CN105415146A - Indexing rotating table and indexing rotating table system - Google Patents
Indexing rotating table and indexing rotating table system Download PDFInfo
- Publication number
- CN105415146A CN105415146A CN201510859898.2A CN201510859898A CN105415146A CN 105415146 A CN105415146 A CN 105415146A CN 201510859898 A CN201510859898 A CN 201510859898A CN 105415146 A CN105415146 A CN 105415146A
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- Prior art keywords
- index table
- wafer
- connecting axle
- end portion
- rotary index
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Abstract
The invention provides an indexing rotating table and an indexing rotating table system. The indexing rotating table comprises a rotary air floatation structure, a drive control structure, a rotary disc frame, a base and multiple wafer carrying tables used for containing pieces to be treated. The drive control structure drives the rotary air floatation structure to rotate by the preset angle, so that the rotary disc frame and the wafer carrying tables are driven to rotate, and the wafer carrying tables are rotated to corresponding stations. By the adoption of the indexing rotating table, the rotary air floatation structure, the drive control structure, the rotary disc frame, the base and the wafer carrying tables used for containing the pieces to be treated are arranged so that the pieces to be treated can be switched among the stations through rotation of the indexing rotating table, multiple processes are integrated, in other words, the processes are finished on the same wafer carrying table, the problem that in the prior art, wafers are conveyed between various devices in the process procedure, and consequently a large number of the wafers are broken is solved, device stability and work efficiency are improved, and energy waste is reduced.
Description
Technical field
The present invention relates to semiconductor manufacturing equipment technical field, refer to a kind of rotary index table and rotary index table system especially.
Background technology
Towards current Advanced Packaging market, more and more higher to the demand of the thinning ultrathin of wafer, super large sheet, wafer occurs bending and deformation under the Action of Gravity Field of self, very easily fragment occurs.But in conventional machining process, the transmission of wafer each equipment room in technological process increases the possibility causing a large amount of fragment, and fragment not only greatly have impact on production efficiency, disturb stable equipment operation, affect grinding quality, also create energy waste simultaneously.
Summary of the invention
The object of the present invention is to provide a kind of rotary index table and rotary index table system, the transmission solving wafer each equipment room in technological process in prior art causes the problem of a large amount of fragment.
In order to solve the problems of the technologies described above, the embodiment of the present invention provides a kind of rotary index table, comprising:
Rotate air floating structure, drived control structure, turntable mounting, base and multiple wafer-supporting platform for placing pending;
Wherein, the described rotation air floating structure plummer that comprises connecting axle and be fixedly linked with the middle part of described connecting axle;
The rotating disk platform that described turntable mounting comprises fixed axis and is fixedly linked with the upper part of described fixed axis, described rotating disk platform is provided with multiple through hole;
Described rotation air floating structure is worn by the end portion of described connecting axle and is fixed on described base, is fixedly linked by the end portion of the upper part of described connecting axle and the fixed axis of described turntable mounting;
The end portion of described wafer-supporting platform is fixed on the plummer of described rotation air floating structure, and upper part is exposed from the through hole of the described rotating disk platform of correspondence position;
The partial fixing that described drived control structure passes from described base with the end portion of described connecting axle is connected;
Described drived control structure drives described rotation air floating structure to rotate the angle preset, and drives described turntable mounting and described wafer-supporting platform to rotate, described wafer-supporting platform is rotated to corresponding station.
Alternatively, described base is provided with the first installing hole, and the end portion of described connecting axle is worn by described first installing hole and is fixed on described base.
Alternatively, the periphery of described first installing hole is provided with boss, and a wherein part for the end portion of described connecting axle is connected with described boss clamping, and the end portion of connecting axle described in another part exposes through described first installing hole.
Alternatively, the end portion of described fixed axis is provided with the second installing hole, and the upper part of described connecting axle is fixedly linked by the end portion of described second installing hole and described fixed axis.
Alternatively, the periphery of described second installing hole is provided with flange arrangement, and a wherein part for the upper part of described connecting axle is inserted in described second installing hole, and the upper part of connecting axle described in another part is fixedly linked by screw and described flange arrangement.
Alternatively, described drived control structure comprises rotary encoder and motor;
Wherein, on the part-structure that the end portion that described rotary encoder fixed cover is located at described connecting axle passes from described base, the end portion end face of described motor and described connecting axle is fixedly linked.
Alternatively, the edge of described plummer is provided with mounting ear, and the end portion of described wafer-supporting platform is fixedly linked by screw and described mounting ear.
Alternatively, the quantity of described wafer-supporting platform is 4, the four indexing rotary table platforms that described rotating disk platform is is calibration with 90 degree;
The quantity of described through hole is 4, and the position of the position of described through hole and described wafer-supporting platform adapts.
Alternatively, described base is the rectangular frame structure with an end face, and described first installing hole is located on described end face.
Present invention also offers a kind of rotary index table system, comprising: above-mentioned rotary index table, also comprises: multiple PROCESS FOR TREATMENT structure;
The wafer-supporting platform of described rotary index table rotates to corresponding station, carries out rotation, and with the described PROCESS FOR TREATMENT respective outer side edges of correspondence position, described PROCESS FOR TREATMENT structure carries out PROCESS FOR TREATMENT to pending on described wafer-supporting platform.
Alternatively, described PROCESS FOR TREATMENT structure comprises: coarse grinding treatment structure, fine grinding process structure, polishing structure and fluctuating plate robot manipulator structure.
The beneficial effect of technique scheme of the present invention is as follows:
In such scheme, described rotary index table rotates air floating structure, drived control structure, turntable mounting, base and multiple wafer-supporting platform for placing pending by arranging, make pending can under the rotation of rotary index table, realize the conversion between multiple station, by integrated for multiple technique, namely on same wafer-supporting platform, multiple technique is completed, the transmission solving wafer each equipment room in technological process in prior art causes the problem of a large amount of fragment, improve stabilization of equipment performance and operating efficiency, reduce energy waste.
Accompanying drawing explanation
Fig. 1 is the rotary index table perspective view of the embodiment of the present invention;
Fig. 2 is the rotary index table cross-sectional view of the embodiment of the present invention;
Fig. 3 is the rotation air supporting structural representation one of the embodiment of the present invention;
Fig. 4 is the rotation air supporting structural representation two of the embodiment of the present invention;
Fig. 5 is the turntable mounting structural representation one of the embodiment of the present invention;
Fig. 6 is the turntable mounting structural representation two of the embodiment of the present invention;
Fig. 7 is the rotary index table System's composition schematic diagram of the embodiment of the present invention;
Fig. 8 is the rotary index table System Working Principle schematic diagram of the embodiment of the present invention.
Detailed description of the invention
For making the technical problem to be solved in the present invention, technical scheme and advantage clearly, be described in detail below in conjunction with the accompanying drawings and the specific embodiments.
The transmission that the present invention is directed to wafer each equipment room in technological process in existing technology causes the problem of a large amount of fragment, provides a kind of rotary index table, as shown in Figures 1 to 6, comprising:
Rotate air floating structure 1, drived control structure 2, turntable mounting 3, base 4 and multiple wafer-supporting platform 5 for placing pending;
Wherein, described rotation air floating structure 1 plummer 7 that comprises connecting axle 6 and be fixedly linked with the middle part of described connecting axle 6;
The rotating disk platform 9 that described turntable mounting 3 comprises fixed axis 8 and is fixedly linked with the upper part of described fixed axis 8, described rotating disk platform 9 is provided with multiple through hole 10;
Described rotation air floating structure 1 is worn by the end portion of described connecting axle 6 and is fixed on described base 4, is fixedly linked by the end portion of the upper part of described connecting axle 6 and the fixed axis 8 of described turntable mounting 3;
The end portion of described wafer-supporting platform 5 is fixed on the plummer 7 of described rotation air floating structure 1, and upper part is exposed from the through hole 10 of the described rotating disk platform 9 of correspondence position;
The partial fixing that described drived control structure 2 passes from described base 4 with the end portion of described connecting axle 6 is connected;
Described drived control structure 2 drives described rotation air floating structure 1 to rotate the angle preset, and drives described turntable mounting 3 and described wafer-supporting platform 5 to rotate, and described wafer-supporting platform 5 is rotated to corresponding station.
The described rotary index table that the embodiment of the present invention provides rotates air floating structure, drived control structure, turntable mounting, base and multiple wafer-supporting platform for placing pending by arranging, make pending can under the rotation of rotary index table, realize the conversion between multiple station, by integrated for multiple technique, namely on same wafer-supporting platform, multiple technique is completed, the transmission solving wafer each equipment room in technological process in prior art causes the problem of a large amount of fragment, improve stabilization of equipment performance and operating efficiency, reduce energy waste.
It should be noted that, the rotation air floating structure in the embodiment of the present invention can comprise flow controller I, flow controller II, damages by pressure, adjust circle, bearing trim ring, transmission ring, axle and rotating base; When driven by motor rotates the axle running of air floating structure, can transmission ring be driven to rotate thereupon, gas be entered from the lower end of rotating base, from flow controller II out, under the promotion of air pressure, transmission ring rises, and departs from rotating base, makes it to realize approximate nothing friction and rotates, in like manner, gas enters from the upper end of bearing trim ring, from flow controller I out, makes transmission ring decline and slow down.
Be prior art owing to rotating air floating structure, thus in this no longer its Structure composing of further detailed description and operation principle, if needed, can referenced patent file 201010190833.0.
Concrete, as shown in Figure 2, described base 4 is provided with the first installing hole 11, and the end portion of described connecting axle 6 is worn by described first installing hole 11 and is fixed on described base 4.
Further, as shown in Figure 2, the periphery of described first installing hole 11 is provided with boss 12, and a wherein part for the end portion of described connecting axle 6 is connected with the clamping of described boss 12, and the end portion of connecting axle 6 described in another part exposes through described first installing hole 11.
Preferably, as shown in Figure 2 and Figure 6, the end portion of described fixed axis 8 is provided with the second installing hole 13, and the upper part of described connecting axle 6 is fixedly linked with the end portion of described fixed axis 8 by described second installing hole 13.
In order to bonding strength, as shown in Figure 2 and Figure 6, in the embodiment of the present invention, the periphery of described second installing hole 13 is provided with flange arrangement 14, a wherein part for the upper part of described connecting axle 6 is inserted in described second installing hole 13, and the upper part of connecting axle 6 described in another part is fixedly linked by screw and described flange arrangement 14.
Wherein, as shown in Figure 2, described drived control structure 2 comprises rotary encoder 15 and motor 16; On the part-structure that the end portion that described rotary encoder 15 fixed cover is located at described connecting axle 6 passes from described base 4, described motor 16 is fixedly linked with the end portion end face of described connecting axle 6.
In order to ensure to install the fastness connected, as shown in Figures 2 to 4, in the embodiment of the present invention, the edge of described plummer 7 is provided with mounting ear 17, and the end portion of described wafer-supporting platform 5 is fixedly linked by screw and described mounting ear 17.
Consider actual wafer-process flow process, as shown in Fig. 1, Fig. 5 and Fig. 6, in the embodiment of the present invention, the quantity of described wafer-supporting platform 5 is preferably 4, corresponding, the four indexing rotary table platforms that described rotating disk platform 9 is is calibration with 90 degree; The quantity of described through hole 10 is 4, and the position of the position of described through hole 10 and described wafer-supporting platform 5 adapts.
Consider production technology and actual service condition, as depicted in figs. 1 and 2, in the embodiment of the present invention, described base 4 preferably has the rectangular frame structure of an end face 18, and described first installing hole 11 is located on described end face 18.
For solving the problems of the technologies described above, the embodiment of the present invention additionally provides a kind of rotary index table system, as shown in Figure 7, comprising: above-mentioned rotary index table A, also comprises: multiple PROCESS FOR TREATMENT structure B;
The wafer-supporting platform 5 of described rotary index table A rotates to corresponding station, and carry out rotation, and coordinate with the described PROCESS FOR TREATMENT structure B of correspondence position, described PROCESS FOR TREATMENT structure carries out PROCESS FOR TREATMENT to pending on described wafer-supporting platform 5.
The rotary index table system that the embodiment of the present invention provides, wafer is thinning, polishing integral is integrated, namely adopt on same wafer-supporting platform and fluctuating plate, corase grind, fine grinding, polishing are carried out to wafer order, improve thin slice transmission reliability, avoid wafer risk broken in grinding, polishing and transmitting procedure from systems approach.
Alternatively, as shown in Figure 7, described PROCESS FOR TREATMENT structure B comprises: coarse grinding treatment structure b1, fine grinding process structure b2, polishing structure b3 and fluctuating plate robot manipulator structure b4.
Below the rotary index table system that the embodiment of the present invention provides is illustrated.
As shown in Figures 1 to 8, the rotary index table system that the embodiment of the present invention provides comprises rotation air floating structure 1, drived control structure 2 (comprising motor 16 and rotary encoder 15), multiple wafer-supporting platform 5, fluctuating plate robot manipulator structure b4, coarse grinding treatment structure b1, fine grinding process structure b2, polishing structure b3, turntable mounting 3 and base 4.
Wherein, the end portion rotating air floating structure 1 is arranged on base 4, rotary encoder 15 suit is fixed on the axle lower end rotating air floating structure 1, motor 15 is fixed on the end face of the axle lower end rotating air floating structure 1, turntable mounting 3 is fixed on and rotates air floating structure 1 top, and wafer-supporting platform 5 lower surface is fixed with rotation air floating structure 1, and upper circle and turntable mounting 3 are fixed, motor 16 drives rotation air floating structure 1 to operate, and drives wafer-supporting platform 5 and turntable mounting 3 run-in synchronism.
Concrete, there is a large through-hole (the first installing hole 11) at base 4 center, is used for inserting from the top down rotating air floating structure 1, installs.There is a circle boss 12 around through hole, rotate air floating structure 1 and be stuck on that circle boss 12.
Rotary encoder 15, from bottom to top, is enclosed within and rotates the axle head of air floating structure 1 lower end, is used for the angle of Real-Time Monitoring worktable rotary and the location that precise positioning workbench stops.
Rotate the axle of air floating structure 1 upper end, insert turntable mounting 3 lower end circular hole (the second installing hole 13), be connected by screw with the flange section (flange arrangement 14) of turntable mounting 3 lower end.
Preferably, rotate on air floating structure 1 and carry four cover wafer-supporting platforms 5, realize four station structures of rotary table.
Namely, the lower surface of wafer-supporting platform 5, is sitting on the big disk (plummer 7) of rotation air floating structure 1, with 90 degree for calibration, installs four respectively, connects by screw.
Corresponding, turntable mounting 3 has the hole (through hole 10) of 4 90 degree of calibration, upper surface, through 4 holes on turntable mounting 3, is exposed in wafer-supporting platform 5 upper surface.
The operation principle of above-mentioned (four stations) rotary index table system is: during equipment operation, fluctuating plate robot manipulator structure b4 moves to E load station, film releasing.Rotary index table A carries out 90 degree of station conversion, and the wafer of load station rotates to D and roughly grinds station, and coarse grinding treatment b1 structure, to lower feeding, carries out rough grinding pass.Rotary index table A carries out 90 degree of station conversion, and the wafer of corase grind station rotates to C and refines station, and structure b2 is to lower feeding in fine grinding process, carries out lapping process.Rotary index table A carries out 90 degree of station conversion, and the wafer of fine grinding station rotates to F polishing station, and polishing structure b3 carries out chemically mechanical polishing to the wafer refined.Rotary index table A carries out 90 degree of station conversion, and the wafer of polishing station rotates to E load station, fluctuating plate robot manipulator structure grasping silicon wafer sheet.
It should be noted that, because above-mentioned rotary encoder 15 is arranged on the axle lower end rotating air floating structure 1, so achieve precision round subsection position monitor and the control of the 90 degree of station conversion of (four stations) rotary index table system, and rotary encoder is higher than traditional photoelectric sensor positioning precision, can ensure that emery wheel passes through wafer-supporting platform center, improve machining accuracy.
As from the foregoing, the rotary index table system that the embodiment of the present invention provides, by the rotary motion of rotary index table, realize wafer roughly grinding, refine, changing between polishing and fluctuating plate four stations, by integrated for attenuated polishing technique, while decreasing fragment rate, improve the stability that equipment runs, solve the transmission of conventional wafer between each process equipment and cause a large amount of fragment, jamming equipment stability, the technical problem of inefficiency, energy waste.
In sum, embodiments provide the four station rotary index table systems that a kind of simple and practical, easy to use, structure is reliable and operate steadily, for improving thin slice transmission reliability, adopt the function of same wafer-supporting platform carrying out fluctuating plate, corase grind, fine grinding, polishing to wafer order, avoid the wafer transmission that each equipment room manually transports in technological process operation, systems approach, essence avoids wafer risk broken in grinding, polishing and transmitting procedure, while decreasing fragment rate, improve the stability that equipment runs.
The present invention can effectively realize: 1. the precise machining process of ultra-thin super large wafer; 2. high production capacity cuts operating costs; 3. complete machine integrated technology improves equipment dependability and stability; 4. production procedure can hardware and software platform, structure is used in processing technology of the same type, improves equipment compatibility and flexibility, and solve fragment in prior art and reduce production efficiency, jamming equipment runs, and affects grinding quality, and the problem of energy waste.Therefore, the semiconductor manufacturing equipment (rotary index table system) for processing wafer provided by the invention, can guarantee the process requirements of semiconductor manufacturing equipment in modern encapsulation technology and large Production requirement.
It should be noted that, the described embodiment that realizes of above-mentioned rotary index table is all applicable to, in the embodiment of this rotary index table system, also can reach identical technique effect.
Above-described is the preferred embodiment of the present invention; should be understood that the ordinary person for the art; not departing under principle prerequisite of the present invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (11)
1. a rotary index table, is characterized in that, comprising:
Rotate air floating structure, drived control structure, turntable mounting, base and multiple wafer-supporting platform for placing pending;
Wherein, the described rotation air floating structure plummer that comprises connecting axle and be fixedly linked with the middle part of described connecting axle;
The rotating disk platform that described turntable mounting comprises fixed axis and is fixedly linked with the upper part of described fixed axis, described rotating disk platform is provided with multiple through hole;
Described rotation air floating structure is worn by the end portion of described connecting axle and is fixed on described base, is fixedly linked by the end portion of the upper part of described connecting axle and the fixed axis of described turntable mounting;
The end portion of described wafer-supporting platform is fixed on the plummer of described rotation air floating structure, and upper part is exposed from the through hole of the described rotating disk platform of correspondence position;
The partial fixing that described drived control structure passes from described base with the end portion of described connecting axle is connected;
Described drived control structure drives described rotation air floating structure to rotate the angle preset, and drives described turntable mounting and described wafer-supporting platform to rotate, described wafer-supporting platform is rotated to corresponding station.
2. rotary index table as claimed in claim 1, it is characterized in that, described base is provided with the first installing hole, and the end portion of described connecting axle is worn by described first installing hole and is fixed on described base.
3. rotary index table as claimed in claim 2, it is characterized in that, the periphery of described first installing hole is provided with boss, and a wherein part for the end portion of described connecting axle is connected with described boss clamping, and the end portion of connecting axle described in another part exposes through described first installing hole.
4. rotary index table as claimed in claim 1, it is characterized in that, the end portion of described fixed axis is provided with the second installing hole, and the upper part of described connecting axle is fixedly linked by the end portion of described second installing hole and described fixed axis.
5. rotary index table as claimed in claim 4, it is characterized in that, the periphery of described second installing hole is provided with flange arrangement, a wherein part for the upper part of described connecting axle is inserted in described second installing hole, and the upper part of connecting axle described in another part is fixedly linked by screw and described flange arrangement.
6. rotary index table as claimed in claim 1, it is characterized in that, described drived control structure comprises rotary encoder and motor;
Wherein, on the part-structure that the end portion that described rotary encoder fixed cover is located at described connecting axle passes from described base, the end portion end face of described motor and described connecting axle is fixedly linked.
7. rotary index table as claimed in claim 1, it is characterized in that, the edge of described plummer is provided with mounting ear, and the end portion of described wafer-supporting platform is fixedly linked by screw and described mounting ear.
8. rotary index table as claimed in claim 1, it is characterized in that, the quantity of described wafer-supporting platform is 4, the four indexing rotary table platforms that described rotating disk platform is is calibration with 90 degree;
The quantity of described through hole is 4, and the position of the position of described through hole and described wafer-supporting platform adapts.
9. rotary index table as claimed in claim 2, it is characterized in that, described base is the rectangular frame structure with an end face, and described first installing hole is located on described end face.
10. a rotary index table system, is characterized in that, comprising: the rotary index table as described in any one of claim 1 to 9, also comprises: multiple PROCESS FOR TREATMENT structure;
The wafer-supporting platform of described rotary index table rotates to corresponding station, carries out rotation, and with the described PROCESS FOR TREATMENT respective outer side edges of correspondence position, described PROCESS FOR TREATMENT structure carries out PROCESS FOR TREATMENT to pending on described wafer-supporting platform.
11. rotary index table systems as claimed in claim 10, it is characterized in that, described PROCESS FOR TREATMENT structure comprises: coarse grinding treatment structure, fine grinding process structure, polishing structure and fluctuating plate robot manipulator structure.
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| CN201510859898.2A CN105415146B (en) | 2015-12-01 | 2015-12-01 | A kind of rotary index table and rotary index table system |
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| CN201510859898.2A CN105415146B (en) | 2015-12-01 | 2015-12-01 | A kind of rotary index table and rotary index table system |
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| CN105415146A true CN105415146A (en) | 2016-03-23 |
| CN105415146B CN105415146B (en) | 2019-06-11 |
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| CN107263267A (en) * | 2017-07-05 | 2017-10-20 | 北京中电科电子装备有限公司 | A kind of wafer attenuated polishing device |
| CN108000267A (en) * | 2017-12-26 | 2018-05-08 | 北京中电科电子装备有限公司 | The machine of being thinned |
| CN109848814A (en) * | 2019-02-26 | 2019-06-07 | 北京中电科电子装备有限公司 | A kind of full-automatic wafer attenuated polishing device |
| CN109877666A (en) * | 2019-03-22 | 2019-06-14 | 安徽新境界自动化技术有限公司 | A kind of double mechanical arms multi-station high efficient grinding apparatus |
| CN112894515A (en) * | 2021-02-07 | 2021-06-04 | 新一代半导体研究所(深圳)有限公司 | Semiconductor wafer surface treatment device and treatment method |
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| CN115401548A (en) * | 2022-08-24 | 2022-11-29 | 河源市众拓光电科技有限公司 | Wafer thinning device and method |
| CN115609392A (en) * | 2022-09-29 | 2023-01-17 | 亚新半导体科技(无锡)有限公司 | Fab factory is with processing equipment who has intelligent automatic function of snatching |
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| WO2019127910A1 (en) * | 2017-12-26 | 2019-07-04 | 北京中电科电子装备有限公司 | Thinning machine |
| CN109848814A (en) * | 2019-02-26 | 2019-06-07 | 北京中电科电子装备有限公司 | A kind of full-automatic wafer attenuated polishing device |
| CN109877666A (en) * | 2019-03-22 | 2019-06-14 | 安徽新境界自动化技术有限公司 | A kind of double mechanical arms multi-station high efficient grinding apparatus |
| CN114096379A (en) * | 2019-07-17 | 2022-02-25 | 东京毅力科创株式会社 | Substrate processing apparatus, substrate processing system, and substrate processing method |
| CN114096379B (en) * | 2019-07-17 | 2023-06-30 | 东京毅力科创株式会社 | Substrate processing apparatus, substrate processing system, and substrate processing method |
| CN112894515B (en) * | 2021-02-07 | 2021-12-21 | 苏州鼎芯光电科技有限公司 | Semiconductor wafer surface treatment device and treatment method |
| CN112894515A (en) * | 2021-02-07 | 2021-06-04 | 新一代半导体研究所(深圳)有限公司 | Semiconductor wafer surface treatment device and treatment method |
| CN115179130A (en) * | 2022-07-26 | 2022-10-14 | 江苏京创先进电子科技有限公司 | Indexing table with locking mechanism and thinning machine |
| CN115179130B (en) * | 2022-07-26 | 2023-11-10 | 江苏京创先进电子科技有限公司 | Indexing table with locking mechanism and thinning machine |
| CN115401548A (en) * | 2022-08-24 | 2022-11-29 | 河源市众拓光电科技有限公司 | Wafer thinning device and method |
| CN115609392A (en) * | 2022-09-29 | 2023-01-17 | 亚新半导体科技(无锡)有限公司 | Fab factory is with processing equipment who has intelligent automatic function of snatching |
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