind of LED bonder suction means, including main body and suction nozzle, it is characterised in that: including being mutually attracted electromagnet and magnetic
Seat, the electromagnet are fixed in the main body, and the magnetic support liftable is set in the main body, and the suction nozzle is set to the magnetic
On seat.
2. LED bonder suction means according to claim 1, it is characterised in that: the magnetic support includes connected activity
Seat and magnetic absorption member, the suction nozzle are fixed in the sliding seat, further include the resetting apparatus resetted for sliding seat, the activity
The resetting apparatus is equipped between seat and main body.
3. LED bonder suction means according to claim 2, it is characterised in that: the resetting apparatus include restoring board,
Pedestal and elastic component, the sliding seat liftable are set on the restoring board, and the bottom end of the restoring board is equipped with the pedestal, institute
The one end for stating elastic component is fixed on the pedestal, and the other end of elastic component offsets with the sliding seat.
4. LED bonder suction means according to claim 3, it is characterised in that: further include for installing the electromagnetism
The mounting bracket of iron, the mounting bracket are fixed on the restoring board.
5. LED bonder suction means according to claim 4, it is characterised in that: the magnetic support is pulled on the electromagnetism
The top of iron.
6. LED bonder suction means according to claim 2, it is characterised in that: it further include guide rail mounting plate and guide rail,
The guide rail mounting plate is set in the main body by the guide rail liftable, is fixed on the guide rail mounting plate described multiple
Position plate.
7. LED bonder suction means according to claim 6, it is characterised in that: further include pressure sensor, with it is described
The block that pressure sensor matches and the controller in main body, the main body are equipped with the block, the guide rail peace
The pressure sensor is additionally provided in loading board, the pressure sensor and electromagnet are electrically connected with the controller respectively.
8. LED bonder suction means according to claim 7, it is characterised in that: further include motor and eccentric shaft, institute
The output end for stating motor drives the guide rail mounting plate to do the reciprocating motion in vertical direction by the eccentric shaft.
9. LED bonder suction means according to claim 8, it is characterised in that: it further include a connection piece, the bias
Axis is fixedly connected by the connector with the guide rail mounting plate.
10. LED bonder suction means according to claim 8, it is characterised in that: the motor and the controller
Signal connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910914649.7A CN110504206A (en) | 2019-09-26 | 2019-09-26 | A kind of LED bonder suction means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910914649.7A CN110504206A (en) | 2019-09-26 | 2019-09-26 | A kind of LED bonder suction means |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110504206A true CN110504206A (en) | 2019-11-26 |
Family
ID=68592856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910914649.7A Pending CN110504206A (en) | 2019-09-26 | 2019-09-26 | A kind of LED bonder suction means |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110504206A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312651A (en) * | 2020-02-28 | 2020-06-19 | 深圳新益昌科技股份有限公司 | Die bonder swing arm system and die bonder |
| CN111564394A (en) * | 2020-05-21 | 2020-08-21 | 中山市新益昌自动化设备有限公司 | Bonding head mechanism and die bonding equipment |
| CN111584698A (en) * | 2020-05-21 | 2020-08-25 | 中山市新益昌自动化设备有限公司 | Die bonder |
| CN113658893A (en) * | 2021-09-10 | 2021-11-16 | 深圳九州光电子技术有限公司 | COC eutectic machine |
| CN117123981A (en) * | 2023-10-26 | 2023-11-28 | 江苏快克芯装备科技有限公司 | Micro-pressure device of chip suction mechanism and chip welding machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012069836A (en) * | 2010-09-27 | 2012-04-05 | Juki Corp | Electronic component mounting device |
| CN202685366U (en) * | 2012-07-31 | 2013-01-23 | 嵊州市康力机械有限公司 | Press manipulator |
| CN103646901A (en) * | 2013-10-25 | 2014-03-19 | 深圳市恒睿智达科技有限公司 | New type welding arm structure |
| CN104795346A (en) * | 2014-01-16 | 2015-07-22 | 北京中电科电子装备有限公司 | Electromagnetic chip operating device |
| CN107634127A (en) * | 2017-09-11 | 2018-01-26 | 聚灿光电科技（宿迁）有限公司 | It is a kind of to be used to adsorb the suction nozzle of LED wafer and there is its screening installation |
| CN209125851U (en) * | 2018-12-11 | 2019-07-19 | 苏州鸿柏锐自动化科技有限公司 | Electromagnetic and mechanical hand with elevating function |
| CN210668321U (en) * | 2019-09-26 | 2020-06-02 | 先进光电器材（深圳）有限公司 | Suction device of LED die bonder |
-
2019
- 2019-09-26 CN CN201910914649.7A patent/CN110504206A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012069836A (en) * | 2010-09-27 | 2012-04-05 | Juki Corp | Electronic component mounting device |
| CN202685366U (en) * | 2012-07-31 | 2013-01-23 | 嵊州市康力机械有限公司 | Press manipulator |
| CN103646901A (en) * | 2013-10-25 | 2014-03-19 | 深圳市恒睿智达科技有限公司 | New type welding arm structure |
| CN104795346A (en) * | 2014-01-16 | 2015-07-22 | 北京中电科电子装备有限公司 | Electromagnetic chip operating device |
| CN107634127A (en) * | 2017-09-11 | 2018-01-26 | 聚灿光电科技（宿迁）有限公司 | It is a kind of to be used to adsorb the suction nozzle of LED wafer and there is its screening installation |
| CN209125851U (en) * | 2018-12-11 | 2019-07-19 | 苏州鸿柏锐自动化科技有限公司 | Electromagnetic and mechanical hand with elevating function |
| CN210668321U (en) * | 2019-09-26 | 2020-06-02 | 先进光电器材（深圳）有限公司 | Suction device of LED die bonder |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312651A (en) * | 2020-02-28 | 2020-06-19 | 深圳新益昌科技股份有限公司 | Die bonder swing arm system and die bonder |
| CN111312651B (en) * | 2020-02-28 | 2020-10-13 | 深圳新益昌科技股份有限公司 | Die bonder swing arm system and die bonder |
| CN111564394A (en) * | 2020-05-21 | 2020-08-21 | 中山市新益昌自动化设备有限公司 | Bonding head mechanism and die bonding equipment |
| CN111584698A (en) * | 2020-05-21 | 2020-08-25 | 中山市新益昌自动化设备有限公司 | Die bonder |
| CN113658893A (en) * | 2021-09-10 | 2021-11-16 | 深圳九州光电子技术有限公司 | COC eutectic machine |
| CN117123981A (en) * | 2023-10-26 | 2023-11-28 | 江苏快克芯装备科技有限公司 | Micro-pressure device of chip suction mechanism and chip welding machine |
| CN117123981B (en) * | 2023-10-26 | 2024-03-15 | 江苏快克芯装备科技有限公司 | Micro-pressure device of chip suction mechanism and chip welding machine |
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