WO2019127910A1

WO2019127910A1 - Thinning machine

Info

Publication number: WO2019127910A1
Application number: PCT/CN2018/078721
Authority: WO
Inventors: 杨生荣; 贺东葛; 姚立新; 王仲康; 衣忠波; 刘宇光; 张盼
Original assignee: 北京中电科电子装备有限公司
Priority date: 2017-12-26
Filing date: 2018-03-12
Publication date: 2019-07-04
Also published as: CN108000267A

Abstract

A thinning machine (100), comprising: a body (10), the body being provided with two feeding and grinding shafts (11); a rotary tray (20), the rotary tray being rotationally disposed on the body and located below the feeding and grinding shafts; a plurality of wafer chuck systems (30), each wafer chuck system being used for sucking wafers by means of vacuum, the multiple wafer chuck systems being separately disposed on the rotary tray and driven by the rotary tray so that the stations of the wafer chuck systems are switched, the multiple wafer chuck systems being arranged at intervals, and when the rotary tray rotates to any working position, two of the multiple wafer chuck systems corresponding to the positions of the two feeding and grinding shafts; and a drive member (40), the drive member is connected to the rotary tray so as to drive the rotary tray to rotate. According to the thinning machine, the production efficiency of wafer grinding can be effectively improved, and energy consumption is reduced.

Description

Thinning machine

Cross-reference to related applications

The present application claims priority to Chinese Patent Application No. 2017.

Technical field

The present disclosure relates to the field of semiconductor processing equipment, and more particularly to a thinning machine.

Background technique

Semiconductor-specific equipment In the process of processing wafers, since wafer grinding technology belongs to nano-plastic grinding technology, most hard and brittle materials can only be processed by grinding, and plastic grinding can improve surface quality, but Low efficiency and poor economy.

One of the ways to increase the plastic deformation to obtain a higher removal rate is to increase the grinding wheel speed. Due to the limitation of mechanical rigidity and the heat resistance temperature of the diamond abrasive, the rotation speed of the grinding wheel will be limited, so the way to improve the grinding efficiency can be carried out from the structural layout design of the grinding system.

Summary of the invention

In view of this, the present disclosure provides a thinning machine.

In order to solve the above technical problem, the present disclosure adopts the following technical solutions:

A thinning machine according to an embodiment of the present disclosure includes:

a body having two feed grinding shafts;

Rotating the tray, the rotating tray is rotatably disposed on the body and below the feed grinding shaft;

a plurality of stage systems, each of the stage systems for respectively absorbing a wafer by vacuum, a plurality of the stage systems being respectively disposed on the rotating tray and driven by the rotating tray to switch each a station of the stage system, a plurality of the stage systems are spaced apart, and the rotating tray is rotated to any working position, two of the plurality of said stage systems The table system corresponds to the position of the two feed grinding axes;

a driving member connected to the rotating tray to drive the rotating tray to rotate.

Further, the rotating tray is formed in a circular shape, and the rotating tray is rotatably provided on the body about an axis thereof.

Further, the plurality of said stage systems are three, and the three said stage systems are evenly spaced apart on the rotating tray, and the distance between any two of the stage systems is equal to two The distance between the feed grinding axes.

Further, each of the carrier system includes:

a spindle, the spindle being disposed on the rotating tray;

a stage, the stage being detachably disposed on the spindle for absorbing the wafer by vacuum.

Further, the stage is formed in a disc shape, and the stage is detachably connected to the main shaft by bolts.

Further, the thinning machine further includes:

a tenter provided on the body adjacent to the feed grinding shaft for clamping a non-standard wafer to prevent the advancement when a non-standard wafer is placed on the stage The grinding shaft drives non-standard wafer activity during operation.

Further, the rotating tray is formed as an air floating tray, and the rotating tray and the body are compressed air as a gas film.

Further, the thinning machine further includes:

a drive shaft, the drive shaft being disposed on a lower surface of the rotating tray and coupled to the rotating tray and the driving member, the driving shaft being coaxially disposed with the rotating tray to drive the driving member Rotate the tray to rotate.

Further, the drive shaft extends in a vertical direction, and the driving member is formed as a motor extending in a horizontal direction, and the thinning machine further includes:

The speed reducer is formed in an L shape, one end of the speed reducer is connected to the motor, and the other end of the speed reducer is connected to the drive shaft.

Further, the drive shaft is integrally formed with the rotating tray.

The beneficial effects of the above technical solutions of the present disclosure are as follows:

The thinning machine according to the embodiment of the present disclosure can effectively improve the production efficiency of wafer grinding and reduce energy consumption, and the thinning machine can be widely used for grinding of various standard or non-standard wafers, conforming to wafer grinding processing. According to the process requirements, the thinning machine has a compact overall structure, simple installation, reliable structure and stable operation.

DRAWINGS

1 is a schematic structural view of a thinning machine according to an embodiment of the present disclosure;

2 is another schematic structural view of a thinning machine according to an embodiment of the present disclosure;

3 is a top plan view of a thinning machine of an embodiment of the present disclosure;

4 is a schematic structural view of a carrier of a thinning machine according to an embodiment of the present disclosure;

FIG. 5 is another schematic structural view of a stage of a thinning machine according to an embodiment of the present disclosure; FIG.

Figure 6 is a schematic view showing the operation of the film stage of the thinning machine of the embodiment of the present disclosure;

Figure 7 is a schematic view showing another operation of the film stage of the thinning machine of the embodiment of the present disclosure;

FIG. 8 is still another schematic view of the working table of the thinning machine of the thinning machine according to the embodiment of the present disclosure; FIG.

Fig. 9 is a schematic view showing still another operation of the stage of the thinning machine of the embodiment of the present disclosure.

Reference mark:

Thinning machine 100;

Body 10; feed grinding shaft 11;

Rotating tray 20;

a bearing table system 30; a main shaft 31; a bearing table 32; a first receiving table 32a; a second receiving table 32b; a third receiving table 32c;

Drive member 40;

Stretcher 50;

Drive shaft 60;

Reducer 70.

Detailed ways

The technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. It is apparent that the described embodiments are part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure are within the scope of the disclosure.

The thinning machine 100 according to an embodiment of the present disclosure will be specifically described below with reference to the accompanying drawings.

As shown in FIGS. 1 through 9, a thinning machine 100 according to an embodiment of the present disclosure includes a body 10, a rotating tray 20, a plurality of stage systems 30, and a drive member 40.

Specifically, the body 10 has two feed grinding shafts 11 that are rotatably disposed on the body 10 and below the feed grinding shaft 11, each of which is used for vacuum suction A plurality of wafer stage systems 30 are respectively disposed on the rotating tray 20 and driven by the rotating tray 20 to switch the stations of each of the stage systems 30. The plurality of stage systems 30 are spaced apart and the rotating tray 20 is When rotated to any working position, two of the plurality of stage systems 30 correspond to the positions of the two feed grinding shafts 11, and the drive member 40 is coupled to the rotating tray 20 to drive the rotating tray 20. Turn.

In other words, the thinning machine 100 according to an embodiment of the present disclosure is mainly composed of the body 10, the rotating tray 20, the plurality of stage systems 30, and the driving member 40. Two feeding grinding shafts 11 can be mounted on the body 10, and the two feeding grinding shafts 11 can respectively perform rough grinding and fine grinding on the wafer, and the same wafer can first be ground through a coarse grinding wheel to remove more matrix materials. The finer grinding wheel then grinds off less matrix material. The time for rough grinding and fine grinding of the two feed grinding shafts 11 is close, and there is no time waiting between the stations, so that the processing of the coarse grinding station and the fine grinding station can be realized simultaneously for different wafers, and the processing can be improved. The efficiency of the equipment.

The rotating tray 20 may be disposed on the body 10, and the rotating tray 20 may be rotated on the body 10. The mounting position of the rotating tray 20 on the body 10 may be located below the feeding grinding shaft 11. Each of the stage systems 30 can be used to vacuum-adsorb the wafers, respectively, and the plurality of stage systems 30 can be mounted on the rotating tray 20, respectively, the driving member 40 can be mounted under the rotating tray 20, and the driving member 40 can drive the rotating tray 20 turns.

The rotary tray 20 can be driven by the drive member 40 to rotate each of the stage system 30, and the rotation of the rotary tray 20 can switch the station of each of the stage systems 30. A plurality of stage systems 30 can be mounted on the rotating tray 20 at intervals, and when the rotating tray 20 is rotated to any working position, two of the plurality of stage systems 30 can be separately and two The position of the feed grinding shaft 11 corresponds to that the two feed grinding shafts 11 can simultaneously grind the wafer, wherein one feed grinding shaft 11 can be used for rough grinding of the wafer, and another feed grinding The shaft 11 can be used to finely grind the wafer.

Thus, the thinning machine 100 according to the embodiment of the present disclosure can effectively improve the production efficiency of wafer grinding and reduce energy consumption.

According to an embodiment of the present disclosure, the rotary tray 20 is formed in a circular shape, and the rotary tray 20 is rotatably provided on the body 10 about its axis.

That is, the rotary tray 20 can be machined into a circular shape, and the rotary tray 20 can be rotated on the body 10, and the position of each of the stage system 30 can be switched by rotating the rotary tray 20.

In some embodiments of the present disclosure, the plurality of stage systems 30 are three, and the three stage systems 30 are evenly spaced apart on the rotating tray 20. The distance between any two of the stage systems 30 is equal to two. The distance between the feed grinding shafts 11 is spaced.

In other words, the stage system 30 can be formed in three, and the three stage systems 30 can be mounted evenly spaced on the rotating tray 20. The distance between any two of the stage systems 30 may be equal to the distance between the two feed grinding shafts 11, and the three stage systems 30 may be mounted/unloaded on the thinning machine 100, respectively. An orderly switching between the bit, the roughing station and the finishing station ensures that any two of the stage systems 30 can be fed to the two grinding axes 11 respectively when the rotating tray 20 is rotated to any working position. Corresponding to the position, the two feed grinding shafts 11 can simultaneously grind the wafers on any two of the stage systems 30 to improve the grinding efficiency of the thinning machine 100.

According to one embodiment of the present disclosure, each of the stage systems 30 includes a main shaft 31 and a stage 32, respectively.

Specifically, the main shaft 31 is provided on the rotary tray 20, and the stage 32 is detachably provided on the main shaft 31 for absorbing the wafer by vacuum.

That is, each of the stage systems 30 is mainly composed of a main shaft 31 and a stage 32. The spindle 31 can be mounted on the rotary tray 20, and the carrier 32 can be detachably mounted with the spindle 31. The wafer can be mounted on the carrier 32 to effectively improve the assembly efficiency between the carrier 32 and the spindle 31.

In some embodiments of the present disclosure, the stage 32 is formed in the shape of a disk, and the stage 32 is detachably coupled to the spindle 31 by bolts.

In other words, the carrier 32 can be processed into a disk shape, and the carrier 32 can be detachably connected by a bolt and a spindle 31, and the assembly efficiency between the carrier 32 and the spindle 31 can be effectively improved by bolting. .

According to one embodiment of the present disclosure, the thinning machine 100 further includes a stretcher 50.

Specifically, the stretcher 50 is disposed on the body 10 adjacent to the feed grinding shaft 11, and the stretcher 50 is used to hold the non-standard wafer when the non-standard wafer is placed on the stage 32 to prevent the feed grinding shaft 11 from being fed. Work with non-standard wafer activities.

That is, the thinning machine 100 can also include a stretcher 50. The stretcher 50 can be mounted on the body 10, and the mounting position of the stretcher 50 on the body 10 can be adjacent to the feed grinding shaft 11. When the thinning machine 100 is in operation, the standard wafer and the non-standard wafer can be separately ground. When the thinning machine 100 grinds the standard wafer, the standard wafer can be placed directly on the wafer stage 32, and the wafer stage 32 can be rotated to the roughing station of the thinning machine 100 by adsorption or The grinding station is used for grinding. When the thinning machine 100 grinds a non-standard wafer, the stretcher 50 can be used to clamp a non-standard wafer, preventing the feed grinding shaft 11 from driving non-standard wafer activities during operation, and improving the thinning machine 100 to non-standard The polishing efficiency of the wafer greatly increases the range of use of the thinning machine 100, and realizes the processing requirements for different wafers.

In some embodiments of the present disclosure, the rotating tray 20 is formed as an air floating tray, and between the rotating tray 20 and the body 10, compressed air is used as a gas film.

In other words, the rotating tray 20 can be processed into an air floating tray, and the compressed air can be used as a gas film between the rotating tray 20 and the body 10 to prevent the friction between the rotating tray 20 and the body 10 from being caused by the rotation of the rotating tray 20. dead.

According to one embodiment of the present disclosure, the thinning machine 100 further includes a drive shaft 60.

Specifically, the drive shaft 60 is provided on the lower surface of the rotary tray 20 and is coupled to the rotary tray 20 and the drive member 40. The drive shaft 60 is disposed coaxially with the rotary tray 20 to drive the rotary tray 20 to be rotated by the drive member 40.

That is, the thinning machine 100 also includes a drive shaft 60. The drive shaft 60 can be mounted on the lower surface of the rotary tray 20. The drive shaft 60 can be coupled to the rotary tray 20 and the drive member 40. The drive shaft 60 can be disposed coaxially with the rotary tray 20 to facilitate the drive member 40 to drive the rotary tray 20 to rotate.

In some embodiments of the present disclosure, the thinning machine 100 further includes a speed reducer 70.

Specifically, the speed reducer 70 is formed in an L shape, one end of the speed reducer 70 is connected to the motor, and the other end of the speed reducer 70 is connected to the drive shaft 60.

In other words, the thinning machine 100 further includes a speed reducer 70, the drive shaft 60 can be vertically mounted on the lower surface of the rotating tray 20, the driving member 40 can be formed as a motor, and the speed reducer 70 can be processed into an L shape, the speed reducer 70 One end may be connected to the motor, and the motor may be mounted at one end of the speed reducer 70 in the horizontal direction. One end of the speed reducer 70 in the vertical direction may be connected to the drive shaft 60, and the cooperation between the speed reducer 70 and the drive member 40 may be effective. The rotational speed of the rotating tray 20 is controlled.

According to an embodiment of the present disclosure, the drive shaft 60 is integrally formed with the rotary tray 20, which improves the stability of the overall structure of the drive shaft 60 and the rotary tray 20, and reduces molding difficulty and molding cost.

The working principle of the thinning machine 100 of the present disclosure will be described below with reference to the accompanying drawings in conjunction with the specific embodiments.

As shown in FIGS. 1 to 9, two thinner grinding shafts 11 can be mounted on the thinning machine 100, and the two feed grinding shafts 11 can perform rough grinding and fine grinding of the wafer at the same time. The three carrier system 30 can be evenly spaced apart and mounted on the rotating tray 20. The three carrier systems 30 can be respectively mounted/unloaded at the thinning machine 100, the roughing station and the finishing station. During the orderly switching, the three stage system 30 can transmit 120° or 240° at three working positions, ensuring that the wafers of the two feed grinding axes 11 are always at the same time. Grinding and fine grinding. That is to say, each of the stage system 30 can realize two processing processes - rough grinding and fine grinding.

In the following, taking the grinding process of the non-standard wafer by the thinning machine 100 as an example, the transfer process of the three stage system 30 between the three working positions will be described.

As shown in FIGS. 6 to 9, the first stage 32a, the second stage 32b, and the third stage 32c may be respectively mounted/unloaded at the thinning machine 100, the rough grinding station, and Ordered switching between fine grinding stations.

First, as shown in FIG. 6, when the first stage 32a is in the fine grinding station, the corresponding feed grinding shaft 11 at the finishing grinding station can perform fine grinding on the non-standard wafer. After the finish grinding process is completed, the first stage 32a can be rotated 120° counterclockwise and then placed at the loading/unloading station. As shown in Fig. 7, the worker can grind the loading/unloading station. After the non-standard wafer is unloaded, and the unloading is completed, the film is loaded to ensure the uninterrupted cycle of the grinding machine 100 grinding process. After the operator installs the sheet, the first stage 32a can continue to rotate 120° counterclockwise and then be in the rough grinding station, as shown in FIG. 8 , corresponding to the feed grinding shaft in the rough grinding station. 11 can be used for rough grinding of non-standard wafers. After the rough grinding process is completed, the first stage 32a can be rotated 240° clockwise, as shown in Fig. 9, the first stage 32a can be returned to the fine grinding station. Similarly, the second stage 32b and the third stage 32c can be changed according to the change of the position of the first stage 32a, respectively, to ensure that the three stage systems 30 can simultaneously realize two processing processes - coarse Grinding and fine grinding.

In summary, the thinning machine 100 according to an embodiment of the present disclosure can effectively improve the production efficiency of wafer grinding, reduce energy consumption, and the thinning machine 100 can be widely used for grinding of various standard or non-standard wafers, in accordance with The process requirement of the wafer grinding process is that the thinning machine 100 has a compact structure, simple installation, reliable structure and stable operation.

The above is an alternative embodiment of the present disclosure, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present disclosure. It should also be considered as the scope of protection of the present disclosure.

Claims

A thinning machine comprising:

a body having two feed grinding shafts;

Rotating the tray, the rotating tray is rotatably disposed on the body and below the feed grinding shaft;

a plurality of stage systems, each of the stage systems for respectively absorbing a wafer by vacuum, a plurality of the stage systems being respectively disposed on the rotating tray and driven by the rotating tray to switch each a station of the stage system, a plurality of the stage systems are spaced apart, and the rotating tray is rotated to any working position, two of the plurality of said stage systems The table system corresponds to the position of the two feed grinding axes;

a driving member connected to the rotating tray to drive the rotating tray to rotate.
The thinning machine according to claim 1, wherein the rotating tray is formed in a circular shape, and the rotating tray is rotatably provided on the body about an axis thereof.
The thinning machine according to claim 2, wherein said stage system is three, and said three stage systems are evenly spaced apart on said rotating tray, any two of said stage systems The distance between the intervals is equal to the distance between the two feed grinding axes.
The thinning machine of claim 1 wherein each of said stage systems comprises:

a spindle, the spindle being disposed on the rotating tray;

a stage, the stage being detachably disposed on the spindle for absorbing the wafer by vacuum.
The thinning machine according to claim 4, wherein the stage is formed in a disk shape, and the stage is detachably coupled to the spindle by bolts.
The thinning machine of claim 4, further comprising:

a tenter provided on the body adjacent to the feed grinding shaft for clamping a non-standard wafer to prevent the advancement when a non-standard wafer is placed on the stage The grinding shaft drives non-standard wafer activity during operation.
The thinning machine according to claim 1, wherein the rotary tray is formed as an air floating tray, and a gas film is formed between the rotary tray and the body by compressed air.
The thinning machine of claim 1 further comprising:

a drive shaft, the drive shaft being disposed on a lower surface of the rotating tray and coupled to the rotating tray and the driving member, the driving shaft being coaxially disposed with the rotating tray to drive the driving member Rotate the tray to rotate.
The thinning machine according to claim 8, wherein the drive shaft extends in a vertical direction, the driving member is formed as a motor extending in a horizontal direction, and the thinning machine further comprises:

The speed reducer is formed in an L shape, one end of the speed reducer is connected to the motor, and the other end of the speed reducer is connected to the drive shaft.
The thinning machine according to claim 8, wherein the drive shaft is integrally formed with the rotary tray.