JPS61168462A - Wafer grinder - Google Patents

Wafer grinder

Info

Publication number
JPS61168462A
JPS61168462A JP570285A JP570285A JPS61168462A JP S61168462 A JPS61168462 A JP S61168462A JP 570285 A JP570285 A JP 570285A JP 570285 A JP570285 A JP 570285A JP S61168462 A JPS61168462 A JP S61168462A
Authority
JP
Japan
Prior art keywords
grinding
wafer
onto
chuck
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP570285A
Other languages
Japanese (ja)
Inventor
Takao Ishihara
Takashi Shimura
Satoru Yamamoto
Hajime Yui
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP570285A priority Critical patent/JPS61168462A/en
Publication of JPS61168462A publication Critical patent/JPS61168462A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To achieve highly accurate and efficient grinding by arranging a plurality of spinnable wafer chuck tables in pair at the position lapping over the rotary diameter of grinding means thereby preventing shifted loading and formation of grinding pattern on the grinding face of wafer.
CONSTITUTION: A work or a wafer 3 is passed sequentially from a loader through passing mechanism onto a wafer chuck table 2 at predetermined position on an index table 1 then held through vacuum suction onto the chuck table 2 while directing the surface upward for every predetermined rotary angle of table 1. Then it is moved to the grinding position as the table 1 will rotate where a cup grinding wheel 7 is arranged across a pair of chuck tables 2a, 2b to grind two wafers 3 at a time under uniform load. Consequently, shifted load is never applied onto the cup grinding wheel 7 to prevent occurrence of grinding pattern while to improve the grinding accuracy.
COPYRIGHT: (C)1986,JPO&Japio
JP570285A 1985-01-18 1985-01-18 Wafer grinder Pending JPS61168462A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP570285A JPS61168462A (en) 1985-01-18 1985-01-18 Wafer grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP570285A JPS61168462A (en) 1985-01-18 1985-01-18 Wafer grinder

Publications (1)

Publication Number Publication Date
JPS61168462A true JPS61168462A (en) 1986-07-30

Family

ID=11618440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP570285A Pending JPS61168462A (en) 1985-01-18 1985-01-18 Wafer grinder

Country Status (1)

Country Link
JP (1) JPS61168462A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02301137A (en) * 1989-05-15 1990-12-13 Toshiba Mach Co Ltd Polishing apparatus
JPH05277915A (en) * 1992-03-31 1993-10-26 Nec Yamagata Ltd Wafer backside grinding device
JP2000173961A (en) * 1998-12-01 2000-06-23 Sharp Corp Method and apparatus for manufacturing semiconductor device
US6155913A (en) * 1999-04-12 2000-12-05 Chartered Semiconductor Manuf. Ltd. Double polishing head
US6220945B1 (en) 1998-04-24 2001-04-24 Ebara Corporation Polishing apparatus
US6402588B1 (en) 1998-04-27 2002-06-11 Ebara Corporation Polishing apparatus
JP2006198734A (en) * 2005-01-21 2006-08-03 Honda Motor Co Ltd Grinding method
JP2018094636A (en) * 2016-12-08 2018-06-21 株式会社ディスコ Grinding device
WO2018219422A1 (en) * 2017-05-29 2018-12-06 Diskus Werke Schleiftechnik Gmbh Grinding method for machining external surfaces of workpieces with a grinding wheel

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02301137A (en) * 1989-05-15 1990-12-13 Toshiba Mach Co Ltd Polishing apparatus
JPH05277915A (en) * 1992-03-31 1993-10-26 Nec Yamagata Ltd Wafer backside grinding device
US6220945B1 (en) 1998-04-24 2001-04-24 Ebara Corporation Polishing apparatus
US6520845B2 (en) 1998-04-24 2003-02-18 Ebara Corporation Polishing apparatus
US6402588B1 (en) 1998-04-27 2002-06-11 Ebara Corporation Polishing apparatus
JP2000173961A (en) * 1998-12-01 2000-06-23 Sharp Corp Method and apparatus for manufacturing semiconductor device
US6155913A (en) * 1999-04-12 2000-12-05 Chartered Semiconductor Manuf. Ltd. Double polishing head
JP2006198734A (en) * 2005-01-21 2006-08-03 Honda Motor Co Ltd Grinding method
JP2018094636A (en) * 2016-12-08 2018-06-21 株式会社ディスコ Grinding device
WO2018219422A1 (en) * 2017-05-29 2018-12-06 Diskus Werke Schleiftechnik Gmbh Grinding method for machining external surfaces of workpieces with a grinding wheel

Similar Documents

Publication Publication Date Title
JPS56152562A (en) Grinder
JPS61164773A (en) Method and device for grinding wafer
JPS58184727A (en) Processing apparatus for semiconductor material and satin-finished surface thereof
JPS61168462A (en) Wafer grinder
JPS61109656A (en) Surface grinding apparatus
JPH04343658A (en) Wafer polishing device with dresser and dressing method for abrasive fabric surface
JPH02180554A (en) Method and device for notch grinding of semiconductor wafer
JPS5914469A (en) Polishing apparatus
JPS61173851A (en) Method of grinding internal surface
JPH03154777A (en) Grinding method and device by cup type super abrasive grain grindstone
JPH04364729A (en) Apparatus for chamfering wafer notch
JPS5662753A (en) Surface grinder
JPS6377647A (en) Grinding method for plate-shaped body and its device
JPS61226260A (en) Dressing device in grinding machine
JPS6076959A (en) Manufacture of semi-conductor device
JPS62162460A (en) One-side polishing machine
JPS62107951A (en) Surface grinder
JPH03149179A (en) Grinding device for hard disk base board
JPS61226266A (en) Grinding method in grinding machine
JPS5351589A (en) Apparatus for controlling truing and dressing
JPH02303759A (en) Polishing of peripheral edge part of wafer
JPS5937037A (en) Vertical rotary table type surface grinder
JPH0386455A (en) Automatic grinder
JPS61274876A (en) Semiconductor wafer measuring method in automatic surface grinder
JPS62176746A (en) Two-surface chamfering machining device for glass material