CN215401545U - Wafer frame collecting device for chip packaging - Google Patents
Wafer frame collecting device for chip packaging Download PDFInfo
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- CN215401545U CN215401545U CN202121889361.8U CN202121889361U CN215401545U CN 215401545 U CN215401545 U CN 215401545U CN 202121889361 U CN202121889361 U CN 202121889361U CN 215401545 U CN215401545 U CN 215401545U
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- clamping
- collecting device
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Abstract
The utility model discloses a wafer frame collecting device for chip packaging, which comprises a horizontal moving mechanism, wherein the horizontal moving mechanism is connected with a vertical adjusting mechanism, the vertical adjusting mechanism is connected with a clamping mechanism, and the clamping mechanism is used for clamping a wafer frame box; vertical adjustment mechanism includes the crane, it is connected with elevating screw to rotate on the crane, fixedly connected with elevator motor on the crane, elevator motor's output shaft and the coaxial fixed connection of one end of elevating screw, threaded connection has the elevator on the elevating screw, the first guide bar of fixedly connected with on the crane, with the first guide bar sliding connection of elevator, fixture is connected with the elevator. The wafer frame collecting device for chip packaging provided by the utility model is convenient for adjusting the moving distance of the wafer frame box in the vertical direction and collecting the wafer frame.
Description
Technical Field
The application relates to the field of chip packaging, in particular to a wafer frame collecting device for chip packaging.
Background
In the semiconductor industry, the storage or transport of various semiconductor devices or semiconductor semi-finished products has become a significant issue. In the case of automated machines, it is critical to efficiently produce semiconductor devices to transport desired materials or semiconductor devices to a desired location.
Semiconductor devices that are often required to be stored or transported include wafers, substrates, masks or wafer frames (waferframes), and the like. And the dimensions used in different semiconductor processes are different, carriers of different sizes are derived.
At present, chinese patent application with application number CN201910510341.6 discloses a horizontal moving device for a wafer frame box and a wafer loading system, which includes a slide rail, a slide block, a horizontal movement driving mechanism, a lifting mechanism, and a bearing structure, wherein the bearing structure is installed on the lifting mechanism, and the slide block is directly or indirectly fixedly connected with the lifting mechanism; the lifting mechanism is used for driving the corresponding bearing structure to do lifting motion, so that the bearing structure can be supported on the lower side of the wafer frame box after being lifted, and the wafer frame box can be loaded; the horizontal movement driving mechanism can drive the sliding block to horizontally move along the sliding rail, so that the lifting mechanism directly or indirectly connected to the sliding block, the bearing structure and the wafer frame box synchronously move horizontally.
In view of the above-mentioned related art, the inventor thinks that the wafer frame box needs to be driven by a cylinder in the process of moving in the vertical direction, and the height of lifting in the vertical direction is difficult to adjust, which is inconvenient for collecting the wafer frame.
SUMMERY OF THE UTILITY MODEL
In order to conveniently adjust the moving distance of the wafer frame box in the vertical direction and conveniently collect the wafer frame, the application provides a wafer frame collecting device for chip packaging.
The application provides a wafer frame collection device for chip packaging adopts the following technical scheme:
a wafer frame collecting device for chip packaging comprises a horizontal moving mechanism, wherein the horizontal moving mechanism is connected with a vertical adjusting mechanism, the vertical adjusting mechanism is connected with a clamping mechanism, and the clamping mechanism is used for clamping a wafer frame box;
vertical adjustment mechanism includes the crane, it is connected with elevating screw to rotate on the crane, fixedly connected with elevator motor on the crane, elevator motor's output shaft and the coaxial fixed connection of one end of elevating screw, threaded connection has the elevator on the elevating screw, the first guide bar of fixedly connected with on the crane, with the first guide bar sliding connection of elevator, fixture is connected with the elevator.
Through adopting above-mentioned technical scheme, horizontal migration mechanism drives brilliant circle frame box horizontal migration, when the height of the vertical direction of brilliant circle frame box needs to be adjusted, starts elevator motor, and elevator motor's output shaft drives the lead screw and rotates, and the lift of elevator is driven to elevator pivoted in-process, and the elevator drives the wafer frame box and goes up and down to conveniently adjust the distance that brilliant circle frame box moved in vertical direction, conveniently collect wafer frame.
Optionally, there are two first guide rods, and the two first guide rods are respectively located at two sides of the lifting screw rod.
Through adopting above-mentioned technical scheme, first guide bar leads the elevator to improve device's stability.
Optionally, the horizontal moving mechanism includes a bottom plate and a first driving motor, fixed plates are fixedly connected to both ends of the bottom plate, a horizontal lead screw is rotatably connected between the two fixed plates, a horizontal moving block is connected to the horizontal lead screw in a threaded manner, the horizontal moving block is slidably connected to the bottom plate, the lifting frame is fixedly connected to the horizontal moving block, and the first driving motor drives the horizontal lead screw to rotate.
By adopting the technical scheme, the first driving motor is started, the first driving motor drives the horizontal lead screw to rotate, the horizontal moving block is driven to transversely move in the process of rotating the horizontal lead screw, and the horizontal moving block drives the lifting frame and the wafer frame box to horizontally move.
Optionally, the output shaft of the first driving motor is sleeved with a belt, and the belt is sleeved on the horizontal screw rod.
Through adopting above-mentioned technical scheme, first driving motor passes through the belt and drives horizontal lead screw and rotate.
Optionally, the bottom plate is fixedly connected with two T-shaped bars, the horizontal lead screw is located between the two T-shaped bars, the horizontal lead screw is parallel to the two T-shaped bars, and the horizontal moving block slides along the T-shaped bars.
Through adopting above-mentioned technical scheme, the T type strip leads horizontal moving block to improve the stability of device.
Optionally, the clamping mechanism comprises a connecting plate and a connecting block, the connecting plate is fixedly connected with the lifting block, the connecting block is fixedly connected with the connecting plate, a supporting plate is fixedly connected onto the connecting block, one end of the connecting plate, far away from the connecting block, of a top plate is fixedly connected with the connecting block, a clamping lead screw is rotatably connected between the top plate and the connecting block, the clamping lead screw is in threaded connection with a clamping piece, a second guide rod is fixedly connected between the top plate and the connecting block, the second guide rod penetrates through the clamping piece, a second driving motor is fixedly connected onto the top plate, and an output shaft of the second driving motor is fixedly connected with the clamping lead screw in a coaxial mode.
Through adopting above-mentioned technical scheme, place the wafer frame box in the backup pad, start second driving motor, second driving motor's output shaft drives the centre gripping lead screw and rotates, and centre gripping lead screw pivoted in-process drives the holder and moves towards the backup pad to it is fixed to carry out the centre gripping to the wafer frame box.
Optionally, the second driving motor is fixedly connected to the top plate through a vertical plate.
Through adopting above-mentioned technical scheme, the riser is fixed and is supported second driving motor.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the lifting frame, the lifting screw and the lifting block are arranged, the horizontal moving mechanism drives the wafer frame box to move horizontally, when the height of the wafer frame box in the vertical direction needs to be adjusted, the lifting motor is started, the output shaft of the lifting motor drives the lifting screw to rotate, the lifting block is driven to lift in the rotating process of the lifting screw, and the lifting block drives the wafer frame box to lift, so that the moving distance of the wafer frame box in the vertical direction can be conveniently adjusted, and the wafer frame can be conveniently collected;
according to the wafer frame box, the supporting plate, the clamping screw rod and the clamping piece are arranged, the wafer frame box is placed on the supporting plate, the second driving motor is started, the output shaft of the second driving motor drives the clamping screw rod to rotate, and the clamping piece is driven to move towards the supporting plate in the rotating process of the clamping screw rod, so that the wafer frame box is clamped and fixed.
Drawings
FIG. 1 is a schematic structural diagram of a wafer frame collecting device for chip packaging according to the present invention;
FIG. 2 is a side view of a wafer frame collecting device for chip packaging according to the present invention;
fig. 3 is a schematic structural diagram of a clamping mechanism in a wafer frame collecting device for chip packaging according to the present invention.
In the figure: 1. a horizontal movement mechanism; 11. a base plate; 12. a first drive motor; 13. a fixing plate; 14. a horizontal lead screw; 15. a horizontal moving block; 16. a belt; 17. t-shaped strips; 2. a vertical adjustment mechanism; 21. a lifting frame; 22. lifting a screw rod; 23. a lifting motor; 24. a lifting block; 25. a first guide bar; 3. a clamping mechanism; 31. a connecting plate; 32. connecting blocks; 33. a support plate; 34. a top plate; 35. a second drive motor; 36. clamping the screw rod; 37. a clamping member; 38. a second guide bar; 39. a riser.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the embodiment of the wafer frame collecting device for chip packaging provided by the utility model comprises a horizontal moving mechanism 1, wherein the horizontal moving mechanism 1 is connected with a vertical adjusting mechanism 2, the vertical adjusting mechanism 2 is connected with a clamping mechanism 3, and the clamping mechanism 3 is used for clamping a wafer frame box.
Referring to fig. 1 and 2, the horizontal movement mechanism 1 includes a bottom plate 11 and a first driving motor 12, fixing plates 13 are fixedly connected to both ends of the bottom plate 11, and a horizontal lead screw 14 is rotatably connected between the two fixing plates 13. The horizontal lead screw 14 is in threaded connection with a horizontal moving block 15, and the horizontal moving block 15 is in sliding connection with the bottom plate 11. The vertical adjusting mechanism 2 is connected with a horizontal moving block 15, a belt 16 is sleeved on an output shaft of the first driving motor 12, and the belt 16 is sleeved on the horizontal lead screw 14. The first driving motor 12 rotates the horizontal lead screw 14 via the belt 16.
Referring to fig. 1 and 2, two T-shaped bars 17 are fixedly connected to the bottom plate 11, the horizontal lead screw 14 is located between the two T-shaped bars 17, the horizontal lead screw 14 is parallel to the two T-shaped bars 17, and the horizontal moving block 15 slides along the T-shaped bars 17. The T-bar 17 guides the horizontal moving block 15, thereby improving the stability of the apparatus.
Referring to fig. 1 and 2, the first driving motor 12 is started, the first driving motor 12 drives the horizontal lead screw 14 to rotate, the horizontal moving block 15 is driven to move transversely in the process of rotating the horizontal lead screw 14, and the horizontal moving block 15 drives the lifting frame 21 and the wafer frame box to move horizontally.
Referring to fig. 1 and 2, the vertical adjusting mechanism 2 includes a lifting frame 21, and the lifting frame 21 is fixedly connected to the horizontal moving block 15. The lifting frame 21 is rotatably connected with a lifting screw rod 22, the lifting frame 21 is fixedly connected with a lifting motor 23, and an output shaft of the lifting motor 23 is coaxially and fixedly connected with one end of the lifting screw rod 22. The elevating screw 22 is connected with an elevating block 24 through screw threads, and the clamping mechanism 3 is connected with the elevating block 24. The lifting frame 21 is fixedly connected with two first guide rods 25, the lifting block 24 is connected with the first guide rods 25 in a sliding mode, and the two first guide rods 25 are located on two sides of the lifting screw rod 22 respectively. The first guide bar 25 guides the lift block 24, thereby improving the stability of the apparatus.
Referring to fig. 1 and 2, the horizontal moving block 15 drives the horizontal movement of the wafer frame box, when the height of the vertical direction of the wafer frame box needs to be adjusted, the lifting motor 23 is started, the output shaft of the lifting motor 23 drives the lifting screw 22 to rotate, the lifting screw 22 drives the lifting block 24 to lift, and the lifting block 24 drives the wafer frame box to lift, so that the moving distance of the wafer frame box in the vertical direction is conveniently adjusted, and the wafer frame is conveniently collected.
Referring to fig. 2 and 3, the clamping mechanism 3 includes a connecting plate 31, a connecting block 32 and a second driving motor 35, the connecting plate 31 is fixedly connected with the lifting block 24, and the connecting block 32 is fixedly connected with the connecting plate 31. Fixedly connected with backup pad 33 on connecting block 32, connecting block 32's one end fixedly connected with roof 34 is kept away from to connecting plate 31, rotate between roof 34 and the connecting block 32 and be connected with centre gripping lead screw 36, centre gripping lead screw 36 threaded connection has holder 37, two second guide bars 38 of fixedly connected with between roof 34 and the connecting block 32, holder 37 is all passed to two second guide bars 38, second driving motor 35 passes through riser 39 fixed connection on roof 34. The riser 39 fixes and supports the second drive motor 35. An output shaft of the second driving motor 35 passes through the top plate 34 and is coaxially and fixedly connected with the clamping screw 36.
Referring to fig. 2 and 3, the wafer frame cassette is placed on the support plate 33, the second driving motor 35 is started, the output shaft of the second driving motor 35 drives the clamping screw 36 to rotate, and the clamping screw 36 drives the clamping piece 37 to move towards the support plate 33 in the rotating process, so that the wafer frame cassette is clamped and fixed.
The working principle is as follows: the first driving motor 12 is started, the first driving motor 12 drives the horizontal lead screw 14 to rotate, the horizontal moving block 15 is driven to transversely move in the rotating process of the horizontal lead screw 14, and the horizontal moving block 15 drives the lifting frame 21 and the wafer frame box to horizontally move.
Horizontal moving block 15 drives the horizontal movement of wafer frame box, when the height of the vertical direction of wafer frame box needs to be adjusted, start elevator motor 23, elevator motor 23's output shaft drives lift screw 22 and rotates, lift screw 22 pivoted in-process drives elevator block 24 and goes up and down, elevator block 24 drives the wafer frame box and goes up and down to conveniently adjust the distance that wafer frame box moved in vertical direction, conveniently collect wafer frame.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. The utility model provides a wafer frame collection device for chip package which characterized in that: the wafer frame box clamping device comprises a horizontal moving mechanism (1), wherein the horizontal moving mechanism (1) is connected with a vertical adjusting mechanism (2), the vertical adjusting mechanism (2) is connected with a clamping mechanism (3), and the clamping mechanism (3) is used for clamping a wafer frame box;
vertical adjustment mechanism (2) include crane (21), it is connected with elevating screw (22) to rotate on crane (21), fixedly connected with elevator motor (23) on crane (21), the output shaft of elevator motor (23) and the coaxial fixed connection of one end of elevating screw (22), threaded connection has elevator piece (24) on elevating screw (22), the first guide bar of fixedly connected with (25) on crane (21), with the first guide bar of elevator piece (24) (25) sliding connection, fixture (3) are connected with elevator piece (24).
2. The wafer frame collecting device for chip packaging according to claim 1, wherein: the number of the first guide rods (25) is two, and the two first guide rods (25) are respectively positioned on two sides of the lifting screw rod (22).
3. The wafer frame collecting device for chip packaging according to claim 1, wherein: the horizontal moving mechanism (1) comprises a bottom plate (11) and a first driving motor (12), fixing plates (13) are fixedly connected to two ends of the bottom plate (11), a horizontal lead screw (14) is rotatably connected between the two fixing plates (13), a horizontal moving block (15) is in threaded connection with the horizontal lead screw (14), the horizontal moving block (15) is in sliding connection with the bottom plate (11), the lifting frame (21) is fixedly connected with the horizontal moving block (15), and the first driving motor (12) drives the horizontal lead screw (14) to rotate.
4. The wafer frame collecting device for chip packaging as claimed in claim 3, wherein: the belt (16) is sleeved on an output shaft of the first driving motor (12), and the belt (16) is sleeved on the horizontal lead screw (14).
5. The wafer frame collecting device for chip packaging as claimed in claim 3, wherein: the bottom plate (11) is fixedly connected with two T-shaped strips (17), the horizontal lead screw (14) is located between the two T-shaped strips (17), the horizontal lead screw (14) is parallel to the two T-shaped strips (17), and the horizontal moving block (15) slides along the T-shaped strips (17).
6. The wafer frame collecting device for chip packaging as claimed in claim 5, wherein: the clamping mechanism (3) comprises a connecting plate (31) and a connecting block (32), the connecting plate (31) is fixedly connected with the lifting block (24), the connecting block (32) is fixedly connected with the connecting plate (31), a supporting plate (33) is fixedly connected on the connecting block (32), one end of the connecting plate (31) far away from the connecting block (32) is fixedly connected with a top plate (34), a clamping screw rod (36) is rotatably connected between the top plate (34) and the connecting block (32), the clamping screw rod (36) is in threaded connection with a clamping piece (37), a second guide rod (38) is fixedly connected between the top plate (34) and the connecting block (32), the second guide rod (38) penetrates through the clamping piece (37), a second driving motor (35) is fixedly connected to the top plate (34), and an output shaft of the second driving motor (35) is coaxially and fixedly connected with the clamping screw rod (36).
7. The wafer frame collecting device for chip packaging as claimed in claim 6, wherein: and the second driving motor (35) is fixedly connected to the top plate (34) through a vertical plate (39).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121889361.8U CN215401545U (en) | 2021-08-12 | 2021-08-12 | Wafer frame collecting device for chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121889361.8U CN215401545U (en) | 2021-08-12 | 2021-08-12 | Wafer frame collecting device for chip packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215401545U true CN215401545U (en) | 2022-01-04 |
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ID=79662562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121889361.8U Active CN215401545U (en) | 2021-08-12 | 2021-08-12 | Wafer frame collecting device for chip packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215401545U (en) |
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2021
- 2021-08-12 CN CN202121889361.8U patent/CN215401545U/en active Active
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