CN115547894A - A wash polishing all-in-one for wafer production and processing - Google Patents
A wash polishing all-in-one for wafer production and processing Download PDFInfo
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- CN115547894A CN115547894A CN202211417021.4A CN202211417021A CN115547894A CN 115547894 A CN115547894 A CN 115547894A CN 202211417021 A CN202211417021 A CN 202211417021A CN 115547894 A CN115547894 A CN 115547894A
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- 238000005498 polishing Methods 0.000 title claims abstract description 101
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000004140 cleaning Methods 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 239000007921 spray Substances 0.000 claims description 19
- 238000013016 damping Methods 0.000 claims description 11
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 7
- 238000010009 beating Methods 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 67
- 230000000694 effects Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a cleaning and polishing integrated machine for wafer production and processing, which is applied to the technical field of wafer polishing.
Description
Technical Field
The invention belongs to the technical field of wafer polishing, and particularly relates to a cleaning and polishing integrated machine for wafer production and processing.
Background
According to the processing procedure and specification requirements of wafer production, various situations are encountered when polishing the wafer, but the situations are not limited to the following one, and more specifically, the wafer needs to be fixed on a support and polished by a polishing sheet of a polishing head during wafer production.
And the polishing effect directly determines the smoothness of the produced surface of the wafer, thereby affecting the quality of finished products, but in the prior art, when the wafer is produced and processed, the taking and placing of the wafer are troublesome, the efficiency is low, hard impurities may be adhered to the surface of the wafer before and after the polishing process, and the impurities may scratch the wafer during polishing.
According to the two problems mentioned above, we find that the wafer polishing machines on the market are difficult to avoid the problems at the same time, and even if the problems can be solved, extra processes are required to be added for operation, so that the required effect cannot be achieved, and therefore, the integrated wafer production and polishing machine which can clean the surfaces of wafers before and after polishing and has high polishing efficiency is provided.
Disclosure of Invention
The invention aims to solve the problem that the existing cleaning and polishing integrated machine for wafer production and processing has the advantages that the surface of a wafer can be cleaned before and after polishing, and the polishing efficiency is higher.
The technical purpose of the invention is realized by the following technical scheme: the utility model provides a wash polishing all-in-one for wafer production and processing, includes the base, the left side bolt at base top has the grudging post, the bottom bolt of grudging post has runner assembly, the top of base is provided with the working disc, the inboard of working disc is provided with polishing assembly, the front side bolt of working disc has vice piece, the top of vice piece is rotated and is connected with the damping pivot, the outside of damping pivot is rotated and is connected with the horizontal pole, the inboard bolt of horizontal pole has the drip fill.
Adopt above-mentioned technical scheme, through setting up base cooperation grudging post, support the structure, the working disc of setting is used for installing polishing subassembly, and the polishing subassembly of setting is used for fixing and driving its rotation to being processed the wafer and polishes, and the turned angle of removal horizontal pole can be convenient for to vice piece cooperation damping pivot of setting, and the dropping liquid hopper of setting can be convenient for drop polishing liquid on the different positions of structure.
The invention is further configured to: the polishing assembly comprises a main driving motor, the main driving motor is bolted to the top of the base, a connecting shaft is bolted to the end portion of an output shaft of the main driving motor, a polishing disc is bolted to the outer side of the connecting shaft, and the outer side of the polishing disc is rotatably connected with the working disc.
By adopting the technical scheme, the main driving motor is arranged, so that the grinding disc can be driven to rotate through the connecting shaft, and the effect of polishing the wafer material on the surface of the grinding disc is achieved.
The invention is further configured to: the bottom bolt of working disc has the pole setting, the bottom and the base bolt of pole setting, the top of polishing dish bonds there is magnetic force piece gum, the top of magnetic force piece gum bonds there is the polishing film, the top of polishing film bonds there is the polishing pad, the outside of polishing dish is provided with the sealing washer, the outside and the working disc in close contact with of sealing washer.
Adopt above-mentioned technical scheme, through setting up the pole setting, can be convenient for install the top at the base with the working disc, the magnetic force piece gum that sets up is used for the cooperation to grind the film and installs the polishing pad to in order to carry out the polishing operation, the sealing washer is avoided the liquid that drips on the polishing pad to permeate the bottom of working disc.
The invention is further configured to: the rotating assembly comprises a cylinder, the top of the cylinder is bolted with the vertical frame, the end part of a telescopic shaft of the cylinder is bolted with a bottom shell, and a carrier assembly is arranged on the inner side of the bottom shell.
By adopting the technical scheme, the air cylinder is arranged, so that the bottom shell and the internal structure can be conveniently pushed to move along the vertical direction, and the arranged slide glass component is used for installing, fixing and driving the wafer to rotate.
The invention is further configured to: the slide glass component comprises an electric telescopic cylinder, the top of the electric telescopic cylinder is in bolted connection with the top of the inner side of the bottom shell, the telescopic end of the electric telescopic cylinder is in bolted connection with a driving motor, and the output end of the driving motor is in bolted connection with a contact component.
By adopting the technical scheme, the bottom shell can be conveniently pushed by arranging the electric telescopic cylinder, and the arranged driving motor can be convenient for driving the contact assembly to rotate, so that the wafer fixed inside the contact assembly rotates.
The invention is further configured to: the contact assembly comprises a contact shell, the top of the contact shell is bolted with the telescopic end of the electric telescopic cylinder, the inner side of the contact shell is connected with a sliding rod in a sliding mode, the bottom of the sliding rod is bolted with a wafer carrying disc, the inner side of the contact shell is provided with an inner framework, and the inner side of the inner framework is bolted with a wafer taking assembly.
Adopt above-mentioned technical scheme, through setting up the contact shell, can be convenient for support slide bar and slide glass dish, the setting of slide bar can be convenient for be close to or keep away from slide glass dish so that fix or absorb operations such as the wafer when the contact shell moves along the vertical direction.
The invention is further configured to: the sheet taking assembly comprises a sheet taking shell, the outer side of the sheet taking shell is bolted with the inner side of an inner framework, a compression spring is bolted at the top of the inner side of the sheet taking shell, a top narrow plate is bolted at the bottom of the compression spring, a middle plate is arranged at the bottom of the top narrow plate, a bottom narrow plate is arranged at the bottom of the middle plate, the top of the bottom narrow plate is bolted with the middle plate, the top of the middle plate and the top narrow plate through stand columns, an air pump is bolted at the top of the middle plate, a vent pipe is bolted at the rear side of the air pump, one side of the vent pipe, far away from the air pump, penetrates through the bottom of the middle plate and the bottom narrow plate to the bottom narrow plate and is bolted with a sucker, and the top of the sucker is bolted with the bottom of the bottom narrow plate.
Adopt above-mentioned technical scheme, get piece shell and compression spring cooperation through the setting, can connect the narrow dish in top, well dish and the bottom narrow dish of connecting through the stand, the air pump of setting can be convenient for extract the gas in the sucking disc through the breather pipe, make the sucking disc can adsorb in order to suck up the wafer on glossy wafer surface, can put down the wafer when exhausting, and the electronic telescoping cylinder drives the structure whereabouts when carrying out the polishing operation, the sucking disc supports and presses the top of wafer at the dish of polishing, so that polish the wafer.
The invention is further configured to: the top of the top narrow plate is bolted with a limiting telescopic rod, the top of the limiting telescopic rod is bolted with the piece taking shell, and the inner side of the contact shell is bolted with a fan.
By adopting the technical scheme, the moving position of the top narrow disc can be conveniently limited by arranging the limiting telescopic rod, and the arranged fan can be used for blowing off the surface moisture of the wafer after the top of the wafer is cleaned so as to avoid water stain.
The invention is further configured to: the surface bolt of bottom shell has the spray rinsing frame, the inboard bolt of spray rinsing frame has the shower nozzle, the top bolt of shower nozzle has the water service pipe, the outside joint of water service pipe has the pipe support, the top and the grudging post bolt of pipe support, the inboard bolt of grudging post has the liquid pump, one side and the water service pipe bolt that the liquid pump is close to the water service pipe.
Adopt above-mentioned technical scheme, through setting up the spray rinsing frame, can be convenient for support the shower nozzle, the water service pipe that sets up cooperates the liquid pump to extract the cleaning solution and spray required clear wafer surface through the shower nozzle, and the pipe support that sets up can be convenient for install the water service pipe to avoid the water service pipe flagging.
The invention is further configured to: the inner side of the working disc is provided with a leakage groove, the outer side of the working disc is connected with a discharge pipe in a bolted mode, the discharge pipe is arranged on the outer side of the leakage groove, and one side, far away from the leakage groove, of the discharge pipe is connected with a one-way valve in a bolted mode.
By adopting the technical scheme, the leakage groove is arranged, so that the accumulated liquid in the working disc can be conveniently led out and discharged through the discharge pipe, and the control can be performed through the one-way valve when the liquid is discharged.
In conclusion, the invention has the following beneficial effects:
through setting up base cooperation grudging post, support the structure, the working disc of setting is used for installing polishing assembly, polishing assembly of setting is used for fixing and driving its rotation to polish by the processing wafer, and vice piece cooperation damping pivot of setting, the turned angle of horizontal pole can be convenient for remove, the dropping liquid fill of setting can be convenient for drop polishing solution on the different positions of structure, cylinder among the rotating assembly is convenient for promote bottom shell and overall rising of inner structure or whereabouts, slide glass subassembly of setting can be convenient for carry on spacing and drive rotatory effect to the wafer, cooperation main drive motor drives pivoted polishing dish and plays better polishing effect, the liquid pump of setting can be convenient for extract the cleaning solution and lead to the fish tail to the wafer when the polishing of turn-over is avoided its surface to have impurity to adhere to lead to the polishing to non-polishing face in order to clean.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the bottom housing construction of the present invention;
FIG. 3 is a schematic structural view of a slide assembly of the present invention;
FIG. 4 is a schematic view of the contact assembly of the present invention;
FIG. 5 is a schematic view of the present invention showing the structure of the film taking assembly;
FIG. 6 is a schematic diagram of the polishing assembly of the present invention;
FIG. 7 is a schematic view of a contact housing construction of the present invention;
FIG. 8 is a schematic view of a contact shell configuration of the present invention;
fig. 9 is an enlarged view of a portion a of fig. 6 according to the present invention.
Reference numerals: 1. a base; 2. erecting a frame; 3. a rotating assembly; 301. a cylinder; 302. a bottom housing; 303. a slide assembly; 3031. an electric telescopic cylinder; 3032. a drive motor; 3033. a contact assembly; 331. a contact housing; 332. a slide bar; 333. a slide tray; 334. an inner frame; 335. a film taking assembly; 351. taking the slice shell; 352. a compression spring; 353. a top narrow plate; 354. a middle disc; 355. a bottom narrow plate; 356. a column; 357. an air pump; 358. a breather pipe; 359. a suction cup; 4. a working plate; 5. a polishing assembly; 501. a main drive motor; 502. a connecting shaft; 503. grinding disc; 6. a secondary block; 7. a damping rotating shaft; 8. a cross bar; 9. a drip hopper; 10. erecting a rod; 11. carrying out gum application on the magnetic sheet; 12. grinding and polishing the negative plate; 13. a polishing pad; 14. a seal ring; 15. limiting the telescopic rod; 16. a fan; 17. a spray rinsing rack; 18. a spray head; 19. a water pipe; 20. a pipe frame; 21. a liquid pump; 22. a leak groove; 23. a discharge pipe; 24. a one-way valve.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example 1:
referring to fig. 1-5, a cleaning and polishing all-in-one machine for wafer production and processing comprises a base 1, wherein a vertical frame 2 is bolted on the left side of the top of the base 1, a rotating assembly 3 is bolted on the bottom of the vertical frame 2, the structure is supported by arranging the base 1 to be matched with the vertical frame 2, and the rotating assembly 3 is used for limiting a wafer and driving the wafer to rotate.
As shown in fig. 1, the rotating assembly 3 includes a cylinder 301, the top of the cylinder 301 is bolted to the stand 2, the end of the telescopic shaft of the cylinder 301 is bolted to a bottom housing 302, a slide assembly 303 is disposed inside the bottom housing 302, the bottom housing 302 and the internal structure can be pushed to move along the vertical direction conveniently by disposing the cylinder 301, and the slide assembly 303 is used for mounting, fixing and driving the wafer.
As shown in fig. 3, the slide glass assembly 303 includes an electric telescopic cylinder 3031, the top of the electric telescopic cylinder 3031 is bolted to the top of the inner side of the bottom housing 302, a driving motor 3032 is bolted to the telescopic end of the electric telescopic cylinder 3031, and a contact assembly 3033 is bolted to the output end of the driving motor 3032, the bottom housing 302 can be conveniently pushed by the arrangement of the electric telescopic cylinder 3031, and the arranged driving motor 3032 can conveniently drive the contact assembly 3033 to rotate, so that a wafer fixed inside the contact assembly 3033 rotates.
As shown in fig. 4, the contact assembly 3033 includes a contact housing 331, a top of the contact housing 331 is bolted to a telescopic end of the telescopic cylinder 3031, a sliding rod 332 is slidably connected to an inner side of the contact housing 331, a slide tray 333 is bolted to a bottom of the sliding rod 332, an inner frame 334 is disposed on the inner side of the contact housing 331, a wafer picking assembly 335 is bolted to an inner side of the inner frame 334, the contact housing 331 is disposed to facilitate supporting the sliding rod 332 and the slide tray 333, and the sliding rod 332 is disposed to facilitate approaching or separating from the slide tray 333 when the contact housing 331 moves along a vertical direction to facilitate fixing or sucking operations on a wafer.
As shown in fig. 5, the pick-up assembly 335 includes a pick-up housing 351, an outer side of the pick-up housing 351 is bolted to an inner side of the inner frame 334, a top portion of the inner side of the pick-up housing 351 is bolted to a compression spring 352, a bottom portion of the compression spring 352 is bolted to a top narrow plate 353, a bottom portion of the top narrow plate 353 is provided with a bottom narrow plate 355, a top portion of the bottom narrow plate 355 is bolted to the middle plate 354, the top portion of the middle plate 354 and the top narrow plate 353 are all bolted through a column 356, a top portion of the middle plate 354 is bolted to a gas pump 357, a rear side of the gas pump 357 is bolted to a gas vent pipe, a side of the gas vent pipe 358 far away from the gas pump 357 penetrates through the middle plate 354 and the bottom narrow plate 355 to the bottom of the bottom narrow plate 355 and is bolted to a suction cup 359, a top portion of the suction cup 359 is bolted to the bottom narrow plate 355, the top narrow plate 353, the top narrow plate 354, the bottom narrow plate 355 and the compression spring 352 cooperate to facilitate a wafer sucking up the gas from the gas pump 358 to polish the wafer surface of the wafer while the wafer is pressed against the suction cup 359, and the wafer is polished.
As shown in fig. 5, the top of the top narrow plate 353 is bolted with a limiting telescopic rod 15, the top of the limiting telescopic rod 15 is bolted with the sheet taking shell 351, the inner side of the contact shell 331 is bolted with a fan 16, the limiting telescopic rod 15 is arranged, the moving position of the top narrow plate 353 can be conveniently limited, and the arranged fan 16 can be used for conveniently blowing off the surface moisture of the wafer after the top of the wafer is cleaned so as to avoid water stain.
The using process is briefly described as follows: when the wafer polishing device is used, the wafer carrying disc 333 is firstly contacted with the surface of the polishing pad 13, then a wafer sheet to be polished is placed in a groove formed in the inner side of the wafer carrying disc 333, then the electric telescopic cylinder 3031 falls, the driving motor 3032 drives the bottom shell 302 to rotate while pushing the bottom shell 302, the sliding rod 332 moves along the contact shell 331 when the contact shell 331 falls, the sucking disc 359 of the wafer taking assembly 335 is pressed against the surface of the wafer, the compression spring 352 is compressed when the force is continuously applied, the wafer is prevented from being excessively extruded, and the wafer is driven to rotate by the driving motor 3032 when the structure at the bottom of the wafer rotates, so that the polishing effect is better.
Example 2:
referring to fig. 1-9, a cleaning and polishing all-in-one machine for wafer production and processing, including base 1, the top of base 1 is provided with work disc 4, the inboard of work disc 4 is provided with polishing subassembly 5, the front side bolt of work disc 4 has vice piece 6, the top of vice piece 6 is rotated and is connected with damping pivot 7, the outside of damping pivot 7 is rotated and is connected with horizontal pole 8, the inboard bolt of horizontal pole 8 has drip fill 9, be used for fixing by setting up polishing subassembly 5 and drive its rotation and polish by polishing to the wafer being processed, vice piece 6 cooperation damping pivot 7 of setting, can be convenient for remove the turned angle of horizontal pole 8, drip fill 9 of setting can be convenient for drip polishing liquid on the different positions of structure.
As shown in fig. 6, the polishing assembly 5 includes a main driving motor 501, the main driving motor 501 is bolted on the top of the base 1, a connecting shaft 502 is bolted on an end portion of an output shaft of the main driving motor 501, a polishing disc 503 is bolted on an outer side of the connecting shaft 502, the outer side of the polishing disc 503 is rotatably connected with the working disc 4, and by arranging the main driving motor 501, the connecting shaft 502 can be used for driving the polishing disc 503 to rotate, so as to achieve an effect of polishing the wafer material on the surface of the polishing disc 503.
As shown in fig. 1 and 6, a vertical rod 10 is bolted to the bottom of the working disk 4, the bottom of the vertical rod 10 is bolted to the base 1, a magnetic sheet back adhesive 11 is bonded to the top of the polishing disk 503, a polishing bottom sheet 12 is bonded to the top of the magnetic sheet back adhesive 11, a polishing pad 13 is bonded to the top of the polishing bottom sheet 12, a sealing ring 14 is arranged on the outer side of the polishing disk 503, the outer side of the sealing ring 14 is in close contact with the working disk 4, the working disk 4 can be conveniently mounted on the top of the base 1 by arranging the vertical rod 10, the arranged magnetic sheet back adhesive 11 is used for being matched with the polishing bottom sheet to mount the polishing pad 13 so as to facilitate polishing operation, and the sealing ring 14 prevents liquid dropping from the polishing pad 13 from permeating to the bottom of the working disk 4.
As shown in fig. 2, the surface of the bottom housing 302 is bolted with the spray frame 17, the spray head 18 is bolted on the inner side of the spray frame 17, the water service pipe 19 is bolted on the top of the spray head 18, the pipe frame 20 is fastened on the outer side of the water service pipe 19, the top of the pipe frame 20 is bolted with the vertical frame 2, the inner side of the vertical frame 2 is bolted with the liquid pump 21, one side of the liquid pump 21 close to the water service pipe 19 is bolted with the water service pipe 19, through the arrangement of the spray frame 17, the spray head 18 can be conveniently supported, the arranged water service pipe 19 is matched with the liquid pump 21 to draw cleaning liquid and spray the cleaning liquid to the wafer surface required to be cleaned through the spray head 18, the arranged pipe frame 20 can be conveniently used for installing the water service pipe 19 so as to avoid the water service pipe 19 from drooping.
As shown in figure 1, a leakage groove 22 is formed in the inner side of the working disk 4, a discharge pipe 23 is bolted to the outer side of the working disk 4, the discharge pipe 23 is arranged on the outer side of the leakage groove 22, a check valve 24 is bolted to one side, far away from the leakage groove 22, of the discharge pipe 23, the accumulated liquid in the working disk 4 is conveniently led out through the leakage groove 22 and is discharged through the discharge pipe 23, and the discharge can be controlled through the check valve 24.
The using process is briefly described as follows: before polishing, firstly, the magnetic sheet back adhesive 11 is adhered to the polishing disc 503, and then, the polishing bottom sheet 12 and the polishing pad 13 are adhered to the magnetic sheet back adhesive, during polishing, the main driving motor 501 drives the polishing disc 503 to rotate in the working disc 4 through the connecting shaft 502, so as to achieve the polishing effect on the wafer thereon, during polishing, the polishing liquid can drop onto the polishing pad 13 through the liquid dropping hopper 9, the dropping position can be adjusted by rotating the cross rod 8 through the damping rotating shaft 7, the spray head 18 arranged on the spray washing frame 17 when the electric telescopic cylinder 3031 drives the bottom structure to rise after single-side polishing can extract the cleaning liquid through the spray pipe and the liquid pump 21 externally connected with the cleaning liquid to clean the unpolished surface of the wafer, so that impurities on the surface of the wafer during the turnover polishing of the wafer affect the polishing efficiency, and accumulated working liquid generated during operation can leak out from the inside of the leakage groove 22 and be discharged through the discharge pipe 23 and the one-way valve 24.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (10)
1. A cleaning and polishing all-in-one machine for wafer production and processing comprises a base (1), and is characterized in that: the left side bolt at base (1) top has connect grudging post (2), the bottom bolt of grudging post (2) has connect rotating assembly (3), the top of base (1) is provided with work dish (4), the inboard of work dish (4) is provided with polishing subassembly (5), the front side bolt of work dish (4) has vice piece (6), the top of vice piece (6) is rotated and is connected with damping pivot (7), the outside of damping pivot (7) is rotated and is connected with horizontal pole (8), the inboard bolt of horizontal pole (8) has drip fill (9).
2. The integrated cleaning and polishing machine for wafer production and processing as claimed in claim 1, wherein: the polishing assembly (5) comprises a main driving motor (501), the main driving motor (501) is bolted to the top of the base (1), the end part of an output shaft of the main driving motor (501) is bolted with a connecting shaft (502), the outer side of the connecting shaft (502) is bolted with a polishing disc (503), and the outer side of the polishing disc (503) is rotationally connected with the working disc (4).
3. The integrated cleaning and polishing machine for wafer production and processing as claimed in claim 2, wherein: the bottom bolt of working disc (4) has pole setting (10), the bottom and base (1) bolt of pole setting (10), the top of beating mill (503) bonds there is magnetic sheet gum (11), the top of magnetic sheet gum (11) bonds and grinds and throw film (12), the top of grinding and throwing film (12) bonds and has polishing pad (13), the outside of beating mill (503) is provided with sealing washer (14), the outside and working disc (4) in close contact with of sealing washer (14).
4. The integrated cleaning and polishing machine for wafer production and processing as claimed in claim 1, wherein: the rotating assembly (3) comprises a cylinder (301), the top of the cylinder (301) is bolted with the stand (2), the end part of a telescopic shaft of the cylinder (301) is bolted with a bottom shell (302), and a carrier assembly (303) is arranged on the inner side of the bottom shell (302).
5. The integrated cleaning and polishing machine for wafer production and processing as claimed in claim 4, wherein: the slide glass assembly (303) comprises an electric telescopic cylinder (3031), the top of the electric telescopic cylinder (3031) is bolted with the top of the inner side of the bottom shell (302), the telescopic end of the electric telescopic cylinder (3031) is bolted with a driving motor (3032), and the output end of the driving motor (3032) is bolted with a contact assembly (3033).
6. The integrated cleaning and polishing machine for wafer production and processing as claimed in claim 5, wherein: the contact component (3033) comprises a contact shell (331), the top of the contact shell (331) is bolted with the telescopic end of the electric telescopic cylinder (3031), the inner side of the contact shell (331) is connected with a sliding rod (332) in a sliding mode, the bottom of the sliding rod (332) is bolted with a chip carrying disc (333), the inner side of the contact shell (331) is provided with an inner framework (334), and the inner side of the inner framework (334) is bolted with a chip taking component (335).
7. The integrated cleaning and polishing machine for wafer production and processing as claimed in claim 6, wherein: the sheet taking assembly (335) comprises a sheet taking outer shell (351), the outer side of the sheet taking outer shell (351) is bolted to the inner side of the inner framework (334), a compression spring (352) is bolted to the top of the inner side of the sheet taking outer shell (351), a top narrow disc (353) is bolted to the bottom of the compression spring (352), a middle disc (354) is arranged at the bottom of the top narrow disc (353), a bottom narrow disc (355) is arranged at the bottom of the middle disc (354), the top of the bottom narrow disc (355) and the middle disc (354), the top of the middle disc (354) and the top narrow disc (353) are all bolted through a stand column (356), a top of the middle disc (354) is bolted with a bottom narrow disc (357), a rear side of the air pump (357) is bolted with an air pipe (358), one side of the air pipe (358) far away from the air pump (357) penetrates through the middle disc (354) and the bottom narrow disc (355) to the bottom of the bottom narrow disc (355) and is bolted with a suction cup (359), and the top of the bottom of the air pump (359) is bolted with the bottom narrow disc (355).
8. The integrated cleaning and polishing machine for wafer production and processing as claimed in claim 7, wherein: the top of the top narrow plate (353) is bolted with a limiting telescopic rod (15), the top of the limiting telescopic rod (15) is bolted with the sheet taking shell (351), and the inner side of the contact shell (331) is bolted with a fan (16).
9. The integrated cleaning and polishing machine for wafer production and processing as claimed in claim 4, wherein: the surface bolt of bottom shell (302) has been connected spray rinsing frame (17), the inboard bolt of spray rinsing frame (17) has shower nozzle (18), the top bolt of shower nozzle (18) has water service pipe (19), the outside joint of water service pipe (19) has pipe support (20), the top and the grudging post (2) bolt of pipe support (20), the inboard bolt of grudging post (2) has liquid pump (21), one side and the water service pipe (19) bolt that liquid pump (21) are close to water service pipe (19).
10. The integrated cleaning and polishing machine for wafer production and processing as claimed in claim 1, wherein: a leakage groove (22) is formed in the inner side of the working disc (4), a discharge pipe (23) is bolted to the outer side of the working disc (4), the discharge pipe (23) is arranged on the outer side of the leakage groove (22), and a check valve (24) is bolted to one side, far away from the leakage groove (22), of the discharge pipe (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211417021.4A CN115547894A (en) | 2022-11-14 | 2022-11-14 | A wash polishing all-in-one for wafer production and processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211417021.4A CN115547894A (en) | 2022-11-14 | 2022-11-14 | A wash polishing all-in-one for wafer production and processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115547894A true CN115547894A (en) | 2022-12-30 |
Family
ID=84720338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211417021.4A Withdrawn CN115547894A (en) | 2022-11-14 | 2022-11-14 | A wash polishing all-in-one for wafer production and processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115547894A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117124163A (en) * | 2023-10-27 | 2023-11-28 | 南通恒锐半导体有限公司 | IGBT wafer back polishing machine |
-
2022
- 2022-11-14 CN CN202211417021.4A patent/CN115547894A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117124163A (en) * | 2023-10-27 | 2023-11-28 | 南通恒锐半导体有限公司 | IGBT wafer back polishing machine |
| CN117124163B (en) * | 2023-10-27 | 2024-01-26 | 南通恒锐半导体有限公司 | IGBT wafer back polishing machine |
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Application publication date: 20221230 |