CN210413996U

CN210413996U - Semiconductor material polishing device

Info

Publication number: CN210413996U
Application number: CN201921454291.6U
Authority: CN
Inventors: 徐宏进
Original assignee: Yangzhou Guorun Semiconductor Technology Co Ltd
Current assignee: Yangzhou Guorun Semiconductor Technology Co Ltd
Priority date: 2019-09-03
Filing date: 2019-09-03
Publication date: 2020-04-28
Anticipated expiration: 2029-09-03

Abstract

The utility model discloses a semiconductor material burnishing device, including fixed case, rotary device, fixing device and support column, there is damping device fixed through the bolt in the bottom four corners of fixed case, the bottom plate surface of fixed case is equipped with rotary device, rotary device's top welded fastening has fixing device, there is the air exhauster fixed through the bolt fastening on fixing device's the left supporting seat surface, welded fastening has the support column on the base surface on fixing device right side, the support column bottom plate surface has positive and negative motor through the bolt fastening, positive and negative motor's output welded fastening has adjusting screw, be equipped with the erection column on adjusting screw's the outer wall, the below of erection column is equipped with the motor case, there is polishing motor through the bolt fastening in the motor case. This semiconductor material burnishing device not only can carry out effectual fixed to the semiconductor material of different specifications, and it is efficient to polish moreover.

Description

Semiconductor material polishing device

Technical Field

The utility model belongs to the technical field of semiconductor processing equipment, concretely relates to semiconductor material burnishing device.

Background

Semiconductor materials are a class of electronic materials that have semiconducting properties (electrical conductivity between conductor and insulator, and resistivity in the range of about 1m Ω -cm to 1G Ω -cm) and are useful in the fabrication of semiconductor devices and integrated circuits. Semiconductor materials are used to fabricate field effect transistors, which are widely used in modern electronic devices, because of their structural stability, their excellent electrical properties, and their low cost. In semiconductor manufacturing, abrasive processing such as grinding and lapping is a necessary way to produce semiconductor wafers, however grinding and lapping can result in poor surface integrity of the single crystal silicon wafer. Polishing and planarization are therefore important for the production of microelectronic components. The existing polishing equipment has poor clamping effect, so that the sliding condition of the semiconductor material is easily caused, and the grinding and polishing effect of the polishing equipment on the semiconductor material is influenced.

Therefore, in response to this situation, there is a strong need to design and produce a semiconductor material polishing apparatus to meet the needs of practical use.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor material burnishing device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor material polishing device comprises a fixed box, a rotating device, a fixing device and support columns, wherein damping devices are fixed at four corners of the bottom of the fixed box through bolts, the rotating device is arranged on the surface of a bottom plate of the fixed box, the fixing device is fixed at the top of the rotating device in a welding manner, an exhaust fan is fixed on the surface of a support seat on the left side of the fixing device through bolts, a guide column is fixed on the surface of the fixed box on the left side of the exhaust fan in a welding manner, the support columns are fixed on the surface of a base on the right side of the fixing device in a welding manner, a positive and negative motor is fixed on the surface of the bottom plate of each support column through bolts, an adjusting screw is fixed on the output end of the positive and negative motor in a welding manner, nut sleeves are rotatably connected on the outer walls of the adjusting screw, mounting columns are fixed on, the bottom of the electric guide rail is fixedly provided with a motor box through a bolt, a polishing motor is fixedly arranged in the motor box through a bolt, an output end of the polishing motor is fixedly welded with an output shaft, and the bottom of the output shaft is fixedly provided with a grinding disc through a bolt.

Preferably, rotary device includes rotating electrical machines and axis of rotation, the rotating electrical machines passes through the bolt fastening at the bottom plate surface of fixed case, the output welded fastening of rotating electrical machines has the axis of rotation, and the top welded fastening of axis of rotation has the driving gear, be equipped with the axis of rotation in the left fixed case of rotating electrical machines, the bottom of axis of rotation is rotated through the bottom plate that rotates seat and fixed case and is connected, welded fastening has the driven gear who meshes with the driving gear mutually on the outer wall of axis of rotation.

Preferably, fixing device includes fixed plate and mount, two sets of adjustment tanks have been seted up on the surface of fixed plate, and the fixed plate surface of adjustment tank both sides has been seted up the fixed screw of multiunit, has the mount through regulating block sliding connection in the adjustment tank, and the regulating block is fixed through the fixed screw on bolt and fixed plate surface, threaded connection clamping screw on the mount, clamping screw's bottom welded fastening has the fixed block.

Preferably, damping device includes shock attenuation sleeve and shock attenuation post, shock attenuation sleeve's bottom welded fastening has the backup pad, set up the shifting chute in the shock attenuation sleeve, be equipped with damping spring in the shifting chute, damping spring's top welded fastening has the limiting plate, and the top intermediate position welded fastening of limiting plate has the shock attenuation post, the top welded fastening of shock attenuation post has the mounting panel, installation piece welded fastening is in the bottom of fixed case.

Preferably, the air inlet end of the exhaust fan is fixedly welded with a fan cover through an air inlet pipe, the surface of the bottom plate of the fixed box is fixedly welded with a dust collection box, and the dust collection box is fixedly connected with the air outlet end of the exhaust fan through an air outlet pipe.

The utility model discloses a technological effect and advantage: according to the semiconductor material polishing device, the semiconductor material is placed on the fixing plate, the position of the fixing frame on the fixing plate is adjusted, the fixing screw is rotated, and the semiconductor material is fixed through the fixing block, so that the phenomenon that the semiconductor material is not firmly fixed can be avoided, and the semiconductor material with different sizes can be fixed; drive the fixed plate through rotary device and rotate, the abrasive disc polishes the operation to semiconductor material, moves on electronic guide rail through the motor case, drives the abrasive disc and removes, can carry out the omnidirectional to semiconductor material on the fixed plate and polish, has improved polishing efficiency, and this semiconductor material burnishing device not only can carry out effectual fixed to the semiconductor material of different specifications, and it is efficient to polish moreover.

Drawings

Fig. 1 is a cross-sectional view of the present invention;

fig. 2 is a sectional view of the shock absorbing device of the present invention;

fig. 3 is a top view of the fixing device of the present invention;

fig. 4 is an enlarged view of a portion a of fig. 1 according to the present invention;

fig. 5 is a schematic structural view of the damping device of the present invention.

In the figure: the device comprises a fixed box 1, a damping device 2, a rotating device 3, a fixing device 4, a supporting column 5, a positive and negative motor 6, an adjusting screw 7, a mounting column 8, a guide column 9, an electric guide rail 10, a motor box 11, a polishing motor 12, a grinding disc 13, a suction fan 14, a dust collection box 15, a fan cover 16, a supporting plate 17, a damping sleeve 18, a damping spring 19, a damping column 20, a mounting plate 21, a rotating motor 22, a driving gear 23, a rotating seat 24, a rotating shaft 25, a driven gear 26, a fixing plate 27, a fixing frame 28, a fixing screw 29 and a fixing block 30.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Unless the direction is defined separately, the directions of up, down, left, right, front, back, etc. referred to herein are the directions of up, down, left, right, front, back, etc. in the drawings of the present invention, and are herein incorporated by reference.

The utility model provides a semiconductor material burnishing device as shown in fig. 1-5, including 1 case of fixed case, rotary device 3, fixing device 4 and support column 5, there is damping device 2 fixed with the bolt in the bottom four corners of fixed case 1, the bottom plate surface of fixed case 1 is equipped with rotary device 3, rotary device 3's top welded fastening has fixing device 4, there is air exhauster 14 fixed with the bolt on fixing device 4's the left supporting seat surface through the bolt, air exhauster 14's model is: RB-73D-1, welded fastening has guide post 9 on the left fixed box 1 surface of air exhauster 14, the guide way has been seted up to one side of guide post 9, welded fastening has support column 5 on the base surface on fixing device 4 right side, support column 5 bottom plate surface has positive and negative motor 6 through the bolt fastening, positive and negative motor 6's model is: b2212-920KV, positive and negative motor 6's output welded fastening has adjusting screw 7, it is connected with the nut cover to rotate on adjusting screw 7's the outer wall, welded fastening has erection column 8 on the outer wall of nut cover, erection column 8 extends to in the guide way that guide column 9 was seted up to through slide rail and guide column 9 sliding connection, nut cover can guarantee that adjusting screw 7 when rotating that erection column 8 carries out vertical migration, the below of erection column 8 is passed through the bolt fastening has electronic guide rail 10, the bottom of electronic guide rail 10 is passed through the bolt fastening has motor case 11, there is polishing motor 12 in the motor case 11 through the bolt fastening, polishing motor 12's model does: Y80M1-2, the output welded fastening of polishing motor 12 has the output shaft, and the output shaft runs through the bottom plate of motor case 11 to the bottom that extends to motor case 11 outer output shaft has abrasive disc 13 through the bolt fastening, it is to be fixed with the model through the bolt fastening on the right side outer wall of fixed case 1: a controller for the BLC-12I8ORC-HD to control electrical equipment (not shown) on the polishing apparatus.

Specifically, the rotating device 3 includes a rotating electrical machine 22 and a rotating shaft 25, the rotating electrical machine 22 is fixed on the bottom plate surface of the fixing box 1 through bolts, and the model of the rotating electrical machine 22 is: YZ-7124, the output welded fastening of rotating electrical machines 22 has the rotation axis, and the top welded fastening of rotation axis has driving gear 23, be equipped with axis of rotation 25 in the left fixed box 1 of rotating electrical machines 22, the bottom of axis of rotation 25 is rotated through rotating seat 24 and fixed box 1's bottom plate and is connected, welded fastening has driven gear 26 with driving gear 23 engaged with on the outer wall of axis of rotation 25, axis of rotation 25 runs through the roof of fixed box 1 to extend to fixed box 1's top.

Specifically, fixing device 4 includes fixed plate 27 and mount 28, two sets of adjustment tanks have been seted up on the surface of fixed plate 27, and the fixed plate 27 surface of adjustment tank both sides has seted up the fixed screw of multiunit, has mount 28 through regulating block sliding connection in the adjustment tank, and the regulating block is fixed through the fixed screw on bolt and fixed plate 27 surface, through adjusting the position of mount 28 on fixed plate 27, can fix not unidimensional semiconductor material, threaded connection clamping screw 29 on the mount 28, clamping screw 29's bottom welded fastening has fixed block 30, the bottom of fixed block 30 is fixed with the rubber slipmat through the glue bonding, can protect semiconductor material.

Specifically, damping device 2 includes damping sleeve 18 and shock-absorbing column 20, damping sleeve 18's bottom welded fastening has backup pad 17, set up the shifting chute in the damping sleeve 18, be equipped with damping spring 19 in the shifting chute, damping spring 19 welded fastening is on the bottom plate surface of damping sleeve 18, damping spring 19's top welded fastening has the limiting plate, and the top intermediate position welded fastening of limiting plate has damping column 20, damping column 20 runs through damping sleeve 18's roof to extend to outside damping sleeve 18, damping column 20's top welded fastening has mounting panel 21, mounting block welded fastening is in the bottom of fixed case 1, damping device 2 can be when the electrical equipment operation on the burnishing device, extrudes the limiting plate through damping column 20, and limiting plate extrusion damping spring 19, damping spring 19 deformation to the vibrations that electrical equipment produced offset, the stability in the polishing process is ensured, and the polishing quality is improved.

Specifically, the inlet end of air exhauster 14 is passed through intake pipe welded fastening and is had fan housing 16, the bottom plate surface welded fastening of fixed case 1 is equipped with dust collection box 15, dust collection box 15 passes through the outlet duct and 14 the fixed connection of outlet end of air exhauster, can adsorb the dust that produces in the polishing process into dust collection box 15 through air exhauster 14 in, avoids the dust to remain on the semiconductor material surface, influences the semiconductor quality after the polishing.

Specifically, when the semiconductor material polishing device is used, a semiconductor material is placed on a fixing plate 27, the position of a fixing frame 28 on the fixing plate 27 is adjusted according to the size of the semiconductor material, the fixing frame 28 is fixed through a bolt after the adjustment is completed, a fixing screw 29 is rotated to drive a fixing block 30 to move downwards to fix the semiconductor material, a polishing motor 12 is started to drive a grinding disc 13 to rotate, a positive and negative motor 6 is started to rotate, an installation column 8 is driven to descend through the reverse rotation of the positive and negative motor 6, the grinding disc 13 is in contact with the semiconductor material to polish the semiconductor material, an exhaust fan 14 is started to adsorb dust generated in the polishing process, a motor box 11 is driven to move through an electric guide rail 10, so that the grinding disc 13 can comprehensively polish the semiconductor material, the installation column 8 is driven to move upwards through the positive and negative motor 6 after the polishing is completed, the electrical equipment on the polishing apparatus is turned off and the semiconductor material is removed from the holding plate 27.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. A semiconductor material polishing device, comprising a fixed box (1), a rotating device (3), a fixing device (4) and a support column (5), characterized in that: the damping device is characterized in that damping devices (2) are fixed at four corners of the bottom of the fixed box (1) through bolts, a rotating device (3) is arranged on the surface of a bottom plate of the fixed box (1), a fixing device (4) is fixed at the top of the rotating device (3) in a welded mode, an exhaust fan (14) is fixed on the surface of a left supporting seat of the fixing device (4) through bolts, a guide column (9) is fixed on the surface of the left fixed box (1) of the exhaust fan (14) in a welded mode, a supporting column (5) is fixed on the surface of a base on the right side of the fixing device (4) in a welded mode, a positive and negative motor (6) is fixed on the surface of the bottom plate of the supporting column (5) through bolts, an adjusting screw (7) is fixed on the output end of the positive and negative motor (6) in a welded mode, a nut sleeve, the lower part of the mounting column (8) is fixedly provided with an electric guide rail (10) through a bolt, the bottom of the electric guide rail (10) is fixedly provided with a motor box (11) through a bolt, a polishing motor (12) is fixedly arranged in the motor box (11) through a bolt, the output end of the polishing motor (12) is fixedly welded with an output shaft, and the bottom of the output shaft is fixedly provided with a grinding disc (13) through a bolt.

2. A semiconductor material polishing apparatus according to claim 1, characterized in that: rotating device (3) include rotating electrical machines (22) and axis of rotation (25), rotating electrical machines (22) pass through the bolt fastening at the bottom plate surface of fixed case (1), the output welded fastening of rotating electrical machines (22) has the axis of rotation, and the top welded fastening of axis of rotation has driving gear (23), be equipped with axis of rotation (25) in the left fixed case (1) of rotating electrical machines (22), the bottom of axis of rotation (25) is rotated through the bottom plate of rotating seat (24) with fixed case (1) and is connected, welded fastening has driven gear (26) with driving gear (23) engaged with on the outer wall of axis of rotation (25).

3. A semiconductor material polishing apparatus according to claim 1, characterized in that: fixing device (4) are including fixed plate (27) and mount (28), two sets of adjustment tanks have been seted up on the surface of fixed plate (27), and the fixed screw of multiunit has been seted up on fixed plate (27) surface of adjustment tank both sides, has mount (28) through regulating block sliding connection in the adjustment tank, and the regulating block is fixed through the fixed screw on bolt and fixed plate (27) surface, threaded connection clamping screw (29) on mount (28), the bottom welded fastening of clamping screw (29) has fixed block (30).

4. A semiconductor material polishing apparatus according to claim 1, characterized in that: damping device (2) are including damping sleeve (18) and shock attenuation post (20), the bottom welded fastening of damping sleeve (18) has backup pad (17), set up the shifting chute in damping sleeve (18), be equipped with damping spring (19) in the shifting chute, the top welded fastening of damping spring (19) has limiting plate, and the top intermediate position welded fastening of limiting plate has shock attenuation post (20), the top welded fastening of shock attenuation post (20) has mounting panel (21), mounting block welded fastening is in the bottom of fixed case (1).

5. A semiconductor material polishing apparatus according to claim 1, characterized in that: the air inlet end of the exhaust fan (14) is fixedly provided with an air cover (16) through an air inlet pipe in a welded mode, the surface of a bottom plate of the fixed box (1) is fixedly provided with a dust collection box (15) in a welded mode, and the dust collection box (15) is fixedly connected with the air outlet end of the exhaust fan (14) through an air outlet pipe.