CN220604661U

CN220604661U - Wafer film pasting device for producing integrated circuits

Info

Publication number: CN220604661U
Application number: CN202322291106.9U
Authority: CN
Inventors: 肖国庆; 林坚; 刘敏文
Original assignee: Jiangxi Core Microelectronics Co ltd
Current assignee: Jiangxi Core Microelectronics Co ltd
Priority date: 2023-08-24
Filing date: 2023-08-24
Publication date: 2024-03-15
Anticipated expiration: 2033-08-24

Abstract

The utility model discloses a film sticking device for producing integrated circuit wafers, which comprises a base, a small motor and an arc clamping plate, wherein a workbench is fixedly arranged on the top surface of the base, a placement table is fixedly arranged on one side of the top surface of the workbench, a cross groove is formed in the placement table, first mounting blocks welded on the top surface of the workbench are uniformly arranged on four sides of the placement table, second mounting blocks are uniformly welded in the cross groove, a screw rod shaft is arranged between each group of the first mounting blocks and the second mounting blocks, a bevel gear is fixedly arranged at one end of the screw rod shaft, adjacent bevel gears are meshed with each other, and one end of the screw rod shaft is connected with the output end of the small motor. The beneficial effects are that: the utility model can complete the synchronous movement of four groups of arc clamping plates by using one small motor, can perform good limiting clamping and fixing on the placed wafer piece, reduces the manufacturing cost of the device and the power consumption in use, and has stronger practicability.

Description

Wafer film pasting device for producing integrated circuits

Technical Field

The utility model relates to the technical field of wafer film sticking, in particular to a wafer film sticking device for producing integrated circuits.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely the wafer, the wafer is very important for the production and processing of integrated circuits, and the wafer is thinned in the process of packaging the integrated circuits, so that a side film is required to be attached to the surface of the wafer for protecting the surface of the chip, and the chips on the wafer cannot be contaminated by foreign matters or scratched.

The prior art discloses the publication number: CN215988673U a wafer pad pasting device, the on-line screen storage device comprises a base, base top fixedly connected with workstation, both sides all fixedly connected with drive case around the workstation, drive case one side fixedly connected with servo motor, the drive case top is through bracing piece fixedly connected with film pressing frame, film pressing frame top fixedly connected with first electric telescopic handle, film pressing frame one side is equipped with the wafer clamping dish, wafer clamping dish one side is equipped with the slide rail, slide rail sliding connection has the stand, stand top fixedly connected with diaphragm, stand one side fixedly connected with second electric telescopic handle, second electric telescopic handle end and workstation top fixedly connected with, this utility model can stabilize the centre gripping to the wafer, take place to rock when avoiding the pad pasting, influence the pad pasting effect, can clear up the wafer surface of treating the pad pasting, avoid impurity to adhere to the wafer surface, can roll extrusion membrane and wafer after the pad pasting, avoid producing the bubble between the wafer.

When the device is used, the plurality of groups of third electric telescopic rods are used for driving the arc clamping plates to move, and the plurality of groups of arc clamping plates are used for limiting, clamping and fixing wafer pieces placed in the placing groove so as to prevent the wafers from shaking and moving to influence the film pasting effect when pasting films, but the plurality of groups of third electric telescopic rods are arranged so as to increase the manufacturing cost of the device and the power consumption when the device is used, reduce the market competitiveness of the device and ensure that the device is general in practicability.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides a wafer film sticking device for producing integrated circuits, which has the advantages that the synchronous movement of four groups of arc clamping plates can be completed by utilizing one small motor, the wafer pieces can be well limited and clamped and fixed, the manufacturing cost of the device and the power consumption during use are reduced, the practicability is higher, and the problems in the background art are further solved.

(II) technical scheme

In order to realize the synchronous movement of four groups of arc clamping plates by using one small motor, the wafer piece placed can be well limited and clamped and fixed, the manufacturing cost of the device and the power consumption during use are reduced, and the device has the advantage of stronger practicability, and the specific technical scheme adopted by the device is as follows: the utility model provides a be used for producing integrated circuit wafer pad pasting device, includes base, small-size motor and arc grip block, base top surface fixed mounting has the workstation, and workstation top surface one side fixed mounting has the platform of placing to place the platform inside and seted up the cross recess, place the four sides of platform and evenly be provided with the first installation piece of welding at the workstation top surface, evenly weld in the cross recess has the second installation piece, every group install the screw thread pole axle between first installation piece and the second installation piece, and the screw thread pole axle is located cross inslot one end fixed mounting has the bevel gear, adjacent the bevel gear intermesh, one screw thread pole axle one end is connected with small-size motor output, place the four sides of platform and evenly be provided with the arc grip block, and arc grip block bottom fixedly welded with direction slider to fixed mounting has the nut in the direction slider, the screw thread has cup jointed the screw thread pole axle in the direction slider bottom end block.

Further, workstation top surface opposite side fixed mounting has the mount, and mount top surface central authorities install electric telescopic handle to electric telescopic handle output connection installs the motor frame, fixed mounting has servo motor in the motor frame, and servo motor output connection installs the rotation axis, and rotation axis bottom fixed mounting has rotatory mounting panel.

Further, first direction sliding sleeve has been welded to rotation mounting panel one side symmetry, and has cup jointed first direction slide bar in the first direction sliding sleeve to first direction slide bar bottom fixedly connected with first metal frame, install the compression roller in the first metal frame, be connected with a plurality of first buffer spring between first metal frame top surface and the rotation mounting panel bottom surface.

Further, the second guide sliding sleeve is symmetrically welded on the other side of the rotary mounting plate, a second guide sliding rod is sleeved in the second guide sliding sleeve, a second metal frame is fixedly connected to the bottom end of the second guide sliding rod, a dust binding roller is arranged in the second metal frame, and a plurality of second buffer springs are connected and arranged between the top surface of the second metal frame and the bottom surface of the rotary mounting plate.

Further, control panel is installed to base one side lateral wall, and control panel and small-size motor, electric telescopic handle and servo motor electric connection.

Further, adjacent screw shafts are perpendicular to each other.

Further, anti-skid rubber pads are fixedly arranged on the inner sides of the four arc-shaped clamping plates.

(III) beneficial effects

Compared with the prior art, the utility model provides a wafer film sticking device for producing integrated circuits, which comprises the following steps of

The beneficial effects are that:

(1) The utility model is provided with a placing table, a small motor and arc clamping plates, when in use, a worker places a wafer piece at the center of the top surface of the placing table, then the worker can start the small motor through a control panel to drive a group of screw rod shafts arranged between a first mounting block and a second mounting block to rotate, the screw rod shafts arranged in four groups are respectively positioned in cross grooves formed in the inner cavity of the placing table, bevel gears are fixedly arranged at the opposite ends of the four screw rod shafts, and adjacent bevel gears are meshed with each other, so when the small motor drives one screw rod shaft to rotate, other screw rod shafts rotate along with the rotation of the screw rod shafts, on the other hand, four arc clamping plates are uniformly arranged at the four sides of the placing table, guide sliding blocks are welded at the bottom surfaces of the four arc clamping plates, and the guide slide block is clamped in a guide chute formed in the top surface of the workbench, and the screw rod shaft is sleeved on the inner screw thread of the nut fixedly installed in the guide slide block, so that the four guide slide blocks and the arc clamping plates can be synchronously driven to move along the direction of the guide chute towards the side wall of the placing table along with the rotation of the screw rod shaft until the anti-slip rubber pads fixedly installed on the inner sides of the four arc clamping plates are abutted against the side edges of the wafer workpiece, thereby realizing the clamping and fixing limit of the wafer.

(2) The utility model is provided with the press roller and the dust adhering roller, as described above, after the clamping and fixing of the wafer workpiece are completed, a worker can start the servo motor arranged on the motor frame to drive the rotating shaft to rotate firstly, because one end of the rotating shaft is fixedly provided with the rotating mounting plate, the rotating mounting plate can rotate along with the rotating shaft by a required angle until the dust adhering roller arranged on one side of the rotating mounting plate moves to the upper part of the wafer workpiece, the arranged dust adhering roller is arranged on the second metal frame, a plurality of second buffer springs are arranged between the top surface of the second metal frame and the bottom surface of the rotating mounting plate in a connecting way, and the second guide slide bars symmetrically welded on the second metal frame are sleeved in the second guide slide sleeve fixedly arranged on the rotating mounting plate, at the moment, the worker starts the motor frame together with the rotating mounting plate to move downwards until the dust adhering roller is abutted against the surface of the wafer, then the servo motor drives the rotating shaft to rotate back and forth in a certain angle again, so that the dust adhering roller rolls back and forth on the surface of the wafer, and after the cleaning is completed, the dust adhering roller can rotate again, the dust adhering roller is driven to rotate again, the rotating mounting plate is arranged on the surface of the wafer, a plurality of second buffer springs are arranged on the top surface of the wafer, and the first buffer springs are arranged on the top surface of the wafer frame in a connecting way, and the wafer frame is rotatably arranged on the top surface of the first metal frame in a round way, and the top surface of the wafer frame is rotatably arranged on the top of the wafer frame, and the wafer frame is rotatably and rotatably mounted on the top mounting plate, the device has the advantages that bubbles are prevented from being generated, the quality and the efficiency of wafer film pasting are improved, the structure of the arranged servo motor, the electric telescopic rod, the dust adhering roller and the compression roller is simpler, the use is more convenient, the working efficiency and the quality of the integrated circuit wafer film pasting device are improved, and the manufacturing cost of the integrated circuit wafer film pasting device is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a wafer film laminating apparatus for producing integrated circuits according to an embodiment of the present utility model;

FIG. 2 is a top plan view of a placement stage for use in producing integrated circuit wafer lamination apparatus in accordance with an embodiment of the present utility model;

FIG. 3 is an enlarged view at A of FIG. 1 according to an embodiment of the present utility model;

FIG. 4 is an enlarged view at B of FIG. 1 according to an embodiment of the present utility model;

FIG. 5 is an enlarged view at C of FIG. 1 according to an embodiment of the present utility model;

fig. 6 is an enlarged view of fig. 1 at D according to an embodiment of the present utility model.

In the figure:

1. a base; 2. a work table; 3. a small motor; 4. a first mounting block; 5. rotating the mounting plate; 6. a press roller; 7. a fixing frame; 8. an electric telescopic rod; 9. a servo motor; 10. a motor frame; 11. a dust adhering roller; 12. a rotation shaft; 13. a control panel; 14. a placement table; 15. a cross groove; 16. a second mounting block; 17. a screw shaft; 18. bevel gears; 19. an arc-shaped clamping plate; 20. an anti-slip rubber pad; 21. a guide slide block; 22. a guide chute; 23. a nut; 24. a first metal frame; 25. a first buffer spring; 26. the first guiding sliding sleeve; 27. a first guide slide bar; 28. a second metal frame; 29. a second buffer spring; 30. the second guiding sliding sleeve; 31. and a second guide slide bar.

Detailed Description

For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.

According to an embodiment of the present utility model, a wafer film laminating apparatus for producing integrated circuits is provided.

The utility model is further described with reference to the accompanying drawings and the specific embodiments, as shown in fig. 1-6, the device for producing integrated circuit wafer film according to the embodiment of the utility model comprises a base 1, a small motor 3 and an arc clamping plate 19, wherein the top surface of the base 1 is fixedly provided with a workbench 2, one side of the top surface of the workbench 2 is fixedly provided with the workbench 14, a cross groove 15 is formed in the workbench 14, four sides of the workbench 14 are uniformly provided with first mounting blocks 4 welded on the top surface of the workbench 2, second mounting blocks 16 are uniformly welded in the cross groove 15, a screw rod shaft 17 is arranged between each group of the first mounting blocks 4 and the second mounting blocks 16, one end of the screw rod shaft 17 positioned in the cross groove 15 is fixedly provided with a bevel gear 18, adjacent bevel gears 18 are meshed with each other, one end of the screw rod shaft 17 is connected with the output end of the small motor 3, four sides of the workbench 14 are uniformly provided with the arc clamping plate 19, the bottom end of the arc clamping plate 19 is fixedly welded with a guide slide block 21, nuts 23 are fixedly arranged in the guide slide block 21, the nuts 17 are sleeved in the guide slide block 23, the screw rod shafts are uniformly, the four sides of the workbench 2 are uniformly provided with four guide slide blocks 21, and the four guide blocks 22 are uniformly arranged in the guide slide blocks 21, and the four guide blocks are embedded in the guide blocks, and the guide blocks are tightly arranged in the guide blocks, and the guide blocks are tightly, and the cost of the guide grooves can be well clamped by the guide grooves and the guide grooves can be realized, and the device can be used for clamping the fact that the device when the device can be used for manufacturing the wafer film is well to be used for clamping and when the wafer film is manufactured.

In one embodiment, the fixed mount 7 is fixedly arranged on the other side of the top surface of the workbench 2, the electric telescopic rod 8 is arranged in the center of the top surface of the fixed mount 7, the motor frame 10 is connected and arranged at the output end of the electric telescopic rod 8, the servo motor 9 is fixedly arranged in the motor frame 10, the rotating shaft 12 is connected and arranged at the output end of the servo motor 9, the rotating mounting plate 5 is fixedly arranged at the bottom end of the rotating shaft 12, the using positions and the using heights of the pressing roller 6 and the dust adhering roller 11 are controlled and regulated, the structure is simpler, the use is more convenient, the work efficiency and the quality of the integrated circuit wafer film pasting device are improved, and the manufacturing cost is reduced.

In one embodiment, a first guiding sliding sleeve 26 is symmetrically welded on one side of the rotary mounting plate 5, a first guiding sliding rod 27 is sleeved in the first guiding sliding sleeve 26, a first metal frame 24 is fixedly connected to the bottom end of the first guiding sliding rod 27, a pressing roller 6 is installed in the first metal frame 24, a plurality of first buffer springs 25 are installed between the top surface of the first metal frame 24 and the bottom surface of the rotary mounting plate 5 in a connecting mode, the pressing roller 6 is pressed on the surface of a wafer and rolls back and forth along the surface of the wafer, so that film pasting operation of the wafer can be completed, air bubbles are prevented from being generated, and the film pasting quality and efficiency of the wafer are improved.

In one embodiment, the second guiding sliding sleeve 30 is symmetrically welded on the other side of the rotary mounting plate 5, the second guiding sliding sleeve 30 is internally sleeved with the second guiding sliding rod 31, the bottom end of the second guiding sliding rod 31 is fixedly connected with the second metal frame 28, the dust-binding roller 11 is arranged in the second metal frame 28, and a plurality of second buffer springs 29 are connected and arranged between the top surface of the second metal frame 28 and the bottom surface of the rotary mounting plate 5, so that the cleaning of tiny dust impurities on the surface of a wafer can be realized.

In one embodiment, a control panel 13 is mounted on a side wall of one side of the base 1, and the control panel 13 is electrically connected with the small motor 3, the electric telescopic rod 8 and the servo motor 9, so that the normal operation of the control device is realized.

In one embodiment, adjacent screw shafts 17 are perpendicular to each other.

In one embodiment, the anti-slip rubber pads 20 are fixedly mounted on the inner sides of the four arc-shaped clamping plates 19, so that the clamping and fixing effects of the four arc-shaped clamping plates 19 on the wafer are improved, and meanwhile, the anti-slip rubber pads 20 can prevent the arc-shaped clamping plates 19 from scratching the edge of the wafer.

Working principle: the utility model is provided with a placing table 14, a small motor 3 and an arc clamping plate 19, when in use, a worker places a wafer piece at the right center of the top surface of the placing table 14, then the worker can start the small motor 3 through a control panel 13 to drive a group of screw rod shafts 17 arranged between a first mounting block 4 and a second mounting block 16 to rotate, the screw rod shafts 17 arranged in four groups are respectively positioned in a cross groove 15 formed in the inner cavity of the placing table 14, bevel gears 18 are fixedly arranged at the opposite ends of the four screw rod shafts 17, and adjacent bevel gears 18 are meshed with each other, so when the small motor 3 drives one screw rod shaft 17 to rotate, the other screw rod shafts 17 rotate along with the rotation of the screw rod shafts, on the other hand, four arc clamping plates 19 are uniformly arranged at the four sides of the placing table 14, guide slide blocks 21 are welded at the bottom surfaces of the four arc clamping plates 19, the guide slide blocks 21 are clamped in guide slide grooves 22 formed in the top surface of the workbench 2, the screw shafts 17 are sleeved in the nuts 23 fixedly arranged in the guide sliding blocks 21, so that the four guide sliding blocks 21 and the arc clamping plates 19 can be synchronously driven to move towards the side wall of the placing table 14 along the direction of the guide sliding grooves 22 along with the rotation of the screw shafts 17 until the anti-slip rubber pads 20 fixedly arranged on the inner sides of the four arc clamping plates 19 are abutted against the side edges of the wafer workpieces, thereby realizing the clamping, fixing and limiting of the wafers, in the process, the synchronous movement of the four groups of arc clamping plates 19 can be completed by only using one small motor 3, the placed wafer workpieces can be well limited, clamped and fixed, the manufacturing cost of the device and the power consumption in use are reduced, the practicability is stronger, in addition, the utility model is provided with the press roller 6 and the dust adhering roller 11, the worker can start the servo motor 9 installed on the motor frame 10 to drive the rotation shaft 12 to rotate firstly, because one end of the rotation shaft 12 is fixedly provided with the rotation mounting plate 5, the rotation mounting plate 5 can rotate with the rotation shaft 12 by a required angle until the dust-binding roller 11 installed on one side of the rotation mounting plate 5 moves above the wafer workpiece, the dust-binding roller 11 is installed on the second metal frame 28, a plurality of second buffer springs 29 are installed between the top surface of the second metal frame 28 and the bottom surface of the rotation mounting plate 5, second guide sliding rods 31 symmetrically welded on the second metal frame 28 are sleeved in second guide sliding sleeves 30 fixedly installed on the rotation mounting plate 5, at the moment, the worker starts the motor frame 10 together with the rotation mounting plate 5 to move downwards again until the dust-binding roller 11 is abutted with the surface of the wafer, then, the servo motor 9 drives the rotating shaft 12 to rotate back and forth in a certain angle again, so that the dust-sticking roller 11 rolls back and forth on the surface of the wafer, the cleaning of dust impurities on the surface of the wafer can be realized, after the cleaning is finished, the servo motor 9 drives the rotating mounting plate 5 to rotate again, so that the press roller 6 arranged on the other side of the bottom surface of the rotating mounting plate 5 moves to the upper part of the wafer, at the moment, a film body is arranged on the white surface of the wafer, because the arranged press roller 6 is arranged on the first metal frame 24, a plurality of first buffer springs 25 are connected between the top surface of the first metal frame 24 and the bottom surface of the rotating mounting plate 5, the first guide sliding rods 27 symmetrically welded on the first metal frame 24 are sleeved in the first guide sliding sleeves 26 fixedly arranged on the rotating mounting plate 5, the press roller 6 can be pressed on the surface of the wafer and roll back and forth along the surface of the wafer, and film sticking operation of the wafer can be completed, the air bubble generation is prevented, the quality and the efficiency of the wafer film are improved, the structure of the arranged servo motor 9, the electric telescopic rod 8, the dust adhering roller 11 and the compression roller 6 is simpler, the use is more convenient, the working efficiency and the quality of the integrated circuit wafer film pasting device are improved, and the manufacturing cost of the integrated circuit wafer film pasting device is reduced.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims

1. The utility model provides a be used for producing integrated circuit wafer pad pasting device, includes base (1), small-size motor (3) and arc grip block (19), its characterized in that, base (1) top surface fixed mounting has workstation (2), and workstation (2) top surface one side fixed mounting has place platform (14) to place platform (14) inside seting up cross recess (15), place platform (14) four sides evenly are provided with first installation piece (4) of welding at workstation (2) top surface, evenly weld in cross recess (15) has second installation piece (16), every group install screw thread pole (17) between first installation piece (4) and second installation piece (16), and screw thread pole (17) are located cross recess (15) one end fixed mounting has bevel gear (18), adjacent bevel gear (18) intermeshing, one screw thread pole (17) one end is connected with small-size motor (3) output, place platform (14) four sides evenly are provided with arc grip block (19), and arc grip block (19) bottom fixed 21) and guide nut (23) are cup jointed to guide nut (23) in the guide nut (23) of installing, guide nut (23) are equipped with in the guide nut (23), the bottom end of the guide sliding block (21) is embedded in the guide sliding groove (22).

2. The device for producing integrated circuit wafer film according to claim 1, wherein a fixing frame (7) is fixedly installed on the other side of the top surface of the workbench (2), an electric telescopic rod (8) is installed in the center of the top surface of the fixing frame (7), a motor frame (10) is installed at the output end of the electric telescopic rod (8), a servo motor (9) is fixedly installed in the motor frame (10), a rotating shaft (12) is installed at the output end of the servo motor (9), and a rotating mounting plate (5) is fixedly installed at the bottom end of the rotating shaft (12).

3. The wafer film pasting device for producing integrated circuits according to claim 2, wherein a first guide sliding sleeve (26) is symmetrically welded on one side of the rotary mounting plate (5), a first guide sliding rod (27) is sleeved in the first guide sliding sleeve (26), a first metal frame (24) is fixedly connected to the bottom end of the first guide sliding rod (27), a pressing roller (6) is mounted in the first metal frame (24), and a plurality of first buffer springs (25) are connected and mounted between the top surface of the first metal frame (24) and the bottom surface of the rotary mounting plate (5).

4. The wafer film pasting device for producing integrated circuits according to claim 2, wherein a second guide sliding sleeve (30) is symmetrically welded on the other side of the rotary mounting plate (5), a second guide sliding rod (31) is sleeved in the second guide sliding sleeve (30), a second metal frame (28) is fixedly connected to the bottom end of the second guide sliding rod (31), a dust adhering roller (11) is mounted in the second metal frame (28), and a plurality of second buffer springs (29) are connected and mounted between the top surface of the second metal frame (28) and the bottom surface of the rotary mounting plate (5).

5. The wafer film laminating device for producing integrated circuits according to claim 1, wherein a control panel (13) is mounted on one side wall of the base (1), and the control panel (13) is electrically connected with the small motor (3), the electric telescopic rod (8) and the servo motor (9).

6. A wafer lamination apparatus for producing integrated circuits according to claim 1, wherein adjacent screw shafts (17) are perpendicular to each other.

7. A wafer film laminating apparatus for producing integrated circuits according to claim 1, wherein the inner sides of the four arc-shaped clamping plates (19) are fixedly provided with anti-slip rubber pads (20).