CN110744424A - Section polishing machine for wafer processing - Google Patents
Section polishing machine for wafer processing Download PDFInfo
- Publication number
- CN110744424A CN110744424A CN201910998745.4A CN201910998745A CN110744424A CN 110744424 A CN110744424 A CN 110744424A CN 201910998745 A CN201910998745 A CN 201910998745A CN 110744424 A CN110744424 A CN 110744424A
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- CN
- China
- Prior art keywords
- polishing
- polisher
- motor
- workbench
- wafer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a tangent plane polishing machine for wafer processing, which structurally comprises a machine base, an inner cavity, a rotary table, a rotary shaft, a first motor, a workbench and a sliding groove, wherein the inner cavity is formed in the machine base, the workbench is vertically arranged above the machine base, the rotary table is vertically arranged at the central position of the workbench through the rotary shaft, the first motor is arranged in the middle of the inner cavity, and the tangent plane polishing machine has the advantages that: according to the invention, the moving device is arranged on the inner side of the workbench, and can move the polishing mechanism, so that wafers with different sizes can be conveniently processed; a polishing sheet is arranged in the fan-shaped polisher, burrs on the section of the wafer can be removed by the polishing sheet, an adsorption pipe is connected to the outer side of the fan-shaped polisher, and chips generated by polishing are conveyed into an external chip collection box from the adsorption pipe; the workbench is provided with a rubber sheet and a negative pressure groove, the negative pressure groove enables the wafer to be fixed on the rotating platform, so that the displacement phenomenon can not occur in the polishing process, and the rubber sheet prevents the bottom of the wafer from being scratched.
Description
Technical Field
The invention discloses a section polishing machine for wafer processing, and belongs to the technical field of wafer processing equipment.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is a basic material for manufacturing a semiconductor chip; various circuit element structures can be processed and manufactured on a silicon wafer to become an integrated circuit product with specific electrical functions, and the wafer has the following defects in the manufacturing process:
in the growth process of the wafer by the Czochralski method, the outer surface of a formed wafer rod has an uneven phenomenon, and burrs easily appear on the section of the wafer during cutting, so that polishing treatment is needed.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a section polishing machine for wafer processing so as to solve the problem.
In order to achieve the purpose, the invention is realized by the following technical scheme: a tangent plane burnishing machine for wafer processing structurally comprises a machine base, an inner cavity, a rotary table, a rotary shaft, a first motor, a workbench and sliding grooves, wherein the inner cavity is formed in the machine base, the workbench is vertically arranged above the machine base, the rotary table is vertically arranged at the center of the workbench through the rotary shaft, the first motor is arranged in the middle of the inner cavity and connected with the rotary shaft, and four groups of sliding grooves are uniformly and equidistantly formed in the periphery of the rotary table;
preferably, each sliding groove is provided with a polishing mechanism, a moving device is arranged in each sliding groove, and the bottom of each polishing mechanism is matched with the moving device through a supporting column.
Preferably, the polishing mechanism consists of a sector polisher and an adsorption device, wherein the adsorption device is arranged at the rear side of the sector polisher, and the sector polisher and the adsorption device are matched with each other.
Preferably, the sector polisher is composed of an arc polishing tank and a polishing sheet, and the polishing sheet is mounted on an inner arc side of the arc polishing tank.
Preferably, the adsorption device comprises an adsorption pipe, a connecting pipe, a suction machine and a connecting pipe, wherein the adsorption pipe is in a fan shape and is connected with the outer side of the arc-shaped polishing groove, the suction machine is connected with the adsorption pipe through the connecting pipe, and the connecting pipe is arranged on the suction machine.
Preferably, the moving device comprises a second motor, fixed blocks, a screw rod and a nut seat, the fixed blocks are symmetrically arranged and are arranged at the bottoms of the front side and the rear side of the sliding groove, the screw rod is arranged between the fixed blocks, one end of the screw rod, far away from the first motor, is connected with the second motor, and the nut seat is arranged on the screw rod.
Preferably, four groups of rubber sheets are arranged on the rotating table, and a negative pressure groove is formed in each rubber sheet.
Preferably, a negative pressure suction pump is arranged inside the rotating platform and connected with the negative pressure groove.
Preferably, the connecting pipe is connected to an external dust collecting tank via a hose.
Advantageous effects
The section polishing machine for wafer processing has the following beneficial effects:
according to the invention, the moving device is arranged on the inner side of the workbench, and can move the polishing mechanism, so that wafers with different sizes can be conveniently processed;
the fan-shaped polisher is internally provided with the polishing sheet, the polishing sheet can remove burrs on the section of a wafer, the outer side of the fan-shaped polisher is connected with the adsorption pipe, and chips generated by polishing are conveyed into an external chip collection box from the adsorption pipe;
according to the invention, the rubber sheet and the negative pressure groove are arranged on the workbench, the wafer is fixed on the rotating table through the negative pressure groove, so that the displacement phenomenon can not occur in the polishing process, and the rubber sheet can prevent the bottom of the wafer from being scratched.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic cross-sectional view of a front side of a section polishing machine for wafer processing according to the present invention;
FIG. 2 is a schematic top view of a section polisher for wafer processing according to the present invention;
FIG. 3 is a schematic view of the interior of a sector polisher according to the present invention;
FIG. 4 is a schematic view of an arcuate polishing trough according to the present invention;
FIG. 5 is a schematic top view of a turntable according to the present invention.
In the figure: the polishing machine comprises a machine base-1, an inner cavity-2, a rotating table-3, a rotating shaft-4, a first motor-5, a workbench-6, a sliding groove-7, a polishing mechanism-8, a supporting column-9, a moving device-11, a fan-shaped polisher-a, an adsorption device-b, an arc-shaped polishing groove-a 1, a polishing sheet-a 2, an adsorption tube-b 1, a connecting tube-b 2, a suction machine-b 3, a connecting tube-b 4, a second motor-111, a fixing block-112, a screw rod-113, a nut seat-114, a rubber sheet-e and a negative pressure groove-f.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1-5, the present invention provides a technical solution of a section polishing machine for wafer processing:
as shown in fig. 1 and 2, the structure of the device comprises a base 1, an inner cavity 2, a rotary table 3, a rotary shaft 4, a first motor 5, a workbench 6 and sliding grooves 7, wherein the inner cavity 2 is formed in the base 1, the workbench 6 is vertically arranged above the base 1, the rotary table 3 is vertically arranged at the center position of the workbench 6 through the rotary shaft 4, the first motor 5 is arranged in the middle of the inner cavity 2, the first motor 5 is connected with the rotary shaft 4, and four groups of sliding grooves 7 are uniformly and equidistantly formed around the rotary table 3;
wherein, every sliding tray 7 on all install polishing mechanism 8 and the inside mobile device 11 that is equipped with of sliding tray 7, polishing mechanism 8 bottom cooperatees with mobile device 11 through support column 9, the wafer is placed at revolving stage 3, polishing mechanism 8 all around is close to its tangent plane to the wafer and polishes.
The polishing mechanism 8 is composed of a fan-shaped polisher a and an adsorption device b, the adsorption device b is installed on the rear side of the fan-shaped polisher a and matched with the fan-shaped polisher a, and the adsorption device b adsorbs debris generated in the polisher a.
As shown in fig. 3 and 4, the sector polisher a is composed of an arc-shaped polishing groove a1 and a polishing sheet a2, the polishing sheet a2 is installed on the inner arc side of the arc-shaped polishing groove a1, the wafer rapidly rotates in the arc-shaped polishing groove a1 and contacts with the polishing sheet a2, and the polishing sheet a2 removes burrs from the cut surface of the wafer.
The adsorption device b comprises an adsorption pipe b1, a connecting pipe b2, a suction machine b3 and a connecting pipe b4, wherein the adsorption pipe b1 is fan-shaped and is connected with the outer side of the arc-shaped polishing groove a1, the suction machine b3 is connected with the adsorption pipe b1 through the connecting pipe b2, the suction machine b3 is provided with the connecting pipe b4, the suction machine b3 generates suction force, and the chips in the adsorption pipe b1 are adsorbed and conveyed into an external chip collecting box from the connecting pipe b 4.
As shown in fig. 1, the moving device 11 is composed of a second motor 111, fixed blocks 112, a screw 113 and a nut seat 114, the fixed blocks 112 are symmetrically arranged and installed at the bottom of the front and rear sides of the sliding groove 7, the screw 113 is arranged between the fixed blocks 112, one end of the screw 113 far away from the first motor 5 is connected with the second motor 111, the nut seat 114 is arranged on the screw 113, and the moving device 11 moves the polishing mechanism 8 to facilitate processing wafers with different sizes.
As shown in fig. 5, four groups of rubber sheets e are disposed on the turntable 3, a negative pressure groove f is formed in each rubber sheet e, and the wafer is fixed on the turntable 3 in the negative pressure groove f, so that the wafer is not displaced during the polishing process.
The wafer to be polished is placed in the middle of the rotary table 3, a negative pressure suction pump in the rotary table 3 generates suction, a negative pressure groove f on the rotary table 3 firmly sucks the bottom of the wafer, and the bottom of the wafer is tightly pressed with the rubber sheet e, so that the bottom of the wafer is prevented from being scratched; the screw 113 rotates to enable the nut seat 114 to drive the fan-shaped polisher a to approach the wafer, after the distance between the fan-shaped polisher a and the wafer is adjusted, the first motor 5 enables the rotating shaft 4 to drive the rotating table 3 to rotate, the wafer is enabled to rotate in the arc-shaped polishing groove a1, burrs on the section of the wafer are removed by the polishing sheet a2, and chips generated by polishing are adsorbed by chips in the adsorption tube b1 and are conveyed into an external chip collection box from the connection tube b 4.
The foregoing merely illustrates the principles and preferred embodiments of the invention and many variations and modifications may be made by those skilled in the art in light of the foregoing disclosure, which are intended to be within the scope of the invention.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A section polishing machine for wafer processing is characterized in that: the structure of the automatic welding machine comprises a machine base (1), an inner cavity (2), a rotating table (3), a rotating shaft (4), a first motor (5), a workbench (6) and sliding grooves (7), wherein the inner cavity (2) is formed in the machine base (1), the workbench (6) is vertically installed above the machine base (1), the rotating table (3) is vertically installed at the central position of the workbench (6) through the rotating shaft (4), the first motor (5) is arranged in the middle of the inner cavity (2), the first motor (5) is connected with the rotating shaft (4), and the four groups of sliding grooves (7) are uniformly and equidistantly formed in the periphery of the rotating table (3);
each sliding groove (7) is provided with a polishing mechanism (8), a moving device (11) is arranged in each sliding groove (7), and the bottom of each polishing mechanism (8) is matched with the moving device (11) through a supporting column (9).
2. The cutting plane polisher for wafer processing as claimed in claim 1 further comprising: the polishing mechanism (8) is composed of a fan-shaped polisher (a) and an adsorption device (b), wherein the adsorption device (b) is installed on the rear side of the fan-shaped polisher (a) and matched with the fan-shaped polisher (a).
3. The cutting plane polisher for wafer processing as set forth in claim 2 wherein: the sector polisher (a) is composed of an arc-shaped polishing tank (a 1) and a polishing sheet (a 2), and the polishing sheet (a 2) is installed on the inner arc side of the arc-shaped polishing tank (a 1).
4. The cutting plane polisher for wafer processing as set forth in claim 2 wherein: adsorption equipment (b) comprises adsorption tube (b 1), connecting pipe (b 2), suction machine (b 3), takeover (b 4), adsorption tube (b 1) is fan-shaped and is connected with arc polishing groove (a 1) outside, suction machine (b 3) is connected with adsorption tube (b 1) through connecting pipe (b 2), be equipped with takeover (b 4) on suction machine (b 3).
5. The cutting plane polisher for wafer processing as claimed in claim 1 further comprising: the moving device (11) is composed of a second motor (111), fixing blocks (112), a screw rod (113) and a nut seat (114), the fixing blocks (112) are symmetrically arranged and are arranged at the bottoms of the front side and the rear side of the sliding groove (7), the screw rod (113) is arranged between the fixing blocks (112), one end, far away from the first motor (5), of the screw rod (113) is connected with the second motor (111), and the nut seat (114) is arranged on the screw rod (113).
6. The cutting plane polisher for wafer processing as claimed in claim 1 further comprising: the turntable (3) is provided with four groups of rubber sheets (e), and a negative pressure groove (f) is formed in each rubber sheet (e).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910998745.4A CN110744424A (en) | 2019-10-21 | 2019-10-21 | Section polishing machine for wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910998745.4A CN110744424A (en) | 2019-10-21 | 2019-10-21 | Section polishing machine for wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110744424A true CN110744424A (en) | 2020-02-04 |
Family
ID=69279057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910998745.4A Withdrawn CN110744424A (en) | 2019-10-21 | 2019-10-21 | Section polishing machine for wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110744424A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113059280A (en) * | 2021-03-25 | 2021-07-02 | 深圳市尚鼎芯科技有限公司 | Cutting device for chip wafer processing |
| CN116652725A (en) * | 2023-07-21 | 2023-08-29 | 苏州博宏源机械制造有限公司 | Wafer grinding and polishing equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102765034A (en) * | 2012-07-18 | 2012-11-07 | 浙江大学 | Multi-grinding-unit multi-working-procedure parallel constant linear velocity grinding method and grinding device |
| CN202592188U (en) * | 2012-06-15 | 2012-12-12 | 浙江新博铝塑品有限公司 | Metal part polishing device |
| CN108296921A (en) * | 2018-03-27 | 2018-07-20 | 宁波高新区新柯保汽车科技有限公司 | A kind of edging device of vehicle glass |
| DE102010032501B4 (en) * | 2010-07-28 | 2019-03-28 | Siltronic Ag | Method and device for dressing the working layers of a double-side sanding device |
| CN209078434U (en) * | 2018-08-24 | 2019-07-09 | 天津天翔电子科技有限公司 | A kind of AG glass edge-grinding machine |
| CN209190514U (en) * | 2018-12-06 | 2019-08-02 | 台州扬天建设有限公司 | A kind of mill component of sanding machine |
-
2019
- 2019-10-21 CN CN201910998745.4A patent/CN110744424A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010032501B4 (en) * | 2010-07-28 | 2019-03-28 | Siltronic Ag | Method and device for dressing the working layers of a double-side sanding device |
| CN202592188U (en) * | 2012-06-15 | 2012-12-12 | 浙江新博铝塑品有限公司 | Metal part polishing device |
| CN102765034A (en) * | 2012-07-18 | 2012-11-07 | 浙江大学 | Multi-grinding-unit multi-working-procedure parallel constant linear velocity grinding method and grinding device |
| CN108296921A (en) * | 2018-03-27 | 2018-07-20 | 宁波高新区新柯保汽车科技有限公司 | A kind of edging device of vehicle glass |
| CN209078434U (en) * | 2018-08-24 | 2019-07-09 | 天津天翔电子科技有限公司 | A kind of AG glass edge-grinding machine |
| CN209190514U (en) * | 2018-12-06 | 2019-08-02 | 台州扬天建设有限公司 | A kind of mill component of sanding machine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113059280A (en) * | 2021-03-25 | 2021-07-02 | 深圳市尚鼎芯科技有限公司 | Cutting device for chip wafer processing |
| CN113059280B (en) * | 2021-03-25 | 2022-12-06 | 深圳市尚鼎芯科技有限公司 | Cutting device for chip wafer processing |
| CN116652725A (en) * | 2023-07-21 | 2023-08-29 | 苏州博宏源机械制造有限公司 | Wafer grinding and polishing equipment |
| CN116652725B (en) * | 2023-07-21 | 2023-10-27 | 苏州博宏源机械制造有限公司 | Wafer grinding and polishing equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200204 |
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| WW01 | Invention patent application withdrawn after publication |