TWI730192B - Grinding device - Google Patents

Abstract

[Problem] To provide a grinding device that can increase the number of grinding processes of the workpiece per unit time. [Solution] A grinding device equipped with a first grinding device and a second grinding device. The grinding device supports a plurality of work chucks that hold the workpiece on a turntable so as to be rotatable. The first grinding device performs the first grinding while rotating the first grinding wheel, and the second grinding device performs the second grinding while rotating the second grinding wheel, and , Corresponding to the first grinding equipment and the second grinding equipment, each is equipped with 2 work clamps, and on the grinding surface of the grinding stone set on the first grinding wheel and 2 work clamps Grinding is performed in the radius area where the two suction surfaces of the table face each other, and the grinding surface of the grinding stone set on the second grinding wheel and the radius area where the two suction surfaces of the two work chucks face each other Grinding in the middle.

Description

Grinding device

FIELD OF THE INVENTION The present invention relates to a grinding device, which is used to grind a workpiece by a grinding device arranged in a grinding area, and the workpiece is held on a work chuck table, and the work chuck table is equipped with Located on the turntable.

BACKGROUND OF THE INVENTION In the manufacturing process of semiconductor devices, a semiconductor device formed with a plurality of ICs, LSIs, and other devices to be processed, before being divided into individual devices, is ground with a grinding device to form a predetermined thickness on the back surface. . A grinding device that grinds the backside of such a wafer is provided with a turn table, a plurality of work clamp tables, and grinding equipment. The turntable can rotate along the workpiece loading and unloading area and the grinding area. , The work chuck tables are arranged on the turntable and move to the grinding area in sequence, the grinding equipment is arranged in the grinding area and the wafer is ground, the wafer is held on the work chuck table, and the The work chuck is positioned in the grinding area (for example, refer to Patent Document 1). Prior Art Documents Patent Documents

Patent Document 1: Japanese Patent Laid-Open No. 2002-200545

SUMMARY OF THE INVENTION Problems to be solved by the invention Generally, the above-mentioned grinding device is equipped with rough grinding equipment and fine grinding equipment as grinding equipment, and the rough grinding equipment and the fine grinding equipment simultaneously grind wafers, And each one grinds one wafer at a time. However, in order to improve production efficiency, there is a requirement to increase the number of wafers that can be ground per unit time, and it is difficult for the existing grinding devices to meet the requirements.

The present invention is an invention made in view of such problems, and its object is to provide a grinding device capable of increasing the number of grinding processes of a workpiece per unit time to improve productivity. Means to solve the problem

The present invention is a grinding device, which is at least composed of: a work clamp table, a turntable, a first grinding device, and a second grinding device. The work clamp table is plural and is used to hold the workpiece. The turntable It can rotate and supports the work chuck to be rotatable. The first grinding equipment is used to perform the first grinding and the second grinding on the ground surface of the workpiece held on the work chuck. The equipment is used to perform the second grinding on the ground surface of the workpiece that is held on the work chuck and has been subjected to the first grinding. The grinding device is characterized in that: the first grinding device is at least The first grinding wheel is composed of a first grinding wheel and a spindle unit. The first grinding wheel is equipped with a grinding stone with a grinding surface. The spindle unit has a rotatable spindle for supporting the first grinding wheel. 2 Grinding equipment is composed of at least a second grinding wheel and a spindle unit. The second grinding wheel is equipped with a grinding stone with a grinding surface. The spindle unit is provided to support the second grinding wheel. And the rotatable spindle and work chuck are equipped with two respectively corresponding to the first grinding equipment and the second grinding equipment. In addition, it is used for the grinding of the grinding stone arranged on the first grinding wheel. Grinding is performed in the radius area where the two suction surfaces of the two work chucks face each other, and the grinding surface of the grinding stone arranged on the second grinding wheel and two of the two work chucks Grinding is performed in the radius area where the suction surfaces face each other.

According to this grinding device, since the first grinding device and the second grinding device are used to simultaneously grind the two workpieces held on the two work chucks, it is consistent with the existing grinding Compared with the device, it can efficiently grind most workpieces. Invention effect

According to the present invention, it is possible to obtain a grinding device capable of increasing the number of grinding processes of a workpiece per unit time to improve productivity.

Mode for Carrying Out the Invention Hereinafter, this embodiment will be described with reference to the attached drawings. Fig. 1 is a top view showing the grinding device of this embodiment. The direction along the paper surface of FIG. 1 is the horizontal direction, and the direction perpendicular to the paper surface of FIG. 1 is the vertical direction.

The grinding device 10 shown in FIG. 1 has a disk-shaped turntable 12 on the upper surface of a base 11. The turntable 12 is rotated around a rotation axis P1 extending in the up-down direction by a rotation drive mechanism (not shown).

As shown in Figure 1, the turntable 12 is provided with 6 work clamping tables. The 6 working clamping tables are composed of 3 first working clamping tables TA and 3 second working clamping tables TB. The first working clamping tables TA are arranged at equal intervals (120° intervals) on the rotation axis P1 In the rotation direction of the turntable 12 as the center, the second work chuck tables TB are arranged at equal intervals (120° intervals) in the rotation direction centered on the rotation axis P1. Each work clamp table TA, TB is a member for sucking and holding a plate-shaped workpiece W (refer to FIGS. 2 and 3), and the details will be described later. In addition to semiconductor substrates and other inorganic material substrates, the workpiece W includes semiconductor wafers or optical element wafers with elements formed thereon, and can be applied to any object as long as it can be a grinding object.

In FIG. 1, three virtual reference lines L extending in the radial direction of the turntable 12 through the rotation axis P1 are represented by one-point chain lines. The three reference lines L are arranged at equal intervals (120° intervals) in the rotation direction centered on the rotation axis P1, and with respect to each reference line L, the first work clamp table TA and the first work clamp table TA are line-symmetrical. 2 Each clamping table TB is equipped with one. The first work clamp table TA and the second work clamp table TB are used as a work clamp table group, and each work clamp table TA, TB is set in a paired relationship that sandwiches the reference line L to form a pair. That is, on the turntable 12, there are 3 sets of working clamping table groups 14, 15 and 16, and each working clamping table group includes a first working clamping table TA and a second working clamping table TB.

On the column 17 protruding upward from the upper surface of the base 11, a first grinding device 20 and a second grinding device 30 are supported, and each pair of grinding devices 20, 30 is held on each work clamp table TA, The workpiece W of TB (refer to Fig. 2 and Fig. 3) is ground. The first grinding equipment 20 is an equipment that performs rough grinding of the workpiece W by the first grinding. The second grinding device 30 is a device for performing the second grinding of the workpiece W that has been rough-ground by the first grinding device 20.

The first grinding machine 20 and the second grinding machine 30 have substantially the same structure except for the grinding stones 26 and 36 described later. 2 and 3 are diagrams for explaining both the first grinding equipment 20 and the second grinding equipment 30, in which the components of the first grinding equipment 20 are represented by general symbols, and the second grinding equipment is represented by parentheses. The components of the grinding equipment 30. In addition, in FIG. 1, in order to easily distinguish the relationship between the turntable 12 on the base 11 and the work clamp tables TA, TB, a two-dot chain line is partially used to virtually represent the first grinding equipment 20 and the second grinding equipment. 30 components.

As shown in FIG. 1, the first grinding equipment 20 includes a moving base 21 and a spindle unit 22 installed on the moving base 21. The moving base 21 is supported so as to be movable in the vertical direction along a pair of guide rails 18 provided on the front surface of the column 17. The main shaft unit 22 has a main shaft 23 capable of rotating around a rotating shaft P2 extending in the vertical direction, and the main shaft 23 is rotationally driven by a motor 24 provided at the upper end. A disc-shaped first grinding wheel 25 is supported at the lower end of the main shaft 23. The center of the first grinding wheel 25 coincides with the rotation axis P2, and when the main shaft 23 rotates, the first grinding wheel 25 rotates around the rotation axis P2. A plurality of grinding stones 26 are arranged in a ring shape on the peripheral edge of the lower surface of the first grinding wheel 25. In addition, the illustration of a part of the grinding grindstone 26 is abbreviate|omitted in FIG. The grinding grindstone 26 is a grinding grindstone for rough grinding, and as shown in FIG. 2 and FIG. 3, it has the grinding surface 26a facing downward.

As shown in FIG. 1, on the front side of the cylinder 17, a ball screw 27 whose rotating shaft extends in the vertical direction is arranged, and the ball screw 27 is rotationally driven by a motor 28 provided at the upper end. The ball screw 27 is screwed into a through screw hole provided in the movable base 21. When the ball screw 27 rotates, the moving base 21 moves up and down along the guide rail 18, and as the moving base 21 moves, the first grinding wheel 25 supported by the spindle unit 22 moves up and down.

As shown in FIG. 1, the second grinding equipment 30 includes a moving base 31 and a spindle unit 32 installed on the moving base 31. The moving base 31 is supported so as to be movable in the vertical direction along a pair of guide rails 19 provided on the front surface of the column 17. The main shaft unit 32 has a main shaft 33 capable of rotating around a rotating shaft P3 extending in the vertical direction, and the main shaft 33 is rotationally driven by a motor 34 provided at the upper end. A disc-shaped second grinding wheel 35 is supported at the lower end of the main shaft 33. The center of the second grinding wheel 35 coincides with the rotation axis P3, and when the main shaft 33 rotates, the second grinding wheel 35 rotates around the rotation axis P3. A plurality of grinding grindstones 36 are arranged in a ring shape on the peripheral edge portion of the lower surface of the second grinding wheel 35. In addition, the illustration of a part of the grinding grindstone 36 is abbreviate|omitted in FIG. The grinding grindstone 36 is a grinding grindstone for finishing grinding, and as shown in FIG. 2 and FIG. 3, it has the grinding surface 36a facing downward.

As shown in FIG. 1, on the front side of the cylinder 17, a ball screw 37 whose rotating shaft extends in the vertical direction is arranged, and the ball screw 37 is rotationally driven by a motor 38 provided at the upper end. The ball screw 37 is screwed into the through screw hole provided in the movable base 31. When the ball screw 37 rotates, the moving base 31 moves up and down along the guide rail 19, and as the moving base 31 moves, the second grinding wheel 35 supported by the spindle unit 32 moves up and down.

A total of six work clamp tables TA, TB constituting the three work clamp table groups 14, 15 and 16 all have a common structure and size. As shown in Figures 2 and 3, each work clamp table TA, TB is equipped with a cylindrical frame 40 and a disc-shaped suction holding portion 41, and the workpiece W is placed on the upper surface of the suction holding portion 41, that is, suction On the surface 42, the suction holding portion 41 is held in a circular recess formed on the upper surface of the frame body 40. The workpiece W is placed with the ground surface Wa (FIG. 2, FIG. 3) facing upward. The adsorption holding portion 41 is composed of a porous member such as porous ceramics, and by activating the suction device 43 conceptually shown in FIG. 2 to cause the suction and holding portion 41 to act on the suction and holding portion 41, the workpiece W can be adsorbed Keep on the adsorption surface 42. Each work chuck table TA, TB is rotated around the rotation axis P4 by a rotation drive mechanism (not shown).

As shown in Figures 1 and 2, the diameter of the first grinding wheel 25 is larger than the diameters of the work clamp tables TA and TB, so that the two work clamp tables constituting each work clamp table group 14, 15 and 16 can be used. The two suction surfaces 42 of TA and TB simultaneously face the grinding stone 26 provided on the lower surface of the first grinding wheel 25. Similarly, the diameter of the second grinding wheel 35 is larger than the diameter of each work clamp table TA, TB, which can make two work clamp tables TA, TB constituting each work clamp table group 14, 15 and 16. The suction surface 42 simultaneously faces the grinding stone 36 provided on the lower surface of the second grinding wheel 35. That is, both the first grinding equipment 20 and the second grinding equipment 30 can simultaneously grind the two workpieces W on the two work chuck tables TA and TB, and the first grinding equipment 20 and the second grinding device 30 simultaneously grind a total of four workpieces W. The details of this grinding process will be described later. In addition, in this embodiment, the first grinding wheel 25 and the second grinding wheel 35 are set to have a common diameter.

As shown in an exaggerated manner in FIG. 2, the suction surface 42 of the suction holding portion 41 is formed in a conical shape with the rotation axis P4 as an axis. Then, the first work clamp table TA and the second work clamp table TB incline the rotation axis P4 with respect to the rotation axis P2 of the first grinding wheel 25 and the rotation axis P3 of the second grinding wheel 35, and are received by the turntable 12 In addition, the degree of inclination of the support corresponds to an angle corresponding to the inclination of the suction surface 42.

The workpiece W sucked and held on the suction surface 42 of each of the first work chuck table TA and the second work chuck table TB has a conical shape along the suction surface 42. Therefore, when the ground surface Wa (FIG. 2, FIG. 3) of the workpiece W on each work chuck table TA, TB is rough grounded by the first grinding device 20, it is relatively 1. The grinding surface 26a (FIG. 2 and FIG. 3) of the grinding stone 26 at the peripheral edge of the lower surface of the grinding wheel 25 becomes a parallel linear radius region, and is ground in contact with the grinding stone 26. In addition, when the grinding surface Wa of the workpiece W on each of the work chucks TA and TB is subjected to finish grinding by the second grinding device 30, it is opposite to that provided under the second grinding wheel 35. The grinding surface 36a (FIG. 2, FIG. 3) of the grinding grindstone 36 at the peripheral edge of the surface becomes a parallel linear radius region, and is ground in contact with the grinding grindstone 36.

In FIG. 1, the area where the grinding surface 26a of the grinding grindstone 26 of the first grinding device 20 faces the ground surface Wa of the workpiece W on the first work chuck TA is represented as a processing line S1 , And the area where the grinding surface 26a of the grinding stone 26 of the first grinding device 20 faces the ground surface Wa of the workpiece W on the second work chuck TB is represented as a processing line S2. In addition, in FIG. 1, the area where the grinding surface 36a of the grinding stone 36 of the second grinding device 30 faces the ground surface Wa of the workpiece W on the first work chuck TA is represented as processing Line S3, and the area where the grinding surface 36a of the grinding stone 36 of the second grinding device 30 faces the ground surface Wa of the workpiece W on the second work chuck table TB is represented as the processing line S4 . In this way, in the first grinding equipment 20, the grinding surface 26a of the grinding stone 26 arranged on the first grinding wheel 25 and the two suction surfaces 42 of the two work chucks TA and TB correspond to each other. In the facing radius area (processing lines S1 and S2), the grinding of the ground surface Wa of the workpiece W is performed. In addition, in the second grinding equipment 30, the grinding surface 36a of the grinding stone 36 arranged on the second grinding wheel 35 and the two suction surfaces 42 of the two work chucks TA and TB face each other. In the opposite radius area (processing lines S3, S4), the grinding of the ground surface Wa of the workpiece W is performed.

Each work clamp table TA, TB can be adjusted by the fine adjustment equipment to adjust the tilt direction and the size of the tilt. As shown in FIG. 3, the fine adjustment device 50 has a structure in which a flange 52 and a fixed portion 53 are connected by an adjustment shaft mechanism. The flange 52 is provided on the work clamp base of the support frame 40 In the lower part of the seat 51, the fixing part 53 is in a fixed relationship with respect to the turntable 12. The adjustment shaft mechanism has: a cylindrical portion 54 fixedly supported with respect to the fixed portion 53, and a bolt shaft 55 inserted into the cylindrical portion 54, and rotates the rotation operation portion 56 provided at the lower end of the bolt shaft 55 to make The bolt shaft 55 moves forward and backward in the vertical direction with respect to the cylindrical portion 54. The vicinity of the upper end of the bolt shaft 55 is connected to the flange 52. When the bolt shaft 55 advances and retreats, the connecting portion of the bolt shaft 55 in the flange 52 changes up and down.

As shown in Fig. 1, each work clamp table TA, TB is supported by the turntable 12 by three support parts M. The support parts M are located at equal intervals in the rotation direction centered on the rotation axis P4. In addition, among the three supporting parts M, the above-mentioned fine adjustment device 50 is arranged at two or more places, and the inclination of each work clamp table TA, TB can be adjusted. For example, in each work clamp table TA, TB, one support M located close to the end of the processing lines S1, S2, S3, and S4 shown in Figure 1 can be used as a fixed support, and the remaining two supports The part M is provided with a fine adjustment device 50. According to this structure, in the conical suction surface 42, the inclination of each work clamp TA, TB can be adjusted centering on the ridgeline extending substantially along the processing lines S1, S2, S3, and S4.

The operation of the grinding device 10 composed of the above configuration will be described. The three work clamp groups 14, 15 and 16 set on the turntable 12 are sequentially moved to the workpiece loading and unloading area E1 shown in FIG. 1 by the rotation of the turntable 12 centered on the rotation axis P1. The grinding area E2 and the second grinding area E3. FIG. 1 shows a state in which the work clamp table group 14 is located in the workpiece loading and unloading area E1, the work clamp table group 15 is located in the first grinding area E2, and the work clamp table group 16 is located in the second grinding area E3.

The workpiece loading and unloading area E1 is an area where the workpiece W is transferred between the transport mechanism (not shown) and the first work chuck table TA and the second work chuck table TB. The to-be-processed object W is conveyed to the to-be-processed object loading and unloading area E1 by a conveyance mechanism. Then, on the suction surfaces 42 of the first work clamp table TA and the second work clamp table TB of the work clamp table group 14 waiting in the work chuck table group 14 waiting in the workpiece loading and unloading area E1, the machined surface Wa is placed on the suction surface 42 upward.物W. Each of the first work clamp table TA and the second work clamp table TB sucks and holds the workpiece W on the suction surface 42 by the suction force of the suction device 43 (FIG. 2 ).

Furthermore, the present invention does not limit the structure of the conveying mechanism, and various types of conveying mechanisms can be used. As an example, if a transport mechanism capable of simultaneously transporting two workpieces W to two work chucking tables TA and TB is used, the transport efficiency can be improved. In addition, the grinding device 10 of this embodiment can also be applied as a part of a cluster module system that freely combines various processing devices and cooperates with each other, and uses the transport mechanism of the cluster module system to perform The conveyance of the workpiece W to the workpiece loading and unloading area E1.

The first grinding area E2 is used by the first grinding equipment 20 to rough-grind the ground surface Wa of the workpiece W held by the first work chuck TA and the second work chuck TB. area. As described earlier, the diameter of the first grinding wheel 25 is larger than the diameter of each of the work clamp tables TA, TB of the work clamp table group 15 located in the first grinding area E2. Furthermore, the grinding surface 26a of the grinding stone 26 provided on the lower surface of the first grinding wheel 25 can be brought into contact with the two suction surfaces 42 held on the two work clamp tables TA and TB. The ground surface Wa of the workpiece W is simultaneously subjected to rough grinding processing (refer to FIG. 2).

In more detail, as shown in FIG. 1, in the first grinding area E2, the rotation axis P2 of the rotation center of the first grinding wheel 25 is located between the first work chuck TA and the second work chuck TB On the reference line L (the reference line L and the rotation axis P2 intersect in a vertical relationship). In addition, the rotation axis P4 in the first work chuck TA and the rotation axis P4 in the second work chuck TB are respectively located on the outer circumference of the first grinding wheel 25.

In this state, the first work clamp table TA and the second work clamp table TB constituting the work clamp table group 15 are each rotated in the direction of arrow R1 (counterclockwise) in FIG. 1 with the rotation axis P4 as the center, and the first work clamp 1 The first grinding wheel 25 in the grinding equipment 20 descends while rotating in the arrow R2 direction (counterclockwise direction) in FIG. 1. Then, the grinding surface 26a of the grinding stone 26 provided on the peripheral portion of the lower surface of the first grinding wheel 25 is applied to the workpiece W held on the first work chuck TA along the processing line S1. The grinding surface Wa is in contact with the ground surface Wa of the workpiece W held on the second work chuck table TB along the processing line S2, following the rotation of a first grinding wheel 25 On the other hand, the rough grinding of the two to-be-processed objects W is performed simultaneously. Since the rough grinding along the processing line S1 and the rough grinding along the processing line S2 are both in the direction from the outer peripheral part of the workpiece W to the center (rotation axis P4), it is possible to set the target by the work clamp The grinding conditions of the two workpieces W held by 15 are set to be the same.

At this time, in the processing line S1 and the processing line S2, since the grinding surface 26a of the grinding grindstone 26 and the suction surfaces 42 of the two work clamp tables TA and TB are adjusted in advance to be parallel, it is possible to align the two The ground surface Wa of the workpiece W is rough ground with good accuracy. In addition, since the grinding surface 26a of the grinding grindstone 26 passes through the rotation axis P4 of each of the two work chucks TA and TB, it is possible to grind the surface Wa on the two workpieces W without leaving them. The whole is uniformly rough ground. In addition, since the processing lines S1 and S2 are located in the triangle-shaped area surrounded by the three support parts M supporting the work clamp tables TA and TB, when rough grinding is performed by the first grinding equipment 20, The stability of the workpiece W can be improved.

The second grinding area E3 is a type of grinding surface Wa of the workpiece W held by the first work chuck TA and the second work chuck TB by the second grinding equipment 30. Area. As described above, the diameter of the second grinding wheel 35 is larger than the diameter of each of the work clamp tables TA and TB of the work clamp table group 16 located in the second grinding area E3. Furthermore, the grinding surface 36a of the grinding stone 36 provided on the lower surface of the second grinding wheel 35 can be brought into contact with the two suction surfaces 42 held on the two work clamp tables TA and TB. The ground surface Wa of the workpiece W is simultaneously subjected to finish grinding processing (refer to FIG. 2).

In more detail, as shown in FIG. 1, in the second grinding area E3, the rotation center of the second grinding wheel 35, that is, the rotation axis P3 is located between the first work chuck TA and the second work chuck TB On the reference line L (the reference line L and the rotation axis P3 intersect in a vertical relationship). In addition, the rotation axis P4 in the first work chuck TA and the rotation axis P4 in the second work chuck TB are respectively located on the outer circumference of the second grinding wheel 35.

In this state, the first work clamp table TA and the second work clamp table TB constituting the work clamp table group 16 are each rotated in the direction of arrow R3 (counterclockwise) in FIG. 2 The second grinding wheel 36 in the grinding equipment 30 descends while rotating in the direction of arrow R4 (counterclockwise) in FIG. 1. Then, the grinding surface 36a of the grinding stone 36 provided on the peripheral portion of the lower surface of the second grinding wheel 35 is applied to the workpiece W held on the first work chuck TA along the processing line S3. The grinding surface Wa is in contact with the ground surface Wa of the workpiece W held on the second work chuck table TB along the processing line S4, following the rotation of a second grinding wheel 35 At the same time, the finish grinding of the two workpieces W is performed. Since the finish grinding along the processing line S3 and the finish grinding along the processing line S4 both become the direction from the outer peripheral part of the workpiece W to the center (rotation axis P4), it is possible to set the target to the work clamp The grinding conditions of the two workpieces W held by 16 are set to be the same.

At this time, in the processing line S3 and the processing line S4, since the grinding surface 36a of the grinding grindstone 36 and the suction surface 42 of the two work clamp tables TA and TB are adjusted to be parallel in advance, it is possible to align the two The ground surface Wa of the workpiece W is finely ground with good accuracy. In addition, since the grinding surface of the grinding grindstone 36 passes through the rotation axis P4 of each of the two work chucks TA and TB, the entire surface Wa can be ground without leaving the two workpieces W. Fine grinding evenly. In addition, since the processing lines S3 and S4 are located in the triangle-shaped area surrounded by the three support parts M that support the work clamp tables TA and TB, when the second grinding equipment 30 performs fine grinding, The stability of the workpiece W can be improved.

In the state shown in FIG. 1, when the grinding of a total of four workpieces W in the first grinding area E2 and the second grinding area E3 is completed, the first grinding wheel 25 and the second grinding wheel 25 are created. In a state where each of the cutting wheels 35 is pulled upward from the workpiece W, the turntable 12 is rotated in the arrow R5 direction (counterclockwise direction) in FIG. 1. When the turntable 12 is rotated by 120° from the position shown in FIG. 1, the work chuck group 14 moves from the workpiece loading and unloading area E1 to the first grinding area E2, and the work chuck group 15 moves from the first grinding area E2 to the first grinding area E2. 2 Grinding area E3, the work chuck group 16 moves from the second grinding area E3 to the workpiece loading and unloading area E1.

Furthermore, in the first grinding area E2, the ground surface Wa of the two workpieces W held on the two work clamp tables TA and TB of the work clamp table group 14 (in the state of FIG. 1 , Is the ungrounded object located in the workpiece loading and unloading area E1), and the first grinding equipment 20 is used for simultaneous rough grinding. Also, in the second grinding area E3, the ground surface Wa of the two workpieces W held on the two work clamp tables TA and TB of the work clamp table group 15 (in the state of FIG. 1 , Which has been rough-ground in the first grinding area E2), and the second grinding device 30 is used to simultaneously perform fine-grinding processing. In addition, in the workpiece loading and unloading area E1, the two workpieces W that have been subjected to finishing grinding, which are held on the two work chucking tables TA and TB of the work chucking table group 16, are transferred to a transport mechanism not shown in the figure. . In the case of continuing the grinding process of the grinding device 10, in the workpiece loading and unloading area E1, a new suction surface 42 is placed on each of the two work clamp tables TA and TB of the work clamp table group 16 The workpiece W in the unground state.

By repeating the above-mentioned operation, the rough grinding process of the first grinding device 20 and the finish grinding process of the second grinding device 30 can be simultaneously performed on the two workpieces W, respectively. Therefore, according to the grinding device 10 of the present embodiment, compared to the existing grinding device in which the grinding device for rough grinding and the grinding device for fine grinding each grind one workpiece at a time, The number of workpieces that can be ground per unit time can be increased to improve productivity.

In addition, in the above embodiment, in the first grinding area E2, the two work chucks TA and TB are arranged in line symmetry with respect to the reference line L, and the rotation axis P3 of the first grinding wheel 25 is located on the reference line. L up. Moreover, the inclination and rotation direction of the two work chucks TA and TB are the same, so that the grinding by the grinding grindstone 26 can advance from the outer periphery of the workpiece W toward the center (rotation axis P4). Similarly, in the second grinding area E3, the two work chucks TA and TB are arranged in line symmetry with respect to the reference line L, and the rotation axis P3 of the rotation axis P3 of the second grinding wheel 35 is positioned at the reference On line L. Moreover, the inclination and rotation direction of the two work chucks TA and TB are the same, so that the grinding by the grinding stone 36 can advance from the outer periphery of the workpiece W toward the center (rotation axis P4). With these configurations, the grinding conditions related to the two workpieces W in the first grinding area E2 become the same, and the grinding conditions related to the two workpieces W in the second grinding area E3 are also the same. To be the same, it is possible to increase the number of grinding processes while eliminating the difference in processing quality.

In addition, the grinding device 10 of the above-mentioned embodiment uses the first grinding wheel 25 or the second grinding wheel 35, which faces the suction surface 42 of the two work chucks TA and TB at the same time, and has a larger diameter. Grinding of two workpieces W. With this configuration, it is possible to grind the range of the workpiece W on the first work chuck TA (processing lines S1, S3) and the range of the workpiece W on the second work chuck TB (processing Between the lines S2 and S4), the grinding stop range where the grinding stones 26 and 36 do not touch the workpiece W is obtained. By using this grinding stop range, each grinding stone 26, 36 can be cooled efficiently, and the durability of each grinding stone 26, 36 can be improved. For example, it is also possible to provide a cooling water supply system that actively cools the grinding stones 26 and 36 in the grinding stop range.

In addition, the present invention is not limited to the embodiment described above, and can be implemented with various modifications. In the above-mentioned embodiment, the size, shape, etc. illustrated in the drawings are not limited to these, and can be appropriately changed within the range in which the effects of the present invention can be exhibited.

For example, in the above-mentioned embodiment, although the first grinding device 20 and the second grinding device 30 have a substantially common structure, they may be equipped with different first grinding devices and second grinding devices. constitute.

In addition, although the grinding device 10 of the above-mentioned embodiment has two grinding areas, the first grinding area E2 and the second grinding area E3, it can also be applied to grinding with three or more different grinding areas.切装置。 Cutting device.

In addition, although the embodiment of the present invention has been described, as another embodiment of the present invention, it is also possible to combine the above-mentioned embodiments or modified examples in whole or in part.

In addition, the embodiment of the present invention is not limited to the above-mentioned embodiment, and various changes, substitutions, and modifications may be made within the scope not departing from the technical idea of the present invention. In addition, if the technical idea of the present invention can be realized in other ways through technological progress or other derived technologies, this method can also be used to implement it. Therefore, the scope of patent application covers all implementation aspects that can be included in the scope of the technical idea of the present invention. Industrial availability

As explained above, the present invention has the effect of being able to increase the number of grinding processes of the workpiece per unit time to achieve an increase in productivity, especially for a kind of grinding equipment arranged in the grinding area The grinding wheel is useful as a grinding device to grind the workpiece, wherein the workpiece is held on a work clamp table, and the work clamp table is arranged on a turntable.

10‧‧‧Grinding device 11‧‧‧Abutment 12‧‧‧Turntable 14,15,16‧‧‧Working clamping table group 17‧‧‧Cylinder 18,19‧‧‧Guide 20‧‧‧First grinding Grinding equipment 21, 31‧‧‧Mobile base 22,32‧‧‧Spindle unit 23,33‧‧‧Spindle 24,34‧‧‧Motor 25‧‧‧First grinding wheel 26,36‧‧‧Grinding Grinding stone 26a, 36a‧‧‧Grinding surface 27, 37‧‧‧Ball screw 28, 38‧‧‧Motor 30‧‧‧Second grinding equipment 35‧‧‧Second grinding wheel 40‧‧‧Frame body 41‧‧‧Suction holding part 42‧‧‧Suction surface 43‧‧‧Suction equipment 50‧‧‧Micro adjustment equipment 51‧‧‧Working clamp base 52‧‧‧Flange 53‧‧‧Fixed part 54‧‧ ‧Cylindrical part 55‧‧‧Bolt shaft 56‧‧‧Rotary operation part E1‧‧‧Working object loading and unloading area E2‧‧‧First grinding area E3‧‧‧Second grinding area L‧‧‧Datum line M‧‧‧Support TA‧‧‧The first work clamp TB‧‧‧The second work clamp P1, P2, P3, P4‧‧‧Rotation axis R1, R2, R3, R4, R5‧‧‧Arrow S1 , S2, S3, S4‧‧‧Processing line W‧‧‧Working object Wa‧‧‧Grinding surface

Fig. 1 is a top view showing the grinding device of this embodiment. Fig. 2 is a side view showing a state in which two workpieces on two work chucks are simultaneously ground by one grinding device in the grinding device of this embodiment. Fig. 3 is a side view showing the fine adjustment equipment of the work clamp table.

10‧‧‧Grinding device

11‧‧‧Abutment

12‧‧‧Turntable

14,15,16‧‧‧Work clamp table group

17‧‧‧Cylinder

18、19‧‧‧Guide rail

20‧‧‧First grinding equipment

21、31‧‧‧Mobile abutment

22, 32‧‧‧Spindle unit

23, 33‧‧‧Spindle

24, 34‧‧‧Motor

25‧‧‧First grinding wheel

26、36‧‧‧Grinding stone

27、37‧‧‧Ball screw

28, 38‧‧‧Motor

30‧‧‧Second Grinding Equipment

35‧‧‧2nd grinding wheel

42‧‧‧Adsorption surface

E1‧‧‧Working object loading and unloading area

E2‧‧‧First grinding area

E3‧‧‧Second grinding area

L‧‧‧Baseline

M‧‧‧Support

TA‧‧‧The first work clamp

TB‧‧‧The second work clamp

P1, P2, P3, P4‧‧‧Rotating axis

R1, R2, R3, R4, R5‧‧‧Arrow

S1, S2, S3, S4‧‧‧Processing line

Claims (3)

A grinding device is composed of at least: a work clamp table, a turntable, a first grinding device, and a second grinding device. The work clamp tables are plural and are used to hold the object to be processed. The turntable can rotate. And the work chuck is supported so as to be rotatable. The first grinding equipment is used to perform the first grinding on the ground surface of the workpiece held on the work chuck. The second grinding equipment Used to perform second grinding on the ground surface of the workpiece that is held on the work chuck and has been subjected to the first grinding, and the grinding device is characterized in that: the first grinding device At least it is composed of a first grinding wheel and a spindle unit. The first grinding wheel is equipped with a grinding stone with a grinding surface. The spindle unit has a rotatably supporting the first grinding wheel. The second grinding device is composed of at least a second grinding wheel and a spindle unit, the second grinding wheel is equipped with a grinding stone with a grinding surface, and the spindle unit has a support The second grinding wheel and the rotatable spindle, the work chuck is corresponding to the first grinding equipment and the second grinding equipment and are respectively equipped with two, and the work chuck has a conical shape. The adsorption surfaces of the two work chucks are implemented in the radius regions of the work chucks parallel to the grinding surface of the grinding stone arranged on the first grinding wheel. Grinding, the rotation direction of the two work chucks and the inclination of the suction surface are the same, so in the radius area, the direction in which the grinding stone grinds the workpiece becomes the same. The two suction surfaces of the clamping table are arranged on the second Grinding is performed in the radius area of each work chuck where the grinding surface of the grinding stone of the grinding wheel becomes parallel, and the rotation direction of the two work chucks is consistent with the inclination of the suction surface. In this radius area, the direction in which the grinding stone grinds the workpiece becomes the same. Such as the grinding device of claim 1, wherein all the work chucks are supported by the support parts at 3 equally spaced positions in the rotating direction centered on the rotating shaft so as to adjust the inclination, and rotate along the When viewed axially, the entire radius area is located within the triangle-shaped area surrounded by the support portion at 3 locations. Such as the grinding device of claim 1, wherein all the work chucks are supported by the support parts at 3 equidistant positions in the direction of rotation centered on the rotating shaft so that the inclination can be adjusted. One of the supporting parts is a fixed supporting part adjacent to the end of the radius area, and the other two of the three supporting parts are equipped with fine adjustment equipment that can adjust the supporting position of the work clamp table in the up and down direction. .

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