CN117594510A - Wafer conveying device with accurate positioning - Google Patents
Wafer conveying device with accurate positioning Download PDFInfo
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- CN117594510A CN117594510A CN202311588223.XA CN202311588223A CN117594510A CN 117594510 A CN117594510 A CN 117594510A CN 202311588223 A CN202311588223 A CN 202311588223A CN 117594510 A CN117594510 A CN 117594510A
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- fixedly connected
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- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 238000003825 pressing Methods 0.000 claims description 17
- 238000001125 extrusion Methods 0.000 claims description 15
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 73
- 230000009471 action Effects 0.000 description 12
- 238000009713 electroplating Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of semiconductors, in particular to a wafer conveying device with accurate positioning, which comprises a base and a first motor fixedly connected to the side wall of the base, wherein a first gear fixedly connected to the output end of the first motor is rotatably arranged in the base, a connecting rod is rotatably arranged in the base, the outer wall of one end of the connecting rod positioned in the base is fixedly connected with another first gear meshed with the first gear, the other end of the connecting rod is fixedly connected with a fixing frame, a second motor is fixedly connected in the fixing frame, the output end of the second motor is fixedly connected with a first air pump, the bottom end of the first air pump is connected with a push rod, and the bottom end of the push rod is provided with a clamping mechanism. According to the wafer conveying device with accurate positioning, through the transmission of the sliding frames, the connecting shafts, the connecting plates and the rotating columns, the distances of the four sliding frames moving inwards are the same, wafer bodies with different sizes can be automatically clamped, deflection caused by the change of the elastic force of a spring on one side can be avoided, and the clamping and positioning are accurate.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer conveying device with accurate positioning.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, the original material of the wafer is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, and then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon. Silicon wafers are formed after grinding, polishing and slicing of silicon ingots, and electroplating is a common method for forming films on wafers in the manufacturing process of semiconductor chips.
In the prior art, when electroplating the wafer, the wafer needs to be transported to the electroplating liquid for electroplating, but when clamping the wafer, the wafer cannot be clamped in different sizes, if the wafer is clamped in different sizes by adjusting the position of the clamping plate, the moving distance of the clamping plate needs to be set in advance, otherwise, the wafer is possibly damaged due to overlarge clamping force, the process is complicated, if the wafer in different sizes is clamped by the elastic force of the spring, the position of the wafer is easily shifted, and the placement of the wafer in the subsequent process is influenced, so that the technician needs to readjust the position where the wafer is placed, the wafer can be located at the corresponding placement position, the overall efficiency of wafer processing is reduced, and if the movement speed of the transfer device is too fast, the wafer is suddenly stopped, the wafer can shake, the wafer can collide with the clamping plate, and the wafer is damaged to a certain extent.
Disclosure of Invention
In order to solve the above problems, the present invention provides a wafer conveying device with accurate positioning.
The wafer conveying device comprises a base and a first motor fixedly connected to the side wall of the base, wherein a placing table is arranged on one side of the base, a wafer body is placed at the top end of the placing table, a first gear fixedly connected to the output end of the first motor is rotatably arranged in the base, a connecting rod is rotatably arranged in the base, the outer wall of one end of the connecting rod, which is positioned in the base, is fixedly connected with another first gear which is meshed with the first gear, the other end of the connecting rod is fixedly connected with a fixing frame, a second motor is fixedly connected in the fixing frame, a first air pump is fixedly connected to the output end of the second motor, a push rod is connected to the bottom end of the first air pump, and a clamping mechanism is arranged at the bottom end of the push rod;
the clamping mechanism comprises a fixed block fixedly connected to the bottom end of the push rod, a second air pump is fixedly connected to the top end of the fixed block, a round groove is formed in the lower surface of the clamping mechanism, a push column is movably inserted into the fixed block at the bottom end of the second air pump, a movable frame is fixedly connected to the bottom end of the push column and arranged in the fixed block in a sliding mode, an inserting rod is fixedly connected to the bottom end of the movable frame, four sliding frames are clamped at the lower side of the movable frame, the sliding frames are slidably arranged in the fixed block, a first spring is fixedly connected between one side wall of each sliding frame and the fixed block, a clamping block is fixedly connected to the inner side of the bottom end of each sliding frame, the clamping block is located in the round groove, a connecting frame is fixedly connected to one side wall of each sliding frame, a rotating column is rotatably arranged in the inner center of the fixed block, a connecting plate is fixedly connected to the outer wall of each rotating column, a connecting frame is sleeved outside each connecting frame, a connecting shaft is connected between each connecting frame and each connecting plate, and each connecting shaft is arranged in each rotating column.
As a further description of the above technical solution: the anti-shaking mechanism comprises a loop bar fixedly connected in a fixed block, a sliding bar is movably inserted in the loop bar, a second spring is fixedly connected between one end of the sliding bar and the loop bar, a pressing block is fixedly connected to one end of the sliding bar, which is close to a rotating column, a stop block is clamped at the bottom end of the sliding bar, the stop block is movably inserted in the loop bar, a third spring is fixedly connected between the bottom end of the stop block and the sliding bar, one inner wall of the clamping block is movably inserted with a squeezing bar, the other end of the squeezing bar is movably inserted in a sliding frame, a fourth spring is fixedly connected between the inner end of the squeezing bar and the sliding frame, the second gear is rotatably arranged in the sliding frame, a pull rope is wound on the outer wall of the central shaft of the second gear, the other end of the pull rope is fixedly connected to the bottom end of the stop block, a sliding block is movably inserted on the outer wall of the lower side of the rotating column, a sliding plate is arranged in the rotating column, a fifth spring is fixedly connected between the upper end of the sliding plate and the rotating column, a sliding plate is fixedly connected to the bottom end of the annular plate, the annular plate is arranged in the sliding plate, the sliding plate is fixedly connected to the sliding plate is arranged between the sliding plate and the rotating column, and the movable plug-in the sliding plate.
As a further description of the above technical solution: the sliding frames are four, and the four sliding frames are distributed at equal intervals in an annular shape relative to the rotating column.
As a further description of the above technical solution: the connecting plates are four, and the four connecting plates are distributed at equal intervals in annular steps relative to the rotating column.
As a further description of the above technical solution: the upper surface of the pressing block is provided with a plurality of straight slot holes which are distributed at equal intervals.
As a further description of the above technical solution: the inserted columns are arranged in a plurality, and the inserted columns are distributed in an annular equidistant mode.
As a further description of the above technical solution: the sliding blocks are arranged in four, the four sliding blocks are distributed in an annular equidistant mode, and inclined planes are formed at adjacent ends of the adjacent sliding blocks.
The invention provides a wafer conveying device with accurate positioning through improvement, and compared with the prior art, the wafer conveying device has the following improvement and advantages:
the method comprises the following steps: when the wafer body is required to be transported into the electroplating pool, the first motor is started firstly, the fixed block is rotated to be right above the wafer body through the connecting rod, then the first air pump is started, the wafer body falls to the outer side of the wafer body, the wafer body is positioned in the fixed block, then the second air pump is started, the push column drives the movable frame to move upwards, the movable frame moves inwards, the distances of the movable frames to move inwards are the same through the transmission of the movable frames, the connecting shafts, the connecting plates and the rotating columns, the wafer bodies with different sizes can be automatically clamped, the distances of the movable frames to move inwards are the same, the position of the wafer is not offset, and the influence on the placement of the wafer in the subsequent process is prevented, so that a technician does not need to set the moving distance of the clamping block in advance, and the overall efficiency of wafer processing is improved;
and two,: before the side wall of the wafer body is clamped by the four clamping blocks, the extrusion rod is extruded inwards by the outer wall of the wafer body, the stop block is pulled downwards through the transmission of the extrusion rod, the second gear, the pull rope and the stop block, so that the stop block is separated from the sliding rod, the sliding rod and the press block move towards the slide block under the action of the elastic force of the second spring, the slide block is extruded inwards by the press block, the slide plate moves downwards under the action of the fifth spring, the annular plate and the inserted column are driven to move downwards, under the action of the fifth spring, the four slide blocks move inwards, when the inserted column rotates downwards, and after the inserted column is positioned in the straight slot hole, the self-locking is completed, the rotating column cannot rotate any more, the slide frame cannot rotate again, and damage to the wafer body due to shaking of the slide frame and the fact that the rotating speed is too fast or suddenly stops in the transferring process is prevented;
to sum up, through the transmission of carriage, even axle, link plate and swivel post for four carriage are the same to the distance that the inboard moved, can carry out the centre gripping with not unidimensional wafer body voluntarily, and can not appear shifting because the spring force of certain one side changes, and the centre gripping location is accurate, through preventing shaking the mechanism, prevent to shake at the transportation in-process, because of rotational speed too fast or stop suddenly leading to carriage and wafer body, cause the damage to the wafer body.
Drawings
The invention is further explained below with reference to the drawings and examples:
fig. 1 is a schematic structural diagram of a wafer conveying device with accurate positioning according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first gear according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a fixing block according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a sliding frame according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a mobile frame according to an embodiment of the present invention;
fig. 6 is a schematic structural view of a rotary column according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of an anti-shake mechanism according to an embodiment of the present invention;
fig. 8 is a schematic structural view of a sliding rod according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a slider according to an embodiment of the present invention;
FIG. 10 is a schematic view of a skateboard according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of a sixth spring according to an embodiment of the present invention.
In the figure: 1. a base; 2. a first motor; 3. a placement table; 4. a wafer body; 5. a connecting rod; 6. a fixing frame; 7. a second motor; 8. a first air pump; 9. a push rod; 10. a clamping mechanism; 101. a fixed block; 102. a second air pump; 103. a circular groove; 104. clamping blocks; 105. pushing a column; 106. a moving rack; 107. a rod; 108. a carriage; 109. a first spring; 1010. a connecting frame; 1011. a rotating column; 1012. a connecting plate; 1013. a connecting shaft; 11. a first gear; 12. an anti-shake mechanism; 121. a loop bar; 122. a slide bar; 123. briquetting; 124. a second spring; 125. a stop block; 126. a third spring; 127. a pull rope; 128. a second gear; 129. a fourth spring; 1210. an extrusion rod; 1211. a straight slot; 1212. a slide block; 1213. inserting a column; 1214. a slide plate; 1215. a fifth spring; 1216. an annular plate; 1217. and a sixth spring.
Detailed Description
The invention is further described with reference to the following detailed drawings in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the implementation of the invention easy to understand. It should be noted that, without conflict, the embodiments and features of the embodiments in the present application may be combined with each other.
Referring to fig. 1 to 11, the embodiment of the present invention provides a technical solution: the wafer conveying device comprises a base 1 and a first motor 2 fixedly connected to the side wall of the base 1, wherein a placing table 3 is arranged on one side of the base 1, a wafer body 4 is placed at the top end of the placing table 3, a first gear 11 fixedly connected to the output end of the first motor 2 is rotationally arranged in the base 1, a connecting rod 5 is rotationally arranged in the base 1, another first gear 11 meshed and connected with the first gear 11 is fixedly connected to the outer wall of one end of the connecting rod 5 in the base 1, a fixing frame 6 is fixedly connected to the other end of the connecting rod 5, a second motor 7 is fixedly connected to the fixing frame 6, a first air pump 8 is fixedly connected to the output end of the second motor 7, a push rod 9 is connected to the bottom end of the first air pump 8, and a clamping mechanism 10 is arranged at the bottom end of the push rod 9;
the clamping mechanism 10 comprises a fixed block 101 fixedly connected with the bottom end of the push rod 9, a second air pump 102 is fixedly connected with the top end of the fixed block 101, a round groove 103 is formed in the lower surface of the clamping mechanism 10, a push column 105 is movably inserted into the fixed block 101 at the bottom end of the second air pump 102, a movable frame 106 which is arranged in the fixed block 101 in a sliding manner is fixedly connected with the bottom end of the push column 105, an inserting rod 107 is fixedly connected with the bottom end of the movable frame 106, four sliding frames 108 are clamped at the lower side of the movable frame 106, the sliding frames 108 are arranged in the fixed block 101 in a sliding manner, a first spring 109 is fixedly connected between one side wall of the sliding frame 108 and the fixed block 101, a clamping block 104 is fixedly connected with the inner side of the bottom end of the sliding frame 108, and clamp splice 104 is located circular slot 103, and carriage 108 a side wall rigid coupling has even frame 1010, and even frame 1010 slides and set up in fixed block 101, and fixed block 101 inside center department rotates and is provided with the rotor post 1011, and rotor post 1011 outer wall rigid coupling has even board 1012, and even board 1012 outside cover is equipped with even frame 1010, is connected with even axle 1013 between even frame 1010 and the even board 1012, is equipped with in the rotor post 1011 and prevents shaking mechanism 12, and carriage 108 is equipped with four, and four carriage 108 are annular equidistant distribution about rotor post 1011, even board 1012 is equipped with four, and four even boards 1012 are annular ladder equidistant distribution about rotor post 1011.
Specifically, when the wafer body 4 needs to be transferred into the electroplating pool, the first motor 2 is started firstly, the fixed block 101 is rotated to be right above the wafer body 4 through the connecting rod 5, then the first air pump 8 is started, the fixed block 101 falls to the outer side of the wafer body 4, the wafer body 4 is positioned in the fixed block 101, then the second air pump 102 is started, the push column 105 drives the movable frame 106 to move upwards, the movable frame 108 moves inwards, and the distance that the four movable frames 108 move inwards is the same through the transmission of the movable frame 108, the connecting shaft 1013, the connecting plate 1012 and the rotating column 1011.
In still another embodiment of the present invention, the anti-shake mechanism 12 includes a sleeve rod 121 fixedly connected in the fixed block 101, a sliding rod 122 is movably inserted in the sleeve rod 121, a second spring 124 is fixedly connected between one end of the sliding rod 122 and the sleeve rod 121, a pressing block 123 is fixedly connected at one end of the sliding rod 122 near the rotating column 1011, a stop block 125 is clamped at the bottom end of the sliding rod 122, the stop block 125 is movably inserted in the sleeve rod 121, a third spring 126 is fixedly connected between the bottom end of the stop block 125 and the sliding rod 122, an extrusion rod 1210 is movably inserted in the inner wall of one of the clamping blocks 104, the other end of the extrusion rod 1210 is movably inserted in the sliding frame 108, a fourth spring 129 is fixedly connected between the inner end of the extrusion rod 1210 and the sliding frame 108, a second gear 128 is engaged and connected to the upper side of one end of the extrusion rod 1210 in the sliding frame 108, the second gear 128 is rotatably arranged in the sliding frame 108, a pull rope 127 is wound around the central shaft outer wall of the second gear 128, the other end of the stay cord 127 is fixedly connected to the bottom end of the stop block 125, a sliding block 1212 is movably inserted into the outer wall of the lower side of the rotating column 1011, a sliding plate 1214 is slidably arranged on the upper side of the sliding block 1212 and fixedly connected with a fifth spring 1215 between the upper end of the sliding plate 1214 and the rotating column 1011, an annular plate 1216 is fixedly connected to the bottom end of the sliding plate 1214 and fixedly connected with a sixth spring 1217 between one side wall of the bottom end of the sliding block 1212 and the rotating column 1011, an inserting column 1213 is fixedly connected to the bottom end of the annular plate 1216 and movably inserted into the rotating column 1011, a plurality of straight slot holes 1211 are formed in the upper surface of the pressing block 123, the plurality of straight slot holes 1211 are distributed at equal intervals, a plurality of inserting columns 1213 are distributed at equal intervals in a ring shape, four sliding blocks 1212 are distributed at equal intervals, and inclined planes are formed at the adjacent ends of the adjacent sliding blocks 1212.
Specifically, before the four clamping blocks 104 clamp the side wall of the wafer body 4, the extrusion rod 1210 is extruded inwards by the outer wall of the wafer body 4, the stop 125 is pulled downwards by the transmission of the extrusion rod 1210, the second gear 128, the pull rope 127 and the stop 125, so that the stop 125 is separated from the sliding rod 122, the sliding rod 122 and the pressing block 123 move towards the sliding block 1212 under the elastic force of the second spring 124, then the pressing block 123 extrudes the sliding block 1212 inwards, then the sliding plate 1214 moves downwards under the action of the fifth spring 1215, so as to drive the annular plate 1216 and the inserting column 1213 to move downwards, under the action of the sixth spring 1217, the four sliding blocks 1212 move inwards, when the inserting column 1213 moves downwards while rotating, after the inserting column 1213 is positioned in the straight slot 1211, the self-locking is completed, the rotating column 1011 can not rotate again, the sliding frame 108 can not rotate again be limited, and in the transferring process is prevented, the sliding frame 108 and the wafer body 4 are rocked due to too fast or sudden stopping of the rotation speed, damage is caused to the wafer body 4, after the wafer body 4 is positioned in the electroplating tank, the second motor 7 is started, so that the surface of the wafer body 4 can be electroplated more uniformly, when the electroplated wafer body 4 needs to be placed, the second air pump 102 is started, the push column 105 drives the moving frame 106 and the insert rod 107 to move downwards, the insert rod 107 presses the sliding block 1212 outwards, the sliding plate 1214 is pressed upwards, the insert column 1213 moves upwards, the pressing block 123 moves outwards, the insert column 1213 is separated from the straight slot 1211, the self-locking is released, the pressing block 123 is pressed into place, the moving frame 106 presses the sliding frame 108 to the outside, the clamping block 104 and the wafer body 4 are not pressed any more, the wafer body 4 is loosened, the push rod 1210 moves outwards under the action of the fourth spring 129, under the action of the third spring 126, the stopper 125 is re-engaged in the sliding rod 122, and the sliding block 1212 is provided with a slope to prevent the pressing block 123 from rubbing against both ends of the sliding block 1212 when moving inward.
Working principle: when the wafer body 4 needs to be transferred into the electroplating pool, the first motor 2 is started firstly, the fixed block 101 is rotated to be right above the wafer body 4 through the connecting rod 5, then the first air pump 8 is started, the fixed block 101 is dropped to the outer side of the wafer body 4, the wafer body 4 is positioned in the fixed block 101, then the second air pump 102 is started, the push column 105 drives the movable frame 106 to move upwards, the sliding frame 108 moves inwards, the distance for moving inwards of the four sliding frames 108 is the same through the transmission of the sliding frame 108, the connecting shaft 1013, the connecting plate 1012 and the rotating column 1011, when the four clamping blocks 104 clamp the side wall of the wafer body 4, the extrusion rod 1210 is extruded inwards by the outer wall of the wafer body 4, the stop 125 is pulled downwards through the transmission of the extrusion rod 1210, the second gear 128, the pull rope 127 and the stop 125, the stop 125 is separated from the sliding rod 122, under the action of the elastic force of the second spring 124, the sliding rod 122 and the pressing block 123 move towards the sliding block 1212, the pressing block 123 presses the sliding block 1212 inwards, the sliding plate 1214 moves downwards under the action of the fifth spring 1215, the annular plate 1216 and the inserting posts 1213 are driven to move downwards, under the action of the sixth spring 1217, the four sliding blocks 1212 move inwards, when the inserting posts 1213 move downwards while rotating, after the inserting posts 1213 are positioned in the straight slot 1211, the self-locking is completed, the rotating posts 1011 can not rotate any more, the sliding frame 108 can not rotate any more, the shaking of the sliding frame 108 and the wafer body 4 caused by too fast or abrupt stopping of the rotating speed in the transferring process is prevented, the wafer body 4 is damaged, after the wafer body 4 is positioned in the electroplating tank, the second motor 7 is started, the surface of the wafer body 4 can be electroplated more uniformly, when the electroplated wafer body 4 needs to be placed, the second air pump 102 is started, the push column 105 drives the movable frame 106 and the insert rod 107 to move downwards, then the insert rod 107 presses the sliding block 1212 to the outer side, the sliding plate 1214 is pressed upwards, the insert column 1213 moves upwards, the pressing block 123 moves outwards, then the insert column 1213 is separated from the straight slot 1211, the self-locking is released, the pressing block 123 is pressed to the original position, then the movable frame 106 presses the sliding frame 108 to the outer side, the clamping block 104 and the wafer body 4 are not abutted any more, the wafer body 4 is loosened, the pressing rod 1210 moves outwards under the action of the fourth spring 129, then the stop block 125 is clamped in the sliding rod 122 again under the action of the third spring 126, and the inclined surface is formed on the sliding block 1212 so as to prevent the pressing block 123 from rubbing with the two ends of the sliding block 1212 when moving inwards.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the foregoing embodiments, and that the foregoing embodiments and description are merely illustrative of the principles of this invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, and these changes and modifications fall within the scope of the invention as hereinafter claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a wafer conveyer of accurate location, includes base (1) and rigid coupling in first motor (2) of base (1) lateral wall, its characterized in that: the wafer processing device comprises a base (1), and is characterized in that a placing table (3) is arranged on one side of the base (1), a wafer body (4) is placed on the top end of the placing table (3), a first gear (11) fixedly connected to the output end of a first motor (2) is rotationally arranged in the base (1), a connecting rod (5) is rotationally arranged in the base (1), another first gear (11) meshed with the first gear (11) is fixedly connected to the outer wall of one end of the connecting rod (5) in the base (1), a fixing frame (6) is fixedly connected to the other end of the connecting rod (5), a second motor (7) is fixedly connected in the fixing frame (6), a first air pump (8) is fixedly connected to the output end of the second motor (7), a push rod (9) is connected to the bottom end of the first air pump (8), and a clamping mechanism (10) is arranged at the bottom end of the push rod (9).
The clamping mechanism (10) comprises a fixed block (101) fixedly connected to the bottom end of the push rod (9), a second air pump (102) is fixedly connected to the top end of the fixed block (101), a round groove (103) is formed in the lower surface of the clamping mechanism (10), a push column (105) is movably inserted into the fixed block (101) at the bottom end of the second air pump (102), a movable frame (106) fixedly connected to the bottom end of the push column (105) in a sliding manner is arranged in the fixed block (101), an inserting rod (107) is fixedly connected to the bottom end of the movable frame (106), four sliding frames (108) are clamped on the lower side of the movable frame (106), a first spring (109) is fixedly connected between one side wall of the sliding frame (108) and the fixed block (101), a clamping block (104) is fixedly connected to the inner side of the bottom end of the sliding frame (108), a connecting frame (1010) is fixedly connected to one side wall of the sliding frame (1010) and is arranged in the round groove (103), a rotating plate (1011) is fixedly connected to the inner side wall of the sliding frame (1010), a connecting shaft (1013) is connected between the connecting frame (1010) and the connecting plate (1012), and an anti-shaking mechanism (12) is arranged in the rotating column (1011).
2. The precisely positioned wafer transfer device of claim 1, wherein: the anti-shaking mechanism (12) comprises a sleeve rod (121) fixedly connected in a fixed block (101), a sliding rod (122) is movably inserted in the sleeve rod (121), a second spring (124) is fixedly connected between one end of the sliding rod (122) and the sleeve rod (121), a pressing block (123) is fixedly connected at one end of the sliding rod (122) close to a rotating column (1011), a stop block (125) is clamped at the bottom end of the sliding rod (122), the stop block (125) is movably inserted in the sleeve rod (121), a third spring (126) is fixedly connected between the bottom end of the stop block (125) and the sliding rod (122), one inner wall of the clamping block (104) is movably inserted with an extrusion rod (1210), the other end of the extrusion rod (1210) is movably inserted in a sliding frame (108), a fourth spring (129) is fixedly connected between the inner end of the extrusion rod (1210) and the sliding frame (108), a second gear (128) is meshed and connected at the upper side of one end of the extrusion rod (1210) located in the sliding frame (108), the second gear (128) is rotatably arranged in the sliding frame (108), a central shaft (127) is wound on the outer wall of the sliding rod (127), the other end of the sliding rod (127) is fixedly connected with the rotating column, the sliding block (1212) is provided with a sliding plate (1214) in a sliding manner on the upper side of the rotating column (1011), a fifth spring (1215) is fixedly connected between the upper end of the sliding plate (1214) and the rotating column (1011), an annular plate (1216) is fixedly connected at the bottom end of the sliding plate (1214), the annular plate (1216) is slidably arranged in the rotating column (1011), a sixth spring (1217) is fixedly connected between one side wall of the bottom end of the sliding block (1212) and the rotating column (1011), an inserting column (1213) is fixedly connected at the bottom end of the annular plate (1216), and the inserting column (1213) is movably inserted in the rotating column (1011).
3. The precisely positioned wafer transfer device of claim 1, wherein: the four sliding frames (108) are arranged, and the four sliding frames (108) are distributed at equal intervals in an annular shape relative to the rotating column (1011).
4. The precisely positioned wafer transfer device of claim 1, wherein: the connecting plates (1012) are provided with four, and the four connecting plates (1012) are distributed at equal intervals in an annular ladder manner relative to the rotating column (1011).
5. The precisely positioned wafer transfer device of claim 2, wherein: the upper surface of the pressing block (123) is provided with a plurality of straight slot holes (1211), and the straight slot holes (1211) are distributed at equal intervals.
6. The precisely positioned wafer transfer device of claim 2, wherein: the inserting posts (1213) are provided with a plurality of inserting posts (1213) which are distributed in an annular equidistant manner.
7. The precisely positioned wafer transfer device of claim 2, wherein: the sliding blocks (1212) are provided with four, the four sliding blocks (1212) are distributed in an annular equidistant mode, and inclined planes are formed at adjacent ends of the adjacent sliding blocks (1212).
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| CN202311588223.XA CN117594510B (en) | 2023-11-27 | 2023-11-27 | Wafer conveying device with accurate positioning |
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| CN117594510B (en) | 2024-04-16 |
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