CN111730430A - Grinding apparatus with adjustable suction cup turntable - Google Patents

Grinding apparatus with adjustable suction cup turntable Download PDF

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Publication number
CN111730430A
CN111730430A CN202010748283.3A CN202010748283A CN111730430A CN 111730430 A CN111730430 A CN 111730430A CN 202010748283 A CN202010748283 A CN 202010748283A CN 111730430 A CN111730430 A CN 111730430A
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CN
China
Prior art keywords
support
support plate
wafer
screw rod
orientation
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Granted
Application number
CN202010748283.3A
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Chinese (zh)
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CN111730430B (en
Inventor
王江涛
赵德文
刘远航
李长坤
路新春
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Beijing Haike Technology Co ltd
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Beijing Haike Technology Co ltd
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Priority to CN202010748283.3A priority Critical patent/CN111730430B/en
Publication of CN111730430A publication Critical patent/CN111730430A/en
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Publication of CN111730430B publication Critical patent/CN111730430B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like

Abstract

The invention discloses a grinding device with an adjustable sucker turntable, which comprises: the angle adjusting device comprises a first adjusting assembly and a second adjusting assembly which are connected with the sucker turntable, the first adjusting assembly is used for adjusting an included angle between the central axis of the sucker turntable and a first orientation, and the second adjusting assembly is used for adjusting an included angle between the central axis of the sucker turntable and a second orientation; the first orientation and the second orientation are orthogonal to the center of the sucker turntable, a rectangular coordinate system plane formed by the first orientation and the second orientation is parallel to the upper surface of the sucker turntable, and the first orientation is perpendicular to a connecting line of two end points of the grinding wheel, which are contacted with the wafer when the grinding wheel grinds the wafer. The invention can realize accurate control of the grinding surface shape of the wafer, and improves the processing effect and the manufacturing quality of the wafer, thereby providing technical guarantee for the stacking process of the ultra-high density semiconductor, and being an important component for the development of high density packaging of the semiconductor and the like.

Description

Grinding apparatus with adjustable suction cup turntable
Technical Field
The invention relates to the technical field of semiconductor wafer processing, in particular to grinding equipment with an adjustable sucker turntable.
Background
In the semiconductor industry, electronic circuits such as ICs (Integrated circuits) and LSIs (Large Scale Integrated circuits) are formed on the surface of a semiconductor wafer to manufacture semiconductor chips. Before the wafer is divided into semiconductor chips, the back surface of the wafer opposite to the device surface on which the electronic circuits are formed is ground by a grinding apparatus, thereby thinning the wafer to a predetermined thickness. The grinding of the back of the wafer can reduce the packaging volume of the chip and the packaging and mounting height, and the thickness of the chip after the back is thinned can even reach less than 5% of the initial thickness. Meanwhile, in order to increase the yield of the IC chip and reduce the unit manufacturing cost, the diameter of the wafer tends to be large, but the wafer is easy to generate warping deformation after the size of the wafer is increased, the requirement on surface shape precision is not easy to guarantee, and the processing effect is poor.
The thickness of the wafer is uneven after the wafer is thinned by using the prior art, the surface shape precision is difficult to ensure, and the subsequent process is influenced.
Disclosure of Invention
The embodiment of the invention provides grinding equipment with an adjustable sucker turntable, and aims to at least solve one of the technical problems in the prior art.
An embodiment of the present invention provides a grinding apparatus with an adjustable chuck turntable, including:
a table for supporting a plurality of chuck turntables;
the sucking disc rotary table is used for holding the wafer and driving the wafer to rotate;
a grinding tool having a grinding wheel for abutting against the wafer to grind and thin the wafer; and
the angle adjusting device for adjusting the sucker turntable comprises a first adjusting assembly and a second adjusting assembly which are connected with the sucker turntable, wherein the first adjusting assembly is used for adjusting an included angle between the central axis of the sucker turntable and a first orientation, and the second adjusting assembly is used for adjusting an included angle between the central axis of the sucker turntable and a second orientation;
the first orientation and the second orientation are orthogonal to the center of the sucker turntable, a rectangular coordinate system plane formed by the first orientation and the second orientation is parallel to the upper surface of the sucker turntable, and the first orientation is perpendicular to a connecting line of two end points of the grinding wheel, which are contacted with the wafer when the grinding wheel grinds the wafer.
In one embodiment, the sucker turntable comprises a sucker, a rotating shaft, a first supporting plate and a second supporting plate, wherein the sucker, the first supporting plate and the second supporting plate are sequentially sleeved outside the rotating shaft from top to bottom;
the first adjusting assembly is connected between the first support plate and the second support plate to raise or lower the first support plate under the support of the second support plate to incline the suction cup, and the second adjusting assembly is connected between the second support plate and the worktable to raise or lower the second support plate under the support of the worktable to incline the suction cup.
In one embodiment, the first adjusting assembly includes a first adjustable leg capable of being lifted and lowered, a first leg and a second leg, the first adjustable leg is located in the first orientation, and the first leg and the second leg are symmetrically distributed about the first orientation.
In one embodiment, the first adjustable support is connected between the first support plate and the second support plate to raise or lower the first support plate with the support of the second support plate through a fulcrum at which the first adjustable support is connected to the first support plate; the first supporting piece and the second supporting piece are fixedly connected with the second supporting plate and are in sliding connection with the first supporting plate respectively.
In one embodiment, the first adjustable support comprises a first screw, a first nut, a first lead screw support, and a first motor drive unit; the first screw rod runs through the upper through hole and the lower through hole which are respectively formed in the corresponding positions of the first supporting plate and the second supporting plate, the first nut is sleeved on the upper portion of the first screw rod and penetrates through the upper through hole and the first supporting plate to be fixedly connected, the first screw rod support is sleeved on the lower portion of the first screw rod and penetrates through the lower through hole and the second supporting plate to be fixedly connected, a protrusion is further arranged on the first screw rod to be clamped on the upper end of the first screw rod support to enable the first screw rod support to rotate, the relative position of the first screw rod and the first screw rod to be unchanged, and the first motor driving unit is connected with the first.
In one embodiment, the first support member and the second support member are each spherically hinged to the first support plate.
In one embodiment, the second adjustment assembly includes a second adjustable leg that is liftable and lowerable, a third leg, and a fourth leg, the second adjustable leg being located in the second orientation, the third leg and the fourth leg being symmetrically distributed about the second orientation.
In one embodiment, the second adjustable support is coupled between the second support plate and the table to raise or lower the second support plate via a fulcrum at which the second adjustable support is coupled to the second support plate, supported by the table; the third branch piece and the fourth branch piece are respectively fixedly connected with the workbench, and the third branch piece and the fourth branch piece are respectively connected with the second supporting plate in a sliding mode.
In one embodiment, the second adjustable support comprises a second screw, a second nut, a second lead screw support, and a second motor drive unit; the second screw rod runs through the through hole of the second support plate, the second nut is sleeved on the upper portion of the second screw rod and penetrates through the through hole to be fixedly connected with the second support plate, the second screw rod support is sleeved on the lower portion of the second screw rod and fixedly connected with the workbench, a protrusion is arranged on the second screw rod and clamped at the upper end of the second screw rod support, so that the second screw rod is supported by the second screw rod support to rotate, the relative position of the second screw rod and the second screw rod is unchanged, and the second motor driving unit is connected with the second screw rod to drive.
In one embodiment, the third branch and the fourth branch are each hinged to the second support plate through a spherical surface.
The embodiment of the invention has the beneficial effects that: by adjusting the inclination angle of the sucker turntable for keeping the wafer, the accurate control of the grinding surface shape of the wafer can be realized, and the processing effect and the manufacturing quality of the wafer are improved, so that the technical support is provided for the stacking process of the ultra-high-density semiconductor, and the sucker turntable is an important component for the high-density packaging development of the semiconductor and the like.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only and do not limit the scope of protection of the invention, wherein:
fig. 1 shows a grinding apparatus provided by an embodiment of the present invention in a schematic perspective view;
fig. 2 schematically illustrates the working principle of wafer grinding;
FIG. 3 schematically illustrates a grinding area of a wafer;
FIG. 4 schematically illustrates various grinding profiles of a wafer;
FIG. 5 schematically illustrates two characteristic parameters for characterizing a wafer grinding profile;
FIG. 6 is a schematic perspective view of a platen for supporting a wafer according to an embodiment of the present invention;
FIG. 7 illustrates, in a schematic perspective view, a suction cup turntable of the machine table shown in FIG. 6;
fig. 8 shows the suction cup turntable shown in fig. 7 in a schematic sectional view, without the angle adjustment means;
FIG. 9 schematically shows the arrangement of the angle adjusting means on the machine table;
FIG. 10 schematically illustrates an x-direction view of adjusting the tilt angle using a first adjustment assembly;
FIG. 11 schematically illustrates a y-direction view of adjusting the tilt angle using the second adjustment assembly;
FIG. 12 illustrates a top view of a chuck table provided in accordance with an embodiment of the present invention;
FIG. 13 illustrates a first adjustment assembly provided by one embodiment of the present invention;
FIG. 14 illustrates a second adjustment assembly provided by one embodiment of the present invention.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention for the purpose of illustrating the concepts of the invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein. It should be understood that, unless otherwise specified, the following description of the embodiments of the present invention is made for the convenience of understanding, and the description is made in a natural state where relevant devices, apparatuses, components, etc. are originally at rest and no external control signals and driving forces are given.
Fig. 1 shows a grinding apparatus 1 with an adjustable suction cup turntable according to an exemplary embodiment of the present invention in a schematic perspective view. The grinding apparatus 1 shown includes a machine table 3 for carrying a wafer and a grinding tool 2 for bringing a grinding wheel into abutment with the wafer w to grind and thin the wafer.
As shown in fig. 1, the machine 3 for supporting a wafer mainly includes a worktable 31, and a plurality of chuck turntables 32 for holding and driving the wafer to rotate are disposed on the worktable 31. Wherein, the worktable 31 can rotate around the vertical central axis thereof so that the worktable 31 drives the plurality of sucker rotary tables 32 to rotate integrally, thereby realizing the position conversion of the sucker rotary tables 32 among different stations. Each suction cup turntable 32 is also independently rotatable.
As shown in fig. 1, as an implementation manner, three suction cup turntables 32 capable of rotating independently are uniformly distributed on a worktable 31, and each suction cup turntable is provided with a first suction cup, a second suction cup and a third suction cup for sucking a wafer, the three suction cups are porous ceramic suction cups with completely the same structure to realize vacuum suction of the wafer, and the connecting lines of the centers of the three suction cup turntables 32 and the worktable 31 form an included angle of 120 degrees. The three chuck tables 32 correspond to three stations, namely a rough grinding station, a finish grinding station and a loading and unloading station, wherein two stations opposite to the grinding wheel are respectively used for rough grinding and finish grinding, and the other station is used for loading and unloading and cleaning wafers. The three sucker rotary tables 32 can be driven to switch among the three stations through the rotation of the working table 31, so that the sucker rotary tables 32 can carry the wafer to circularly move according to the sequence of the loading and unloading station, the rough grinding station, the fine grinding station and the loading and unloading station. The embodiment realizes full-automatic loading and unloading and continuous grinding and cleaning of the wafer through repeated circulation. The rotary worktable 31 for grinding the wafer has the advantages of high material removal rate, small damage to the surface of the wafer and easy realization of automation.
As shown in fig. 1, the grinding tool 2 is mainly composed of a rough grinding portion 21 and a finish grinding portion 22, the rough grinding portion 21 being provided with a rough grinding wheel 211 for rough grinding the wafer, and the finish grinding portion 22 being provided with a finish grinding wheel 221 for finish grinding the wafer. The grinding process is to press the grinding wheel on the surface of the wafer and rotate the grinding wheel to grind off a certain thickness.
The rough grinding section 21 includes a rough grinding wheel 211 having a cup-shaped configuration, a rough grinding spindle base, and a rough grinding feed mechanism. The rough grinding wheel 211 is connected to the bottom of the rough grinding spindle so that the rough grinding spindle drives the rough grinding wheel 211 to rotate, the rough grinding wheel 211 rotates and grinds the surface of the wafer, the rough grinding spindle is connected with the rough grinding feeding mechanism through the rough grinding spindle seat to move up and down, and the rough grinding wheel 211 is controlled by the rough grinding feeding mechanism to be close to or far away from the wafer to carry out axial plunge feeding grinding. In this embodiment, the rough grinding wheel 211 may be a diamond wheel, and the surface thereof is rough to realize rapid wafer grinding, thereby reducing the wafer thinning time. During rough grinding, the feeding speed of the rough grinding wheel 211 relative to the wafer is 2-10 μm/s so as to realize high-speed feeding, and the rotating speed of the rough grinding wheel 211 is 2000-4000 rpm. The radius of the rough grinding wheel 211 matches the radius of the wafer, and may be 1 to 1.2 times the radius of the wafer. The thickness of the wafer is reduced by more than 600 μm in the rough grinding process, and after the rough grinding process, the thickness of the wafer can be reduced to be within 150 μm.
The refining section 22 includes a refining wheel 221 in the shape of a cup-shaped structure, a refining spindle holder, and a refining feed mechanism. The fine grinding wheel 221 is connected to the bottom of the fine grinding spindle so that the fine grinding spindle drives the fine grinding wheel 221 to rotate, the fine grinding spindle is connected with the fine grinding feeding mechanism through the fine grinding spindle seat so as to achieve up-and-down movement, and the fine grinding wheel 221 is controlled to approach or move away from the wafer through the fine grinding feeding mechanism so as to achieve axial plunge feeding grinding. In this embodiment, the finish grinding wheel 221 may be a diamond wheel with a surface roughness lower than that of the rough grinding wheel 211, which may cause serious surface defects and losses due to the rough grinding to rapidly remove the surface material of the wafer, and the fine surface of the finish grinding wheel 221 is used for low-speed grinding to reduce the thickness of the damaged layer on the surface of the wafer and improve the surface quality of the wafer. In the finish grinding, the feed speed of the finish grinding wheel 221 relative to the wafer is 0.1 to 1 μm/s to realize low-speed feed to improve the grinding precision, and the rotation speed of the finish grinding wheel 221 is 2000-4000 rpm. The radius of the lapping wheel 221 matches the radius of the wafer, which may be 1 to 1.2 times the radius of the wafer.
As shown in fig. 1, the grinding apparatus 1 further includes a measuring unit 4, which includes a contact measuring instrument and a non-contact optical measuring instrument, and can realize online monitoring of the wafer thickness. The probe of the contact type measuring instrument is pressed on the surface of the wafer to measure the thickness of the wafer by utilizing the height difference of the upper surface and the lower surface of the wafer. Two sets of contact gauges are provided, and are disposed in the rough grinding section 21 and the finish grinding section 22, respectively. The non-contact optical measuring instrument irradiates the wafer with infrared light and calculates the thickness of the wafer according to different reflected lights on the upper and lower surfaces of the wafer. It should be noted that, in the present disclosure, the wafer thickness refers to the entire thickness from the upper surface to the lower surface of the wafer, and not the thickness of the coating film laid on the wafer surface.
As shown in fig. 1, the grinding apparatus 1 further includes a cleaning unit 5, and the cleaning unit 5 includes a first cleaning portion 51 and a second cleaning portion 52. The first cleaning part 51 is used for cleaning and polishing the suction disc, has a rotatable first body, is provided with a suction disc cleaning brush and a suction disc polishing oilstone at the bottom of the first body, and is also provided with a through hole for spraying cleaning fluid to the suction disc through a pipeline inside the first body. The second cleaning portion 52 is used for cleaning the wafer and has a rotatable second body, a wafer cleaning brush is disposed at the bottom of the second body, and a through hole is disposed at the bottom of the second body for spraying cleaning liquid to the wafer through a pipeline inside the second body.
As shown in fig. 1, the grinding apparatus 1 further includes a simple robot 6, and the simple robot 6 is used for placing the wafer on the machine table 3 for grinding, and taking out the wafer from the machine table 3 for subsequent transportation after the grinding and cleaning are completed. As an implementation manner, a vacuum pipeline is arranged inside the simple robot 6 to realize vacuum adsorption of the wafer.
In addition, in the specific implementation, the grinding apparatus 1 further includes a grinding fluid supply unit for spraying a grinding fluid, which may be deionized water, onto the surface of the wafer to aid grinding during rough grinding and/or finish grinding.
Fig. 2 shows the working principle of grinding using a grinding wheel and a chuck turntable 32, as shown in the figure, a rotary chuck turntable 32 equipped with a vacuum chuck is used for grinding, the vacuum chuck adsorbs the wafer and drives the wafer to rotate, the center of the wafer coincides with the center of the chuck turntable 32, the grinding wheel presses on the wafer to rotate and feeds along the axial direction F according to a certain feeding speed, and thereby the wafer is ground.
Fig. 3 shows, in a schematic simplified diagram, a semi-contact grinding mode employed in the present disclosure, such as a grinding zone 34 shown by a hatched area in fig. 3, and the grinding wheel is in contact with only a center-to-edge area of the wafer, i.e., the grinding zone 34, for grinding, so that the wafer forms various grinding profiles after grinding, as shown in fig. 4. As shown in FIG. 5, the roughness is used for one of the grinding surfaces1And fullness2Two characteristic parameter pairsAnd (5) characterizing the specific grinding surface shape.
It can be understood that the grinding surface shape of the wafer is related to the included angle between the grinding wheel and the axis of the sucking disc, and the control of the grinding surface shape can be realized by adjusting the included angle between the axis of the grinding wheel and the axis of the sucking disc. The following describes an embodiment of the present disclosure for adjusting the grinding surface shape of the wafer by adjusting the tilt angle of the chuck table 32.
Fig. 6 is a schematic perspective view illustrating a wafer-supporting machine 3 according to an embodiment of the present invention, which includes:
a table 31 that rotatably supports a plurality of suction cup turn tables 32;
a chuck turntable 32 for holding the wafer and rotating the wafer;
an angle adjusting device 33 (not shown) connected to the suction cup turntable 32 to adjust the inclination angle of the suction cup turntable 32 in at least two directions.
As shown in fig. 6, the table 31 is rotatable about its vertical central axis, and three suction cup rotating tables 32 which are individually rotatable are uniformly distributed on the table 31, the three suction cup rotating tables 32 being rotated respectively between the loading and unloading station, the rough grinding station and the finish grinding station.
Fig. 7 and 8 show the structure of the suction cup turntable 32 provided in one embodiment of the present invention in a schematic perspective view and a sectional view, respectively. For the sake of clarity, the angle adjustment device 33 is not shown in fig. 8. The illustrated suction cup turntable 32 includes: suction cup 321, a pressure plate (not shown), a mounting plate 322, a first support plate 323, a second support plate 324, a bushing 325, a rotating shaft 326, a connecting shaft 327, a pulley 328, and a rotary joint 329. The suction cup 321 is fixed on the mounting plate 322 by a pressing plate, the mounting plate 322 is fixed at the top end of the rotating shaft 326, a shaft sleeve 325 is sleeved outside the rotating shaft 326, the rotating shaft 326 and the shaft sleeve 325 penetrate through the central hollow area of the first supporting plate 323 and the second supporting plate 324 to enable the annular first supporting plate 323 and the annular second supporting plate 324 to be stacked up and down and sleeved outside the shaft sleeve 325, the shaft sleeve 325 is fixedly connected with the first supporting plate 323, the suction cup 321 is located above the first supporting plate 323, and the second supporting plate 324 is arranged below the first supporting plate 323. The bottom end of the rotating shaft 326 is fixedly connected with a connecting shaft 327, the connecting shaft 327 is connected with a belt wheel 328, and the belt wheel 328 is connected with a motor through a transmission belt to realize electric rotation. A rotary joint 329 is fixed to the bottom end of the connecting shaft 327.
Referring to fig. 8, the working principle of the present embodiment for realizing the rotation and tilt control of the suction cup turntable 32 is: the rotation shaft 326 drives the sucker 321 to rotate through motor control and transmission of a transmission belt, a belt wheel 328 and a connecting shaft 327, the supporting plate is fixedly connected with the shaft sleeve 325, and when the supporting plate inclines, the shaft sleeve 325 is enabled to incline together with the rotation shaft 326, so that the sucker 321 inclines.
The embodiment of the present disclosure in which the inclination angle of the suction cup turntable 32 is adjusted by the angle adjusting device 33 will be described in detail below.
Fig. 9 shows a layout of an angle adjusting device 33 according to an embodiment of the present invention.
As shown in fig. 9, the angle adjusting means 33 includes a first adjusting assembly 330 and a second adjusting assembly 340 arranged along the circumferential direction of the suction cup. In one embodiment of the present invention, the first adjustment assembly 330 is coupled between the first support plate and the second support plate, and the second adjustment assembly 340 is coupled between the second support plate and the table.
For ease of understanding, the x-direction is defined herein as the first orientation and the y-direction is defined herein as the second orientation in fig. 9.
The first adjusting component 330 is used for adjusting an included angle between the central axis of the sucker turntable 32 and the first orientation (x direction), and the first adjusting component 330 enables the sucker turntable 32 to rotate around the second orientation (y direction), so that the plumpness of the grinding surface shape of the wafer can be adjusted. The second adjusting component 340 is used for adjusting an included angle between the central axis of the sucker turntable 32 and the second orientation (y direction), and the second adjusting component 340 can enable the sucker turntable 32 to rotate around the first orientation (x direction), so that the concave-convex degree of the grinding surface shape of the wafer can be adjusted.
Wherein, the first adjusting component 330 and the second adjusting component 340 are respectively connected with the suction cup turntable 32, specifically adopting the mode of being connected with the supporting plate, thereby directly controlling the inclination of the supporting plate through the angle adjusting device 33, and further enabling the suction cup to incline. The three chuck turntables 32 on the table 31 are each connected to an angle adjusting device 33, and in the specific process, when the chuck turntables 32 are rotated to the fine grinding station for fine grinding of the wafer, the angle adjusting step is performed.
It will be appreciated that the first orientation (x-direction) and the second orientation (y-direction) are perpendicular to each other and the xy rectangular coordinate system plane formed by the first orientation and the second orientation is parallel to the upper surface of the chuck table 32.
The specific arrangement of the first orientation (x-direction) and the second orientation (y-direction) is: when the table 31 moves the suction cup turntable 32 to the top right-hand refining station as shown in fig. 9, that is, when the suction cup turntable 32 carries the wafer at the refining station so that the refining wheel 221 performs refining on the wafer, the first orientation (x direction) is perpendicular to a line connecting two end points where the wafer contacts the refining wheel 221. After the direction of the first orientation (x direction) is thus set, the specific positions and directions of the first orientation (x direction) and the second orientation (y direction) can be determined based on the first orientation (x direction) and the second orientation (y direction) being perpendicular to each other and intersecting the center of the chuck turntable 32.
With reference to fig. 9-11, it will be appreciated that the chuck table 32 alone rotates in the y-direction, i.e., the fullness of the wafer grinding profile is controlled by the action of the first adjustment assembly 3302. The sucker turntable 32 independently rotates around the x direction, namely the concave-convex degree of the grinding surface shape of the wafer can be controlled when the second adjusting assembly 340 is controlled to act1. Therefore, the concave-convex degree of the grinding surface shape of the wafer can be respectively and independently controlled by adopting the angle adjusting device 33 in the disclosure1And fullness2The control precision is high and the effect is good.
Fig. 13 shows a layout structure of the first adjustment assembly 330 in the chuck table 32 according to an embodiment of the present invention. Fig. 13 is a sectional view taken along the direction C-C shown in fig. 12.
As shown in fig. 13, the first adjustment assembly 330 includes a first adjustable leg 331, a first leg 332, and a second leg 333, the first adjustable leg 331 is located in a first orientation (x-direction), and the first leg 332 and the second leg 333 are symmetrically distributed about the first orientation (x-direction). The first adjustable support 331 adjusts an included angle between the central axis of the suction cup turntable 32 and the first direction (x direction) by lifting and lowering the height.
Preferably, the first adjustable support 331, the first support 332 and the second support 333 are uniformly distributed along the circumference, and the angle between the connecting line of each support and the central axis is 120 °.
The first adjustable support 331 is coupled between the first support plate 323 and the second support plate 324 to raise or lower the first support plate 323 by a fulcrum at which the first adjustable support 331 is coupled to the first support plate 323 under the support of the second support plate 324; the first support member 332 and the second support member 333 are fixedly connected to the second support plate 324, respectively, and the first support member 332 and the second support member 333 are slidably connected to the first support plate 323, respectively. Optionally, the first support member 332 and the second support member 333 are each spherically hinged with the first support plate 323.
As shown in fig. 13, the first adjustable support 331 can be controlled by a screw structure, and includes a first screw 3311, a first nut 3312, a first screw support 3313, and a first motor driving unit 3314. The first screw 3311 penetrates through upper and lower through holes respectively formed at corresponding positions of the first and second support plates 323 and 324, and the first nut 3312 is fitted over the first screw 3311 and penetrates through the upper through hole and is fixedly coupled to the first support plate 323 to enable the relative height of the first nut 3312 and the first screw 3311 to be changed when the first screw 3311 is rotated by the screw-engagement of the first nut 3312 and the first screw 3311, thereby raising or lowering the first support plate 323. The first screw supporter 3313 is sleeved on the lower portion of the first screw 3311, passes through the lower through hole, and is fixedly connected to the second support plate 324, and the first screw 3311 is further provided with a protrusion for being clamped on the upper end of the first screw supporter 3313, so that the first screw supporter 3313 supports the first screw 3311 to rotate without changing the relative position of the first screw 3311 and the second screw 3313. The first motor driving unit 3314 is connected to the first screw 3311 to provide power. The working principle of the first adjustable support 331 is as follows: when the first motor driving unit 3314 drives the first screw 3311 to rotate, the first screw support 3313 is fixed to the second support plate 324, so that the first screw 3311 is supported by the second support plate 324, and the first nut 3312 is connected to the first support plate 323 to ascend or descend through a screw-thread fit.
It is understood that the first adjustable support 331 may also be implemented by an electric lifting structure, a pneumatic lifting structure, or a hydraulic lifting structure.
As shown in fig. 13, the first support member 332 includes a first pin 3321 penetrating the first and second support plates 323 and 324 and first upper and lower hemispheres 3322 and 3323. The lower portion of the first pin 3321 is fixedly connected to the second support plate 324, and the protruding head portion of the first pin 3321 is caught on the upper surface of the first support plate 323. The first upper hemisphere 3322 is located between the protruding head and the first support plate 323, the first upper hemisphere 3322 is placed in the groove on the upper surface of the first support plate 323 and is sleeved outside the first pin 3321 through the central through hole of the first upper hemisphere 3322, a gap is left between the central through hole of the first upper hemisphere 3322 and the first pin 3321, and the spherical surface of the first upper hemisphere 3322 is placed upward. The first lower hemisphere 3323 is located between the first support plate 323 and the second support plate 324, the first lower hemisphere 3323 is disposed in the groove on the lower surface of the first support plate 323 and is sleeved outside the first pin 3321 through the central through hole of the first lower hemisphere 3323, a gap is left between the central through hole of the first lower hemisphere 3323 and the first pin 3321, and the spherical surface of the first lower hemisphere 3323 is disposed downward. The working principle of the first leg 332 is: the second support plate 324 is used as a support, and the first support plate 323 drives the first upper hemisphere 3322 and the first lower hemisphere 3323 to rotate around the first pin 3321 when the first support plate 323 tilts through the cooperation among the first pin 3321, the first upper hemisphere 3322 and the first lower hemisphere 3323, so that the sliding connection between the first support member 332 and the first support plate 323 is realized.
The second support 333 is implemented in the same manner and has the same structural composition as the first support 332, and can be implemented by those skilled in the art according to the above description, which is not described herein again.
Fig. 14 shows a layout structure of the second adjusting assembly 340 in the chuck turntable 32 according to an embodiment of the present invention. Fig. 14 is a sectional view taken along the direction B-B shown in fig. 12.
As shown in fig. 14, the second adjustment assembly 340 includes a second adjustable leg 341, a third leg 342, and a fourth leg 343, the second adjustable leg 341 being located in the second orientation (y-direction), the third leg 342 and the fourth leg 343 being symmetrically distributed about the second orientation (y-direction). The second adjustable support 341 adjusts the included angle between the central axis of the suction cup turntable 32 and the second orientation (y direction) by lifting or lowering the height.
Preferably, the second adjustable branch 341, the third branch 342 and the fourth branch 343 are uniformly distributed along the circumference, and the included angle between each branch and the connecting line of the central axis is 120 °.
Second adjustable support 341 is connected between second support plate 324 and table 31 to raise or lower second support plate 324 under the support of table 31 via the fulcrum at which second adjustable support 341 is connected to second support plate 324; the third branch 342 and the fourth branch 343 are fixedly connected to the worktable 31, and the third branch 342 and the fourth branch 343 are slidably connected to the second supporting plate 324. Optionally, the third branch 342 and the fourth branch 343 are each spherically hinged with the second supporting plate 324.
As shown in fig. 14, the second adjustable supporting element 341 can be controlled by a screw rod structure, and includes a second screw rod 3411, a second nut 3412, a second screw rod holder 3413 and a second motor driving unit 3414. Second screw 3411 extends through a through hole of second support plate 324, and second nut 3412 is fitted over second screw 3411 and extends through the through hole and is fixedly coupled to second support plate 324 so that the relative heights of second nut 3412 and second screw 3411 are changed when second screw 3411 is rotated to raise or lower second support plate 324 by the threaded engagement of second nut 3412 and second screw 3411. The second screw support 3413 is sleeved on a lower portion of the second screw 3411 and is fixedly connected to the table 31, and a protrusion is formed on the second screw 3411 to be caught on an upper end of the second screw support 3413, so that the second screw support 3411 is supported by the second screw support 3413 to rotate, and a relative position of the second screw and the second screw is not changed. The second motor driving unit 3414 is connected to the second screw 3411 to supply power. The working principle of the second adjustable support 341 is as follows: when the second motor driving unit 3414 drives the second screw 3411 to rotate, since the second screw holder 3413 is fixed to the table 31, the second screw 3411 is supported by the table 31, and the second nut 3412 is connected to the second support plate 324 to be lifted or lowered by a screw-fit action.
It is understood that the second adjustable support 341 may also be implemented by an electric lifting structure, a pneumatic lifting structure, or a hydraulic lifting structure.
As shown in fig. 14, the third supporting member 342 includes a second pin 3421 penetrating the second supporting plate 324, and a second upper hemisphere 3422 and a second lower hemisphere 3423. The lower portion of the second pin 3421 is sleeved with a connecting member, the connecting member is fixedly connected to the workbench 31 to fix the second pin 3421 to the workbench 31, and the protruding head of the second pin 3421 is clamped on the upper surface of the second support plate 324. The second upper hemisphere 3422 is located between the convex head and the second support plate 324, the second upper hemisphere 3422 is located in the groove on the upper surface of the second support plate 324 and is sleeved outside the second pin 3421 through the central through hole of the second upper hemisphere 3422, a gap is left between the central through hole of the second upper hemisphere 3422 and the second pin 3421, and the spherical surface of the second upper hemisphere 3422 is located upward. The second lower hemisphere 3423 is located between the second supporting plate 324 and the connecting member, the second lower hemisphere 3423 is disposed in the groove of the lower surface of the second supporting plate 324 and is sleeved outside the second pin 3421 through the central through hole of the second lower hemisphere 3423, a gap is left between the central through hole of the second lower hemisphere 3423 and the second pin 3421, and the spherical surface of the second lower hemisphere 3423 is disposed downward. The working principle of the third branch 342 is: with the workbench 31 as a support, the second support plate 324 drives the second upper hemisphere 3422 and the second lower hemisphere 3423 to rotate around the second pin 3421 when the second support plate 324 tilts by the cooperation among the second pin 3421, the second upper hemisphere 3422 and the second lower hemisphere 3423, so as to realize the sliding connection between the third support member 342 and the second support plate 324.
The implementation manner and the structural composition of the fourth branch 343 are the same as those of the third branch 342, and those skilled in the art can implement the fourth branch according to the above description, and are not described herein again.
Based on fig. 13 and 14, the working process of implementing angle adjustment by one embodiment of the present invention includes:
1) when the first adjusting component 330 is used for adjusting the included angle between the central axis of the sucker turntable 32 and the first orientation (x direction), the plumpness of the grinding surface shape of the wafer can be controlled2The specific process is as follows: the first adjustable support member 331 raises or lowers the first support plate 323 with the second support plate 324 as a support while positioning the first support plate 323 at the first support member 332 and the second support member 333The support plate 323 moves accordingly so that the rotation shaft 326 of the first support plate 323 connected to the suction cup turntable 32 is tilted.
2) When the second adjusting component 340 is used for adjusting the included angle between the central axis of the sucker turntable 32 and the second orientation (y direction), the roughness of the grinding surface shape of the wafer can be controlled1The specific process is as follows: the second adjustable support 341 raises or lowers the second support plate 324 with the table 31 as a support, and simultaneously moves the second support plate 324 at the third and fourth supports 342 and 343, respectively, and tilts the first support plate 323 accordingly based on the connection of the first adjustment assembly 330 to the second support plate 324 and the first support plate 323, thereby tilting the rotation shaft 326 of the suction cup turntable 32.
The embodiment of the invention adopts a layout design of six-point support, and realizes the control of the roughness of the grinding surface shape of the wafer respectively by adjusting the inclination angle of the sucker turntable in two directions1And fullness2The method avoids the cross change of the two, is easy to realize accurate wafer surface shape control and improves the grinding effect. In addition, the double-layer adjustment is carried out by adopting two sets of overlapped adjusting components, so that the realization of an angle adjusting function is ensured, and the structure is compact.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A grinding apparatus having an adjustable chuck table, comprising:
a table for supporting a plurality of chuck turntables;
the sucking disc rotary table is used for holding the wafer and driving the wafer to rotate;
a grinding tool having a grinding wheel for abutting against the wafer to grind and thin the wafer; and
the angle adjusting device for adjusting the sucker turntable comprises a first adjusting assembly and a second adjusting assembly which are connected with the sucker turntable, wherein the first adjusting assembly is used for adjusting an included angle between the central axis of the sucker turntable and a first orientation, and the second adjusting assembly is used for adjusting an included angle between the central axis of the sucker turntable and a second orientation;
the first orientation and the second orientation are orthogonal to the center of the sucker turntable, a rectangular coordinate system plane formed by the first orientation and the second orientation is parallel to the upper surface of the sucker turntable, and the first orientation is perpendicular to a connecting line of two end points of the grinding wheel, which are contacted with the wafer when the grinding wheel grinds the wafer.
2. The grinding apparatus of claim 1, wherein the chuck table comprises a chuck, a rotating shaft, a first support plate and a second support plate, the chuck, the first support plate and the second support plate being sequentially sleeved outside the rotating shaft in the order from top to bottom;
the first adjusting assembly is connected between the first support plate and the second support plate to raise or lower the first support plate under the support of the second support plate to incline the suction cup, and the second adjusting assembly is connected between the second support plate and the worktable to raise or lower the second support plate under the support of the worktable to incline the suction cup.
3. The abrading apparatus of claim 2, wherein the first adjustment assembly includes a first adjustable leg that is liftable and lowerable, a first leg, and a second leg, the first adjustable leg being positioned in the first orientation, the first leg and the second leg being symmetrically distributed about the first orientation.
4. The grinding apparatus of claim 3 wherein the first adjustable support is connected between the first support plate and the second support plate to raise or lower the first support plate under support of the second support plate via a fulcrum at which the first adjustable support is connected to the first support plate; the first supporting piece and the second supporting piece are fixedly connected with the second supporting plate and are in sliding connection with the first supporting plate respectively.
5. The grinding apparatus of claim 4 wherein the first adjustable support comprises a first screw, a first nut, a first screw mount, and a first motor drive unit; the first screw rod runs through the upper through hole and the lower through hole which are respectively formed in the corresponding positions of the first supporting plate and the second supporting plate, the first nut is sleeved on the upper portion of the first screw rod and penetrates through the upper through hole and the first supporting plate to be fixedly connected, the first screw rod support is sleeved on the lower portion of the first screw rod and penetrates through the lower through hole and the second supporting plate to be fixedly connected, a protrusion is further arranged on the first screw rod to be clamped on the upper end of the first screw rod support to enable the first screw rod support to rotate, the relative position of the first screw rod and the first screw rod to be unchanged, and the first motor driving unit is connected with the first.
6. The grinding apparatus of claim 4 wherein said first and second legs are each spherically hinged to said first support plate.
7. The abrading apparatus of claim 2, wherein the second adjustment assembly includes a second adjustable leg that is liftable and lowerable, a third leg, and a fourth leg, the second adjustable leg being positioned in the second orientation, the third leg and the fourth leg being symmetrically distributed about the second orientation.
8. The grinding apparatus of claim 7 wherein said second adjustable support is connected between said second support plate and said table for raising and lowering said second support plate under support of said table by a fulcrum point at which said second adjustable support is connected to said second support plate; the third branch piece and the fourth branch piece are respectively fixedly connected with the workbench, and the third branch piece and the fourth branch piece are respectively connected with the second supporting plate in a sliding mode.
9. The grinding apparatus of claim 8 wherein said second adjustable support comprises a second screw, a second nut, a second screw mount, and a second motor drive unit; the second screw rod runs through the through hole of the second support plate, the second nut is sleeved on the upper portion of the second screw rod and penetrates through the through hole to be fixedly connected with the second support plate, the second screw rod support is sleeved on the lower portion of the second screw rod and fixedly connected with the workbench, a protrusion is arranged on the second screw rod and clamped at the upper end of the second screw rod support, so that the second screw rod is supported by the second screw rod support to rotate, the relative position of the second screw rod and the second screw rod is unchanged, and the second motor driving unit is connected with the second screw rod to drive.
10. The grinding apparatus of claim 8 wherein said third leg and said fourth leg are each spherically hinged to said second support plate.
CN202010748283.3A 2020-07-30 2020-07-30 Grinding apparatus with adjustable suction cup turntable Active CN111730430B (en)

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CN113664679B (en) * 2021-09-02 2024-04-16 苏州市通达自动扶梯配件厂 Device for automatically grinding outer diameter of escalator roller
CN114871886A (en) * 2021-12-18 2022-08-09 华海清科股份有限公司 Wafer processing method, system and terminal equipment
CN114871886B (en) * 2021-12-18 2024-02-02 华海清科股份有限公司 Wafer processing method, system and terminal equipment

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