CN215377387U - Mounting structure for semiconductor wafer - Google Patents
Mounting structure for semiconductor wafer Download PDFInfo
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- CN215377387U CN215377387U CN202121946239.XU CN202121946239U CN215377387U CN 215377387 U CN215377387 U CN 215377387U CN 202121946239 U CN202121946239 U CN 202121946239U CN 215377387 U CN215377387 U CN 215377387U
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Abstract
The utility model discloses an installation structure for a semiconductor wafer, which comprises a bearing plate and a first supporting plate fixedly connected to the bearing plate, wherein a rotating rod is rotatably connected to the first supporting plate, a gear is fixedly connected to the rotating rod, a second supporting plate is fixedly connected to the bearing plate, a sliding column is slidably connected to the second supporting plate, a rack is fixedly connected to the sliding column, the rack is meshed with the gear, a connecting block is fixedly connected to one end, away from the gear, of the rack, a supporting block is slidably connected to the connecting block, a sucking disc is fixedly connected to the supporting block, a wafer is adsorbed on the sucking disc, a bearing block is fixedly connected to the bearing plate, a placing table is placed on the bearing block, a wafer clamping groove is placed on the placing table, and a limiting mechanism for preventing the wafer from deviating is arranged on the bearing block. According to the utility model, the problem that the wafer is easy to damage during installation is solved through the matching of the structures, and the problem that the wafer is easy to deviate during installation is solved.
Description
Technical Field
The utility model relates to the technical field of mounting structures, in particular to a mounting structure for a semiconductor wafer.
Background
The wafer is a kind of silicon wafer for manufacturing semiconductor chips, which is made by pulling silicon crystal with special impurity into silicon crystal bar, grinding and cutting, the manufactured wafer will be installed in the transmission device and transported to the step machine of manufacturing each chip until the manufacturing of chips on the wafer is completed, and these devices can not be separated from the installation device of wafer.
The wafer needs to be coated with a film in the process of producing the wafer, the wafer needs to be installed in the wafer clamping groove firstly and then placed into a film coating machine for coating the film, but the wafer is fragile in texture, the wafer is easy to damage in installation, the quality of the wafer can be affected by direct hand contact, the quality of the wafer is reduced, the wafer is easy to be affected by external forces such as inertia force in the transportation process, the position of the wafer is deviated, the wafer cannot reach the next machine for processing, and therefore the wafer is not easy to damage in installation, and the installation structure for the semiconductor wafer, with the position of the wafer not prone to deviate, needs to be designed to solve the problem.
SUMMERY OF THE UTILITY MODEL
The present invention has been made to solve the problems of the related art, and an object of the present invention is to provide a mounting structure for a semiconductor wafer, which has advantages that a wafer is not easily damaged during mounting and a position of the wafer is not easily shifted during mounting.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a mounting structure that semiconductor wafer was used, includes bearing plate and the first backup pad of fixed connection on the bearing plate, it is connected with the dwang to rotate on the first backup pad, fixedly connected with gear on the dwang, fixedly connected with second backup pad on the bearing plate, sliding connection has the slip post in the second backup pad, fixedly connected with rack on the slip post, rack and gear engagement, the one end fixedly connected with connecting block of gear is kept away from to the rack, sliding connection has the supporting shoe on the connecting block, fixedly connected with sucking disc on the supporting shoe, adsorb the wafer on the sucking disc, fixedly connected with bearing block on the bearing plate, place the platform on the bearing block, place the bench and placed wafer draw-in groove, be equipped with the stop gear who prevents the wafer off tracking on the bearing block.
Preferably, the limiting mechanism comprises a fourth supporting plate, a third supporting plate is fixedly connected to the bearing block, the specific number of the third supporting plates is two, each group of the third supporting plates is fixedly connected to a telescopic rod, the telescopic rods are fixedly connected to fourth supporting plates, and the four supporting plates are respectively abutted to two sides of the placing table.
Preferably, the limiting mechanism comprises limiting rods, each group of limiting rods is fixedly connected to the fourth supporting plate, limiting rods are fixedly connected to the limiting rods, two ends of each limiting rod are respectively attached to the supporting blocks, and through grooves matched with the limiting rods are formed in the connecting blocks.
Preferably, the sliding column is fixedly connected with a first sliding block, and the second supporting plate is provided with a sliding groove matched with the first sliding block.
Preferably, the telescopic rod is sleeved with a spring, and two ends of the spring are respectively abutted against the third supporting plate and the fourth supporting plate.
Preferably, one end of the rotating rod, which is far away from the gear, is fixedly connected with a rotating block, and a handle is fixedly connected to the rotating block.
Preferably, the supporting block is fixedly connected with a second sliding block, and the connecting block is provided with a sliding groove matched with the second sliding block.
Compared with the prior art, the utility model has the following beneficial effects: the utility model achieves the effect of supporting the whole equipment by arranging the bearing plate, achieves the effect of supporting the rotating rod by arranging the first supporting plate, achieves the effect of rotating the gear by arranging the rotating rod when manually shaking the handle, achieves the effect of sliding the rack by arranging the gear, achieves the effect of supporting the sliding column by arranging the second supporting plate, achieves the effect of supporting the rack by arranging the sliding column, achieves the effect of sliding the connecting block by arranging the rack, achieves the effect of synchronous sliding of the supporting block when the connecting block slides by arranging the connecting block, achieves the effect of synchronous sliding of the sucker when the supporting block slides by arranging the supporting block, achieves the effect of adsorbing the wafer by arranging the sucker, achieves the effect of supporting the placing table and the limiting mechanism by arranging the bearing block, achieves the effect of placing the wafer clamping groove by arranging the placing table, achieves the effect of supporting the telescopic rod by arranging the third supporting plate, the effect of supporting the fourth supporting plate is achieved by arranging the telescopic rod, the effect of clamping the placing table and supporting the limiting column is achieved by arranging the fourth supporting plate, the limiting rod slides by arranging the limiting post and the connecting block abuts against the limiting post when sliding to achieve the limiting effect, the limiting rod is arranged to ensure that the fourth supporting plate moves along with the fourth supporting plate when the placing table is placed manually, thereby the limiting rod slides to achieve the effect that the supporting block slides to be in the same horizontal line with the placing table, the sliding column can slide and support the rack by arranging the sliding grooves on the first sliding block and the second supporting plate, the effect of positioning the placing table and quickly positioning the supporting block is achieved by arranging the telescopic rod and the spring, the effect of supporting the handle is achieved by arranging the rotating block, the effect of rotating the rotating rod when the handle is manually shaken is achieved by arranging the handle, and the effect that the supporting block can slide is achieved by arranging the sliding grooves formed in the second sliding block and the connecting block.
The problem that the wafer is easy to damage when being installed is solved through the matching of the structure, and the problem that the wafer is easy to deviate when being installed is solved.
Drawings
FIG. 1 is a schematic structural view of the present invention as a whole;
FIG. 2 is a schematic view of the structure of the telescopic rod and the spring of the present invention;
FIG. 3 is a schematic view of the construction of the connector block and support block of the present invention;
FIG. 4 is a schematic structural view of a stop lever and a stop post according to the present invention.
In the figure: 1. a bearing plate; 101. a first support plate; 1011. rotating the rod; 1012. rotating the block; 1013. A handle; 1014. a gear; 102. a second support plate; 1021. a sliding post; 1022. a first slider; 1023. a rack; 1024. connecting blocks; 1025. a support block; 1026. a suction cup; 1027. a second slider; 103. a bearing block; 1031. a third support plate; 1032. a telescopic rod; 1033. a spring; 1034. a fourth support plate; 1035. a limiting rod; 1036. a limiting column; 1037. and (6) placing the table.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The utility model provides a technical scheme that: the utility model provides a mounting structure that semiconductor wafer was used, including bearing plate 1 and the first backup pad 101 of fixed connection on the bearing plate 1, it is connected with dwang 1011 to rotate on the first backup pad 101, fixedly connected with gear 1014 on the dwang 1011, fixedly connected with second backup pad 102 on the bearing plate 1, sliding connection has sliding column 1021 on the second backup pad 102, fixedly connected with rack 1023 on the sliding column 1021, rack 1023 and gear 1014 meshing, rack 1023 keeps away from the one end fixedly connected with connecting block 1024 of gear 1014, sliding connection has the supporting shoe 1025 on the connecting block 1024, fixedly connected with sucking disc 1026 on the supporting shoe 1025, adsorb the wafer on the sucking disc 1026, fixedly connected with bearing block 103 on the bearing plate 1, place platform 1037 on the bearing block 103, place the wafer slot on the platform 1037, be equipped with the stop gear who prevents the wafer off tracking on the bearing block 103.
Referring to fig. 1 and 2, the effect of supporting the whole device is achieved by setting the bearing plate 1, the effect of supporting the rotating rod 1011 is achieved by setting the first supporting plate 101, the effect of rotating the gear 1014 through the rotating rod 1011 when the handle 1013 is manually shaken through setting the rotating rod 1011, the effect of sliding the rack 1023 through setting the gear 1014, the effect of supporting the sliding column 1021 through setting the second supporting plate 102, the effect of supporting the rack 1023 through setting the sliding column 1021, the effect of sliding the connecting block 1024 through setting the rack 1023, the effect of sliding the supporting block 1025 synchronously when the connecting block 1024 slides through setting the connecting block 1024, the effect of sliding the suction cup 1026 synchronously when the supporting block 1025 slides through setting the supporting block 1025, the effect of adsorbing the wafer through setting the suction cup 1026, and the effects of supporting the placing table 1037 and the limiting mechanism through setting the bearing block 103, the wafer card slot placing effect is achieved by arranging the placing table 1037.
The limiting mechanism comprises a fourth supporting plate 1034, a third supporting plate 1031 is fixedly connected to the bearing block 103, the specific number of the third supporting plates 1031 is two, a telescopic rod 1032 is fixedly connected to each group of the third supporting plates 1031, a fourth supporting plate 1034 is fixedly connected to each telescopic rod 1032, and the two groups of the fourth supporting plates 1034 are respectively abutted to two sides of the placing table 1037.
Referring to fig. 2 and 4, the effect of supporting the telescopic bar 1032 is achieved by providing the third support plate 1031, the effect of supporting the fourth support plate 1034 is achieved by providing the telescopic bar 1032, and the effect of clamping the placing table 1037 and supporting the spacing columns 1036 is achieved by providing the fourth support plate 1034.
The limiting mechanism comprises limiting rods 1035, a limiting column 1036 is fixedly connected to each group of fourth supporting plates 1034, a limiting rod 1035 is fixedly connected to each limiting column 1036, two ends of each limiting rod 1035 are respectively attached to the supporting block 1025, and a through groove matched with the limiting rods 1035 is formed in the connecting block 1024.
Referring to fig. 2 and 4, the limiting rod 1035 is arranged to slide, and the connecting block 1024 is arranged to slide to abut against the limiting rod 1036 to achieve a limiting effect, and the limiting rod 1035 is arranged to enable the fourth support plate 1034 to move when the placing table 1037 is placed manually, so that the limiting rod 1035 slides to achieve an effect that the support block 1025 slides to be located in the same horizontal line with the placing table 1037.
The sliding column 1021 is fixedly connected with a first sliding block 1022, and the second supporting plate 102 is provided with a sliding groove matched with the first sliding block 1022.
Referring to fig. 1, the sliding column 1021 can slide and support the rack 1023 by arranging the sliding grooves formed on the first sliding block 1022 and the second supporting plate 102.
A spring 1033 is sleeved on the telescopic rod 1032, and two ends of the spring 1033 respectively abut against the third support plate 1031 and the fourth support plate 1034.
Referring to fig. 2, the positioning of the placement table 1037 and the quick positioning of the support block 1025 is achieved by the arrangement of the telescoping rod 1032 and the spring 1033.
The end of the rotating rod 1011 far from the gear 1014 is fixedly connected with a rotating block 1012, and a handle 1013 is fixedly connected to the rotating block 1012.
Referring to fig. 1, the effect of supporting the handle 1013 is achieved by providing the rotation block 1012, and the effect of rotating the rotation rod 1011 when the handle 1013 is manually shaken is achieved by providing the handle 1013.
Fixedly connected with second slider 1027 on the supporting shoe 1025, seted up on the connecting block 1024 with second slider 1027 complex spout.
Referring to fig. 3, the second slider 1027 and the connecting block 1024 are disposed with a sliding slot to achieve the effect of sliding the supporting block 1025.
The working principle is as follows: when the mounting structure for the semiconductor wafer is used, the effect of supporting the whole equipment is achieved by arranging the bearing plate 1, the effect of supporting the rotating rod 1011 is achieved by arranging the first supporting plate 101, the effect of rotating the gear 1014 is achieved by arranging the rotating rod 1011 when the handle 1013 is manually shaken, the effect of sliding the rack 1023 is achieved by arranging the gear 1014, the effect of supporting the sliding column 1021 is achieved by arranging the second supporting plate 102, the effect of supporting the rack 1023 is achieved by arranging the sliding column 1021, the effect of sliding the connecting block 1024 is achieved by arranging the rack 1023, the effect of synchronously sliding the supporting block 1025 when the connecting block 1024 slides is achieved by arranging the connecting block 1024, the effect of synchronously sliding the sucking disc 1026 when the supporting block 1025 slides is achieved by arranging the sucking disc 1026, the effect of adsorbing the wafer is achieved by arranging the bearing block 103, and the effects of supporting the placing table 1037 and the limiting mechanism are achieved by arranging the bearing block 103, the wafer card slot placing effect is achieved by arranging the placing table 1037.
Reach the effect of supporting telescopic link 1032 through setting up third backup pad 1031, reach the effect of supporting fourth backup pad 1034 through setting up telescopic link 1032, reach the clamping through setting up fourth backup pad 1034 and place the platform 1037 and support the effect of spacing post 1036.
The limiting rod 1035 is arranged to slide through the limiting column 1036, the limiting rod 1035 abuts against the limiting column 1036 when the connecting block 1024 slides, the fourth supporting plate 1034 moves along with the limiting rod 1035 when the placing table 1037 is placed manually, and therefore the limiting rod 1035 slides to achieve the effect that the supporting block 1025 slides to be located in the same horizontal line with the placing table 1037.
The sliding column 1021 can slide and support the rack 1023 by arranging the sliding grooves formed in the first sliding block 1022 and the second supporting plate 102.
The positioning of the placing table 1037 and the quick positioning of the support block 1025 are achieved by the provision of the telescoping rod 1032 and the spring 1033.
The effect of supporting the handle 1013 is achieved by providing the rotation block 1012, and the effect of rotating the rotation rod 1011 when manually shaking the handle 1013 is achieved by providing the handle 1013.
The effect that the supporting block 1025 can slide is achieved by arranging the second sliding block 1027 and the sliding grooves formed in the connecting block 1024.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a mounting structure that semiconductor wafer used, includes bearing plate (1) and fixed connection first backup pad (101) on bearing plate (1), its characterized in that: the wafer-placing device is characterized in that a rotating rod (1011) is connected to the first supporting plate (101) in a rotating mode, a gear (1014) is fixedly connected to the rotating rod (1011), a second supporting plate (102) is fixedly connected to the bearing plate (1), a sliding column (1021) is connected to the second supporting plate (102) in a sliding mode, a rack (1023) is fixedly connected to the sliding column (1021), the rack (1023) is meshed with the gear (1014), a connecting block (1024) is fixedly connected to one end, far away from the gear (1014), of the rack (1023), a supporting block (1025) is connected to the connecting block (1024) in a sliding mode, a sucking disc (1026) is fixedly connected to the supporting block (1025), a wafer is adsorbed on the sucking disc (1026), a bearing block (103) is fixedly connected to the bearing plate (1), a placing table (1037) is placed on the bearing block (103), and wafer clamping grooves are placed on the placing table (1037), and the bearing block (103) is provided with a limiting mechanism for preventing the wafer from deviating.
2. A mounting structure for a semiconductor wafer as defined in claim 1, wherein: the limiting mechanism comprises a fourth supporting plate (1034), a third supporting plate (1031) is fixedly connected to the bearing block (103), the specific number of the third supporting plates (1031) is two groups, each group of the third supporting plates (1031) is fixedly connected with a telescopic rod (1032), each telescopic rod (1032) is fixedly connected with the fourth supporting plate (1034), and the four supporting plates (1034) are two groups and are respectively abutted to two sides of the placement table (1037).
3. A mounting structure for a semiconductor wafer as defined in claim 2, wherein: the limiting mechanism comprises limiting rods (1035), each group of the fourth supporting plate (1034) is fixedly connected with a limiting column (1036), each limiting column (1036) is fixedly connected with a limiting rod (1035), two ends of each limiting rod (1035) are respectively attached to the corresponding supporting block (1025), and a through groove matched with each limiting rod (1035) is formed in each connecting block (1024).
4. A mounting structure for a semiconductor wafer as defined in claim 2, wherein: a first sliding block (1022) is fixedly connected to the sliding column (1021), and a sliding groove matched with the first sliding block (1022) is formed in the second supporting plate (102).
5. A mounting structure for a semiconductor wafer as defined in claim 2, wherein: a spring (1033) is sleeved on the telescopic rod (1032), and two ends of the spring (1033) are respectively abutted against the third supporting plate (1031) and the fourth supporting plate (1034).
6. A mounting structure for a semiconductor wafer as defined in claim 1, wherein: one end of the rotating rod (1011) far away from the gear (1014) is fixedly connected with a rotating block (1012), and a handle (1013) is fixedly connected to the rotating block (1012).
7. A mounting structure for a semiconductor wafer as defined in claim 1, wherein: fixedly connected with second slider (1027) on supporting shoe (1025), set up the spout with second slider (1027) complex on connecting block (1024).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121946239.XU CN215377387U (en) | 2021-08-19 | 2021-08-19 | Mounting structure for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121946239.XU CN215377387U (en) | 2021-08-19 | 2021-08-19 | Mounting structure for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215377387U true CN215377387U (en) | 2021-12-31 |
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ID=79619059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121946239.XU Active CN215377387U (en) | 2021-08-19 | 2021-08-19 | Mounting structure for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215377387U (en) |
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2021
- 2021-08-19 CN CN202121946239.XU patent/CN215377387U/en active Active
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