CN103646901A - New type welding arm structure - Google Patents
New type welding arm structure Download PDFInfo
- Publication number
- CN103646901A CN103646901A CN201310539655.1A CN201310539655A CN103646901A CN 103646901 A CN103646901 A CN 103646901A CN 201310539655 A CN201310539655 A CN 201310539655A CN 103646901 A CN103646901 A CN 103646901A
- Authority
- CN
- China
- Prior art keywords
- arm
- welding arm
- wafer
- lever arm
- bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68372—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support a device or wafer when forming electrical connections thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
The invention is suitable for the technical field of semiconductor die bond. The invention discloses a new type welding arm structure comprising a welding arm support fixed with a welding arm connection seat. The end portion of the welding arm support is provided with a sliding block and an air cylinder for making the sliding block slide up and down. The sliding block is provided with a lever arm and a wafer suction nozzle. A bracket arm provided with an accommodation cavity is connected with the welding arm support. A pressure sensor connected with a control module is arranged in the accommodation cavity. A reset spring is arranged between the bracket arm and the lever arm. During operation, the pressure sensor is used to feed the pressure between the lever arm and the bracket arm back to the control module in time and cause the air cylinder to control the position of the wafer suction nozzle. The bracket arm is fixed with the welding arm bracket, both of the lever arm and the wafer suction nozzle are fixed on the sliding block and moved synchronously, so that the wafer damage caused by bonding in the large pressure condition can be avoided, and the stability and reliability of the clamping of the welding arm and the wafer can be improved.
Description
Technical field
The present invention relates to semiconductor die bond technical field, particularly a kind of die bond machine Novel welding arm configuration.
Background technology
Semiconductor crystal solidifying apparatus need to be delivered to the material of die bond behind relevant position by feeding device when being used as, and by manipulator, by crystal, as LED wafer moves to substrate correspondence position, is fixed.
Existing semiconductor crystal solidifying apparatus weldering arm, by operating key resultant pressure accurately during bonding between wafer and substrate, causes part wafer to damage, thus the stability of bonding and reliability not high.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of Novel welding arm configuration, and this Novel welding arm configuration damages wafer by pressure in the time of can avoiding bonding, improves stability and the reliability of wafer bonding.
In order to address the above problem, the invention provides a kind of Novel welding arm configuration, this Novel welding arm configuration comprises the weldering arm bearing fixing with weldering arm Connection Block, the cylinder that is provided with slide block in the end of this weldering arm bearing and slide block is slided up and down, this slide block is provided with lever arm and wafer suction nozzle, the trailing arm that is provided with storage cavity is connected with weldering arm bearing, is provided with the pressure sensor being connected with control module in this storage cavity, between this trailing arm and lever arm, is provided with back-moving spring.
Say further, described lever arm is provided with pin, and described back-moving spring is sheathed on this pin.
Say further, on described lever arm, be also provided with contact screw, this contact screw one end coordinates with pressure sensor.
Novel welding arm configuration of the present invention, comprise the weldering arm bearing fixing with weldering arm Connection Block, the cylinder that is provided with slide block in the end of this weldering arm bearing and slide block is slided up and down, this slide block is provided with lever arm and wafer suction nozzle, the trailing arm that is provided with storage cavity is connected with weldering arm bearing, in this storage cavity, be provided with the pressure sensor being connected with control module, between this trailing arm and lever arm, be provided with back-moving spring.During work, by described pressure sensor in good time by the pressure feedback between lever arm and trailing arm to control module, and control cylinder is controlled the position of wafer suction nozzle.Because this trailing arm and weldering arm support are fixed, lever arm and wafer suction nozzle are all fixed on synchronizing moving on slide block, can avoid bonding when pressure is larger to damage wafer, improve stability and the reliability of weldering arm and wafer clamping.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, and accompanying drawing in describing is some embodiments of the present invention, to those skilled in the art, do not paying under the prerequisite of creative work, can also obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is that the present invention welds arm configuration example structure schematic diagram.
Fig. 2 is that the present invention welds arm configuration decomposition texture schematic diagram.
Below in conjunction with embodiment, and with reference to accompanying drawing, the realization of the utility model object, functional characteristics and advantage are described further.
Embodiment
In order to make object, technical scheme and the advantage of invention clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is a part of embodiment of invention, rather than whole embodiment.Embodiment based in the present invention, the every other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work, belongs to the scope of protection of the invention.
As depicted in figs. 1 and 2, the invention provides a kind of Novel welding arm configuration embodiment.
This Novel welding arm configuration comprises: with the fixing weldering arm bearing 31 of weldering arm Connection Block, the cylinder 33 that is provided with slide block 30 in the end of this weldering arm bearing 31 and slide block 30 is slided up and down, this slide block 30 is provided with lever arm 34 and wafer suction nozzle 32, the trailing arm 37 that is provided with storage cavity 371 is connected with weldering arm bearing 31, in this storage cavity 371, be provided with the pressure sensor 36 being connected with control module, between this trailing arm 37 and lever arm 34, be provided with back-moving spring 38.
Specifically, described lever arm 34 is provided with pin, and described back-moving spring 38 is sheathed on this pin, is convenient to back-moving spring 38 fixing and spacing.On described lever arm 34, be also provided with contact screw 35, these contact screw 35 one end coordinate with pressure sensor 36, regulate the pressure data of the output of pressure sensor 36.
During work, by described pressure sensor 36 in good time by the pressure feedback between lever arm 34 and trailing arm 37 to control module, and by the position of cylinder 33 control wafer suction nozzles 32.Because this trailing arm 37 is fixing with weldering arm support 31, lever arm 34 is all fixed on synchronizing moving on slide block 30 with wafer suction nozzle 32, can avoid bonding when pressure is larger to damage wafer, improves stability and the reliability of weldering arm and wafer clamping.
Above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement, and these modifications or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (3)
1. Novel welding arm configuration, comprises the weldering arm bearing fixing with weldering arm Connection Block, it is characterized in that:
The cylinder that is provided with slide block in the end of this weldering arm bearing and slide block is slided up and down, this slide block is provided with lever arm and wafer suction nozzle, the trailing arm that is provided with storage cavity is connected with weldering arm bearing, in this storage cavity, be provided with the pressure sensor being connected with control module, between this trailing arm and lever arm, be provided with back-moving spring.
2. Novel welding arm configuration according to claim 1, is characterized in that:
Described lever arm is provided with pin, and described back-moving spring is sheathed on this pin.
3. Novel welding arm configuration according to claim 1, is characterized in that:
On described lever arm, be also provided with contact screw, this contact screw one end coordinates with pressure sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310539655.1A CN103646901B (en) | 2013-10-25 | 2013-10-25 | Weld arm configuration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310539655.1A CN103646901B (en) | 2013-10-25 | 2013-10-25 | Weld arm configuration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103646901A true CN103646901A (en) | 2014-03-19 |
| CN103646901B CN103646901B (en) | 2018-10-19 |
Family
ID=50252099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310539655.1A Expired - Fee Related CN103646901B (en) | 2013-10-25 | 2013-10-25 | Weld arm configuration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103646901B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110504206A (en) * | 2019-09-26 | 2019-11-26 | 先进光电器材（深圳）有限公司 | A kind of LED bonder suction means |
| CN111312651A (en) * | 2020-02-28 | 2020-06-19 | 深圳新益昌科技股份有限公司 | Die bonder swing arm system and die bonder |
| CN113753512A (en) * | 2021-09-13 | 2021-12-07 | 深圳市标谱半导体科技有限公司 | Feed supplement device and tape loading machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080129064A1 (en) * | 2006-12-01 | 2008-06-05 | Asm America, Inc. | Bernoulli wand |
| US20090087932A1 (en) * | 2007-09-28 | 2009-04-02 | Tokyo Electron Limited | Substrate supporting apparatus, substrate supporting method, semiconductor manufacturing apparatus and storage medium |
| CN101664932A (en) * | 2009-09-23 | 2010-03-10 | 清华大学 | Robot arm |
| CN102173345A (en) * | 2011-02-25 | 2011-09-07 | 华中科技大学 | Pneumatic linear driven chip picking and turning device |
| CN203536388U (en) * | 2013-10-25 | 2014-04-09 | 深圳市恒睿智达科技有限公司 | A novel soldering arm structure |
-
2013
- 2013-10-25 CN CN201310539655.1A patent/CN103646901B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080129064A1 (en) * | 2006-12-01 | 2008-06-05 | Asm America, Inc. | Bernoulli wand |
| US20090087932A1 (en) * | 2007-09-28 | 2009-04-02 | Tokyo Electron Limited | Substrate supporting apparatus, substrate supporting method, semiconductor manufacturing apparatus and storage medium |
| CN101664932A (en) * | 2009-09-23 | 2010-03-10 | 清华大学 | Robot arm |
| CN102173345A (en) * | 2011-02-25 | 2011-09-07 | 华中科技大学 | Pneumatic linear driven chip picking and turning device |
| CN203536388U (en) * | 2013-10-25 | 2014-04-09 | 深圳市恒睿智达科技有限公司 | A novel soldering arm structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110504206A (en) * | 2019-09-26 | 2019-11-26 | 先进光电器材（深圳）有限公司 | A kind of LED bonder suction means |
| CN111312651A (en) * | 2020-02-28 | 2020-06-19 | 深圳新益昌科技股份有限公司 | Die bonder swing arm system and die bonder |
| CN111312651B (en) * | 2020-02-28 | 2020-10-13 | 深圳新益昌科技股份有限公司 | Die bonder swing arm system and die bonder |
| CN113753512A (en) * | 2021-09-13 | 2021-12-07 | 深圳市标谱半导体科技有限公司 | Feed supplement device and tape loading machine |
| CN113753512B (en) * | 2021-09-13 | 2022-07-29 | 深圳市标谱半导体科技有限公司 | Feed supplement device and tape loading machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103646901B (en) | 2018-10-19 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181019 Termination date: 20191025 |