TW201916242A - Electronic component encapsulation device and encapsulation method encapsulating electronic components on a substrate with high precision - Google Patents

Abstract

This invention provides an electronic component encapsulation device and encapsulation method for encapsulating electronic components on a substrate with high precision. Before using upper and lower cameras 51 to shoot, at a predetermined encapsulation position C, an electronic component (semiconductor chip t) and encapsulation area of a substrate K, the upper and lower cameras 51 shoots the encapsulation area positioned on the encapsulation position C, positional deviation of the encapsulation area relative to the encapsulation position C is calculated according to the shot image, and by eliminating the positional deviation calculated, a carrier table driving part 22 is used to correct the position of the encapsulation area.

Description

Electronic component packaging device and packaging method

The present invention relates to a packaging device and a packaging method for an electronic component.

In the manufacturing process of a semiconductor package such as a Quad Flat Package (QFP) or a Ball Grid Array Package (BGA), a surface (electrode forming surface) on which an electrode is formed of an electronic component such as a semiconductor wafer is performed. A flip chip package that is oppositely packaged with a substrate on which a circuit pattern is formed, such as a plug-in substrate. In the flip chip package, in order to directly bond the fine electrode pads of the electronic component to the fine terminals formed on the circuit pattern of the substrate, it is necessary to accurately position both of them. Therefore, in a package device for electronic components that are flip-chip mounted, high positioning accuracy and package accuracy are required.

Patent Document 1 is known as a packaging device for an electronic component that responds to such a request. Such an electronic component packaging device positions a package region of the packaged electronic component on the substrate at a predetermined package position set in advance, and positions the electronic component packaged in the package region above the package region. In this state, the upper and lower imaging cameras are placed between the substrate and the electronic component, the lower camera is used to identify the position of the package area of the substrate, and the upper camera is used to identify the position of the electronic component. Further, after the alignment of the package region of the substrate and the electronic component is performed based on the recognition results of both, the electronic component is packaged.

Such a package device achieves a package accuracy of about ±2 μm to 3 μm sufficient for manufacturing QFP or BGA.

However, in recent years, the development of small-sized and high-performance high-bandwidth memory is being carried out due to the spread of mobile devices such as mobile phones, and semiconductor packages using three-dimensional high integration technology of Through-Silicon-Via (TSV) are used. The manufacturing process is attracting attention. The TSV refers to an electrode that penetrates the inside of the semiconductor wafer up and down. In such a three-dimensional high-integration technique using TSV, 1000 or more through electrodes are disposed on each semiconductor wafer in an amount larger than that of the semiconductor wafer used in the QFP, and all of the through electrodes must be electrically operated. Sexual connection.

Therefore, it is estimated that the package precision of each semiconductor wafer, that is, the electronic component, is required to be higher than the package precision required for the manufacturing process such as QFP or BGA, and specifically, the package precision is ±1 μm or less. [Prior Art Document] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2011-077173

[Problems to be Solved by the Invention] However, when the electronic component packaging device having the configuration disclosed in Patent Document 1 is used as it is, it is difficult to obtain a package accuracy of ±1 μm or less.

Therefore, the inventors and the like have attempted to improve the imaging magnification of the upper and lower camera cameras to improve the position recognition accuracy. However, if only the position recognition accuracy is improved, the package accuracy cannot be sufficiently improved to the extent that it satisfies the requirements in the manufacturing process using TSV.

An object of the present invention is to provide a packaging device and a packaging method for an electronic component in which an electronic component can be packaged on a substrate with high precision. [Means for solving the problem]

The electronic component packaging device of the present embodiment is an electronic component packaging device in which a plurality of package regions are mounted on a substrate, and includes: a supply unit that supplies the electronic component; and a substrate platform that includes the mounting a mounting table of the substrate and a mounting table driving unit for moving the mounting table, wherein the plurality of package regions of the substrate placed on the mounting table are sequentially positioned by driving of the mounting table driving unit a package portion having a package tool that holds the electronic component supplied from the supply portion and a tool drive portion that moves the package tool, and the electronic component is packaged in the In the package area on the package position; the image pickup unit performs, on the package position, the electronic component held on the package tool and the package area of the substrate placed on the mounting table And an imaging unit that recognizes a relative positional relationship between the electronic component and the package region based on the captured image obtained by the imaging unit, and controls the work a driving unit that positions the electronic component opposite to the package area to encapsulate the electronic component in the package area; and the control unit uses the imaging unit to face the package position Before imaging the electronic component and the package area, the image capturing unit images the package area positioned at the package position, and obtains the package area relative to the package position according to the image The position is deviated, and the stage driving unit is controlled to eliminate the obtained positional deviation.

The method of packaging an electronic component according to the present embodiment is a method of packaging an electronic component in a plurality of package regions on which an electronic component is packaged, and includes: a package region positioning step of placing the substrate on the mounting table a predetermined package area of the plurality of package areas is positioned at a preset package position; an electronic part positioning step of holding the electronic parts supplied from the supply part by using a packaging tool, and positioning the held electronic parts At the package position, an imaging step of imaging the package area positioned on the package position and the electronic component, and a packaging step of arranging the package area according to the captured image obtained in the imaging step Positioning opposite to the electronic component and encapsulating the electronic component in the package area; and having a position correction step of the package area, the position correction step of the package area is performed before the performing the imaging step Capturing the package area located at the package position by the package area positioning step, according to Image pickup position obtained with respect to the package the package region deviated position, and in a manner to eliminate the obtained correcting the positional deviation of the position of the package region. [Effects of the Invention]

According to the present invention, the electronic component can be packaged on the substrate with high precision.

Hereinafter, embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings. Furthermore, the position, size, and the like of each component are merely an easy expression for understanding the structure.

Here, in the configuration of the packaging device of the prior electronic component, there is a limit to the improvement of the package precision of the electronic component. That is, the packaged area of the substrate is positioned at a previously set package position, and the electronic component is positioned at a previously set package position, so that the upper and lower camera cameras enter between the two, and the relative positions of the substrate and the electronic component are identified. In the configuration in which the two are packaged after alignment, there is a limit to the improvement of the package precision.

As a result of intensive research by the inventors and the like, it was found that the following two factors particularly hindered the improvement of the package precision. One factor is the positional error when the substrate is placed on the substrate platform provided in the packaging device for the electronic component, particularly the rotational position error in the horizontal rotation direction. Another factor is the positioning error of the package area that occurs when the package areas of the substrate are positioned at the package locations.

These cases will be described below. When the package portion or the substrate platform provided in the package of the electronic component is repeatedly moved toward the same position, the reproducibility of the movement position is high. Therefore, in the prior package device, the package position is defined as a fixed position, and the package area of the electronic component and the substrate is positioned relative to the position, thereby strongly eliminating the movement position error of the package portion or the substrate platform. Therefore, the inventors and the like have verified the operation of the package portion and the substrate platform in detail. As a result, it can be seen that in the package portion which can be said to be a purely repetitive movement, the movement position error can be substantially eliminated.

On the other hand, on the substrate platform, intermittent movement in the distance corresponding to the arrangement of the package regions is repeated in order to sequentially position the respective package regions at the package position. Although this movement is repeated movement at the same distance, it is not a purely repeated movement. Therefore, it is found that the positioning error is slightly generated due to the absolute positional accuracy of the substrate platform every time intermittent movement is performed. Further, when the substrate is placed on the substrate stage, a placement position error including horizontal rotation deviation occurs. The placement position error is corrected by the substrate platform. As described above, when the placement position error is corrected, even if the same intermittent movement is performed, the substrate stage moves with a trajectory different from the case where the placement position error is not corrected. Moreover, it is found that the positioning error is further increased in the case where the trajectories are different. As a result of measuring the positioning error of the plurality of substrates, the inventors found that there was a variation in the position at which the substrate platform was intermittently moved or the distance at which the substrate was intermittently moved, but a positioning error of about 20 μm to 100 μm occurred.

However, when the electronic component is packaged in the package area, the positioning error is corrected on the package side. Therefore, even if the package portion is reproducibly positioned at the package position by the reverse movement, since the package error is corrected, the package portion is packaged with the electronic component at a position deviated from the package position.

Therefore, the inventors and the like have a relationship between the amount of movement of the correction movement of the package tool driven in the XYZ direction by the tool drive unit in the package portion, and the decrease in the package accuracy of the package tool due to the correction movement. We conducted a survey. That is, the Z axis of the package tool appears to maintain a vertical state and move in the XY direction. However, if observed microscopically, it moves while shaking with respect to the vertical direction. The reason for this is pitching, yawing, rolling, and the like of the XY moving axis. Therefore, it can be considered that if the moving position of the package tool is changed, the tilted state of the Z axis also changes, and if the moving position of the package tool is changed, the positional deviation in the XY direction which occurs when the package tool is lowered also changes. In order to investigate the presence or absence of the positional deviation caused by this, at the height position where the electronic component is imaged, the package tool is lowered from the positions of the eight positions set based on the package position, and it is confirmed that the electronic component is packaged on the substrate. The package accuracy on the top. In other words, it is confirmed for each position of the eight positions how much the electronic component is packaged with respect to the position directly below the position before the fall. Furthermore, the eight positions are four positions shifted by +50 μm, +100 μm, -50 μm, -100 μm in the X direction with respect to the package position, and shifted by +50 μm, +100 μm, -50 μm in the Y direction, - Four positions of -100 μm. As a result, it was found that the directions of the positional deviation were different at eight positions, but the package position deviation of 1 μm or more was generated at the maximum. In addition, it has been found that there is a tendency that the positional deviation from the position of the package position is relatively large as compared with the position close to the package position.

Therefore, the inventors have found that the package accuracy can be particularly improved by eliminating the movement position error when the respective package regions of the substrate are positioned at the package position.

[Configuration of Electronic Component Packaging Apparatus] FIG. 1 is a front view showing a schematic configuration of an electronic component packaging apparatus 1 according to the embodiment. The electronic component packaging apparatus 1 includes a supply unit 10 that supplies a semiconductor wafer t as an electronic component, a substrate stage 20 on which a substrate K that encapsulates the semiconductor wafer t is placed, and a transfer unit 30 that picks up the semiconductor wafer one by one from the supply unit 10 The package portion 40 sucks and holds the semiconductor wafer t picked up by the transfer portion 30, and encapsulates the semiconductor wafer t in a package region (not shown) placed on the substrate K on the substrate stage 20; the image pickup portion 50 The semiconductor wafer t and the substrate K are imaged when the semiconductor wafer t is packaged by the package portion 40, and the control unit 60 controls the supply unit 10, the substrate stage 20, the transfer unit 30, the package unit 40, the image pickup unit 50, and the like ( Refer to Figure 2).

The supply unit 10 has a wafer stage 12 that holds the wafer ring 11. The wafer ring 11 is a member that holds an adhesive sheet (not shown) of a plurality of semiconductor wafers t that are diced by cutting the semiconductor wafer W. The wafer table 12 can be used as the Y direction in one direction in the horizontal direction, the Y direction in the direction orthogonal to the X direction in the horizontal direction, and the wafer table driving unit 13 (see FIG. 2). The direction of rotation in the horizontal plane moves in the θ direction.

The substrate stage 20 includes a mounting table 21 on which the substrate K on which the semiconductor wafer t is packaged, and a mounting table driving unit 22 that moves the mounting table 21 in the X direction, the Y direction, and the θ direction. The substrate stage 20 sequentially positions a plurality of package regions in the substrate K placed on the mounting table 21 at the package position C indicated by a chain line in FIG. The mounting table 21 supplies the substrate K before the semiconductor wafer t is packaged by a substrate transfer device (not shown), and the substrate K after the semiconductor wafer t is packaged is carried out.

The transfer unit 30 includes an adsorption nozzle 31 that adsorbs and holds the semiconductor wafer t, and an elevation/reverse driving unit 32 (see FIG. 2) that moves the adsorption nozzle 31 in the Z direction in the vertical direction orthogonal to the horizontal direction. The adsorption nozzle 31 is vertically inverted about the rotation axis 31a provided in parallel with the X direction. The adsorption nozzle 31 picks up the semiconductor wafer t from the wafer ring 11 of the supply portion 10 at the pickup position A shown by the alternate long and short dash line in FIG. 1, and reverses the picked semiconductor wafer t to the point shown in FIG. The transfer position B shown by the scribe line is transferred.

The package portion 40 includes a package tool 41 that adsorbs and holds the semiconductor wafer t supplied from the supply unit 10, and encapsulates the held and held semiconductor wafer t in a package region placed on the substrate K on the mounting table 21; The drive unit 42 moves the package tool 41 in the X direction, the Y direction, the Z direction, and the θ direction. The package tool 41 receives the semiconductor wafer t from the adsorption nozzle 31 at the transfer position B, and encapsulates the semiconductor wafer t on the substrate K positioned at the package position C at the package position C indicated by the alternate long and short dash line in FIG. In the package area.

The imaging unit 50 includes a vertical imaging camera 51 that images the semiconductor wafer t and the package region of the substrate K, and a forward/backward driving unit 52 that moves the vertical imaging camera 51 forward and backward between the imaging position and the retracted position in the Y direction; The processing unit 53 performs image processing such as binarization on the captured image obtained by the up-and-down imaging camera 51, and transmits the image to the control unit 60. Further, the upper and lower imaging camera 51 includes an upper camera 51a that images the semiconductor wafer t and a lower camera 51b that images the substrate K. The upper camera 51a and the lower camera 51b are connected to the image processing unit 53, respectively. Further, the upper and lower imaging camera 51 is provided with an optical path conversion unit 51c such as a cymbal. The optical path conversion unit 51c converts the direction of the optical axis of the upper camera 51a from the Y direction to the upper direction along the Z direction, and converts the direction of the optical axis of the lower camera 51b from the Y direction to the lower direction along the Z direction. In FIG. 1, the optical axes of the upper side camera 51a and the lower side camera 51b are indicated by chain-dotted arrows. The upper camera 51a, the lower camera 51b, and the optical path conversion unit 51c are housed in the casing 51d of the vertical imaging camera 51. Here, the optical axis of the upper camera 51a that is converted into the Z direction toward the semiconductor wafer t and the optical axis of the lower camera 51b that is converted into the Z direction toward the package region are arranged to match in the vertical direction, that is, Coaxially configured. Further, in the casing 51d, the imaging opening (not shown) corresponds to the position of the optical axis converted into the Z direction, and is disposed in the casing 51d in a positional relationship in which the center of the opening coincides with the optical axis. On the upper and lower surfaces. Therefore, at the imaging position, the opening portion is positioned in the package position C.

The control unit 60 is provided with a storage unit 61. In the memory unit 61, information necessary for the operation of the packaging device 1 such as the transfer unit 30 including the information of the package position C or the operation condition of the package unit 40 is stored. The control unit 60 controls the supply unit 10, the substrate stage 20, the transfer unit 30, the package unit 40, the imaging unit 50, and the like with reference to the data stored in the storage unit 61.

[Explanation of Operation] Next, the operation of the package device 1 of the present embodiment will be described with reference to Figs. 3 to 6 . First, a wafer ring 11 to which a plurality of semiconductor wafers t are attached to an adhesive sheet (not shown) is supplied and held on the wafer stage 12 of the supply unit 10 (wafer ring supply step). Moreover, the substrate K before packaging is placed on the substrate stage 20 by a substrate transfer device (not shown) (substrate supply step).

In this state, the wafer stage driving unit 13 is controlled to position the semiconductor wafer t initially picked up on the wafer ring 11 at the pickup position A. When the semiconductor wafer t is positioned at the pickup position A, as shown in FIG. 3, the elevation/reverse driving unit 32 is controlled to lower the adsorption nozzle 31 onto the semiconductor wafer t. The adsorption nozzle 31 picks up the semiconductor wafer t after picking up the semiconductor wafer t and rising to the original height (pickup step). Then, the adsorption nozzle 31 is vertically inverted with the rotation axis 31a as a center, and the semiconductor wafer t is positioned at the delivery position B in a state where the front and back are reversed as indicated by a chain double-dashed line in FIG. 3 (reverse step) .

At this time, as shown in FIG. 3, the package tool 41 is positioned at the delivery position B by the tool driving unit 42, and more specifically, is positioned at a position directly above the semiconductor wafer t positioned at the delivery position B. . Therefore, when the semiconductor wafer t is positioned at the delivery position B, the tool driving unit 42 is controlled to lower the package tool 41 to the position of the semiconductor wafer t held by the adsorption nozzle 31 as shown in FIG. 4 . Moreover, the package tool 41 adsorbs and holds the semiconductor wafer t. When the package tool 41 adsorbs and holds the semiconductor wafer t, the tool driving unit 42 raises the package tool 41 to the original height and transfers it to the package position C. As shown by a chain double-dashed line in FIG. 4, the transferred semiconductor wafer t is positioned at a package position C at a height position for imaging by the upper and lower imaging cameras 51 (electronic component positioning step).

Here, in the present embodiment, the position correction step of the package region is performed during the period from the supply of the semiconductor wafer t to the supply position from the supply unit 10, that is, the package is performed simultaneously with the electronic component positioning step. The location correction step for the zone.

That is, at the timing when the semiconductor wafer t is picked up by the package tool 41 in the pickup step, the package region of the packaged semiconductor wafer t on the substrate K is positioned at the package position C (package region positioning step). If the package area is positioned on the package position C, the advance/retract drive unit 52 is controlled, or the advance/retract drive unit 52 is controlled while positioning the package area on the package position C. As shown in FIG. 4, the upper and lower camera 51 is self-retracted. The position moves toward the recording position. When the up-and-down imaging camera 51 is positioned at the imaging position, the package area is imaged by the lower camera 51b.

Here, on the substrate K, a circuit pattern is provided in each package region, for example, corresponding to the TSV of the semiconductor wafer t, and an alignment mark for positioning is provided. Therefore, the lower side camera 51b images the image of the package area including the alignment mark.

When the lower camera 51b images the package area, the captured image is transmitted to the image processing unit 53, and the image processing unit 53 performs image processing such as binarization, and then transmits the image to the control unit 60. The control unit 60 calculates the position of the package region based on the image of the image captured by the lower camera 51b transmitted from the image processing unit 53 using a known image matching method, and the package is stored in the memory unit 61 in advance. The positional information of the position C is compared to determine the positional deviation of the package area with respect to the package position C. As a result of the positional deviation, the stage driving unit 22 is driven to eliminate the positional deviation, and the position of the package area is corrected (the position correction step of the package area). Thereby, the package area can be correctly positioned on the package position C. Further, after the positional deviation is corrected, the lower side camera 51b can be used to image the package area again, and it is confirmed whether or not the positional correction of the package area is appropriate. Furthermore, if it is determined that the position correction is not appropriate as a result, the positional correction of the package area can be performed again.

After the electronic component positioning step and the position correction step of the package region are completed, as shown in FIG. 5, the semiconductor wafer t held by the package tool 41 and the package region of the substrate K are imaged by the upper and lower camera 51. (camera step). That is, at the package position C, the semiconductor wafer t is disposed in a positional relationship with the package region separated from above and below. The upper and lower imaging cameras 51 enter between the semiconductor wafer t and the package area, and the semiconductor wafer t is imaged by the upper camera 51a, and the package area is imaged by the lower camera 51b. When the semiconductor wafer t and the package region are imaged by the upper and lower camera 51, the control unit 60 recognizes both the semiconductor wafer t subjected to the image processing by the image processing unit 53 and the image of the image of the package region. The relative positional relationship (location identification step). Further, the upper and lower imaging cameras 51 that have completed imaging are moved to the retracted position as shown in FIG. 6.

Thereafter, the control unit 60 controls the tool driving unit 42 to package the semiconductor wafer t held on the package tool 41 in the package region. At this time, when a deviation occurs in the relative positional relationship between the semiconductor wafer t and the package region, the tool driving portion 42 is operated to eliminate the positional deviation and then packaged (packaging step).

The above operations are repeatedly performed on all the package regions on the substrate K. When the encapsulation of the semiconductor wafer t in all the package regions on the substrate K is completed, the substrate K that has been packaged is carried out from the mounting table 21 by a substrate transfer device (not shown), and a new substrate K is supplied. Further, if all the semiconductor wafers t on the wafer ring 11 are picked up, the wafer ring 11 is replaced with a new wafer ring 11. This type of action only repeats the necessary production quantities, such as a batch.

[Operation and Effect] According to the package device 1 of the embodiment, the lower side camera 51b of the upper and lower imaging cameras 51 is imaged by the upper and lower imaging cameras 51 before the semiconductor wafer t and the package region positioned at the package position C are imaged. Capturing the package area positioned at the package position C, and determining the positional deviation of the package area with respect to the package position C based on the image data, and controlling the load to eliminate the position deviation when the positional deviation occurs The stage driving unit 22 corrects the position of the package area.

Therefore, when the semiconductor wafer t and the package region of the substrate K positioned at the package position C are simultaneously imaged by the upper and lower camera 51, since the package region is positioned with high precision on the package position C, the semiconductor can be made When the relative positional deviation of the wafer t from the package region is shifted, the amount of movement of the package tool 41 is reduced to a small amount or the amount of movement is eliminated, and the semiconductor wafer t can be packaged in the package region with high package accuracy.

That is, since the package tool 41 is repeatedly moved between the transfer position B and the package position C, the accuracy of repeated movement toward the package position C is extremely high. However, if the positioning accuracy of the package region with respect to the package position C is low and the relative positional deviation of the package region from the semiconductor wafer t is large, the amount of correction movement of the package tool 41 in the XY direction required for the correction of the positional deviation becomes Big. In this case, the state of the tilt of the Z-axis caused by the pitch, the sway, the rolling, or the like of the XY moving shaft of the tool drive unit 42 changes, which hinders the improvement of the package accuracy. In the present embodiment, as described above, the position of the package region is corrected with respect to the package position C before the upper and lower imaging cameras 51 image the semiconductor wafer t and the package region positioned at the package position C. Therefore, the relative positional deviation of the package region from the semiconductor wafer t is suppressed, whereby the amount of correction movement of the package tool 41 in the XY direction can be minimized, so that the change in the state of the tilt of the Z-axis of the package tool 41 can be suppressed as much as possible. . As a result, the trajectory of the posture or the downward movement of the package tool 41 when the package tool 41 is lowered toward the package area can be kept substantially constant each time, whereby the package accuracy can be improved. In this way, it is possible to cope with a manufacturing process of a semiconductor package such as a high-frequency wide memory using a three-dimensional high-integration technique using TSV, which requires higher packaging accuracy than a semiconductor package such as a QFP or a BGA.

In addition, the position correction step of the package region of the substrate K positioned at the package position C is performed during the period from the supply unit 10 receiving the supply of the semiconductor wafer t to the package position C, that is, the positioning of the electronic component The step simultaneously performs a position correcting step of positioning the package area of the substrate K on the package position C. Therefore, it is not necessary to ensure an individual time for the new step of the position correction step of the package region, and the time required for packaging one semiconductor wafer t on the substrate K can be prevented from becoming long, and the decrease in productivity can be prevented.

In addition, the upper and lower imaging cameras 51 that simultaneously image the semiconductor wafer t positioned in the state separated above and below the package position C and the package region of the substrate K are subjected to the package region of the substrate K when the position correction step of the package region is performed. Camera. Therefore, it is not necessary to separately provide an image pickup device such as a camera for the new step of the position correction step of the package region, and it is possible to avoid complication of the configuration of the package device 1.

(Other Embodiments) Further, the present invention is not limited to the above embodiments. For example, in the above-described embodiment, the upper and lower imaging cameras 51 in the imaging unit 50 are provided with an upper camera 51a that images the semiconductor wafer t (electronic components) and a lower camera 51b that images the package region of the substrate K. For example, the present invention is not limited thereto. For example, a single imaging camera can simultaneously image an electronic component located on the upper side and a package area of the substrate K located on the lower side. Specifically, it is also possible to arrange, on the optical axis of the horizontally arranged imaging camera, a horizontal line that intersects perpendicularly with respect to the optical axis as a boundary, and set the upper half to an angle of 45° in a direction away from the imaging camera. The upwardly inclined reflecting surface is set to the lower surface of the reflecting surface which is inclined downward at an angle of 45° in the direction away from the camera camera, and the electronic component is taken in the upper half of the imaging field of the camera camera. Image, and capture the image of the package area in the lower half. Further, when imaging the package region of the substrate K when performing the position correction step of the package region, only the lower half of the imaging field of view of the imaging camera may be used. Even if the imaging unit 50 is provided in this manner, the same operational effects as those of the above embodiment can be obtained.

Further, an imaging camera that images the semiconductor wafer t (electronic component), an imaging camera that images the package region of the substrate K, and a package region of the substrate K in the position correction step of the package region may be separately provided. Camera camera.

In addition, the position correction step of the package region of the substrate K is performed simultaneously with the electronic component positioning step in the period from the supply of the semiconductor wafer t (electronic component) from the supply unit 10 to the package position C. Example of execution. However, the position correction step of the package region of the substrate K may be performed before the imaging of the semiconductor wafer t and the package region positioned at the package position C by the upper and lower imaging cameras 51. Therefore, the pickup step of picking up the semiconductor wafer t from the supply unit 10 may be performed in parallel with the transfer unit 30. In other words, the self-transfer unit 30 may be simultaneously executed with the electronic component positioning step while the semiconductor wafer t is picked up from the supply unit 10 until the package tool 41 moves toward the package position C.

Further, in the above-described embodiment, the package position can be always set to a fixed position regardless of the type of the semiconductor wafer t as the electronic component or the type of the substrate K, and the type of the semiconductor wafer t or the substrate K can be used. For example, switching between changes in size or the like. In short, it may be maintained at a fixed position during the period from the start of packaging to the completion of packaging from the required production amount (for example, one batch) of the semiconductor wafer t of the type to be packaged.

The embodiments of the present invention have been described above, but the embodiments are not intended to limit the scope of the invention. The present invention can be implemented in various other forms, and various omissions, substitutions and changes may be made without departing from the scope of the invention. The embodiments and variations thereof are included in the scope of the invention, and are included in the invention described in the scope of the patent application.

1‧‧‧Package

10‧‧‧Supply Department

11‧‧‧ wafer ring

12‧‧‧ Wafer

13‧‧‧ Wafer Drive Department

20‧‧‧Base platform

21‧‧‧ mounting table

22‧‧‧Station drive department

30‧‧‧Transfer Department

31‧‧‧Adsorption nozzle

31a‧‧‧Rotary axis

32‧‧‧ Lifting and reversing drive unit

40‧‧‧Packing Department

41‧‧‧Packaging tools

42‧‧‧Tool Drive Department

50‧‧‧Photography Department

51‧‧‧Up and down camera

51a‧‧‧Upper camera

51b‧‧‧Lower camera

51c‧‧‧Light Path Conversion Department

51d‧‧‧ frame

52‧‧‧Advance and Retraction Drive Department

53‧‧‧Image Processing Department

60‧‧‧Control Department

61‧‧‧Memory Department

A‧‧‧ pick up location

B‧‧‧ handover location

C‧‧‧Packing location

K‧‧‧Substrate

t‧‧‧Semiconductor wafer

W‧‧‧Semiconductor Wafer

X, Y, Z, θ‧‧‧ directions

Fig. 1 is a front elevational view showing a schematic configuration of an electronic component packaging apparatus according to an embodiment. Fig. 2 is a block diagram showing a packaging device for an electronic component according to an embodiment. 3 is a front elevational view showing the operation of the packaging device for an electronic component. 4 is a front elevational view showing the operation of the packaging device for an electronic component. Fig. 5 is a front elevational view showing the operation of the packaging device for an electronic component. Fig. 6 is a front elevational view showing the operation of the electronic component packaging apparatus.

Claims (6)

A packaging device for an electronic component, which is an electronic component packaging device for encapsulating electronic components in a plurality of package regions on a substrate, comprising: a supply portion for supplying the electronic component; and a substrate platform having a mounting a mounting table of the substrate and a mounting table driving unit that moves the mounting table, and a plurality of the package regions of the substrate placed on the mounting table by driving of the mounting table driving unit Positioning at a predetermined package position; the package portion includes a package tool for holding the electronic component supplied from the supply portion and a tool drive portion for moving the package tool, and the electronic component is packaged and positioned In the package area at the package position; an imaging unit at the package position, encapsulating the electronic component held on the package tool and the substrate placed on the mounting table The area is imaged; and the control unit identifies a relative positional relationship between the electronic component and the package area based on the captured image obtained by the imaging unit, and The tool driving unit is configured to position the electronic component opposite to the package area to encapsulate the electronic component in the package area; and the control unit is configured by the imaging unit Before imaging the electronic component and the package area at a package position, the image capturing unit images the package area positioned at the package position, and obtains a package relative to the package according to the image. The position of the package area at the position is deviated, and the stage driving unit is controlled to eliminate the obtained positional deviation. The electronic component packaging apparatus according to claim 1, wherein the control unit is in a period from when the packaging tool receives the supply of the electronic component from the supply unit to the package position. And the image forming unit is disposed on the package area positioned at the package position by the imaging unit before imaging the electronic component and the package area at the package position Imaging and control of the mounting table drive unit based on the captured image. The electronic component packaging apparatus according to claim 2, wherein the imaging unit includes the electronic component that enters the package position and the substrate that is positioned at the package position. Between the package areas, an upper and lower camera camera capable of simultaneously capturing images of the electronic component and the package area, and the control unit is performed by the upper and lower camera cameras by the upper and lower camera cameras Imaging of the package area positioned at the package position before the electronic component and the package area are imaged at the package position. The electronic component packaging apparatus according to claim 3, wherein the upper and lower imaging cameras include an upper camera that images the electronic component and a lower camera that images the package area, and the orientation camera The optical axis of the upper camera of the electronic component is disposed coaxially with the optical axis of the lower camera facing the package region. A method of packaging an electronic component, which is a method of packaging an electronic component in a plurality of package regions on a substrate, comprising: a package region positioning step of loading the substrate on the mounting table a predetermined package area of the plurality of package regions of the substrate is positioned at a preset package position; an electronic component positioning step of holding the electronic component supplied from the supply portion with the package tool and holding the electronic component The component is positioned at the package position; the image capturing step is to image the package area positioned on the package position and the electronic component; and the packaging step is performed according to the camera image obtained in the image capturing step Positioning the package area opposite to the electronic component and encapsulating the electronic component in the package area; and including a position correction step of the package area, the position correction step of the package area before performing the imaging step Inserting the package area positioned on the package position by the package area positioning step Imaging, image obtained based on the imaging position of the package relative to the package region deviated position, and so as to eliminate the positional deviation of the obtained correcting the position of the region of the package. The method of packaging an electronic component according to claim 5, wherein the position correcting step of the package region is performed simultaneously with the electronic component positioning step.