CN218592556U

CN218592556U - Edge grinding machine for processing semiconductor wafer

Info

Publication number: CN218592556U
Application number: CN202222234131.9U
Authority: CN
Inventors: 黄毅
Original assignee: Jiangsu Jinggong Semiconductor Equipment Co ltd
Current assignee: Jiangsu Jinggong Semiconductor Equipment Co ltd
Priority date: 2022-08-24
Filing date: 2022-08-24
Publication date: 2023-03-10
Anticipated expiration: 2032-08-24

Abstract

The utility model discloses an edging machine for semiconductor wafer processing, including be used for carrying out the edging mechanism of edging to semiconductor wafer, be used for the edging in-process to carry out fixed establishment, feed table, ejection of compact platform to semiconductor wafer, ejection of compact platform one side is provided with the feed table, ejection of compact platform one side is provided with edging mechanism, edging mechanism front end is provided with fixed establishment still includes the cooling mechanism that is used for cooling down the desquamation to semiconductor wafer edging in-process. Has the advantages that: be provided with a cooling mechanism, carry out water spray treatment to its wafer at the edging in-process, the purpose that reaches the cooling that can be better, and the dust is fallen with the piece to the clearance that can also be better and air circumstance pollution is avoided, the better purpose that reaches energy-concerving and environment-protective of hydroenergy recycle.

Description

Edge grinding machine for processing semiconductor wafer

Technical Field

The utility model relates to a wafer processing field especially relates to an edging machine for processing of semiconductor wafer.

Background

The silicon single crystal is a brittle material, in order to avoid corner cracking to influence the strength of a wafer, damage the smoothness of the surface of the wafer and bring pollution particles to subsequent processes, edge grinding equipment is used for automatically finishing the edge shape and the outer diameter size of the wafer, but in the edge grinding process, the outer periphery of the wafer is difficult to clamp, the wafer is directly placed in an edge grinding frame, in the edge grinding process, certain friction is generated between the edge grinding sheet and the wafer, the particles on the outer periphery of the wafer are separated out and adsorbed on the outer periphery of the wafer to be difficult to drop, the friction force generated between the particles and the edge grinding sheet is increased, the extrusion force between the edge grinding sheet and the wafer is increased, the wafer is easy to shift in the edge grinding frame, and the outer periphery of the wafer is damaged in the edge grinding process.

Patent CN202011593859.X discloses a wafer processing edging equipment, its structure includes the workstation, the standing groove, the support frame, the cylinder, the sander, control panel, surface mounting has the standing groove on the workstation, and workstation up end and support frame bottom weld, the plate body carries out lateral shifting, the inboard surface of plate body is contradicted the wafer outside limit, contradict with the polishing plate through the wafer outside limit, edging the wafer outside limit, the granule that produces in the edging process enters into inside the recess, prevent that the granule that appears in the edging process from adsorbing at wafer outside limit periphery, supplementary slide ball through the rotor lower extreme rotates at the locating piece, the locating piece keeps the location motionless, conflict to wafer up end middle part under the conflict board, conflict in-process through torsion spring's rotation, make the conflict support fixed to wafer center part, avoid the wafer to take place the offset at the in-process that carries out the grinding plate, prevent that wafer in-process outside periphery is impaired, but this device is in-process, the mill will produce high temperature and sweeps with the wafer friction, do not have effectual processing to fall not only to influence and the air quality and can influence the edging.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide an edge grinding machine for semiconductor wafer processing to solve the above problems.

The utility model discloses a following technical scheme realizes above-mentioned purpose:

the utility model provides an edging machine for semiconductor wafer processing, includes the edging mechanism that is used for carrying out the edging to semiconductor wafer, is used for the edging in-process to carry out fixed establishment, feed table, ejection of compact platform to semiconductor wafer, ejection of compact platform one side is provided with the feed table, ejection of compact platform one side is provided with edging mechanism, edging mechanism front end is provided with fixed establishment still includes the mechanism of cooling that is used for cooling down and removes bits to semiconductor wafer edging in-process.

Preferably, the following components: the cooling mechanism comprises a water tank, a water pipe, a water pump, a first motor, a water pumping pipe, a gear, a first sucker, a first telescopic rod, a fixed block and a fixed plate, wherein the water tank is installed on one side of the feeding table, the first motor is installed at the front end of the water tank, the water pumping pipe is installed at the rear end of the first motor, the gear is installed above the water pumping pipe, the gear is arranged above the water pump, the water pump is arranged on one side of the water pipe, the first telescopic rod is installed on one side of the water pipe, the fixed block is installed at the fixed end of the first telescopic rod, the fixed plate is installed at the telescopic end of the first telescopic rod, and the first sucker is installed below the fixed plate.

Preferably, the following components: edging mechanism includes second motor, ring gear, screw axis, dead lever, sliding block, second telescopic link, third motor, mill, the dead lever sets up the basin top, the screw axis is installed dead lever one side, the screw axis rear side is installed the ring gear, the ring gear opposite side is installed the second motor, second motor front end is provided with the sliding block, install the sliding block top the third motor, install third motor one side the second telescopic link, third motor front end is provided with the mill.

Preferably, the following components: the fixing mechanism comprises a fourth motor, a belt, a second sucker and a rotating block, the fourth motor is arranged at the front end of the water tank, the belt is arranged at the rear end of the fourth motor, the second sucker is arranged above the belt, and the rotating block is arranged below the second sucker.

Preferably, the following components: the first motor is connected with the water tank through a bolt, the water pump is connected with the water tank through rotation, the fixed end of the first telescopic rod is fixedly connected with the fixed block, and the telescopic end of the first telescopic rod is fixedly connected with the fixed block.

Preferably, the following components: the sliding block with the dead lever passes through sliding connection, the second telescopic link stiff end with the sliding block passes through fixed connection, the flexible end of second telescopic link with the third motor passes through fixed connection.

Preferably, the following components: the second sucker is fixedly connected with the rotating block.

Compared with the prior art, the beneficial effects of the utility model are as follows: be provided with a cooling mechanism, carry out water spray treatment to its wafer at the edging in-process, the purpose that reaches the cooling that can be better, and the dust is fallen with the piece to the clearance that can also be better and air circumstance pollution is avoided, the better purpose that reaches energy-concerving and environment-protective of hydroenergy recycle.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a perspective view of an edge grinding machine for semiconductor wafer processing according to the present invention;

fig. 2 is a partial part diagram of a cooling mechanism of an edge grinding machine for semiconductor wafer processing according to the present invention;

fig. 3 is a partial part diagram of an edge grinding mechanism of an edge grinding machine for semiconductor wafer processing according to the present invention;

fig. 4 is a partial part diagram of a fixing mechanism of an edge grinding machine for semiconductor wafer processing according to the present invention.

The reference numerals are illustrated below:

1. a cooling mechanism; 11. a water tank; 12. a water pipe; 13. a water pump; 14. a first motor; 15. a water pumping pipe; 16. a gear; 17. a first suction cup; 18. a first telescopic rod; 19. a fixed block; 110. a fixing plate; 2. an edge grinding mechanism; 21. a second motor; 22. a ring gear; 23. a screw shaft; 24. fixing the rod; 25. a slider; 26. a second telescopic rod; 27. a third motor; 28. a grinding disc; 3. a fixing mechanism; 31. a fourth motor; 32. a belt; 33. a second suction cup; 34. rotating the block; 4. a feeding table; 5. a discharging platform.

Detailed Description

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate a number of the indicated technical features. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The present invention will be further explained with reference to the accompanying drawings:

as shown in fig. 1-4, an edge grinding machine for processing a semiconductor wafer comprises an edge grinding mechanism 2 for grinding an edge of the semiconductor wafer, a fixing mechanism 3 for fixing the semiconductor wafer in the edge grinding process, a feeding table 4 and a discharging table 5, wherein the feeding table 4 is arranged on one side of the discharging table 5, the edge grinding mechanism 2 is arranged on one side of the discharging table 5, the fixing mechanism 3 is arranged at the front end of the edge grinding mechanism 2, and the edge grinding machine further comprises a cooling mechanism 1 for cooling and removing chips in the edge grinding process of the semiconductor wafer;

in this embodiment: the cooling mechanism 1 comprises a water tank 11, a water pipe 12, a water pump 13, a first motor 14, a water pumping pipe 15, a gear 16, a first suction disc 17, a first telescopic rod 18, a fixing block 19, a fixing plate 110, the water tank 11 is installed on one side of a feeding table 4, the first motor 14 is installed at the front end of the water tank 11, the water pumping pipe 15 is installed at the rear end of the first motor 14, the gear 16 is installed above the water pumping pipe 15, the water pump 13 is arranged above the gear 16, the water pipe 12 is arranged on one side of the water pump 13, the first telescopic rod 18 is installed on one side of the water pipe 12, the fixing block 19 is installed at the fixed end of the first telescopic rod 18, the fixing plate 110 is installed at the telescopic end of the first telescopic rod 18, the first suction disc 17 is installed below the fixing plate 110, the first motor 14 rotates to drive the gear 16 to rotate, the gear 16 then drives the water pump 13 to rotate, then the first suction disc 17 to rotate, the discharging table 5 is turned to the upper side, then the telescopic end of the first telescopic rod 18 begins to stretch out, then the first suction disc 17 is driven to move downwards, and the semiconductor wafer moved to the upper side of the discharging table 5 to be adsorbed.

In this embodiment: the edging mechanism 2 comprises a second motor 21, a gear ring 22, a screw shaft 23, a fixing rod 24, a sliding block 25, a second telescopic rod 26, a third motor 27 and a grinding disc 28, the fixing rod 24 is arranged above the water tank 11, the screw shaft 23 is arranged on one side of the fixing rod 24, the gear ring 22 is arranged on the rear side of the screw shaft 23, the second motor 21 is arranged on the other side of the gear ring 22, the sliding block 25 is arranged at the front end of the second motor 21, the third motor 27 is arranged above the sliding block 25, the second telescopic rod 26 is arranged on one side of the third motor 27, the grinding disc 28 is arranged at the front end of the third motor 27, the gear ring 22 is driven to rotate through the rotation of the second motor 21, the gear ring 22 drives the screw shaft 23 to rotate, the sliding block 25 can slide back and forth, the front and back edging position is adjusted to be proper, and the telescopic end of the second telescopic rod 26 begins to stretch out and draw back, so that the third motor 27 can be adjusted to be at the right and left edging position.

In this embodiment: the fixing mechanism 3 comprises a fourth motor 31, a belt 32, a second suction cup 33 and a rotating block 34, the fourth motor 31 is arranged at the front end of the water tank 11, the belt 32 is arranged at the rear end of the fourth motor 31, the second suction cup 33 is installed above the belt 32, the rotating block 34 is arranged below the second suction cup 33, and the fourth motor 31 starts to rotate and drives the rotating block 34 to rotate through the belt 32 so as to drive the second suction cup 33 and the semiconductor wafer to rotate and conduct all-dimensional edge grinding.

In this embodiment: first motor 14 passes through bolted connection with basin 11, water pump 13 is connected through rotating with basin 11, 18 stiff ends of first telescopic link pass through fixed connection with

fixed block

19, 18 flexible ends of first telescopic link pass through fixed connection with fixed plate 110, water pump 13 begins to draw water from basin 11 through drinking-water pipe 15, spout on the semiconductor wafer of edging from water pipe 12, reach the effect of cooling and removing the bits, basin 11 is got back to again to the water that falls, and the cycle is used, practices thrift the environmental protection.

In this embodiment: sliding block 25 passes through sliding connection with dead lever 24, and second telescopic link 26 stiff end passes through fixed connection with sliding block 25, and the flexible end of second telescopic link 26 passes through fixed connection with third motor 27, rotates through third motor 27 and drives the rotation of mill 28 and begin to carry out the edging.

In this embodiment: the second suction cup 33 is fixedly connected with the rotating block 34, starts to rotate through the fourth motor 31, drives the rotating block 34 to rotate through the belt 32, and then drives the second suction cup 33 and the semiconductor wafer to rotate so as to carry out all-dimensional edge grinding.

The working principle is as follows: firstly, a semiconductor wafer to be edge-ground is placed above a discharge table 5, then a first motor 14 starts to rotate to drive a gear 16 to rotate, the gear 16 then drives a water pump 13 to rotate, the water pump 13 drives a fixed block 19 and a first telescopic rod 18 which are installed around the fixed block to rotate, the first telescopic rod 18 drives a fixed plate 110 at a telescopic end to rotate, the fixed plate 110 drives the first suction disc 17 to rotate, the fixed plate turns to the position above the discharge table 5, then the telescopic end of the first telescopic rod 18 starts to extend to drive the first suction disc 17 to move downwards to be adsorbed above the semiconductor wafer in the discharge table 5, after adsorption is completed, the telescopic end of the first telescopic rod 18 retracts, then the first motor 14 rotates to drive the first suction disc 17 and the adsorbed semiconductor wafer to rotate, the telescopic end of the first telescopic rod 18 extends to drive the first suction disc 17 and the semiconductor wafer to descend to a second suction disc 33, then the second suction disc 33 starts to adsorb and fix the semiconductor wafer, the first suction disc 17 restores to the original position, then the second motor 21 rotates to drive a gear ring 22 to rotate, the gear ring 22 to adjust the front and back, then the water pump 25 can slide to a proper position to the front and back to a proper position to grind the edge, then the water pump 13 to rotate, and back, then the water tank can drive a water pump 13 to rotate, after the water tank to rotate, the water pump 13 to drive a water tank to rotate, the water pump 13 to rotate, after the telescopic end to rotate, the telescopic pipe to rotate to drive the water pump 33 to rotate, the falling water returns to the water tank 11 again for recycling, the water is saved and environment-friendly, and finally after the edge grinding is finished, the first telescopic rod 18 continues to drive the first sucking disc 17 and the semiconductor wafer to rotate to the feeding table 4, and the edge grinding process is finished.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention.

Claims

1. The utility model provides an edging machine for semiconductor wafer processing, includes edging mechanism (2) that are used for carrying out the edging to semiconductor wafer, be used for the edging in-process to carry out fixed establishment (3), feeding platform (4), ejection of compact platform (5) one side is provided with feeding platform (4), ejection of compact platform (5) one side is provided with edging mechanism (2), edging mechanism (2) front end is provided with fixed establishment (3), its characterized in that: the device also comprises a cooling mechanism (1) for cooling and removing scraps in the edge grinding process of the semiconductor wafer;

cooling mechanism (1) includes basin (11), water pipe (12), water pump (13), first motor (14), drinking-water pipe (15), gear (16), first suction disc (17), first telescopic link (18), fixed block (19), fixed plate (110), basin (11) are installed feed table (4) one side, first motor (14) are installed basin (11) front end, install first motor (14) rear end drinking-water pipe (15), install drinking-water pipe (15) top gear (16), gear (16) top is provided with water pump (13), water pump (13) one side is provided with water pipe (12), install water pipe (12) one side first telescopic link (18), install first telescopic link (18) stiff end fixed block (19), install the flexible end of first telescopic link (18) fixed plate (110), install fixed plate (110) below first suction disc (17).

2. An edge grinding machine for semiconductor wafer processing according to claim 1, wherein: edging mechanism (2) include second motor (21), ring gear (22), screw axis (23), dead lever (24), sliding block (25), second telescopic link (26), third motor (27), mill (28), dead lever (24) set up basin (11) top, screw axis (23) are installed dead lever (24) one side, install screw axis (23) rear side ring gear (22), install ring gear (22) opposite side second motor (21), second motor (21) front end is provided with sliding block (25), install sliding block (25) top third motor (27), install third motor (27) one side second telescopic link (26), third motor (27) front end is provided with mill (28).

3. An edge grinding machine for semiconductor wafer processing according to claim 1, wherein: fixing mechanism (3) include fourth motor (31), belt (32), second sucking disc (33), turning block (34), fourth motor (31) set up basin (11) front end, belt (32) set up fourth motor (31) rear end, install belt (32) top second sucking disc (33), second sucking disc (33) below is provided with turning block (34).

4. An edge grinding machine for semiconductor wafer processing according to claim 1, wherein: the water tank is characterized in that the first motor (14) is connected with the water tank (11) through a bolt, the water pump (13) is connected with the water tank (11) in a rotating mode, the fixed end of the first telescopic rod (18) is fixedly connected with the fixed block (19), and the telescopic end of the first telescopic rod (18) is fixedly connected with the fixed plate (110).

5. An edger machine for semiconductor wafer processing according to claim 2, wherein: sliding block (25) with dead lever (24) are through sliding connection, second telescopic link (26) stiff end with sliding block (25) are through fixed connection, the flexible end of second telescopic link (26) with third motor (27) are through fixed connection.

6. An edge grinding machine for semiconductor wafer processing according to claim 3, wherein: the second sucker (33) is fixedly connected with the rotating block (34).