CN216563070U

CN216563070U - Die bonding device for semiconductor wafer

Info

Publication number: CN216563070U
Application number: CN202123220772.0U
Authority: CN
Inventors: 陆金发
Original assignee: Xi'an Xinmei Technology Co ltd
Current assignee: Xi'an Xinmei Technology Co ltd
Priority date: 2021-12-21
Filing date: 2021-12-21
Publication date: 2022-05-17
Anticipated expiration: 2031-12-21

Abstract

The utility model discloses a semiconductor wafer die bonder, and particularly relates to the technical field of semiconductor wafer processing. According to the semiconductor wafer self-locking device, the second handle drives the worm to rotate so as to drive the semiconductor wafer to rotate, the worm and the worm wheel have a self-locking function, the worm can only drive the second U-shaped frame to rotate, the second U-shaped frame cannot rotate automatically, the structure is simple, the semiconductor wafer can be conveniently driven to rotate, the observation of workers is facilitated, and the using effect is good.

Description

Die bonding device for semiconductor wafer

Technical Field

The utility model relates to the technical field of semiconductor wafer processing, in particular to a semiconductor wafer die bonding device.

Background

Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. The main processing modes of the wafer are wafer processing and batch processing, i.e. one or more wafers are processed simultaneously. As semiconductor feature sizes become smaller and smaller, processing and measuring equipment becomes more advanced, so that new data characteristics appear in wafer processing. Semiconductor wafers need to be fixed during processing.

After the existing die bonder fixes the semiconductor wafer, the position of the semiconductor wafer is relatively determined, so that the semiconductor wafer cannot be driven to rotate, the processing condition of the semiconductor wafer needs to be observed at multiple angles when the semiconductor wafer is processed, and the using effect is poor.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a die bonding apparatus for semiconductor wafers, which solves the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme: a die bonding apparatus for semiconductor wafer comprises a first U-shaped frame, a second U-shaped frame disposed on the top of the first U-shaped frame, the second U-shaped frame is internally provided with a storage plate which is fixedly connected with the second U-shaped frame, the bottom of the object placing plate is provided with a positive and negative screw rod, the peripheral surface of the positive and negative screw rod is movably sleeved with two vertical plates, the two vertical plates are both in threaded connection with the positive and negative screw rod, two limiting grooves are arranged on the top end of the object placing plate, the top ends of the two vertical plates respectively penetrate through the two limiting grooves, the top of the object placing plate is provided with two third U-shaped frames which are respectively fixedly connected with the two vertical plates, the bottom of the second U-shaped frame is provided with a rotating shaft, the top end of the rotating shaft is fixedly connected with the bottom end of the second U-shaped frame, the rotating shaft bottom end penetrates through the first U-shaped frame, and the rotating shaft is movably connected with the first U-shaped frame through a bearing.

In a preferred embodiment, a plurality of springs are arranged inside each of the two third U-shaped frames, and the plurality of springs are fixedly connected with the two third U-shaped frames respectively.

In a preferred embodiment, two first rubber pads are arranged inside each of the two third U-shaped frames, and the four first rubber pads are fixedly connected with the plurality of springs respectively.

In a preferred embodiment, a first handle is arranged on one side of the second U-shaped frame, one end of the positive and negative screw rod penetrates through the second U-shaped frame and is fixedly connected with the first handle, and the positive and negative screw rod is movably connected with the second U-shaped frame through a bearing.

In a preferred embodiment, moving wheels are arranged on two sides of the rotating shaft, the top ends of the two moving wheels are fixedly connected with the second U-shaped frame, and the bottom ends of the two moving wheels are in contact with the top end of the first U-shaped frame.

In a preferred embodiment, a worm wheel is arranged inside the first U-shaped frame, and the top end of the worm wheel is fixedly connected with the bottom end of the rotating shaft.

In a preferred embodiment, a worm is arranged on one side of the worm wheel, the worm is meshed with the worm wheel, two ends of the worm are movably connected with the first U-shaped frame through bearings, and two second handles are fixedly sleeved on the outer peripheral surface of the worm.

In a preferred embodiment, two second rubber pads are arranged at the bottom of the first U-shaped frame, and both the two second rubber pads are fixedly connected with the first U-shaped frame.

The utility model has the technical effects and advantages that:

1. the worm is driven to rotate by the second handle, the worm is meshed with the worm wheel, so the worm drives the worm wheel to rotate, the worm wheel is fixedly connected with the rotating shaft, the rotating shaft is movably connected with the first U-shaped frame through the bearing, so the worm wheel drives the rotating shaft to rotate, the rotating shaft is fixedly connected with the second U-shaped frame, so the rotating shaft drives the second U-shaped frame to rotate, so that the semiconductor wafer is driven to rotate, the worm and the worm wheel have a self-locking function, the second U-shaped frame can only be driven to rotate by the worm, the second U-shaped frame cannot rotate independently, the structure is simple, the semiconductor wafer is conveniently driven to rotate, the observation of workers is facilitated, and the using effect is good;

2. the front and back screw rods are driven to rotate by the first handle, the two vertical plates are both in threaded connection with the front and back screw rods, the two limiting grooves limit the two vertical plates to rotate, the front and back screw rods drive the two vertical plates to move oppositely, the two third U-shaped frames are respectively fixedly connected with the two vertical plates, the two vertical plates drive the two third U-shaped frames to move oppositely, the two third U-shaped frames limit the semiconductor wafer, the four first rubber pads are located on the front side and the back side of the semiconductor wafer, the springs are arranged, and the springs rebound to drive the four first rubber pads to extrude and fix the semiconductor wafer, so that the semiconductor wafer is buffered and fixed, and the service life of the semiconductor wafer is long.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.

FIG. 1 is a perspective view of the overall structure of the present invention;

FIG. 2 is a perspective bottom view of the overall structure of the present invention;

FIG. 3 is a perspective view of the second U-shaped frame of the present invention assembled with a worm gear;

FIG. 4 is a perspective view of the third U-shaped frame and the vertical plate of the present invention;

in the figure: 1. a first U-shaped frame; 2. a second U-shaped frame; 3. a first handle; 4. a first rubber pad; 5. a third U-shaped frame; 6. a limiting groove; 7. a storage plate; 8. a vertical plate; 9. a positive and negative screw rod; 10. a moving wheel; 11. a rotating shaft; 12. a worm; 13. a worm gear; 14. a second handle; 15. a second rubber pad; 16. a spring.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided to give a thorough understanding of example embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, steps, and so forth. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure.

Referring to the attached drawings 1-4 of the specification, the semiconductor wafer die bonder of the embodiment comprises a first U-shaped frame 1, a second U-shaped frame 2 is arranged at the top of the first U-shaped frame 1, a placement plate 7 is arranged inside the second U-shaped frame 2, the placement plate 7 is fixedly connected with the second U-shaped frame 2, a positive screw rod 9 and a negative screw rod 9 are arranged at the bottom of the placement plate 7, the positive screw rod 9 and the negative screw rod 9 drive two vertical plates 8 to move oppositely, two vertical plates 8 are movably sleeved on the outer peripheral surfaces of the positive screw rod 9 and the negative screw rod 9, the two vertical plates 8 drive two third U-shaped frames 5 to move oppositely, the two vertical plates 8 are both in threaded connection with the positive screw rod 9 and the negative screw rod 9, two limiting grooves 6 are arranged at the top end of the placement plate 7, the two vertical plates 8 are limited by the two limiting grooves 6, the top ends of the two vertical plates 8 respectively pass through the two limiting grooves 6, two third U-shaped frames 5 are arranged at the top of the placement plate 7, and the two third U-shaped frames 5 are respectively fixedly connected with the two vertical plates 8, the bottom of the second U-shaped frame 2 is provided with a rotating shaft 11, the rotating shaft 11 drives the second U-shaped frame 2 to rotate, the top end of the rotating shaft 11 is fixedly connected with the bottom end of the second U-shaped frame 2, the bottom end of the rotating shaft 11 penetrates through the first U-shaped frame 1, and the rotating shaft 11 is movably connected with the first U-shaped frame 1 through a bearing.

Referring to the attached drawings 3-4 of the specification, a plurality of springs 16 are arranged inside two third U-shaped frames 5, the springs 16 rebound to drive four first rubber pads 4 to extrude and fix the semiconductor wafer, the springs 16 are fixedly connected with the two third U-shaped frames 5 respectively, referring to the attached drawings 1-4 of the specification, two first rubber pads 4 are arranged inside the two third U-shaped frames 5, the four first rubber pads 4 extrude and fix the semiconductor wafer, the four first rubber pads 4 are fixedly connected with the springs 16 respectively, referring to the attached drawings 1 of the specification, a first handle 3 is arranged on one side of each second U-shaped frame 2, the first handle 3 drives a positive and negative screw rod 9 to rotate, one end of the positive and negative screw rod 9 penetrates through the second U-shaped frame 2 and is fixedly connected with the first handle 3, and the positive and negative screw rod 9 is movably connected with the second U-shaped frame 2 through a bearing.

Referring to the attached drawings 1 and 3 of the specification, two sides of a rotating shaft 11 are respectively provided with a moving wheel 10, a second U-shaped frame 2 drives the moving wheels 10 to rotate at the top end of a first U-shaped frame 1, the stability of the second U-shaped frame 2 is improved, the top ends of the two moving wheels 10 are fixedly connected with the second U-shaped frame 2, the bottom ends of the two moving wheels 10 are respectively contacted with the top end of the first U-shaped frame 1, referring to the attached drawings 1-3 of the specification, a worm wheel 13 is arranged in the first U-shaped frame 1, the top end of the worm wheel 13 is fixedly connected with the bottom end of the rotating shaft 11, referring to the attached drawings 1-2 of the specification, one side of the worm wheel 13 is provided with a worm 12, the worm 12 is meshed with the worm wheel 13 and has a self-locking function, the second U-shaped frame 2 can only be driven to rotate by the worm 12, the second U-shaped frame 2 can not rotate by itself, both ends of the worm 12 are movably connected with the first U-shaped frame 1 through bearings, the outer peripheral surface of the worm 12 is fixedly sleeved with two second handles 14, referring to the attached drawings 1-2 in the specification, two second rubber pads 15 are arranged at the bottom of the first U-shaped frame 1, so that the stability of the first U-shaped frame 1 is improved, and the two second rubber pads 15 are fixedly connected with the first U-shaped frame 1.

The using method of the embodiment comprises the following steps: the second handle 14 is rotated by the worker, because the second handle 14 is fixedly sleeved on the outer peripheral surface of the worm 12, both ends of the worm 12 are movably connected with the first U-shaped frame 1 through a bearing, the second handle 14 drives the worm 12 to rotate, because the worm 12 is meshed with the worm wheel 13, the worm 12 drives the worm wheel 13 to rotate, because the worm wheel 13 is fixedly connected with the rotating shaft 11, the rotating shaft 11 is movably connected with the first U-shaped frame 1 through a bearing, the worm wheel 13 drives the rotating shaft 11 to rotate, because the rotating shaft 11 is fixedly connected with the second U-shaped frame 2, the rotating shaft 11 drives the second U-shaped frame 2 to rotate, so as to drive the semiconductor wafer to rotate, the worm 12 and the worm wheel 13 have a self-locking function, the second U-shaped frame 2 can only be driven to rotate by the worm 12, the second U-shaped frame 2 cannot rotate by itself, the structure is simple, the semiconductor wafer is convenient to drive to rotate, the observation of the worker is convenient, and the use effect is good, meanwhile, the second U-shaped frame 2 drives the moving wheel 10 to rotate at the top end of the first U-shaped frame 1, so that the stability of the second U-shaped frame 2 is improved;

a worker places a semiconductor wafer on the object placing plate 7, then rotates the first handle 3, the first handle 3 is fixedly connected with the positive and negative screw rods 9, the positive and negative screw rods 9 are movably connected with the second U-shaped frame 2 through bearings, so the first handle 3 drives the positive and negative screw rods 9 to rotate, the two vertical plates 8 are both in threaded connection with the positive and negative screw rods 9, the two limiting grooves 6 limit the rotation of the two vertical plates 8, so the positive and negative screw rods 9 drive the two vertical plates 8 to move towards each other, the two third U-shaped frames 5 drive the two third U-shaped frames 5 to move towards each other, the two third U-shaped frames 5 limit the semiconductor wafer, so that the four first rubber pads 4 are positioned at the front side and the rear side of the semiconductor wafer, and the plurality of springs 16 are arranged to drive the four first rubber pads 4 to extrude and fix the semiconductor wafer, the semiconductor wafer is buffered and fixed, the service life of the semiconductor wafer is long, and the stability of the first U-shaped frame 1 is improved by arranging the two second rubber pads 15.

While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the utility model.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the utility model, only the structures related to the disclosed embodiments are referred to, other structures can refer to common designs, and the same embodiment and different embodiments of the utility model can be combined with each other without conflict;

and finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.

Claims

1. A die bonding device for a semiconductor wafer comprises a first U-shaped frame (1), and is characterized in that: the top of the first U-shaped frame (1) is provided with a second U-shaped frame (2), the inside of the second U-shaped frame (2) is provided with a storage plate (7), the storage plate (7) is fixedly connected with the second U-shaped frame (2), the bottom of the storage plate (7) is provided with a positive screw rod and a negative screw rod (9), the outer peripheral surface of the positive screw rod and the negative screw rod (9) is movably sleeved with two vertical plates (8), the two vertical plates (8) are both in threaded connection with the positive screw rod and the negative screw rod (9), the top end of the storage plate (7) is provided with two limiting grooves (6), the top ends of the two vertical plates (8) respectively penetrate through the two limiting grooves (6), the top of the storage plate (7) is provided with two third U-shaped frames (5), the two third U-shaped frames (5) are respectively fixedly connected with the two vertical plates (8), the bottom of the second U-shaped frame (2) is provided with a rotating shaft (11), and the top end of the rotating shaft (11) is fixedly connected with the bottom end of the second U-shaped frame (2), the bottom end of the rotating shaft (11) penetrates through the first U-shaped frame (1), and the rotating shaft (11) is movably connected with the first U-shaped frame (1) through a bearing.

2. The die bonding apparatus of claim 1, wherein: a plurality of springs (16) are arranged inside the two third U-shaped frames (5), and the springs (16) are fixedly connected with the two third U-shaped frames (5) respectively.

3. The die bonding apparatus of claim 2, wherein: two first rubber pads (4) are arranged inside the third U-shaped frames (5), and the four first rubber pads (4) are fixedly connected with the springs (16) respectively.

4. The die bonding apparatus of claim 1, wherein: one side of the second U-shaped frame (2) is provided with a first handle (3), one end of the positive and negative screw rod (9) penetrates through the second U-shaped frame (2) and is fixedly connected with the first handle (3), and the positive and negative screw rod (9) is movably connected with the second U-shaped frame (2) through a bearing.

5. The die bonding apparatus of claim 1, wherein: pivot (11) both sides all are equipped with and remove wheel (10), two remove wheel (10) top all with second U-shaped frame (2) fixed connection, two remove wheel (10) bottom all and first U-shaped frame (1) top and contact.

6. The die bonding apparatus of claim 1, wherein: a worm wheel (13) is arranged inside the first U-shaped frame (1), and the top end of the worm wheel (13) is fixedly connected with the bottom end of the rotating shaft (11).

7. The die bonding apparatus of claim 6, wherein: worm wheel (13) one side is equipped with worm (12), worm (12) and worm wheel (13) mesh mutually, worm (12) both ends all pass through bearing swing joint with first U-shaped frame (1), the fixed cover of worm (12) outer peripheral face is equipped with two second handles (14).

8. The die bonding apparatus of claim 1, wherein: two second rubber pads (15) are arranged at the bottom of the first U-shaped frame (1), and the two second rubber pads (15) are fixedly connected with the first U-shaped frame (1).