CN205248235U - IC chip bonding machine - Google Patents
IC chip bonding machine Download PDFInfo
- Publication number
- CN205248235U CN205248235U CN201521070988.5U CN201521070988U CN205248235U CN 205248235 U CN205248235 U CN 205248235U CN 201521070988 U CN201521070988 U CN 201521070988U CN 205248235 U CN205248235 U CN 205248235U
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- glue
- substrate
- station
- rifle
- point
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- Withdrawn - After Issue
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Abstract
The utility model provides a IC chip bonding machine, it makes the productivity of whole equipment in the real work high, and adorns the precision height admittedly to the chip of base plate to the manufacturing cost of whole equipment has been reduced. It includes base plate material loading station, select to glue the station, the mounting station, base plate material loading station for it normally carries to provide the base plate of a little gluing the station in succession, the station is glued to the point, and it is located the dead astern of base plate material loading station, be used for going on a little gluing handling to the chip position of treating of base plate, the point is glued the station and is glued rifle, the gluey rifle control section of point including a gluey workstation, cardboard conveying clamp claw, point, and cardboard conveying clamp claw is located one side position of workstation is glued to the point, the point is glued the rifle and is located directly over the gluey workstation of point, it is external that the rifle is glued to the point rifle control section is glued to the point, the point is glued rifle control section control point and is glued the removal of rifle and put and glue, built -in triaxial movement module of rifle control section is glued to the point, the mounting station, it is used for carrying out the chip to the base plate and adorns admittedly.
Description
Technical field
The utility model relates to the technical field of integrated antenna package, is specially a kind of IC loader.
Background technology
IC loader is the key equipment in semiconductor packing producing line, and it has very in chip loadApplication widely.
IC loader need to be got sheet by more than eight cun large scale wafers from diameter, then pastes accurately at a high speedBe contained on the substrate that width maximum can reach 100mm, the structure of existing IC loader comprises feeding station, pointGlue station, load station, be sent to a glue station by feeding station by material, and some glue station completes a littleAfter glue, material being sent to load station welds.
The structure of conventional point glue station specifically comprises a glue workbench, Glue dripping head, and its glue mode is speciallyPoint glue table feed moves, Glue dripping head fine motion, the corresponding position of material on Glue dripping head alignment point glue workbenchPostpone, then Glue dripping head point glue, its mid point glue workbench, Glue dripping head respectively carry a set of motion module,Both needed to work in coordination and then motion contraposition before a glue, and it makes the operating efficiency of invocation point glue contrapositionNot high, and the defect of two aspects below existing: on the one hand, two overlap arranging of motion modules has improved wholeThe cost of equipment; On the other hand, owing to needing to coordinate different track structures between different motion modules,A point glue workbench coordinates at most installs two Glue dripping heads, and three above Glue dripping heads cannot be suitable for this pointGlue mode, this selects glue mode and cannot promote efficiency and the speed of load.
The structure of load station specifically comprises loading bench, soldering tip assembly, and its welding manner is load workDo substrate position on platform fixing after, the motion module in soldering tip assembly drives soldering tip in X, Y, Z tri-axle sidesTo driving respectively location, respectively loads different on substrate is selected and is carried out load, soldering tip get sheet point positionPutting certain, load point need constantly adjust, and the motion module in soldering tip assembly need to complete three of soldering tipTo adjustment, soldering tip assembly need to be in XY plane in the time getting sheet the feeding of accomplish linear direction, its structure is multipleAssorted, the run duration cycle is long, and cost is high, cannot meet modernization loader should be soon the work of standard againDo requirement.
Summary of the invention
For the problems referred to above, the utility model provides a kind of IC loader, and it makes whole equipment in realityProduction capacity in the work of border is high, and it is high that the chip of substrate is fixedly mounted with to precision, and has reduced the manufacture of whole equipmentCost.
A kind of IC loader, is characterized in that: it comprises substrate feeding station, selects glue station, load workPosition;
Described substrate feeding station, for providing continuously a substrate for glue station normally to carry;
Described some glue station, its be positioned at the dead astern of described substrate feeding station, for to substrate wait pasteChip position carries out a glue processing, and described some glue station comprises a glue workbench, clamp conveying jaw, pointGlue rifle, some glue rifle control section, described clamp conveying jaw is positioned at a side position of described some glue workbench,Described some glue rifle be positioned at described some glue workbench directly over, the control of described the external described some glue rifle of glue riflePart, the movement of described some glue rifle control section control point glue rifle and some glue, described some glue rifle control sectionA built-in three-axis moving module;
Described load station, it is fixedly mounted with for substrate is carried out to chip, and described load station specifically comprises crystalline substanceCircle supporting table, loading bench, soldering tip, swing arm structure, swing arm control structure, described load workThe dead astern that is positioned at the some glue workbench of described some glue station as platform, described wafer supporting table is positioned at instituteState a side of loading bench, between described loading bench, wafer supporting table, being furnished with can 180 °The swing arm structure of rotation, the bottom of described swing arm structure is connected with described soldering tip, the master of described swing arm structureAxle connects described swing arm control structure, and described swing arm structure can be along the vertical straight elevator of Z axis, described loadStage support is in XY guide holder, and described XY guide holder can drive whole loading bench X to, Y-direction essenceReally mobile.
It is further characterized in that:
Substrate on described loading bench, the wafer of wafer supporting table be in same level height,Guarantee that the adjustable height of soldering tip in the time getting sheet, load is identical, simplify product structure, further reduce costs;
It also comprises stand structure, described substrate feeding station, select glue station, load station is arranged respectivelyIn described stand structure, the end of the rectilinear orbit of described loading bench is provided with discharge of materials structure;
Described some glue rifle is specially two or many that front and back are arranged, described some glue rifle is positioned at described some glue workDo platform directly over, described some glue rifle be external described some glue rifle control section respectively, the control of described some glue rifleThe movement of part control point glue rifle and some glue;
One side of described loading bench is furnished with substrate screens conveying clamp pawl, described substrate screens conveying clampPawl comprises jaw, the first screw axis, and under duty, described substrate is pressed in the inner side of described jaw, described inThe exterior bottom of jaw described the first screw axis that is threaded, described the first screw axis is supported on described loadWorkbench;
Described clamp under duty carries the inner side of jaw to press described substrate, described clamp conveying clampThe exterior bottom of pawl second screw axis that is threaded, described the second screw axis is supported on described some glue workbench;
Distance between two described some glue rifles is specially the half of described substrate length, guarantees described in twoPoint glue rifle can accurately carry out a glue to substrate simultaneously;
Described substrate feeding station comprise substrate storing structure, substrate transhipment structure, substrate carry cylinder,Substrate supporting platform, described substrate carries cylinder that substrate is delivered to described some glue station;
Described substrate transhipment structure comprises material absorbing structure, lifting body, Y-direction translation structure, and described substrate props upCushion cap and substrate storing textural association form a general frame structure, and general frame structure support is in describedThe output of lifting body, the output of described Y-direction translation structure connects consolidating of described lifting bodyFixed structure, described material absorbing structure be positioned at general frame structure directly over and be positioned at the institute under feed statusState substrate supporting platform directly over, when substrate carries cylinder to be transported to the some glue of a glue station by substrateAfter workbench, general frame declines and Y-direction moves, and makes substrate storing structure be positioned at material absorbing structureUnder, general frame rises again afterwards, until highly guarantee substrate of material absorbing structure sticking, and itRear general frame declines, Y-direction moves, rises, and the substrate that material absorbing structure is positioned under feed status props upDirectly over cushion cap, material absorbing structure is removed suction afterwards, and wait substrate carries cylinder that substrate is delivered to a glueStation.
Adopt after structure of the present utility model, substrate feeding station is delivered to substrate after a glue workbench,Clamp carries jaw to block the substrate of a side, guarantee that substrate position fixes, and puts afterwards glue rifle control sectionThree-axis moving module control point glue rifle XYZ three-axis moving carries out a glue operation to the chip on substrate respectively,Owing to only a motion module need being set, it makes the cost of whole equipment low, and due to a motion mouldGroup can not produce and interfere with the track of other motion modules, and then it is multiple that invocation point glue rifle can be arranged, onlyNeed carry out reasonable Arrangement according to the concrete structure of substrate, multiple somes glue rifles can carry out a glue simultaneously,The efficiency of invocation point glue is improved, promoted production capacity; Substrate carries jaw to be transported to dress by clamp afterwardsSheet workbench, of the lock bit in loading bench afterwards, loading bench is supported on XY guide holder, XY guidingSeat can drive whole loading bench X accurately to move to, Y-direction, make being fixedly mounted with in process, substrate together withLoading bench moves together, and substrate can not depart from separately loading bench independently moving, to the core of substrateIt is high that sheet is fixedly mounted with precision, and in addition, soldering tip drives by swing arm structure that can 180 ° of rotations, makes soldering tipWater move flat and be converted into rotation, rotary course only needs electric rotating machine to drive can easily to complete, in welderingHead is got XY guide holder quick acting brilliant time, drives substrate motion to put in place, and its locating periodically is short, and shouldStructure makes the brilliant position of getting of soldering tip, die bond position all fixing, has effectively promoted the precision of soldering tip load,This structure is easy to realize, and has reduced the manufacturing cost of whole equipment; To sum up, it makes whole equipment in realityProduction capacity in the work of border is high, and it is high that the chip of substrate is fixedly mounted with to precision, and has reduced the manufacture of whole equipmentCost.
Brief description of the drawings
Fig. 1 is top view structural representation of the present utility model;
Fig. 2 is the front view structural representation of the general frame of the substrate feeding station of Fig. 1;
In figure, the corresponding reference name of each sequence number is as follows:
Feeding station 1, select glue station 2, load station 3, substrate 4, substrate storing structure 5, substrate and turnFortune structure 6, substrate conveyer belt 7, some glue workbench 8, clamp are carried jaw 9, some glue rifle 10, some glueRifle control section 11, substrate are carried cylinder 12, wafer supporting table 13, loading bench 14, pendulumArm configuration 15, swing arm control structure 16, jacking cylinder 17, Y-direction translation structure 18, XY guide holder 19,Stand structure 20, discharge of materials station 21, soldering tip 22, jaw 23, the first screw axis 24, secondBar axle 25, material absorbing structure 26.
Detailed description of the invention
A kind of IC loader, is specially the IC loader with two some glue rifles, sees Fig. 1, Fig. 2: itsComprise substrate feeding station 1, select glue station 2, load station 3; Substrate feeding station 1 is for carrying continuouslyNormally carry for a substrate 4 for glue station 2, substrate feeding station 1 comprises substrate storing structure 5, substrateTranshipment structure 6, substrate supporting platform 7, substrate are carried cylinder 12, and substrate is carried the piston rod court of cylinder 12Arrange to the substrate one end that is supported on substrate supporting platform 7, substrate carries cylinder 12 that substrate is pushed to a glueStation;
Point glue station 2 is positioned at the dead astern of substrate feeding station 1, for the chip position to be pasted to substrate 4Put and carry out a glue processing, some glue station 2 comprise a glue workbench 8, clamp carry jaw 9, some glue rifle 10,Point glue rifle control section 11, clamp carries jaw 9 to be positioned at a side position of a glue workbench 8, puts glue rifle10 two of arranging before and after being specially, two some glue rifles 10 be positioned at a glue workbench 8 directly over, twoPoint glue rifle 10 outer contact glue rifle control section 11 respectively, puts moving of glue rifle control section 11 control point glue riflesMove and some glue, in described some glue rifle control section, only need a three-axis moving module of layout;
Load station 3 is fixedly mounted with for substrate 4 is carried out to chip, and load station 3 specifically comprises wafer supportingWorkbench 13, loading bench 14, soldering tip 22, swing arm structure 15, swing arm control structure 16, loadWorkbench 14 is positioned at the dead astern of the some glue workbench 8 of a glue station 2,13 of wafer supporting tablesIn a side of loading bench 14, between loading bench 14, wafer supporting table 13, being furnished with canThe swing arm structure 15 of 180 ° of rotations, the bottom of swing arm structure 15 is connected with soldering tip 22, swing arm structure 15Main shaft connect swing arm control structure 16,, swing arm structure 15 can be along the Z axis straight elevator of hanging down, load workMake platform 14 and be supported on XY guide holder 19, XY guide holder 19 can drive whole loading bench 14 to carry out XAccurately move to, Y-direction.
It also comprises stand structure 20, substrate feeding station 1, selects glue station 2, load station 3 cloth respectivelyBe placed in stand structure 20, loading bench 14 end be provided with discharge of materials station 21;
One side of loading bench 14 is furnished with substrate screens conveying clamp pawl, and substrate screens conveying clamp pawl comprisesJaw 23, the first screw axis 24, under duty, substrate 4 is pressed in the inner side of jaw 23, jaw 23Exterior bottom first screw axis 24, the first screw axis 24 that are threaded are supported on loading bench 14;
Clamp under duty carries the inner side of jaw 9 to press substrate 4, and clamp is carried the outside of jaw 9Bottom thread connects the second screw axis 25, the second screw axis 25 and is supported on a glue workbench 8;
Distance between two some glue rifles 10 is specially the half of substrate 4 length, guarantees two some glue rifles 10Can accurately carry out a glue to substrate 4 simultaneously;
Substrate transhipment structure 6 comprises material absorbing structure 26, lifting body 17, Y-direction translation structure 18, substrateSupporting station 27 and substrate storing structure 5 are combined to form a general frame structure, general frame structure supportIn the output of lifting body 17, the output of Y-direction translation structure 18 connects described lifting body17 fixed structure, material absorbing structure 26 be positioned at general frame structure directly over and be positioned under feed statusSubstrate supporting platform 27 directly over, when substrate 4 carries cylinder 12 to be transported to a glue work by substrateAfter the some glue workbench 8 of position 2, general frame declines and Y-direction moves, and makes substrate storing structure 5Be positioned at material absorbing structure 26 under, general frame rises again afterwards, until highly guarantee material absorbing structure26 one of sticking substrates, general frame decline afterwards, Y-direction move, rise, make material absorbing structure 26Be positioned at substrate supporting platform 7 under feed status directly over, material absorbing structure 26 is removed suction afterwards, waits forSubstrate carries cylinder 12 that substrate 4 is delivered to a glue station 2.
Its operation principle is as follows: substrate 4 carries cylinder 12 to be transported to the point of a glue station 2 by substrateGlue workbench 8, is carried jaw 9 to press by clamp afterwards, and then two some glue rifles 10 are in a glue rifle controlUnder the control of part 11, substrate 4 is carried out to quick Accurate Points glue, complete after a glue, clamp is carried jaw 9Under the rotation of the second screw axis 25, drive substrate 4 be delivered to backward load work along selecting glue workbench 8Make platform 14, substrate 4 is pressed in the inner side of jaw 23, and XY guide holder 19 drives loading bench 14 to carry out positionThe swing arm structure 17 moving, can 180 ° of rotations drives that soldering tip 22 rotates, soldering tip 22 does vertically to moving simultaneouslyDo, simultaneously XY guide holder 19 can drive whole loading bench 14 to carry out X accurately to move to, Y-direction,Make soldering tip 22 accurately be fixedly mounted with the position of putting glue corresponding to substrate, after chip has been fixedly mounted with, firstBar axle 24 rotates and drives jaw 23 to drive substrate 4 to move to discharge of materials station 21, the whole course of workCirculation successively.
Above specific embodiment of the utility model is had been described in detail, but that content is only this practicality is newThe preferred embodiment that type is created, can not be considered to the practical range of creating for limiting the utility model. AllCreate according to the utility model equalization variation and the improvement etc. that application range is done, all should still belong to this practicalityWithin novel patent covering scope.
Claims (9)
1. an IC loader, is characterized in that: it comprises substrate feeding station, some glue station, dressSheet station;
Described substrate feeding station, for providing continuously a substrate for glue station normally to carry;
Described some glue station, its be positioned at the dead astern of described substrate feeding station, for to substrate wait pasteChip position carries out a glue processing, and described some glue station comprises a glue workbench, clamp conveying jaw, pointGlue rifle, some glue rifle control section, described clamp conveying jaw is positioned at a side position of described some glue workbench,Described some glue rifle be positioned at described some glue workbench directly over, the control of described the external described some glue rifle of glue riflePart, the movement of described some glue rifle control section control point glue rifle and some glue, described some glue rifle control sectionA built-in three-axis moving module;
Described load station, it is fixedly mounted with for substrate is carried out to chip, and described load station specifically comprises crystalline substanceCircle supporting table, loading bench, soldering tip, swing arm structure, swing arm control structure, described load workThe dead astern that is positioned at the some glue workbench of described some glue station as platform, described wafer supporting table is positioned at instituteState a side of loading bench, between described loading bench, wafer supporting table, being furnished with can 180 °The swing arm structure of rotation, the bottom of described swing arm structure is connected with described soldering tip, the master of described swing arm structureAxle connects described swing arm control structure, and described swing arm structure can be along the vertical straight elevator of Z axis, described loadStage support is in XY guide holder, and described XY guide holder can drive whole loading bench X to, Y-direction essenceReally mobile.
2. a kind of IC loader as claimed in claim 1, is characterized in that: on described loading benchThe wafer of substrate, wafer supporting table in same level height.
3. a kind of IC loader as claimed in claim 1, is characterized in that: it also comprises stand structure,Described substrate feeding station, select glue station, load station is arranged in respectively described stand structure, described dressThe end of the rectilinear orbit of sheet workbench is provided with discharge of materials structure.
4. a kind of IC loader as claimed in claim 1, is characterized in that: described some glue rifle is speciallyBefore and after arrange two or many, described some glue rifle be positioned at described some glue workbench directly over, described pointGlue rifle is external described some glue rifle control section respectively, the movement of described some glue rifle control section control point glue rifleWith a glue.
5. a kind of IC loader as claimed in claim 1, is characterized in that: described loading benchOne side is furnished with substrate screens conveying clamp pawl, and described substrate screens conveying clamp pawl comprises jaw, the first screw mandrelAxle, under duty, described substrate is pressed in the inner side of described jaw, and the exterior bottom screw thread of described jaw connectsConnect described the first screw axis, described the first screw axis is supported on described loading bench.
6. a kind of IC loader as claimed in claim 1, is characterized in that: described under dutyClamp carries the inner side of jaw to press described substrate, and described clamp carries the exterior bottom of jaw to be threadedThe second screw axis, described the second screw axis is supported on described some glue workbench.
7. a kind of IC loader as claimed in claim 4, is characterized in that: two described some glue rifles itBetween distance be specially the half of described substrate length.
8. a kind of IC loader as claimed in claim 1, is characterized in that: described substrate feeding stationComprise substrate storing structure, substrate transhipment structure, substrate conveying cylinder, substrate supporting platform, described substrateCarry cylinder that substrate is delivered to described some glue station.
9. a kind of IC loader as claimed in claim 8, is characterized in that: described substrate transhipment structureComprise material absorbing structure, lifting body, Y-direction translation structure, described substrate supporting platform and substrate storing structure groupClose and form a general frame structure, general frame structure support is in the output of described lifting body,The output of described Y-direction translation structure connects the fixed structure of described lifting body, described material absorbing structureBe positioned at general frame structure directly over and be positioned at described substrate supporting platform under feed status directly over.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521070988.5U CN205248235U (en) | 2015-12-21 | 2015-12-21 | IC chip bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521070988.5U CN205248235U (en) | 2015-12-21 | 2015-12-21 | IC chip bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205248235U true CN205248235U (en) | 2016-05-18 |
Family
ID=55947314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521070988.5U Withdrawn - After Issue CN205248235U (en) | 2015-12-21 | 2015-12-21 | IC chip bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205248235U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428259A (en) * | 2015-12-21 | 2016-03-23 | 王敕 | IC chip mounting machine |
| CN106241370A (en) * | 2016-08-24 | 2016-12-21 | 广州超音速自动化科技股份有限公司 | A kind of full-automatic charging & discharging machine |
| CN106328564A (en) * | 2016-09-25 | 2017-01-11 | 东莞市联洲知识产权运营管理有限公司 | Integrated circuit package wire |
| CN107138345A (en) * | 2017-05-04 | 2017-09-08 | 东莞市智感机械电子科技有限公司 | A kind of automatic patch PVC board machine |
| CN111816575A (en) * | 2020-06-19 | 2020-10-23 | 浙江亚芯微电子股份有限公司 | Three-chip packaging process |
-
2015
- 2015-12-21 CN CN201521070988.5U patent/CN205248235U/en not_active Withdrawn - After Issue
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428259A (en) * | 2015-12-21 | 2016-03-23 | 王敕 | IC chip mounting machine |
| CN105428259B (en) * | 2015-12-21 | 2018-04-03 | 王敕 | A kind of IC loaders |
| CN106241370A (en) * | 2016-08-24 | 2016-12-21 | 广州超音速自动化科技股份有限公司 | A kind of full-automatic charging & discharging machine |
| CN106328564A (en) * | 2016-09-25 | 2017-01-11 | 东莞市联洲知识产权运营管理有限公司 | Integrated circuit package wire |
| CN107138345A (en) * | 2017-05-04 | 2017-09-08 | 东莞市智感机械电子科技有限公司 | A kind of automatic patch PVC board machine |
| CN107138345B (en) * | 2017-05-04 | 2019-05-31 | 东莞市智感机械电子科技有限公司 | A kind of automatic patch PVC board machine |
| CN111816575A (en) * | 2020-06-19 | 2020-10-23 | 浙江亚芯微电子股份有限公司 | Three-chip packaging process |
| CN111816575B (en) * | 2020-06-19 | 2022-01-28 | 浙江亚芯微电子股份有限公司 | Three-chip packaging process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170406 Address after: Four road 215513 Jiangsu province Changshou City economic and Technological Development Zone No. 11 Branch Chong Park Building No. 5 Patentee after: JIANGSU ACCURACY ASSEMBLY AUTOMATION EQUIPMENT CO., LTD. Address before: Four road 215000 Jiangsu city of Suzhou Province along the Yangtze River in Changshou City economic and Technological Development Zone No. 11 Science Park Building 5 202-1 Patentee before: Wang Chi |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160518 Effective date of abandoning: 20180403 |