CN214690377U

CN214690377U - Wafer conveying and discharging mechanism

Info

Publication number: CN214690377U
Application number: CN202120297585.3U
Authority: CN
Inventors: 杨勇
Original assignee: Suzhou Gulang Technology Co ltd
Current assignee: Suzhou Gulang Technology Co ltd
Priority date: 2021-02-02
Filing date: 2021-02-02
Publication date: 2021-11-12
Anticipated expiration: 2031-02-02

Abstract

The utility model discloses a unloading mechanism is carried to wafer, including supporting platform, set up the magazine placer that is used for placing the magazine in order on supporting platform, set up the Y axle mobile device that is used for controlling the Y direction removal on supporting platform, set up the Z axle mobile device that is used for controlling the Z direction removal on the Y axle mobile device, set up the double-layered frame device that is used for centre gripping magazine and accomodates the wafer of unloading on the Z axle mobile device, set up the wafer installation device that is used for placing the wafer on supporting platform, set up the blevile of push that is used for promoting the wafer on the wafer installation device, the beneficial effects of the utility model are that, can push away the wafer to the magazine in the double-layered frame device well through magazine placer, double-layered frame device, wafer installation device, blevile of push.

Description

Wafer conveying and discharging mechanism

Technical Field

The utility model relates to an unloading technical field of mechanism, especially a unloading mechanism is carried to wafer.

Background

The wafer needs to be blanked after normal processing, but the wafer is blanked manually at present, but in the blanking process, hands of people who manually operate can certainly contact the wafer, and at the moment, the wafer has a pollution risk, which affects the quality and yield of IC chips; moreover, the end shape of the wafer is easily damaged during manual operation, which affects the yield of the wafer and the subsequent normal use.

Therefore, the automatic wafer blanking mechanism is designed on the basis of the defects of the prior art, and the use requirements of people can be met.

SUMMERY OF THE UTILITY MODEL

Because the blanking of the processed wafer is generally carried out manually at present, but the manual blanking can pollute the wafer and easily causes certain damage to the complete shape of the wafer, the wafer conveying and blanking mechanism is designed on the basis of the defects of the prior art, so that the manual direct contact with the wafer can be avoided, the pollution to the wafer is reduced, and the wafer conveying and blanking mechanism is convenient for people to use.

Realize above-mentioned purpose the technical scheme of the utility model be, a unloading mechanism is carried to wafer, including supporting platform, still include:

the material box placing device is arranged on the supporting platform and used for placing material boxes in order;

the Y-axis moving device is arranged on the supporting platform and used for controlling the movement in the Y direction;

the Z-axis moving device is arranged on the Y-axis moving device and is used for controlling the movement in the Z direction;

the clamping frame device is arranged on the Z-axis moving device and used for clamping the material box and accommodating the blanked wafer;

the wafer mounting device is arranged on the supporting platform and used for placing a wafer;

and the pushing device is arranged on the wafer mounting device and used for pushing the wafer on the wafer mounting device.

To further supplement the technical scheme, the two material box placing devices are distributed up and down and comprise a material box conveying mechanism, support rods arranged around the lower part of the material box conveying mechanism, stop blocks arranged around the upper part of the material box conveying mechanism and a baffle arranged on one side of the upper part of the material box conveying mechanism; the lower end of the supporting rod is fixedly arranged on the supporting platform; the upper end of the support rod is fixedly arranged at the lower end of the material box conveying mechanism, the stop block is fixedly arranged at the upper end of the material box conveying mechanism, and the baffle is fixedly arranged on the material box conveying mechanism.

Further supplementing the present technical solution, the Y-axis moving device includes a first linear module.

To further supplement the technical scheme, the Z-axis moving device comprises a second linear module, and the Z-axis moving device is fixedly installed on the Y-axis moving device.

In addition to the technical scheme, the frame clamping device comprises a fixed block, first clamping jaws arranged on two sides below the fixed block, a first air cylinder arranged on the fixed block, a first push rod connected with the first air cylinder, a pushing block fixedly connected with the first push rod, and second clamping jaws arranged on the left side and the right side above the pushing block, wherein the fixed block is fixedly arranged on the second linear module, the first clamping jaw is fixedly arranged on the fixed block, the first air cylinder is fixedly arranged on the fixed block, and the second clamping jaw is fixedly arranged on the pushing block; a sensor is arranged on one side of the pushing block close to the second clamping jaw.

The technical scheme is further supplemented, and the wafer mounting device comprises a mounting frame, pressing devices which are symmetrically arranged on two sides above the mounting frame, limiting columns arranged on the pressing devices on the two sides, a fixing frame arranged on the pressing devices, and a photoelectric sensor arranged on the fixing frame; the mounting frame is fixedly mounted on the supporting platform, one end of the limiting column is fixedly connected with the pressing device on one side, the other end of the limiting column is fixedly connected with the pressing device on the other side, the two fixing frames are symmetrically arranged on the mounting frame in a front-back mode, and the photoelectric sensors on the fixing frames on the two sides are symmetrically arranged; and a heating platform is arranged between the limiting columns on the two sides above the mounting rack.

In addition to the technical solution, the pressing device includes a substrate, a driving wheel disposed on the substrate, a driving motor connected to the driving wheel, a plurality of first belt pulleys connected to the driving wheel through a belt, a second belt pulley connected to the first belt pulleys through a belt, pressing wheels disposed on two sides of the substrate, a pressing plate disposed on the substrate, and a width limiting plate disposed above the pressing plate; the base plate is fixedly arranged on the mounting frame, the driving motor is fixedly arranged on the base plate, the second belt pulleys are arranged on the front side and the rear side of the base plate symmetrically, the first belt pulley and the second belt pulley are fixedly arranged on the base plate, and the pressing wheel is tangent to the second belt pulley after the belt is arranged; the pressing wheel is fixedly installed on the base plate, the pressing plate is arranged between the second belt wheels on the two sides and fixedly installed on the base plate, the width limiting plate is fixedly installed on the base plate, a gap exists between the width limiting plate and the pressing plate, and the gap is larger than the sum of the thicknesses of the belt and the wafer.

The technical scheme is further supplemented, the material pushing device is installed on the base plate on the pressing device on one side, the material pushing device comprises a fixing plate, a belt synchronous conveying mechanism arranged on the fixing plate, a pushing mechanism arranged on the belt conveying mechanism and a sliding rail arranged on the fixing plate, the fixing plate is fixedly installed on the side face of the base plate, and the pushing mechanism is installed on the sliding rail in a sliding mode.

The belt synchronous conveying mechanism comprises a stepping motor, a first synchronous wheel connected with the stepping motor, and a second synchronous wheel connected with the first synchronous wheel through a synchronous belt, wherein the stepping motor is fixedly arranged on a fixing plate.

The technical scheme is further supplemented, the pushing mechanism comprises a synchronous belt pressing plate, an air cylinder mounting block connected with the synchronous belt pressing plate, a second air cylinder fixedly connected with the air cylinder mounting block, a second push rod connected with the second air cylinder, a shifting sheet connected with the second push rod, and a sliding block arranged on one side, far away from the second air cylinder, of the air cylinder mounting block; the synchronous belt pressing plate is installed on a synchronous belt on the belt synchronous conveying mechanism, the air cylinder installation block is arranged below the synchronous belt and fixedly connected with the synchronous belt, the second air cylinder is arranged on one side, close to the wafer, of the air cylinder installation block, the second push rod is arranged below the second air cylinder, the shifting piece is arranged in front of the second push rod, and the sliding block is fixedly connected with the air cylinder installation block and is slidably installed on the sliding rail.

The wafer pushing device has the advantages that the wafer can be well pushed into the material box in the frame clamping device through the matching of the material box placing device, the frame clamping device, the wafer mounting device and the material pushing device, wherein the frame clamping device can play a role in clamping and supporting the material box placed on the material box placing device, and the material pushing device can push the wafer on the wafer mounting device into the material box, so that the wafer pushing device is convenient for people to use, does not need to manually contact the wafer, and reduces pollution caused by manual contact; the clamping frame device is further provided with a Y-axis moving device and a Z-axis moving device, so that the clamping frame device can clamp the material box according to the position of the material box on the material box placing device at the lower layer, the material box filled with the material can be better placed on the material box placing device at the upper layer, the applicability is stronger, and the using effect is good; wherein both sides still are equipped with closing device on the wafer installation device, can compress tightly the wafer, prevent that it from producing the skew at the removal in-process position, can't directly fall into the magazine to closing device's design plays certain guard action to the tip of wafer.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the overall structure of the magazine wafer loading apparatus of the present invention;

FIG. 3 is a schematic view of the mounting structure of the magazine placing device of the present invention;

fig. 4 is a first angle schematic view of the frame clamping device of the present invention;

fig. 5 is a second angle schematic view of the frame clamping device of the present invention;

fig. 6 is a schematic view of the overall installation structure of the wafer installation device and the pushing device of the present invention;

fig. 7 is a schematic view of a partial mounting structure of the wafer mounting device and the pushing device according to the present invention;

in the figure, 1, a platform is supported; 2. a magazine placement device; 21. a magazine conveying mechanism; 22. a support bar; 23. a stopper; 24. a baffle plate; 3. a Y-axis moving device; 4. a Z-axis moving device; 5. a frame clamping device; 51. a fixed block; 52. a first jaw; 53. a first cylinder; 54. a pushing block; 55. a second jaw; 56. a sensor; 6. a wafer mounting device; 61. a mounting frame; 621. a substrate; 622. a driving wheel; 623. a drive motor; 624. a first pulley; 625. a second pulley; 626. a pinch roller; 627. pressing a plate; 628. a width limiting plate; 63. a limiting column; 64. a fixed mount; 65. a photosensor; 66. a heating platform; 7. a material pushing device; 71. a fixing plate; 721. a stepping motor; 722. a first synchronizing wheel; 723. a second synchronizing wheel; 731. pressing plates of the synchronous belt; 732. a cylinder mounting block; 733. a second cylinder; 734. a second push rod; 735. a shifting sheet; 736. a slider; 74. a slide rail.

Detailed Description

In order to make the technical solution more clear to those skilled in the art, the technical solution of the present invention will be described in detail below with reference to fig. 1 to 7:

the utility model comprises a supporting platform 1, a material box placing device 2, a clamping frame device 5, a wafer mounting device 6 and a material pushing device 7, wherein the supporting platform 1 provides a working platform and further supports each device, the material box placing device 2 is provided with two material boxes which are distributed up and down, the lower layer is provided with a plurality of empty material boxes which are convenient for the clamping frame device 5 to clamp and place wafers, the upper layer is used for conveying the material boxes filled with materials, and the conveying directions of the two materials are opposite; the clamping frame device 5 can clamp and support the material box in the material box placing device 2 at the lower layer, the wafer mounting device 6 is used for mounting a wafer and heating and deforming the deformed wafer film, the pushing device 7 can push the wafer on the wafer mounting device 6 into the material box clamped on the clamping frame device 5 until the material box is filled with the wafer, and then the material box filled with the wafer is placed on the material box placing device 2 at the upper layer through the clamping frame device 5 for conveying, so that the material box is convenient for people to use, does not need to directly contact the wafer manually, and reduces pollution caused by contact; in order to enable the frame clamping device 5 to better clamp the material boxes on the material box placing device 2 on the lower layer or better place the material boxes filled with the materials on the material box placing device 2 on the upper layer, the frame clamping device 5 is arranged on the Z-axis moving device 4, and the Z-axis moving device 4 is arranged on the Y-axis moving device 3, so that the frame clamping device 5 can move in the direction of Y, Z according to the positions of the material boxes, the adaptability is stronger, and the material boxes can be better clamped; further, the Y-axis moving device 3 includes a first linear module, and the Z-axis moving device 4 includes a second linear module; when in work: firstly, the Y-axis moving device 3 and the Z-axis moving device 4 move the clamping frame device 5 in the Y direction and the Z direction to move the clamping frame device to one side of the lower material box placing device 2 and then clamp an empty material box, then move the clamping frame device to one side of the wafer mounting device 6 to facilitate the feeding of a wafer, then the pushing device 7 pushes the wafer into the material box on the clamping frame device 5, the process is repeated until the material box is filled with the material, and then the Y-axis moving device 3 and the Z-axis moving device 4 are continuously controlled to enable the clamping frame device 5 to place the material box filled with the material on the clamping frame device 5 on the upper material box placing device 2 and then convey the material box away; the structure of the magazine placing device 2, the clamping frame device 5, the wafer mounting device 6 and the pushing device 7 will be described in detail below:

the material box placing device 2 comprises a material box conveying mechanism 21, support rods 22 arranged on the periphery below the material box conveying mechanism 21, stop blocks 23 arranged on the periphery above the material box conveying mechanism 21 and a baffle plate 24 arranged on one side above the material box conveying mechanism 21; the lower end of the support rod 22 is fixedly arranged on the support platform 1; the upper end of the support rod 22 is fixedly mounted at the lower end of the material box conveying mechanism 21, the stop block 23 is fixedly mounted at the upper end of the material box conveying mechanism 21, the baffle plate 24 is fixedly mounted on the material box conveying mechanism 21, the material box is placed on the material box conveying mechanism 21, the support rod 22 plays a supporting role for the material box conveying mechanism 21, and the stop block 23 and the baffle plate 24 can play a limiting role for the material box.

The frame clamping device 5 comprises a fixed block 51, first clamping jaws 52 arranged on two sides below the fixed block 51, first air cylinders 53 arranged on the fixed block 51, first push rods connected with the first air cylinders 53, pushing blocks 54 fixedly connected with the first push rods, and second clamping jaws 55 arranged on the left side and the right side above the pushing blocks 54, wherein the fixed block 51 is fixedly arranged on a second linear module, the first clamping jaws 52 are fixedly arranged on the fixed block 51, the first air cylinders 53 are fixedly arranged on the fixed block 51, and the second clamping jaws 55 are fixedly arranged on the pushing blocks 54; a sensor 56 is arranged on one side of the pushing block 54 close to the second clamping jaw 55; the first clamping jaw 52 and the second clamping jaw 55 are matched to clamp the material box, wherein the first clamping jaw 52 is kept fixed, the second clamping jaw 55 can move up and down under the action of the first cylinder 53, so that the distance between the first clamping jaw 52 and the second clamping jaw 55 can be adjusted according to the height of the material box, the material box can be clamped better, the applicability is stronger, and the material box can be used by people conveniently; the sensor 56 is mainly used for monitoring the magazine and then facilitating the clamping of the magazine by the first clamping jaw 52 and the second clamping jaw 55.

The wafer mounting device 6 comprises a mounting frame 61, pressing devices which are symmetrically arranged on two sides above the mounting frame 61, limiting columns 63 arranged on the pressing devices on the two sides, a fixing frame 64 arranged on the pressing devices, and a photoelectric sensor 65 arranged on the fixing frame 64, wherein the wafer mounting device 6 comprises the mounting frame 61; the two limiting columns 63 are arranged on the front side and the rear side of the pressing device and can limit the pressing device to a certain extent, the photoelectric sensor 65 can monitor wafers on the pressing device, and the follow-up pushing device 7 can conveniently work to push the wafers into the material box; the mounting frame 61 is fixedly mounted on the supporting platform 1, one end of each limiting column 63 is fixedly connected with the pressing device on one side, the other end of each limiting column is fixedly connected with the pressing device on the other side, two fixing frames 64 are symmetrically arranged on the mounting frame 61 in a front-back mode, the photoelectric sensors 65 on the fixing frames 64 on the two sides are symmetrically arranged, a heating platform 66 is arranged between the limiting columns on the two sides above the mounting frame 61, and the heating platform 66 can heat the wafer film mounted above the heating platform, so that the wafer film after deformation can be deformed and restored; the pressing device comprises a substrate 621, a driving wheel 622 arranged on the substrate 621, a driving motor 623 connected with the driving wheel 622, a plurality of first belt pulleys 624 connected with the driving wheel 622 through a belt, a second belt pulley 625 connected with the first belt pulleys 624 through a belt, pressing wheels 626 arranged on two sides of the substrate 621, a pressing plate 627 arranged on the substrate 621, and a width limiting plate 628 arranged above the pressing plate 627; the base plate 621 is fixedly installed on the installation frame 61, the driving motor 623 is fixedly installed on the base plate 621, the second belt pulleys 625 are provided with two parts and symmetrically arranged on the front side and the rear side of the base plate 621, the first belt pulley 624 and the second belt pulley 625 are fixedly installed on the base plate 621, and the pressing wheel 626 is tangent to the second belt pulley 625 after the belt is installed; the second belt wheel 625 can also drive the pressure wheel 626 to rotate when rotating, the pressure wheel 626 is fixedly arranged on the substrate 621, the pressure plate 627 is arranged between the second belt wheels 625 on two sides and is fixedly arranged on the substrate 621, the second belt wheels 625 on two sides penetrate through the pressure plate 627 through a belt to be connected, the width limiting plate 628 is fixedly arranged on the substrate 621 and has a gap with the pressure plate 627, the wafer is arranged above the belt and below the width limiting plate 628, the gap is larger than the sum of the thicknesses of the belt and the wafer, and the numerical value is about 2-3mm, so that the wafer can be well clamped in the gap, the wafer cannot deviate in the moving process, and the wafer can be conveniently and stably dropped onto a material box in the follow-up process; the driving wheel 622 can rotate under the action of the driving motor 623, the driving wheel 622 can drive the first belt pulley 624 and the second belt pulley 625 to rotate through a belt when rotating, and then the wafer can be clamped between the pressure plate 627 and the width limiting plate 628 and then slowly moves under the action of the second belt pulley 625.

The pushing device 7 is mounted on the substrate 621 on the pressing device on one side, the pushing device 7 comprises a fixing plate 71, a belt synchronous conveying mechanism arranged on the fixing plate 71, a pushing mechanism arranged on the belt conveying mechanism, and a sliding rail 74 arranged on the fixing plate 71, the fixing plate 71 is fixedly mounted on the side surface of the substrate 621, and the pushing mechanism is slidably mounted on the sliding rail 74; the belt synchronous conveying mechanism comprises a stepping motor 721, a first synchronous wheel 722 connected with the stepping motor 721 and a second synchronous wheel 723 connected with the first synchronous wheel 722 through a synchronous belt, the stepping motor 721 is fixedly mounted on the fixing plate 71, the pushing mechanism comprises a synchronous belt pressing plate 731, an air cylinder mounting block 732 connected with the synchronous belt pressing plate 731, a second air cylinder 733 fixedly connected with the air cylinder mounting block 732, a second push rod 734 connected with the second air cylinder 733, a shifting piece 735 connected with the second push rod 734 and a sliding block 736 arranged on one side, far away from the second air cylinder 733, of the air cylinder mounting block 732; the synchronous belt pressing plate 731 is mounted on a synchronous belt on the belt synchronous conveying mechanism, the cylinder mounting block 732 is arranged below the synchronous belt and fixedly connected with the synchronous belt, the second cylinder 733 is arranged on one side of the cylinder mounting block 732 close to the wafer, the second push rod 734 is arranged below the second cylinder 733, the poking piece 735 is arranged in front of the second push rod 734, and the sliding block 736 is fixedly connected with the cylinder mounting block 732 and slidably mounted on the sliding rail 74; according to the position of the wafer, the belt synchronous conveying mechanism works to drive the pushing mechanism arranged on the belt synchronous conveying mechanism to move, so that the wafer is stably pushed into the material box on the clamping frame device, and preferably, the pushing mechanism can stably move on the sliding rail 74 through the sliding block 736 on the pushing mechanism, so that the wafer is conveniently pushed into the material box; thereby pushing mechanism can be according to the height of placing height adjustment plectrum 735 of wafer wherein, the plectrum 735 of being convenient for on it can push away the wafer to the magazine better in, and the suitability is stronger, and the people of being convenient for use.

Above-mentioned technical scheme has only embodied the utility model discloses technical scheme's preferred technical scheme, some changes that this technical field's technical personnel probably made to some parts wherein have all embodied the utility model discloses a principle belongs to within the protection scope of the utility model.

Claims

1. The utility model provides a unloading mechanism is carried to wafer, includes supporting platform (1), its characterized in that still includes:

the material box placing device (2) is arranged on the supporting platform (1) and used for placing material boxes in order;

the Y-axis moving device (3) is arranged on the supporting platform (1) and is used for controlling the movement in the Y direction;

a Z-axis moving device (4) which is arranged on the Y-axis moving device (3) and is used for controlling the movement in the Z direction;

the clamping frame device (5) is arranged on the Z-axis moving device (4) and used for containing the blanked wafer;

the wafer mounting device (6) is arranged on the supporting platform (1) and used for placing a wafer;

and the pushing device (7) is arranged on the wafer mounting device (6) and is used for pushing the wafer on the wafer mounting device (6).

2. The wafer conveying and blanking mechanism as recited in claim 1, wherein the two magazine placement devices (2) are distributed vertically and comprise a magazine conveying mechanism (21), a support rod (22) arranged around the lower part of the magazine conveying mechanism (21), a stop block (23) arranged around the upper part of the magazine conveying mechanism (21), and a baffle plate (24) arranged on one side of the upper part of the magazine conveying mechanism (21); the lower end of the supporting rod (22) is fixedly arranged on the supporting platform (1); the upper end of the support rod (22) is fixedly arranged at the lower end of the material box conveying mechanism (21), the stop block (23) is fixedly arranged at the upper end of the material box conveying mechanism (21), and the baffle plate (24) is fixedly arranged on the material box conveying mechanism (21).

3. The wafer conveying and blanking mechanism of claim 2, wherein the Y-axis moving device (3) comprises a first linear module.

4. The wafer conveying and blanking mechanism according to claim 3, wherein the Z-axis moving device (4) comprises a second linear module, and the Z-axis moving device (4) is fixedly mounted on the Y-axis moving device (3).

5. The wafer conveying and blanking mechanism according to claim 4, wherein the frame clamping device (5) comprises a fixed block (51), first clamping jaws (52) arranged on two sides below the fixed block (51), a first air cylinder (53) arranged on the fixed block (51), a first push rod connected with the first air cylinder (53), a pushing block (54) fixedly connected with the first push rod, and second clamping jaws (55) arranged on the left side and the right side above the pushing block (54), the fixed block (51) is fixedly arranged on the second linear module, the first clamping jaws (52) are fixedly arranged on the fixed block (51), the first air cylinder (53) is fixedly arranged on the fixed block (51), and the second clamping jaws (55) are fixedly arranged on the pushing block (54); a sensor (56) is arranged on one side of the pushing block (54) close to the second clamping jaw (55).

6. The wafer conveying and blanking mechanism according to claim 4, wherein the wafer mounting device (6) comprises a mounting frame (61), pressing devices symmetrically arranged on two sides above the mounting frame (61), limiting columns (63) arranged on the pressing devices on the two sides, a fixing frame (64) arranged on the pressing devices, and a photoelectric sensor (65) arranged on the fixing frame (64); the mounting frame (61) is fixedly mounted on the supporting platform (1), one end of the limiting column (63) is fixedly connected with the pressing device on one side, the other end of the limiting column is fixedly connected with the pressing device on the other side, the two fixing frames (64) are symmetrically arranged on the mounting frame (61) in the front-back direction, and the photoelectric sensors (65) on the fixing frames (64) on the two sides are symmetrically arranged; and a heating platform (66) is arranged between the limiting columns on the two sides above the mounting rack (61).

7. The wafer conveying and blanking mechanism of claim 6, wherein the pressing device comprises a substrate (621), a driving wheel (622) arranged on the substrate (621), a driving motor (623) connected with the driving wheel (622), a plurality of first belt pulleys (624) connected with the driving wheel (622) through a belt, a second belt pulley (625) connected with the first belt pulley (624) through a belt, pressing wheels (626) arranged on two sides of the substrate (621), a pressing plate (627) arranged on the substrate (621), and a width limiting plate (628) arranged above the pressing plate (627); the base plate (621) is fixedly arranged on the mounting frame (61), the driving motor (623) is fixedly arranged on the base plate (621), the second belt pulleys (625) are arranged at the front side and the rear side of the base plate (621) in two and symmetrically mode, the first belt pulley (624) and the second belt pulley (625) are fixedly arranged on the base plate (621), and the pressing wheel (626) is tangent to the second belt pulley (625) after the belt is installed; the pressing wheel (626) is fixedly installed on the substrate (621), the pressing plate (627) is arranged between the second belt wheels (625) on the two sides and is fixedly installed on the substrate (621), the width limiting plate (628) is fixedly installed on the substrate (621) and has a gap with the pressing plate (627), and the gap is larger than the sum of the thicknesses of the belt and the wafer.

8. The wafer conveying and blanking mechanism according to claim 7, wherein the material pushing device (7) is mounted on a substrate (621) of the pressing device on one side, the material pushing device (7) includes a fixing plate (71), a belt synchronous conveying mechanism disposed on the fixing plate (71), a pushing mechanism disposed on the belt conveying mechanism, and a sliding rail (74) disposed on the fixing plate (71), the fixing plate (71) is fixedly mounted on a side surface of the substrate (621), and the pushing mechanism is slidably mounted on the sliding rail (74).

9. The wafer conveying and blanking mechanism of claim 8, wherein the belt synchronous conveying mechanism comprises a stepping motor (721), a first synchronizing wheel (722) connected with the stepping motor (721), and a second synchronizing wheel (723) connected with the first synchronizing wheel (722) through a synchronous belt, and the stepping motor (721) is fixedly mounted on the fixing plate (71).

10. The wafer conveying and blanking mechanism of claim 9, wherein the pushing mechanism comprises a synchronous belt pressing plate (731), a cylinder mounting block (732) connected with the synchronous belt pressing plate (731), a second cylinder (733) fixedly connected with the cylinder mounting block (732), a second push rod (734) connected with the second cylinder (733), a shifting piece (735) connected with the second push rod (734), and a sliding block (736) arranged on one side of the cylinder mounting block (732) far away from the second cylinder (733); the synchronous belt pressing plate (731) is installed on a synchronous belt on a belt synchronous conveying mechanism, the air cylinder installation block (732) is arranged below the synchronous belt and fixedly connected with the synchronous belt, the second air cylinder (733) is arranged on one side, close to a wafer, of the air cylinder installation block (732), the second push rod (734) is arranged below the second air cylinder (733), the poking piece (735) is arranged in front of the second push rod (734), and the sliding block (736) is fixedly connected with the air cylinder installation block (732) and slidably installed on the sliding rail (74).