KR20110057454A - Dual work table for dicing wafer and apparatus for including the same - Google Patents

Dual work table for dicing wafer and apparatus for including the same Download PDF

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Publication number
KR20110057454A
KR20110057454A KR1020090113871A KR20090113871A KR20110057454A KR 20110057454 A KR20110057454 A KR 20110057454A KR 1020090113871 A KR1020090113871 A KR 1020090113871A KR 20090113871 A KR20090113871 A KR 20090113871A KR 20110057454 A KR20110057454 A KR 20110057454A
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KR
South Korea
Prior art keywords
dicing
cutting
plates
conveying
conveyed
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KR1020090113871A
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Korean (ko)
Inventor
황성일
Original Assignee
(주)네온테크
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Priority to KR1020090113871A priority Critical patent/KR20110057454A/en
Publication of KR20110057454A publication Critical patent/KR20110057454A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

The present invention relates to a dual working table for dicing and a dicing apparatus including the same, by installing a double working platform driven independently of each other and transferred to the cutting unit, by repeating the process of alternately being transferred to the cutting side side In addition, the present invention relates to a dicing workbench for dicing and to a dicing device including the double workbench capable of repeatedly performing a preliminary work and a sorting work together with a cutting process.

In the dicing apparatus according to the present invention, for this purpose, two fixing plates for supporting and fixing the semiconductor wafer, two transfer plates coupled to each fixed plate and conveyed or conveyed in the X-axis direction, and the two transfer plates And a controller for controlling each of the conveying apparatus parts, and the controller for controlling the conveying device portions to be repeatedly and independently conveyed with respect to the X-axis direction, respectively, wherein the two conveying plates are alternately conveyed and conveyed to each other. The present invention provides a dicing workbench for dicing and a dicing apparatus including the same, which can be configured to include a dual workbench for dicing to control different operations on the fixed plate at different positions at the same time.

Dicing, Dicing Units, Dual Work Table, Dual Work Table

Description

Dual work table for dicing wafer and apparatus for including the same}

The present invention relates to a dual workbench for dicing and a dicing apparatus including the same, and more particularly, with a workbench for fixing a semiconductor wafer to be able to work by positioning the blade and a blade for cutting the semiconductor wafer. The present invention relates to a dicing apparatus including a rotating spindle and a driving motor for driving the rotating spindle.

A semiconductor chip manufactured and used in various forms in various electronic devices is used for dividing a wafer including semiconductor elements such as an IC formed in a plurality of division schedule lines partitioned on a surface along a predetermined division schedule line for mass production purposes. To produce semiconductor chips of the desired size and function.

As such a wafer dividing apparatus, a dicing apparatus including a cutting portion including a cutting blade rotating by a spindle, and a work table for supporting and fixing the wafer to enable cutting by the cutting blade is generally used.

In the dicing process for cutting wafers using such a dicing apparatus, a semiconductor wafer, which is manufactured in a disk shape to be suitable for mass production and has a plurality of semiconductor elements disposed on the surface, is adhered to a tape, and the cutting of a spindle rotating at high speed By the blade, only the wafer surface excluding the tape is cut into regions which are previously partitioned to include a predetermined semiconductor element. Through this dicing process, a single semiconductor chip is divided from a wafer and manufactured.

1 is a configuration commonly used in a dicing apparatus according to the prior art, in which a cutting part and a rotatable worktable 3 including a spindle 1 and a cutting blade 2 that rotate at high speed are configured to be transportable It includes wealth.

In the prior art dicing apparatus, as shown in FIG. 1, the semiconductor wafer is a region in which the spindle 1 driven by the motor 4 rotating at a high speed and the cutting blade 2 attached to the spindle rotate. The wafer on the workbench is positioned under the cutting blade so that the wafer is cut along the pre-divided street (scheduled line to be divided) as the workbench fixed by (W) is transferred in the tangential direction thereof.

However, such a dicing apparatus according to the related art requires a work process of placing a workbench under a cutting blade to perform a cutting process, and then sorting and rearranging the cut semiconductor chips. There is a problem in that work productivity is impaired because prior work such as recognizing and providing corresponding information to the dicing apparatus is necessary.

The present invention has been made in order to solve the above problems, in the present invention, in the dicing apparatus for dicing and the dicing apparatus including the same, by installing the dual working platform driven independently of each other and transferred to the cutting unit, By repeating the process of alternately transported to the cutting side and then back, there is provided a dicing device for dicing and a dicing device including the double work platform that can repeatedly perform pre-working and sorting work with the cutting process.

In order to achieve the above object, the present invention comprises: two fixing plates for supporting and fixing a semiconductor wafer; Two conveying plates coupled to respective fixed plates and conveyed or conveyed in the X-axis direction; A conveying device unit for repeatedly conveying or conveying each of the two conveying plates independently of the X-axis direction; A controller for controlling the transfer device; And the controller provides a dual workbench for dicing to control the two conveying plates to be alternately transported and conveyed so that different operations can be simultaneously performed on the fixed plates at different positions.

In addition, the fixed plate provides a dual working table for dicing, characterized in that the rotational fixed plate.

In this case, the rotatable stationary plate provides a dual worktable for dicing, characterized in that the rotatable stationary plate is set to rotate at intervals of 90 degrees.

And, each of the rotatable fixed plate is made of a circular, the transfer plate is coupled to provide a dual working platform for dicing, characterized in that consisting of a square transfer plane facing each other.

In addition, the fixing plate provides a dual working table for dicing, characterized in that it further comprises a suction means for absorbing and fixing the semiconductor wafer.

On the other hand, in the present invention, the cutting portion is composed of a spindle that is rotationally driven by a drive motor, a cutting blade coupled to the spindle, the position adjusting means for adjusting the cutting position by transferring the spindle and the cutting blade in the Y-axis direction. Wow; And a double working table for dicing which can respectively seat the semiconductor wafer, wherein the double working table for dicing includes two fixing plates for supporting and fixing the semiconductor wafer; Two conveying plates coupled to respective fixed plates and conveyed or conveyed in the X-axis direction; A conveying device unit for repeatedly conveying or conveying each of the two conveying plates independently of the X-axis direction; A controller for controlling the transfer device; And the controller controls the two transfer plates to be alternately transported and conveyed so that cutting by the cutting unit is performed on one fixed plate, and non-cutting processing is simultaneously performed on the other fixed plate. Provide a Singh device.

Here, the cutting unit provides a dicing apparatus, characterized in that the cutting unit including two spindles and two cutting blades coupled thereto.

In addition, the fixed plate provides a dicing apparatus, characterized in that the rotational fixed plate.

Here, the rotatable stationary plate provides a dicing device, characterized in that the rotatable stationary plate is set to rotate at intervals of 90 degrees.

In addition, each of the rotatable fixed plates is circular, and the transfer plate coupled thereto is provided with a dicing device for dicing comprising a double working table consisting of square transfer plates facing each other.

In addition, the fixing plate provides a dicing apparatus, characterized in that the dual working table for dicing further comprising a suction means for adsorbing and fixing the semiconductor wafer.

As described above, the dual working platform for dicing and the dicing apparatus including the same according to the present invention are configured as a dual working platform in which two working platforms are alternately transported and conveyed, and thus cutting and cutting the wafer by the cutting blade and before and after the cutting process. This can be done at the same time has the effect of significantly reducing the dicing process time by eliminating the work delay time.

In addition, the dual working table for dicing and the dicing apparatus including the same according to the present invention has an effect of increasing the productivity as the time taken for the dicing process is significantly reduced, cost is reduced according to the unit yield, thereby improving productivity.

In the present invention for achieving the above object, a cutting blade for cutting a semiconductor wafer in a straight line, a spindle rotatable and coupled to the cutting blade and a motor for driving the same And a dicing apparatus including a dicing apparatus including a cutting unit consisting of a cutting unit, a double working table for supporting and fixing the semiconductor wafer and repeatedly transferring the semiconductor wafer to the cutting unit. To provide.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this application, the terms “comprises” or “having” are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other It is to be understood that the present invention does not exclude the possibility of the presence or the addition of features, numbers, steps, operations, components, parts, or a combination thereof.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a conceptual diagram briefly showing an example of the operation of each configuration in order to explain the operation of the cutting portion and the double work table in the dicing apparatus according to the present invention.

As shown in FIG. 2, in the dicing apparatus according to the present invention, a cutting portion 10 including a cutting blade 12 configured to be rotatable by a spindle and a semiconductor wafer W are placed so that cutting is performed. It consists of two different work benches (21, 22).

The spindle and cutting blade 12 may be composed of a single spindle and a cutting blade so as to be able to cut about one street, but preferably, as shown in FIG. By configuring the spindles to face each other, two streets can be cut at the same time.

In addition, each spindle is moved back and forth by a transfer means that can be transferred in its axial direction (hereinafter referred to as the 'Y axis direction'), and adjusts the cutting position, and in some cases, the feed direction of the working tables 21 and 22. As one spindle moves in the following (hereinafter referred to as the 'X axis direction'), the spindles may be arranged on two axes to allow cutting in an overlapping area. More preferably, the dicing apparatus according to the present invention may further include an elevating means capable of elevating in a direction perpendicular to a work table (hereinafter referred to as 'Z-axis direction') so that each spindle can adjust the cutting height. .

On the other hand, in the dicing apparatus according to the present invention is a dual workbench which is separated into two different work cutting surfaces, the first workbench 21 and the second workbench 22 configured to suck and fix the semiconductor wafer by vacuum. Is installed, the first workbench and the second workbench are configured to be transportable in the X-axis direction as shown in FIG. Each work bench (first work bench and second work bench) constituting the dual work bench includes adsorption means for fixedly holding and supporting the semiconductor wafer, and is provided in the X-axis direction by separate driving means to enable independent transport of each other. Transferred.

Preferably, the dual working platform is configured to be transported and conveyed alternately in the lower direction of the cutting blade, the spindle and the cutting blade in accordance with a predetermined time, so that the first working platform is below the cutting blade (AA '). In the case where the cutting work is carried out at the second workbench, the realignment work and the preliminary work of the new wafer are performed at the position BB´ where the second workbench is conveyed. If so, the first workbench is configured to perform other operations than cutting at the alignment line BB '.

Therefore, when the first workbench or the second workbench is transferred and positioned on the cutting line AA ′ to perform cutting, each spindle is moved by the first workbench or the second workbench by means of feed in the X-axis direction. It is configured to move to the cuttable position and to cut the wafer as the work table of the cutting line is transferred in the X-axis direction.

3 is a perspective view showing in detail a preferred embodiment of the dicing apparatus according to the present invention.

As shown in FIG. 3, the dicing apparatus according to the present invention includes two spindles rotated by two driving motors 13 and cutting blades 12 coupled to each spindle to perform cutting. It includes a cutting unit 10 including a).

The cutting part includes a conveying means that can be transferred in the Y-axis direction to position the cutting blade according to the cutting position, and a lifting means that can be transferred in the Z-axis direction to adjust the cutting height at the cutting position.

In addition, each spindle constituting the cutting portion is preferably composed of a spindle located coaxially to perform the cutting at a constant level, in some cases, such as when the position on the Y axis of the spindle overlap each other, In consideration of the case where it is necessary to perform the work, the present embodiment can be configured to include a conveying means capable of conveying on the same X axis as the conveying direction of the work part.

On the other hand, in one embodiment of the dicing apparatus according to the present invention is a double worktable consisting of two separate worktables movable in the X-axis direction so that the cutting work can be performed alternately by two spindles (first worktable, second Work table). Each work table is configured to include a conveying means of the work table which is controlled to be transportable in the X-axis direction corresponding to the cutting progress direction, so that each work table can alternately perform a predetermined work.

On the other hand, as shown in Figure 4, the first workbench 21 and the second workbench 22 in the present invention is the primary and secondary cutting along the street partitioned by the rotating cutting blade 12 To this end, each is configured to have rotatable rotating means (not shown), the rotating means being set to be rotatable at intervals of 90 degrees so as to effectively cut the street partitioned horizontally and vertically.

At this time, the first working platform and the second working platform is configured to be spaced apart from each other so that each working platform does not interfere with each other during transport and rotation. For this configuration, in the present embodiment, the transfer plates 31 and 33 constituting the transfer means for moving the respective worktables in the X-axis direction and are formed separately inside the transfer plate, and can be rotated while the wafer is fixed. It is configured to be separated into a rotating fixed plate (32, 34) formed to. In this case, as shown in Figure 3, as shown in Figure 3, the square plates facing each other are configured to be transported in the X-axis direction, so as not to interfere with each other during the transfer, while the fixing plate 32 ) Is composed of a circular plate including a vacuum suction means and a rotating means on the lower side is configured so that interference due to rotation with respect to different working table does not occur.

FIG. 5 is a plan view illustrating performing different operations at opposite positions by sequentially transferring or conveying each work bench.

The conveying means for conveying the first working platform 21 and the second working platform 22 in the X-axis direction alternately transfers or conveys the cutting work and the realignment work and the preliminary work by preliminarily transferring them at opposite positions at predetermined time intervals. The work is configured to be performed simultaneously on each workbench, and as shown in FIG. 5, when the second workbench is performing a wafer cutting operation, the first workbench is a preliminary work for recognizing wafer inception and data at an opposite position. Can be configured to perform

Therefore, in the dicing apparatus according to the present invention, it is possible to simultaneously perform different operations on the two work platforms, thereby maximizing the yield by eliminating the work delay inevitably occurring between cutting operations.

While the invention has been described with reference to the preferred embodiments, those skilled in the art will appreciate that modifications and variations of the elements of the invention may be made without departing from the scope of the invention. In addition, many modifications may be made to particular circumstances or materials without departing from the essential scope of the invention. Therefore, the invention is not limited to the details of the preferred embodiments of the invention, but will include all embodiments within the scope of the appended claims. In particular, the dicing apparatus including the dual working table according to the present invention will be equally applicable to not only the cutting operation of the semiconductor wafer described above, but also similar processes such as a solar light collecting semiconductor module or a memory package module.

1 is a simplified configuration diagram of a dicing apparatus according to the prior art.

2 is a configuration diagram schematically showing an operation example of a dicing apparatus according to the present invention.

Figure 3 is a perspective view showing in detail a preferred embodiment of the dicing apparatus according to the present invention.

Figure 4 is an enlarged perspective view of the working table of the dicing apparatus according to the present invention.

5 is a plan view showing a work table for performing different processes in the dicing apparatus according to the present invention.

<Explanation of symbols for the main parts of the drawings>

10: cutting part 12: cutting blade

21: 1st working bench 22: 2nd working bench

31 (33): Transfer Plate 32 (34): Fixing Plate

Claims (11)

Two fixing plates for supporting and fixing the semiconductor wafer; Two conveying plates coupled to respective fixed plates and conveyed or conveyed in the X-axis direction; A conveying device unit for repeatedly conveying or conveying each of the two conveying plates independently of the X-axis direction; A controller for controlling the transfer device; Including, And the controller controls the two transfer plates to be alternately transported and conveyed so that different operations can be simultaneously performed on the fixed plates at different positions. The dual working platform for dicing according to claim 1, wherein the fixed plate is a rotary fixed plate. The dicing platform of claim 2 wherein the rotatable stationary plate is a rotatable stationary plate set to rotate at intervals of 90 degrees. 3. The dual working platform for dicing as set forth in claim 2, wherein each of the rotatable fixed plates is circular, and the transfer plates coupled thereto are composed of rectangular transfer planes facing each other. 2. The dual working table for dicing according to claim 1, wherein the fixing plate further includes suction means for absorbing and fixing the semiconductor wafer. A cutting unit including a spindle rotationally driven by a drive motor, a cutting blade coupled to the spindle, and a position adjusting means for transferring the spindle and the cutting blade in the Y-axis direction to adjust a cutting position; It includes; a dual worktable for dicing each seating the semiconductor wafer; The dual working table for dicing includes two fixing plates for supporting and fixing a semiconductor wafer; Two conveying plates coupled to respective fixed plates and conveyed or conveyed in the X-axis direction; A conveying device unit for repeatedly conveying or conveying each of the two conveying plates independently of the X-axis direction; A controller for controlling the transfer device; Including, And the controller controls the two transfer plates to be alternately transferred and conveyed so that cutting by the cutting portion is performed on one fixed plate, and non-cutting processing is simultaneously performed on the other fixed plate. The dicing apparatus according to claim 6, wherein the cutting portion is a cutting portion including two spindles and two cutting blades coupled thereto. The dicing apparatus according to claim 7, wherein the fixing plate is a rotatable fixing plate. The dicing apparatus according to claim 8, wherein the rotatable stationary plate is a rotatable stationary plate set to rotate at intervals of 90 degrees. 9. The dicing apparatus according to claim 8, wherein each of the rotatable fixed plates is circular, and the transfer plates coupled thereto are double working tables for dicing comprising square transfer plates facing each other. The dicing apparatus according to claim 1, wherein the fixed plate is a dual working platform for dicing further comprising adsorption means for adsorbing and fixing the semiconductor wafer.
KR1020090113871A 2009-11-24 2009-11-24 Dual work table for dicing wafer and apparatus for including the same KR20110057454A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102148100B1 (en) 2019-08-26 2020-08-25 (주)네온테크 Hybrid dicing apparatus and cutting method for the same
KR102148117B1 (en) 2020-03-26 2020-08-26 (주)네온테크 Apparatus comprising multi router spinndle and processing method for the same
KR102550583B1 (en) 2022-06-17 2023-07-03 (주)네온테크 Processing and checking methods by auto alignment after loading substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102148100B1 (en) 2019-08-26 2020-08-25 (주)네온테크 Hybrid dicing apparatus and cutting method for the same
KR102148117B1 (en) 2020-03-26 2020-08-26 (주)네온테크 Apparatus comprising multi router spinndle and processing method for the same
KR102550583B1 (en) 2022-06-17 2023-07-03 (주)네온테크 Processing and checking methods by auto alignment after loading substrate

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